This document provides instructions for Laboratory Assignment 2 for the course CMPE 118/218 Introduction to Mechatronics. The assignment involves designing, building, and programming a simple motorized platform using SolidWorks, CorelDraw, and a laser cutter. Students must complete three parts: 1) designing the platform components in CAD software; 2) cutting out parts from foamcore and MDF using the laser cutter; and 3) building a working detector circuit to control the motors.
OverviewYou will provide a comprehensive and detailed manual .docxgerardkortney
Overview:
You will provide a comprehensive and detailed manual documenting the step-by-step process for building a computer using the components provided in LabSim 14.1: “Build a Computer from Scratch.” The manual will be used by entry-level technicians, so it should be clear, concise, and formatted using the IEEE citation style, with screenshots of each step from LabSim 14.1. Your manual should be similar to step-by-step instructions on How to Change the Oil in Your Car. In this example, not only is each step described in detail, but also there is a visual representation of each step. Keep in mind that your manual will be used as a guide for new technicians.
The manual should not document how to complete a LabSim section; rather, it should provide detailed instructions on how to build an actual computer for a potential customer:
"Drag the motherboard from the shelf to the motherboard plate in the system case."
"After properly grounding yourself, pick up the motherboard and place it inside the area where the motherboard will sit in the case. Align the screw holes on the motherboard with the screw holes on the case. Use appropriate screws to mount the motherboard inside the case, making sure not to scratch the surface of the motherboard."
To learn how you will be assessed on this assignment, please take a moment to review the rubric.
The manual will be submitted in three parts. Each part includes: Part 1 (Sections 1-5), Part 2 (Sections 6-10), and Part 3 (Sections 11-12).
Computer Requirements:
· motherboard with Socket 1366
· power supply that supports the specified motherboard
· fastest processor possible (available on the shelf and compatible with the motherboard)
· maximum memory possible
· fastest hard drive possible
· CD-DVD drive with fastest connection to the motherboard
best video card available (available on the shelf and compatible with the motherboard)
Manual Sections
In addition to including the sections listed below, your manual should
· address the environment in which the computer build will take place. For example, what are the best practices when working in a carpeted room?
· not use computer jargon. Although the manual will be used to train new technicians, it may also be used by someone with limited computer knowledge, so the manual must be easy to understand.
· include explanations on methodology. For example, why is it important to use an antistatic grounding bracelet when working with the computer? Or why is it important to install memory sticks in pairs?
1 Workspace Preparation (LabSim 1.0)
2 Installing Motherboard (LabSim 3.3)
3 Installing Power Supply (LabSim 3.2)
4 Installing CPU (LabSim 3.4 and 3.10)
5 Installing RAM (LabSim 3.5)
6 Installing Hard Drive (LabSim 5.4)
7 Installing Optical Drive (LabSim 5.6)
8 Installing Video Card (LabSim 3.8)
9 Connecting Monitors, Keyboard, and Mouse (LabSim 4.0)
10 BIOS Configuration (LabSim 3.6)
11 Installing Windows 7 (LabSim 10.3)
Configuring Critical Windows Features (La.
EELE 5331 Digital ASIC DesignLab ManualDr. Yushi Zhou.docxtoltonkendal
EELE 5331: Digital ASIC Design
Lab Manual
Dr. Yushi Zhou
Department of Electrical Engineering
Lakehead University
Thunder Bay, Ontario, Canada
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2 MOSFET Devices and Layout Tutorial . . . . . . . . . . . . . 4
2.1 Prepare For Schematic . . . . . . . . . . . . . . . . . . 4
2.2 Perform Simulation . . . . . . . . . . . . . . . . . . . . 7
2.3 Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.4 Layout Veri�cation . . . . . . . . . . . . . . . . . . . . 17
2.5 Report . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2.6 How to understand DRC error report . . . . . . . . . . 26
3 CMOS Inverter . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.1 Design speci�cations . . . . . . . . . . . . . . . . . . . 27
3.2 Lab Procedure . . . . . . . . . . . . . . . . . . . . . . 29
3.3 Report . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
1
EELE5331:Digital ASIC Design [email protected]
1 Introduction
This lab manual is an essential components of EELE5331: Digital ASIC
Design, o�ered by Dr. Yushi Zhou. The lab works consists of schematic
entry, symbol generation, pre-layout simulation, layout, physical and logic
veri�cation, extraction and post-layout simulation for the design. All the
students are required to submit individual lab report before the deadline.
