The document discusses placement algorithms used in circuit design. It describes the min-cut placement algorithm which partitions the layout surface and circuit into halves recursively to minimize wirelength. Terminal propagation is discussed to address limitations of min-cut by considering terminal pin positions. Placement by simulated annealing is also summarized, using neighborhood structures and cost functions to iteratively improve placement quality as temperature decreases.
IJERA (International journal of Engineering Research and Applications) is International online, ... peer reviewed journal. For more detail or submit your article, please visit www.ijera.com
An Investigation of Self-Interference Reduction Strategy in Correlated SM-OFD...Rosdiadee Nordin
R. Nordin, M. Ismail, "An Investigation of Self-Interference Reduction Strategy in Correlated SM-OFDMA Systems", Proceedings of 17th Asia-Pasific Conference on Communications. APCC 2011, Oct. 2011
IJERA (International journal of Engineering Research and Applications) is International online, ... peer reviewed journal. For more detail or submit your article, please visit www.ijera.com
IJERA (International journal of Engineering Research and Applications) is International online, ... peer reviewed journal. For more detail or submit your article, please visit www.ijera.com
An Investigation of Self-Interference Reduction Strategy in Correlated SM-OFD...Rosdiadee Nordin
R. Nordin, M. Ismail, "An Investigation of Self-Interference Reduction Strategy in Correlated SM-OFDMA Systems", Proceedings of 17th Asia-Pasific Conference on Communications. APCC 2011, Oct. 2011
IJERA (International journal of Engineering Research and Applications) is International online, ... peer reviewed journal. For more detail or submit your article, please visit www.ijera.com
In this presentation on External Thermal Resistance we will look at the thermal resistance of various substrate types, thermal management with printed circuit boards, and examples that compare the thermal resistance of various substrate technologies.
Expert Design & Empirical Test Strategies for Practical Transformer DevelopmentRAF Tabtronics LLC
Expert Design & Empirical Test Strategies for Practical Transformer Development presented by Mr. Victor QUINN of RAF Tabtronics LLC at the 2012 Applied Power Electronics Conference (APEC).
Algorithm for Multi-Path Hop-By-Hop RoutingJens Oberender
The next generation internet provides resilient wide area networking. Resilience is the ability to resist outer influences such as link failures. During routing protocols reorganize the communication paths after a topology change, data loss can occur. Using multiple paths, network operation can continue after failure detection.
This work examines Multi-Path Hop-by-Hop routing where any single link failure can be locally recovered. We produce acyclic routing graphs for destination-based routing. Our approach results in two edge sets: active and reserve links. Active edges provide an acyclic graph embedding a spanning tree. Any failure that is not covered by redundant active edges is recovered by inserting a reserve edge. We guarantee recovery of the first link failure event and then seamlessly restore a HammockSet for the new topology.
Two similar approaches have been published. The O2-algorithm derived out of the project ”Key Components for the Mobile Internet of Next Generation” [Sch01] and constructs thin Hammock-Sets but is restricted to certain topologies. The MPA-algorithm [Nar00] succeeds on any topology, yet it cannot provide redundancy to all nodes. We specify topologies that allow stand-by recovery to all nodes and destinations, while we construct edge-maximized HammockSets.
For evaluation we introduce link significance, a measure for the forwarding function of inner HammockSet nodes. A heuristic algorithm optimizes the HammockSet layout for traffic distribution. It restricts the number of HammockSets on one network edge, increasing the bandwidth fraction available to the participating HammockSets.
A prototype implementation has been part of this work. It constructs HammockSets for any
destination node of a topology. The final chapter discusses the feasibility of implementing our approach in real-world systems. Further, we point out possibilities for future work.
In this presentation on External Thermal Resistance we will look at the thermal resistance of various substrate types, thermal management with printed circuit boards, and examples that compare the thermal resistance of various substrate technologies.
Expert Design & Empirical Test Strategies for Practical Transformer DevelopmentRAF Tabtronics LLC
Expert Design & Empirical Test Strategies for Practical Transformer Development presented by Mr. Victor QUINN of RAF Tabtronics LLC at the 2012 Applied Power Electronics Conference (APEC).
Algorithm for Multi-Path Hop-By-Hop RoutingJens Oberender
The next generation internet provides resilient wide area networking. Resilience is the ability to resist outer influences such as link failures. During routing protocols reorganize the communication paths after a topology change, data loss can occur. Using multiple paths, network operation can continue after failure detection.
This work examines Multi-Path Hop-by-Hop routing where any single link failure can be locally recovered. We produce acyclic routing graphs for destination-based routing. Our approach results in two edge sets: active and reserve links. Active edges provide an acyclic graph embedding a spanning tree. Any failure that is not covered by redundant active edges is recovered by inserting a reserve edge. We guarantee recovery of the first link failure event and then seamlessly restore a HammockSet for the new topology.
