Este documento define el primer modelo de rendimiento para la carrera de obstáculos Spartan. Analiza los datos de frecuencia cardíaca de atletas de élite en competiciones Sprint, Super y Beast para determinar las zonas de intensidad. Las Spartan Sprint y Super son intensas y de alta intensidad, mientras que la Beast tiene una mayor componente aeróbica. El modelo sugiere entrenar en zonas de alta intensidad para prepararse para las Spartan.
"Session ID: SFO17-102
Session Name: Deploy STM32 family on Zephyr - SFO17-102
Speaker: Erwan Gouriou
Track: LITE
★ Session Summary ★
Objects:
-Quick intro on STM32 offer
-Strategy used to minimize code and maintenance effort and break silos
-Status on supported drivers
Slides:
-STM32 families and SoCs (highlight number of refs (>900) and need for mutualization)
-SoC naming conventions
-ST boards
-STM32Cube
-Initial deployment in Zephyr
-STM32Cube introduction and introduction in Zephyr
*HAL vs LL
*Information conveyed by CMSIS files
-Driver deployment strategy
*CMSIS (generic defines)
*LL/HAL
-Simplification brought by driver init code and pinmux generated by Device tree
---------------------------------------------------
★ Resources ★
Event Page: http://connect.linaro.org/resource/sfo17/sfo17-102/
Presentation:
Video:
---------------------------------------------------
★ Event Details ★
Linaro Connect San Francisco 2017 (SFO17)
25-29 September 2017
Hyatt Regency San Francisco Airport
---------------------------------------------------
Keyword:
http://www.linaro.org
http://connect.linaro.org
---------------------------------------------------
Follow us on Social Media
https://www.facebook.com/LinaroOrg
https://twitter.com/linaroorg
https://www.youtube.com/user/linaroorg?sub_confirmation=1
https://www.linkedin.com/company/1026961"
Este documento resume las consideraciones generales, la evaluación preoperatoria, el manejo intraoperatorio y postoperatorio para la resección pulmonar. La evaluación preoperatoria busca identificar pacientes de alto riesgo a través de pruebas de función pulmonar y cardiopulmonar para disminuir la morbilidad y mortalidad postoperatoria. El manejo intraoperatorio se enfoca en el aislamiento pulmonar, la hidratación controlada y la ventilación protectora. El manejo postoperatorio prioriza el control del dolor y la extubación temprana.
1. FPGAs implement digital circuits using programmable logic blocks (CLBs) containing lookup tables (LUTs) and flip-flops. LUTs can implement combinational logic functions, while flip-flops allow implementing sequential logic.
2. The CLBs are connected through a programmable switch matrix that can be configured to route signals between LUTs and flip-flops as needed to implement a target circuit design.
3. An example circuit for a seatbelt warning light is mapped to the LUTs and switch matrix of an FPGA, showing how the design can be implemented without requiring a new fabrication run like with an ASIC.
3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update -...Yole Developpement
3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications.
TSVs have been adopted for MEMS, Sensors, and Memory devices. What will the next technology driver be?
Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CMOS image sensors (CIS), MEMS, sensors, and radio frequency (RF) filters. In the near future they will also enable photonics and LED function integration. The market for 3D TSV and 2.5D interconnect is expected to reach around two million wafers in 2020, expanding at a 22% compound annual growth rate (CAGR). The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.
CIS still commanded more than 70% % share of TSV market wafer volume in 2015, although this will decrease to around 60% by 2020. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors (FPS). However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 30% of CIS production by 2020. The TSV markets for RF filters and FPS are expected to reach around $1.6B and $0.5B by 2020 respectively. The report will explain the market’s dynamics and give an overview of all segments and key markets. It will also provide market data in terms of revenues, units and wafer starts for all the different segments, including market share.
This document discusses package fabrication technology. It begins by defining packaging as the technology required between an integrated circuit and the system level. There are three main levels of packaging - chip, board, and system level. The major functions of packaging are signal distribution, power distribution, heat dissipation, and protection from mechanical, chemical and electromagnetic stresses. Package fabrication technologies include refractory ceramic and molded plastic, and are either through-hole or surface mount. Key aspects covered include chip-to-package interconnections using wire bonding, TAB, flip chip, and chip-on-board approaches. 3D packaging technology is also summarized.