All reports must be typed and professionally prepared. The content that
needs to be included in the report are given at the end of each lab. There
are total three labs, and each part will be released before the lab starts.
• Lab 1: MOSFET devices and layout tutorial
• Lab 2: CMOS Inverter
• Lab 3: CMOS Digital Logic Circuits
It should be noted that the students are not limited to the assigned lab
time, which may not be enough to complete the lab. Students are expected
to work on the lab during their free time if that case is required. You may
use remote log-in to complete the labs.
TSMC CMOS 180 nm technology process design kit (PDK) is a 1-Poly,
6-Metal technology, with a maximum supply voltage of 1.8 V for thin oxide
devices and 3.3 V for thick oxide devices. This process is suitable for design-
ing analog, digital, RF and mixed-signal circuits and systems. In this course,
all the labs are designed based upon CMOS 180 nm process. The computer-
aided design (CAD) tools that are adopted in this course are from Cadence
Design Systems for the purpose of schematic entry, simulation, implemen-
tation and veri�cation. The Cadence custom IC design platform provides
a graphical interface for various stages in the design �ow. An overview of
the design �ow and which tools are involved in each stage is shown in Fig.1.
As you may notice that there are loops, indicating iterative procedures. For
instance, if the physical layout does not pass design rules check or LVS check,
Page 2
EELE5331:Digital ASIC Design [email protected]
the modi�cation of.
Instructions 3-5 pages double space research paper about Eric Sc.docxnormanibarber20063
Instructions
3-5 pages double space research paper about Eric Schmidt (Google)
High profile manager CEOs. Please include information about this person’s personal and professional background, management style and skills and research about why this person is (or is not) such an effective manager/leader. You should utilize at least three articles dated from 2008 to present as references.
Paper should contain the following:
· Title page
· An introduction3-5 pages (double-spaced, no more than 12 pt. font) of cited research in APA format.
· A conclusion
· Reference page in APA format (Including at least three articles on management dated from 2008 to present)
Paper should include three sections: the Title Page, Main Body, and References. An Abstract in not necessary for this paper.
EECE237/ATT00001.htm
__MACOSX/EECE237/._ATT00001.htm
EECE237/ATT00002.htm
__MACOSX/EECE237/._ATT00002.htm
EECE237/ATT00003.htm
__MACOSX/EECE237/._ATT00003.htm
EECE237/ATT00004.htm
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EECE237/ATT00005.htm
__MACOSX/EECE237/._ATT00005.htm
EECE237/Lab 01 Notes.pdf
EECE 237 Lab 01 Setup Notes
Fall Semester 2016
I. Communicate with the Launchpad by PuTTY in your PC.
From Computer Management of your Microsoft Windows, check which COM port is
connected with your Launchpad.
For example, the following case (a PC running Windows 10) shows it is COM3.
Open PuTTY, choose “serial” for the connection mode. Set the “Serial Line” to the port you
are using, and set the “Speed” to 115200.
II. Tiva Software (TivaWare for C series)
http://www.ti.com/tool/sw-tm4c
Install “SW-TM4C-2.1.3.156”. The Keil RealView MDK is now ARMKeil MDK. If the installed
TivaWare locates in C:\ti, the example “Hello” project is in “C:\ti\TivaWare_C_Series-
2.1.3.156\examples\boards\ek-tm4c123gxl”.
http://www.ti.com/tool/sw-tm4c
__MACOSX/EECE237/._Lab 01 Notes.pdf
EECE237/Lab Preparation Notes.pdf
EECE 237 Lab 01 Preparation Notes
Fall Semester 2016
I. Install Keil Toolchain on your PC
The following steps describe installation of ARM Keil toolchain, the MDK ARM (MDK is the
abbreviation of Microcontroller Development Kit). It is highly recommended that you have access to a
PC or a laptop running Windows 7, 8, or 10. The functioning of the toolchain is not tested in Mac or
Linux boxes. Screenshots were captured from an installation in a Windows 10 PC.