Two similar approaches have been published. The O2-algorithm derived out of the project ”Key Components for the Mobile Internet of Next Generation” [Sch01] and constructs thin Hammock-Sets but is restricted to certain topologies. The MPA-algorithm [Nar00] succeeds on any topology, yet it cannot provide redundancy to all nodes. We specify topologies that allow stand-by recovery to all nodes and destinations, while we construct edge-maximized HammockSets.
For evaluation we introduce link significance, a measure for the forwarding function of inner HammockSet nodes. A heuristic algorithm optimizes the HammockSet layout for traffic distribution. It restricts the number of HammockSets on one network edge, increasing the bandwidth fraction available to the participating HammockSets.
A prototype implementation has been part of this work. It constructs HammockSets for any
destination node of a topology. The final chapter discusses the feasibility of implementing our approach in real-world systems. Further, we point out possibilities for future work.
Routing in Integrated circuits is an important task which requires extreme care while placing the modules and circuits and connecting them with each other.
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Placement
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• The process of arranging the circuit components on a layout surface.
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• Inputs: A set of fixed modules, a netlist.
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R
. c
• Goal: Find the best position for each module on the chip according to
ld
O
appropriate cost functions.
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– Considerations: routability/channel density, wirelength, cut size,
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w
performance, thermal issues, I/O pads.
tu D B C A
U
jn
1 2 1 3
.
T
1
w
E F G H
5 5 6
3 5
w
2
N
Density = 2 (2 tracks required)
7 8
3
w 4 6 8 4
J
6 A B C D
4
8 7 2 7
E F G H
wirelength = 10 wirelength = 12
Shorter wirelength, 3 tracks required.
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Estimation of Wirelength
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• Semi-perimeter method: Half the perimeter of the bounding rectangle
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approximation!
o m
that encloses all the pins of the net to be connected. Most widely used
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.c
• Complete graph: Since #edges in a complete graph ( n(n−1) ) is n
ld
× #
O
2 2
or
2
of tree edges (n − 1), wirelength ≈ n (i,j)∈net dist(i, j).
W
tu
and then to the next closest, etc. w
• Minimum chain: Start from one vertex and connect to the closest one,
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. jn
• Source-to-sink connection: Connect one pin to all other pins of the
T
net. Not accurate for uncongested chips.
w w
N
• Steiner-tree approximation: Computationally expensive.
w
J
• Minimum spanning tree
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4
D
10 7
7 8 8
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3 3
3
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R
. c 3
ld
4
O
or
semi−perimeter len = 11 complete graph len * 2/n = 17.5 chain len = 14
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tu w
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. jn
T
8
w
10
w 7
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3 4 3
w
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3
4
source−to−sink len = 17 Steiner tree len = 12 Spanning tree len = 13
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Min-Cut Placement
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• Breuer, “A class of min-cut placement algorithms,” DAC-77.
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• Quadrature: suitable for circuits with high density in the center.
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• Bisection: good for standard-cell placement.
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ld
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• Slice/Bisection: good for cells with high interconnection on the periphery.
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3a 2a 2
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1
3c
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4
5
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3b 2b 6
.
3d 7
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4a 2 4b 6a 5a 6b 4 6c 5b 6d 10a 9a10b8 10c 9b 10d
w
N
n/2 C2
n/2 n/4 n/k n/k
w n/4 C2
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C1
C1 C1 n/4 n/k
n/4 C2
n/2 n/2 n/2
(k−1)n/k (k−2)n/k
quadrature bisection slice/bisection
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Algorithm for Min-Cut Placement
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Algorithm: Min Cut Placement(N, n, C)
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/* N : the layout surface */
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R
/* n: # of cells to be placed */
/* n0 : # of cells in a slot */
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ld
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/* C: the connectivity matrix */
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1
2
begin
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if (n ≤ n0 ) then PlaceCells(N, n, C);
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jn
3 else
4
.
(N1 , N2 ) ← CutSurface(N );
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5
w
6
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(n1 , C1 ), (n2 , C2 ) ← Partition(n, C);
Call Min Cut Placement(N1 , n1 , C1 );
N
7 Call Min Cut Placement(N2 , n2 , C2 );
w end
J
8
4
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Quadrature Placement Example
D
• Apply K-L heuristic to partition + Quadrature Placement: Cost C1 = 4, C2L = C2R = 2,
etc.
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P
Q
2 4
7
8
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R
c
1 14 Q1
5 12
ld .