Monitoring Service Agreement Sample (Purchase this doc, Text: 08118887270 (Wh...GLC
This document is a services agreement between PT ____________, a company in Indonesia (the Customer), and XXX, a Korean company (the Provider). The agreement outlines the terms under which the Provider will provide logistics management and monitoring services for the Customer's operations in Korea. Specifically, the Provider will liaise with the Customer's logistics contractor, oversee the Customer's logistics activities and needs, and provide regular reports. In exchange, the Customer will pay the Provider a monthly fee of 5% of the total delivery cost. The agreement has a set term and can be terminated early for non-performance or other specified reasons. It also includes standard provisions regarding confidentiality, dispute resolution, and governing law.
The document discusses propagation delay, rise/fall times, and transient response in digital circuits. It defines key timing parameters and describes how to model digital gates and wires as resistor-capacitor circuits to estimate delays. The RC model approximates transistor behavior with average resistance and capacitance values. Delay is calculated using techniques like Elmore delay, which sums the resistive and capacitive contributions of each node in the circuit. Examples show how to apply these techniques to calculate delays for common circuit structures.
Este documento define el primer modelo de rendimiento para la carrera de obstáculos Spartan. Analiza los datos de frecuencia cardíaca de atletas de élite en competiciones Sprint, Super y Beast para determinar las zonas de intensidad. Las Spartan Sprint y Super son intensas y de alta intensidad, mientras que la Beast tiene una mayor componente aeróbica. El modelo sugiere entrenar en zonas de alta intensidad para prepararse para las Spartan.
"Session ID: SFO17-102
Session Name: Deploy STM32 family on Zephyr - SFO17-102
Speaker: Erwan Gouriou
Track: LITE
★ Session Summary ★
Objects:
-Quick intro on STM32 offer
-Strategy used to minimize code and maintenance effort and break silos
-Status on supported drivers
Slides:
-STM32 families and SoCs (highlight number of refs (>900) and need for mutualization)
-SoC naming conventions
-ST boards
-STM32Cube
-Initial deployment in Zephyr
-STM32Cube introduction and introduction in Zephyr
*HAL vs LL
*Information conveyed by CMSIS files
-Driver deployment strategy
*CMSIS (generic defines)
*LL/HAL
-Simplification brought by driver init code and pinmux generated by Device tree
---------------------------------------------------
★ Resources ★
Event Page: http://connect.linaro.org/resource/sfo17/sfo17-102/
Presentation:
Video:
---------------------------------------------------
★ Event Details ★
Linaro Connect San Francisco 2017 (SFO17)
25-29 September 2017
Hyatt Regency San Francisco Airport
---------------------------------------------------
Keyword:
http://www.linaro.org
http://connect.linaro.org
---------------------------------------------------
Follow us on Social Media
https://www.facebook.com/LinaroOrg
https://twitter.com/linaroorg
https://www.youtube.com/user/linaroorg?sub_confirmation=1
https://www.linkedin.com/company/1026961"
Este documento resume las consideraciones generales, la evaluación preoperatoria, el manejo intraoperatorio y postoperatorio para la resección pulmonar. La evaluación preoperatoria busca identificar pacientes de alto riesgo a través de pruebas de función pulmonar y cardiopulmonar para disminuir la morbilidad y mortalidad postoperatoria. El manejo intraoperatorio se enfoca en el aislamiento pulmonar, la hidratación controlada y la ventilación protectora. El manejo postoperatorio prioriza el control del dolor y la extubación temprana.
1. FPGAs implement digital circuits using programmable logic blocks (CLBs) containing lookup tables (LUTs) and flip-flops. LUTs can implement combinational logic functions, while flip-flops allow implementing sequential logic.
2. The CLBs are connected through a programmable switch matrix that can be configured to route signals between LUTs and flip-flops as needed to implement a target circuit design.
3. An example circuit for a seatbelt warning light is mapped to the LUTs and switch matrix of an FPGA, showing how the design can be implemented without requiring a new fabrication run like with an ASIC.
3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update -...Yole Developpement
3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications.