1. Fill out the form at
https://www.keil.com/demo/eval/armv4.htm
Notice that we use version 4.74. Set your Company to California State University, Chico. Set your
device to TM4C123. It should not cost any money. You can select or not select whether you
want email from ARMKeil.
Submit the form after you finish it.
2. You will see a download link similar to the following:
Download the software MDK474.EXE.
3. Run the MDK474.EXE file. Install the application in some place that is easy to find, for example
C:\Keil or D:\Keil.
https://www.keil.com/de.
A new model assembly tool for chassis at ScaniaAltair
The shortening of the current development cycles for commercial vehicles puts a higher focus on virtual testing compared to physical testing. At the same time, more items are subject to testing requirements in order to increase the quality of the vehicles and new markets introduce new requirements on the same vehicles. All these factors increase the demand for simulation at Scania along with the expressed goal to integrate virtual simulation into the product development cycle much more explicitly than before.
In order to meet the new demands for both more accurate and also a higher number of simulations, the chassis simulation department has looked into updating the assembly tool that started to be developed, together with Altair, in 2006.
The new tool has been developed together with Altair since the end of 2013 with the expressed goal to use a lot of the new core functionalities that are available within the HyperMesh software of today and keep the customisation to a minimum. This presentation is aimed to present the current status of the tool and some of the challenges that are still ahead of us.
Speakers
Niklas Torstensson, Scania VC AB
FEATool Multiphysics Matlab FEM and CFD Toolbox - v1.6 Quickstart GuideFEATool Multiphysics
FEATool Multiphysics v1.6 Quickstart Guide
FEATool Multiphysics is a fully integrated and easy to use Matlab Multiphysics PDE and FEM Finite Element Analysis simulation toolbox, featuring built-in support for heat transfer, computational fluid dynamics CFD, chemical and reaction engineering, and structural mechanics modeling and simulation.
Visit https://www.featool.com for more information.
We will go through how to analyze a design with Simulation CFD from beginning to end. We will start at the Inventor model and end at visualizing the results. In addition to seeing the actual workflow we will talk about how simulation tools can be used throughout the life of a design project, from early concept to final testing.
OverviewYou will provide a comprehensive and detailed manual .docxgerardkortney
Overview:
You will provide a comprehensive and detailed manual documenting the step-by-step process for building a computer using the components provided in LabSim 14.1: “Build a Computer from Scratch.” The manual will be used by entry-level technicians, so it should be clear, concise, and formatted using the IEEE citation style, with screenshots of each step from LabSim 14.1. Your manual should be similar to step-by-step instructions on How to Change the Oil in Your Car. In this example, not only is each step described in detail, but also there is a visual representation of each step. Keep in mind that your manual will be used as a guide for new technicians.
The manual should not document how to complete a LabSim section; rather, it should provide detailed instructions on how to build an actual computer for a potential customer:
"Drag the motherboard from the shelf to the motherboard plate in the system case."
"After properly grounding yourself, pick up the motherboard and place it inside the area where the motherboard will sit in the case. Align the screw holes on the motherboard with the screw holes on the case. Use appropriate screws to mount the motherboard inside the case, making sure not to scratch the surface of the motherboard."
To learn how you will be assessed on this assignment, please take a moment to review the rubric.
The manual will be submitted in three parts. Each part includes: Part 1 (Sections 1-5), Part 2 (Sections 6-10), and Part 3 (Sections 11-12).
Computer Requirements:
· motherboard with Socket 1366
· power supply that supports the specified motherboard
· fastest processor possible (available on the shelf and compatible with the motherboard)
· maximum memory possible
· fastest hard drive possible
· CD-DVD drive with fastest connection to the motherboard
best video card available (available on the shelf and compatible with the motherboard)
Manual Sections
In addition to including the sections listed below, your manual should
· address the environment in which the computer build will take place. For example, what are the best practices when working in a carpeted room?
· not use computer jargon. Although the manual will be used to train new technicians, it may also be used by someone with limited computer knowledge, so the manual must be easy to understand.
· include explanations on methodology. For example, why is it important to use an antistatic grounding bracelet when working with the computer? Or why is it important to install memory sticks in pairs?