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R
or
3
9 13
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6
w
16 Q2
tu
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n 10 15 Q3
.j
T
w w P 2 4 8 14 O1
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C4a C4a
w 2,4,5,7 8,12,13,14 5 7 12 13
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C2 C2 C2
1,3,6,9 10,11,15,16 Q 1 9 11 16 O2
C4b C4b
3 6 10 15 O3
C1 R
C3a C1 C3b
5
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Min-Cut Placement with Terminal Propagation
D
• Dunlop & Kernighan, “A procedure for placement of standard-cell VLSI
L
circuits,” IEEE TCAD, Jan. 1985.
o m
R
. c
• Drawback of the original min-cut placement: Does not consider the
ld
O
positions of terminal pins that enter a region.
or
– What happens if we swap {1, 3, 6, 9} and {2, 4, 5, 7} in the previous
W
example?
tu w prefer to have them in R1
U
S
. jn S
T
L1
w w L1 R1
N
w R
J
L2 L2 R2
6
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Terminal Propagation
D
• We should use the fact that s is in L1 !
center dummy cell
L
s s p
o m
R
L1
p R1 L1
. c R1
ld
O
or
L2 R2 L2 R2
W
Lower cost
tu w higher cost
P will stay in R1 for the rest of partitioning!
U
. jn
• When not to use p to bias partitioning? Net s has cells in many groups?
minimum rectilinear
T
w w Steiner tree
N
p p2
w
p1
p
J
R
h h/3 h h/3
L
p3
Don’t use p to bias the
solution in either direction! Use p! G
7
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Terminal Propagation Example
D
• Partitioning must be done breadth-first, not depth-first.
L
a S
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R
b S
a
. c b
ld
O
c
or
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d
tu w c d
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. jn
T
C1 C1 C1 C1
w w
N
p1 c b
a b a b L1 a
L1 R1
b R1
L
w R L R
J
L2
c d c d L2 c d R2 a d R2
unbiased partition with terminal without terminal
of R propagation propagation
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Placement by Simulated Annealing
D
• Sechen and Sangiovanni-Vincentelli, “The TimberWolf placement and
L
o m
routing package,” IEEE J. Solid-State Circuits, Feb. 1985; “TimberWolf
3.2: A new standard cell placement and global routing package,” DAC-
R
86.
.c
ld
O
or
• TimberWolf: Stage 1
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– Modules are moved between different rows as well as within the same
row.
tu w
U
jn
– Modules overlaps are allowed.
.
– When the temperature is reached below a certain value, stage 2
T
begins.
w w
N
• TimberWolf: Stage 2
w
J
– Remove overlaps.
– Annealing process continues, but only interchanges adjacent modules
within the same row.
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Solution Space & Neighborhood Structure
D
• Solution Space: All possible arrangements of the modules into rows,
L
possibly with overlaps.
o m
R
• Neighborhood Structure: 3 types of moves
.c
ld
O
– M1 : Displace a module to a new location.
– M2 : Interchange two modules.
or
W
w
– M3 : Change the orientation of a module.
tu
U
. jn 1 2 2 1
T
w w 3 4
N
4 3
overlap
w
J
M1 M2 M3
10
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Neighborhood Structure
D
• TimberWolf first tries to select a move between M1 and M2 : P rob(M1 ) = 0.8, P rob(M2 ) =
0.2.
L
module will be chosen with probability 0.1.
o m
• If a move of type M1 is chosen and it is rejected, then a move of type M3 for the same
R
.c
• Restrictions: (1) what row for a module can be displaced? (2) what pairs of modules
ld
O
can be interchanged?
• Key: Range Limiter
or
W
tu w
– At the beginning, (WT , HT ) is very large, big enough to contain the whole chip.
– Window size shrinks slowly as the temperature decreases. Height and width ∝
U
jn
log(T ).
.
– Stage 2 begins when window size is so small that no inter-row module interchanges
T
are possible.
w w
N
w W
J
T
H
T
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Cost Function
D
• Cost function: C = C1 + C2 + C3.
L
• C1 : total estimated wirelength.
o m
R
c
– C1 = (αi wi + βi hi )
.
i∈N ets
ld
– αi , βi are horizontal and vertical weights, respectively. (αi = 1, βi = 1 ⇒ 1 × perime-
O
2
or
ter of the bounding box of Net i.)
W
– Critical nets: Increase both αi and βi .
βi < αi .
tu w
– If vertical wirings are “cheaper” than horizontal wirings, use smaller vertical weights:
U
. jn
• C2 : penalty function for module overlaps.
T
w
– C2 = γ 2
Oij , γ: penalty weight.
i=j
w
N
– Oij : amount of overlaps in the x-dimension between modules i and j.
w
• C3 : penalty function that controls the row length.
J
– C2 = δ r∈Rows
|Lr − Dr |, δ: penalty weight.
– Dr : desired row length.
– Lr : sum of the widths of the modules in row r.
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Annealing Schedule
D
• Tk = rk Tk−1 , k = 1, 2, 3, . . .
L
m
• rk increases from 0.8 to max value 0.94 and then decreases to 0.8.
o
R
• At each temperature, a total # of nP attempts is made.
.c n: # of
ld
O
modules; P : user specified constant.
• Termination: T < 0.1.
or
W
tu w
U
. jn
T
w w
N
w
J 13
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