TSVs have been adopted for MEMS, Sensors, and Memory devices. What will the next technology driver be?
Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CMOS image sensors (CIS), MEMS, sensors, and radio frequency (RF) filters. In the near future they will also enable photonics and LED function integration. The market for 3D TSV and 2.5D interconnect is expected to reach around two million wafers in 2020, expanding at a 22% compound annual growth rate (CAGR). The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.
CIS still commanded more than 70% % share of TSV market wafer volume in 2015, although this will decrease to around 60% by 2020. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors (FPS). However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 30% of CIS production by 2020. The TSV markets for RF filters and FPS are expected to reach around $1.6B and $0.5B by 2020 respectively. The report will explain the market’s dynamics and give an overview of all segments and key markets. It will also provide market data in terms of revenues, units and wafer starts for all the different segments, including market share.
This document discusses package fabrication technology. It begins by defining packaging as the technology required between an integrated circuit and the system level. There are three main levels of packaging - chip, board, and system level. The major functions of packaging are signal distribution, power distribution, heat dissipation, and protection from mechanical, chemical and electromagnetic stresses. Package fabrication technologies include refractory ceramic and molded plastic, and are either through-hole or surface mount. Key aspects covered include chip-to-package interconnections using wire bonding, TAB, flip chip, and chip-on-board approaches. 3D packaging technology is also summarized.
Monitoring Service Agreement Sample (Purchase this doc, Text: 08118887270 (Wh...GLC
This document is a services agreement between PT ____________, a company in Indonesia (the Customer), and XXX, a Korean company (the Provider). The agreement outlines the terms under which the Provider will provide logistics management and monitoring services for the Customer's operations in Korea. Specifically, the Provider will liaise with the Customer's logistics contractor, oversee the Customer's logistics activities and needs, and provide regular reports. In exchange, the Customer will pay the Provider a monthly fee of 5% of the total delivery cost. The agreement has a set term and can be terminated early for non-performance or other specified reasons. It also includes standard provisions regarding confidentiality, dispute resolution, and governing law.
The document discusses propagation delay, rise/fall times, and transient response in digital circuits. It defines key timing parameters and describes how to model digital gates and wires as resistor-capacitor circuits to estimate delays. The RC model approximates transistor behavior with average resistance and capacitance values. Delay is calculated using techniques like Elmore delay, which sums the resistive and capacitive contributions of each node in the circuit. Examples show how to apply these techniques to calculate delays for common circuit structures.
Tra le linee di ricerca di greenLIFE, la depilazione ossidativa portata su scala industriale nella relazione di Roberto Mecenero di Conceria Dani durante il convegno #greenleather2017
Tra le linee di ricerca di greenLIFE, la depilazione ossidativa portata su scala industriale nella relazione di Roberto Mecenero di Conceria Dani durante il convegno #greenleather2017
10. SISTEMA BICARBONATO
LA CONCENTRAZIONE DELL’ ACIDO CONIUGATO
NEL SANGUE, PUO’ AUMENTARE O DIMINUIRE IN
FUNZIONE:
1. DEGLI ATTI RESPIRATORI
2. DELL’ ATTIVITA’ RENALE
18. RENE
Aumenta la pCO2 intracellulare quindi
aumenta la formazione ex-novo di HCO3
che viene riversata nel sangue e aumenta
L’ ESCREZIONE DI H+ nel tubulo
21. RENE
Diminuisce la pCO2 intracellulare quindi diminuisce la
formazione ex-novo di HCO3 che viene riversata nel
sangue e DIMINUISCE L’ ESCREZIONE DI H+ nel
tubulo
22.
23. ACIDOSI METABOLICA
• POLMONI Iperventilano CO2
• RENE Diminuisce la pCO2 intracellulare
quindi diminuisce la formazione ex-novo di HCO3
che viene riversata nel sangue e
DIMINUISCE L’ESCREZIONE DI H+ nel tubulo
24.
25. ALCALOSI METABOLICA
• POLMONI Ipoventilano CO2
• RENI Aumenta la pCO2 intracellulare quindi aumenta la
formazione ex-novo di HCO3 che viene riversata
nel sangue e AUMENTA L’ ESCREZIONE DI H+
nel tubulo