1 Workspace Preparation (LabSim 1.0)
2 Installing Motherboard (LabSim 3.3)
3 Installing Power Supply (LabSim 3.2)
4 Installing CPU (LabSim 3.4 and 3.10)
5 Installing RAM (LabSim 3.5)
6 Installing Hard Drive (LabSim 5.4)
7 Installing Optical Drive (LabSim 5.6)
8 Installing Video Card (LabSim 3.8)
9 Connecting Monitors, Keyboard, and Mouse (LabSim 4.0)
10 BIOS Configuration (LabSim 3.6)
11 Installing Windows 7 (LabSim 10.3)
Configuring Critical Windows Features (La.
EELE 5331 Digital ASIC DesignLab ManualDr. Yushi Zhou.docxtoltonkendal
EELE 5331: Digital ASIC Design
Lab Manual
Dr. Yushi Zhou
Department of Electrical Engineering
Lakehead University
Thunder Bay, Ontario, Canada
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2 MOSFET Devices and Layout Tutorial . . . . . . . . . . . . . 4
2.1 Prepare For Schematic . . . . . . . . . . . . . . . . . . 4
2.2 Perform Simulation . . . . . . . . . . . . . . . . . . . . 7
2.3 Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.4 Layout Veri�cation . . . . . . . . . . . . . . . . . . . . 17
2.5 Report . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2.6 How to understand DRC error report . . . . . . . . . . 26
3 CMOS Inverter . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.1 Design speci�cations . . . . . . . . . . . . . . . . . . . 27
3.2 Lab Procedure . . . . . . . . . . . . . . . . . . . . . . 29
3.3 Report . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
1
EELE5331:Digital ASIC Design [email protected]
1 Introduction
This lab manual is an essential components of EELE5331: Digital ASIC
Design, o�ered by Dr. Yushi Zhou. The lab works consists of schematic
entry, symbol generation, pre-layout simulation, layout, physical and logic
veri�cation, extraction and post-layout simulation for the design. All the
students are required to submit individual lab report before the deadline.
All reports must be typed and professionally prepared. The content that
needs to be included in the report are given at the end of each lab. There
are total three labs, and each part will be released before the lab starts.
• Lab 1: MOSFET devices and layout tutorial
• Lab 2: CMOS Inverter
• Lab 3: CMOS Digital Logic Circuits
It should be noted that the students are not limited to the assigned lab
time, which may not be enough to complete the lab. Students are expected
to work on the lab during their free time if that case is required. You may
use remote log-in to complete the labs.
TSMC CMOS 180 nm technology process design kit (PDK) is a 1-Poly,
6-Metal technology, with a maximum supply voltage of 1.8 V for thin oxide
devices and 3.3 V for thick oxide devices. This process is suitable for design-
ing analog, digital, RF and mixed-signal circuits and systems. In this course,
all the labs are designed based upon CMOS 180 nm process. The computer-
aided design (CAD) tools that are adopted in this course are from Cadence
Design Systems for the purpose of schematic entry, simulation, implemen-
tation and veri�cation. The Cadence custom IC design platform provides
a graphical interface for various stages in the design �ow. An overview of
the design �ow and which tools are involved in each stage is shown in Fig.1.
As you may notice that there are loops, indicating iterative procedures. For
instance, if the physical layout does not pass design rules check or LVS check,
Page 2
EELE5331:Digital ASIC Design [email protected]
the modi�cation of.
Instructions 3-5 pages double space research paper about Eric Sc.docxnormanibarber20063
Instructions
3-5 pages double space research paper about Eric Schmidt (Google)
High profile manager CEOs. Please include information about this person’s personal and professional background, management style and skills and research about why this person is (or is not) such an effective manager/leader. You should utilize at least three articles dated from 2008 to present as references.
Paper should contain the following:
· Title page
· An introduction3-5 pages (double-spaced, no more than 12 pt. font) of cited research in APA format.
· A conclusion
· Reference page in APA format (Including at least three articles on management dated from 2008 to present)
Paper should include three sections: the Title Page, Main Body, and References. An Abstract in not necessary for this paper.
EECE237/ATT00001.htm
__MACOSX/EECE237/._ATT00001.htm
EECE237/ATT00002.htm
__MACOSX/EECE237/._ATT00002.htm
EECE237/ATT00003.htm
__MACOSX/EECE237/._ATT00003.htm
EECE237/ATT00004.htm
__MACOSX/EECE237/._ATT00004.htm
EECE237/ATT00005.htm
__MACOSX/EECE237/._ATT00005.htm
EECE237/Lab 01 Notes.pdf
EECE 237 Lab 01 Setup Notes
Fall Semester 2016
I. Communicate with the Launchpad by PuTTY in your PC.
From Computer Management of your Microsoft Windows, check which COM port is
connected with your Launchpad.
For example, the following case (a PC running Windows 10) shows it is COM3.
Open PuTTY, choose “serial” for the connection mode. Set the “Serial Line” to the port you
are using, and set the “Speed” to 115200.
II. Tiva Software (TivaWare for C series)
http://www.ti.com/tool/sw-tm4c
Install “SW-TM4C-2.1.3.156”. The Keil RealView MDK is now ARMKeil MDK. If the installed
TivaWare locates in C:\ti, the example “Hello” project is in “C:\ti\TivaWare_C_Series-
2.1.3.156\examples\boards\ek-tm4c123gxl”.
http://www.ti.com/tool/sw-tm4c
__MACOSX/EECE237/._Lab 01 Notes.pdf
EECE237/Lab Preparation Notes.pdf
EECE 237 Lab 01 Preparation Notes
Fall Semester 2016
I. Install Keil Toolchain on your PC
The following steps describe installation of ARM Keil toolchain, the MDK ARM (MDK is the
abbreviation of Microcontroller Development Kit). It is highly recommended that you have access to a
PC or a laptop running Windows 7, 8, or 10. The functioning of the toolchain is not tested in Mac or
Linux boxes. Screenshots were captured from an installation in a Windows 10 PC.
1. Fill out the form at
https://www.keil.com/demo/eval/armv4.htm
Notice that we use version 4.74. Set your Company to California State University, Chico. Set your
device to TM4C123. It should not cost any money. You can select or not select whether you
want email from ARMKeil.
Submit the form after you finish it.
2. You will see a download link similar to the following:
Download the software MDK474.EXE.
3. Run the MDK474.EXE file. Install the application in some place that is easy to find, for example
C:\Keil or D:\Keil.
https://www.keil.com/de.
A new model assembly tool for chassis at ScaniaAltair
The shortening of the current development cycles for commercial vehicles puts a higher focus on virtual testing compared to physical testing. At the same time, more items are subject to testing requirements in order to increase the quality of the vehicles and new markets introduce new requirements on the same vehicles. All these factors increase the demand for simulation at Scania along with the expressed goal to integrate virtual simulation into the product development cycle much more explicitly than before.
In order to meet the new demands for both more accurate and also a higher number of simulations, the chassis simulation department has looked into updating the assembly tool that started to be developed, together with Altair, in 2006.
The new tool has been developed together with Altair since the end of 2013 with the expressed goal to use a lot of the new core functionalities that are available within the HyperMesh software of today and keep the customisation to a minimum. This presentation is aimed to present the current status of the tool and some of the challenges that are still ahead of us.
Speakers
Niklas Torstensson, Scania VC AB
FEATool Multiphysics Matlab FEM and CFD Toolbox - v1.6 Quickstart GuideFEATool Multiphysics
FEATool Multiphysics v1.6 Quickstart Guide
FEATool Multiphysics is a fully integrated and easy to use Matlab Multiphysics PDE and FEM Finite Element Analysis simulation toolbox, featuring built-in support for heat transfer, computational fluid dynamics CFD, chemical and reaction engineering, and structural mechanics modeling and simulation.
Visit https://www.featool.com for more information.
We will go through how to analyze a design with Simulation CFD from beginning to end. We will start at the Inventor model and end at visualizing the results. In addition to seeing the actual workflow we will talk about how simulation tools can be used throughout the life of a design project, from early concept to final testing.
Dev Dives: Train smarter, not harder – active learning and UiPath LLMs for do...UiPathCommunity
💥 Speed, accuracy, and scaling – discover the superpowers of GenAI in action with UiPath Document Understanding and Communications Mining™:
See how to accelerate model training and optimize model performance with active learning
Learn about the latest enhancements to out-of-the-box document processing – with little to no training required
Get an exclusive demo of the new family of UiPath LLMs – GenAI models specialized for processing different types of documents and messages
This is a hands-on session specifically designed for automation developers and AI enthusiasts seeking to enhance their knowledge in leveraging the latest intelligent document processing capabilities offered by UiPath.
Speakers:
👨🏫 Andras Palfi, Senior Product Manager, UiPath
👩🏫 Lenka Dulovicova, Product Program Manager, UiPath
Key Trends Shaping the Future of Infrastructure.pdfCheryl Hung
Keynote at DIGIT West Expo, Glasgow on 29 May 2024.
Cheryl Hung, ochery.com
Sr Director, Infrastructure Ecosystem, Arm.
The key trends across hardware, cloud and open-source; exploring how these areas are likely to mature and develop over the short and long-term, and then considering how organisations can position themselves to adapt and thrive.
UiPath Test Automation using UiPath Test Suite series, part 4DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 4. In this session, we will cover Test Manager overview along with SAP heatmap.
The UiPath Test Manager overview with SAP heatmap webinar offers a concise yet comprehensive exploration of the role of a Test Manager within SAP environments, coupled with the utilization of heatmaps for effective testing strategies.
Participants will gain insights into the responsibilities, challenges, and best practices associated with test management in SAP projects. Additionally, the webinar delves into the significance of heatmaps as a visual aid for identifying testing priorities, areas of risk, and resource allocation within SAP landscapes. Through this session, attendees can expect to enhance their understanding of test management principles while learning practical approaches to optimize testing processes in SAP environments using heatmap visualization techniques
What will you get from this session?
1. Insights into SAP testing best practices
2. Heatmap utilization for testing
3. Optimization of testing processes
4. Demo
Topics covered:
Execution from the test manager
Orchestrator execution result
Defect reporting
SAP heatmap example with demo
Speaker:
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
Kubernetes & AI - Beauty and the Beast !?! @KCD Istanbul 2024Tobias Schneck
As AI technology is pushing into IT I was wondering myself, as an “infrastructure container kubernetes guy”, how get this fancy AI technology get managed from an infrastructure operational view? Is it possible to apply our lovely cloud native principals as well? What benefit’s both technologies could bring to each other?
Let me take this questions and provide you a short journey through existing deployment models and use cases for AI software. On practical examples, we discuss what cloud/on-premise strategy we may need for applying it to our own infrastructure to get it to work from an enterprise perspective. I want to give an overview about infrastructure requirements and technologies, what could be beneficial or limiting your AI use cases in an enterprise environment. An interactive Demo will give you some insides, what approaches I got already working for real.
Let's dive deeper into the world of ODC! Ricardo Alves (OutSystems) will join us to tell all about the new Data Fabric. After that, Sezen de Bruijn (OutSystems) will get into the details on how to best design a sturdy architecture within ODC.
The Art of the Pitch: WordPress Relationships and SalesLaura Byrne
Clients don’t know what they don’t know. What web solutions are right for them? How does WordPress come into the picture? How do you make sure you understand scope and timeline? What do you do if sometime changes?
All these questions and more will be explored as we talk about matching clients’ needs with what your agency offers without pulling teeth or pulling your hair out. Practical tips, and strategies for successful relationship building that leads to closing the deal.
GraphRAG is All You need? LLM & Knowledge GraphGuy Korland
Guy Korland, CEO and Co-founder of FalkorDB, will review two articles on the integration of language models with knowledge graphs.
1. Unifying Large Language Models and Knowledge Graphs: A Roadmap.
https://arxiv.org/abs/2306.08302
2. Microsoft Research's GraphRAG paper and a review paper on various uses of knowledge graphs:
https://www.microsoft.com/en-us/research/blog/graphrag-unlocking-llm-discovery-on-narrative-private-data/
Slack (or Teams) Automation for Bonterra Impact Management (fka Social Soluti...Jeffrey Haguewood
Sidekick Solutions uses Bonterra Impact Management (fka Social Solutions Apricot) and automation solutions to integrate data for business workflows.
We believe integration and automation are essential to user experience and the promise of efficient work through technology. Automation is the critical ingredient to realizing that full vision. We develop integration products and services for Bonterra Case Management software to support the deployment of automations for a variety of use cases.
This video focuses on the notifications, alerts, and approval requests using Slack for Bonterra Impact Management. The solutions covered in this webinar can also be deployed for Microsoft Teams.
Interested in deploying notification automations for Bonterra Impact Management? Contact us at sales@sidekicksolutionsllc.com to discuss next steps.
Software Delivery At the Speed of AI: Inflectra Invests In AI-Powered QualityInflectra
In this insightful webinar, Inflectra explores how artificial intelligence (AI) is transforming software development and testing. Discover how AI-powered tools are revolutionizing every stage of the software development lifecycle (SDLC), from design and prototyping to testing, deployment, and monitoring.
Learn about:
• The Future of Testing: How AI is shifting testing towards verification, analysis, and higher-level skills, while reducing repetitive tasks.
• Test Automation: How AI-powered test case generation, optimization, and self-healing tests are making testing more efficient and effective.
• Visual Testing: Explore the emerging capabilities of AI in visual testing and how it's set to revolutionize UI verification.
• Inflectra's AI Solutions: See demonstrations of Inflectra's cutting-edge AI tools like the ChatGPT plugin and Azure Open AI platform, designed to streamline your testing process.
Whether you're a developer, tester, or QA professional, this webinar will give you valuable insights into how AI is shaping the future of software delivery.
State of ICS and IoT Cyber Threat Landscape Report 2024 previewPrayukth K V
The IoT and OT threat landscape report has been prepared by the Threat Research Team at Sectrio using data from Sectrio, cyber threat intelligence farming facilities spread across over 85 cities around the world. In addition, Sectrio also runs AI-based advanced threat and payload engagement facilities that serve as sinks to attract and engage sophisticated threat actors, and newer malware including new variants and latent threats that are at an earlier stage of development.
The latest edition of the OT/ICS and IoT security Threat Landscape Report 2024 also covers:
State of global ICS asset and network exposure
Sectoral targets and attacks as well as the cost of ransom
Global APT activity, AI usage, actor and tactic profiles, and implications
Rise in volumes of AI-powered cyberattacks
Major cyber events in 2024
Malware and malicious payload trends
Cyberattack types and targets
Vulnerability exploit attempts on CVEs
Attacks on counties – USA
Expansion of bot farms – how, where, and why
In-depth analysis of the cyber threat landscape across North America, South America, Europe, APAC, and the Middle East
Why are attacks on smart factories rising?
Cyber risk predictions
Axis of attacks – Europe
Systemic attacks in the Middle East
Download the full report from here:
https://sectrio.com/resources/ot-threat-landscape-reports/sectrio-releases-ot-ics-and-iot-security-threat-landscape-report-2024/
State of ICS and IoT Cyber Threat Landscape Report 2024 preview
Lab_2_2009
1. UNIVERSITY OF CALIFORNIA, SANTA CRUZ
BOARD OF STUDIES IN COMPUTER ENGINEERING
CMPE118/218/L: INTRODUCTION TO MECHATRONICS
LABORATORY ASSIGNMENT NUMBER 2 FOR CMPE 118/218
Due by 6:00pm on Wednesday, January 28, 2009
Pre-Lab Due by 12:00noon on Thursday, January 22, 2009
Purpose: This lab is intended to acquaint you with:
Using SolidWorks as a visualization tool.
Developing parts in SolidWorks/CorelDraw
Cutting parts using the Laser Cutter
Working in Foamcore
Assembling a working filter
Minimum Parts There is a selection of motors set out in the lab that you may use as the motors to develop your
Required: motor mounts. The motors are just for use as props in this lab. I want them back. Foamcore, 3/16”
MDF, hot-glue guns, hot-glue sticks, eXacto knifes, lots of blades.
For the circuit part, a small perf board (from BELS) and soldering station (provided) and/or wire-
wrap tools. BELS has the knifes and glue guns and glue sticks.
Note: In order to save on material costs, you should team up with AT LEAST one other person on
this lab (in order to get to know you classmates, team up with someone you have not worked with
before). You are responsible for providing you own materials.
Warning: razor blades are very sharp and will cut through your skin quite easily, hot glue won’t do
permanent damage, but it is very painful on the skin. BE CAREFUL.
Pre-Lab:
Complete the following exercises AFTER you have read through the lab assignment and BEFORE
starting to work on the parts of the lab.
0.1 ) Set yourself up at any workstation that has SolidWorks installed (all the machines in BE115
do) and follow the SolidWorks “getting started” tutorial included with the program under
HELP->SolidWorks Tutorials->Getting Started.
Note that we have 10 licensed copies of SolidWorks off the FlexLM server, do not leave it
running when you are not using it.
0.2) Look through the attached pages with the dimensions and drawings for a simple gearbox
assembly (there will be a physical one of these down in the lab). Watch the SolidWorks
tutorial lecture at:
http://www.soe.ucsc.edu/classes/cmpe118/Winter09/Videos/SolidWorks_Parts.avi
http://www.soe.ucsc.edu/classes/cmpe118/Winter09/Videos/Solidworks_Assembly.avi
These tutorials will walk you through the process of making the parts in SolidWorks, and
assembling them together. There are a few mistakes in the tutorial (see if you can find them).
The gear and pinion are on the website to download.
In the report: Include a dimensioned three view and shaded printout of the part from the tutorial in 0.2.
Part 1 Designing A Simple Motorized Platform
Reading: Fabulous Foamcore (on the website), CKO Ch. 26
Assignment: You are to design, capture the design and assemble a simple motorized platform. The platform
should have a flat base made from two layers of Foamcore and it should carry two DC gear-motors
2. CMPE 118/218 Lab Number 2 Due by 6:00 PM on January 28, 2009 2
and an H-Bridge Module (2.5” x 2.3” electronic part). The motors should be mounted to the base
using motor mounts constructed of Foamcore. The mounts should attach to the base using ‘Tab in
Slot’ construction. The motor mounts should provide more robust support than the simple planar
design shown in class. The H-Bridge Module should be attached to the top of the base near the
motors. Also mounted to the platform should be a 4.5” diameter 6” tall circular column,
constructed of foamcore and centered on the base. Sitting atop the column should be a smaller
platform, also made of foamcore. The platform should have the shape of a square box of about 1”
depth and be centered on the platform.
1.1) Using SolidWorks (or any other drafting program, SketchUp, Visio, CorelDraw, etc.) to
construct simple 3-D shapes to represent the base, motors, motor driver board, column and
platform. Create an assembly of these parts to explore how they will fit together.
1.2) Using the Fabulous Foamcore handout, and a sharp eXacto knife (be careful!), build the
foamcore box that will sit atop the platform. Use lap joints at the edges.
1.3) As above, build the foamcore column. Use a lap joint to close the column.
1.4) Figure out how you are going to attach the column to the base and to the platform. You may
want to do this BEFORE you actually build them.
1.5) Using SolidWorks, create the parts necessary to assemble the motor mounts that you
designed and mount them to the base. The finished base should be roughly circular with
recessed cutouts to provide room for 3” wheels to be mounted on the motors. You will need
to move the 2D shapes to CorelDraw for part 2 of this lab.
1.6) Using SolidWorks, create 3” wheels to be mounted on the motor shafts. These will need to
be at least three layers of foamcore, or two layers of MDF. You will need to move the 2D
shapes to CorelDraw for part 2 of this lab.
In the report: Include a printout of the model from part 1.1 and the individual parts from parts 1.5 and 1.6.
Part 2 Implementing A Simple Motorized Platform
Reading: CMPE-118 LaserCutter Handout
Assignment: Take the design that you created in Part 1 and implement a prototype of the platform.
2.1) Using the laser cutter handout (on the website), to be distributed later, and you printouts from
the above drafting part, to prepare your part designs for cutting using the laser cutter. (Note that
the laser cutter is driven from CorelDraw, so you will need to get your parts into that program).
NOTE: No Etching Allowed. Aside from markings in order to help you assemble parts, there
is no etching allowed on your designs. Remember that you will have to baby-sit your design
while it is being cut out, and that means you will have to wait.
WARNING: IT IS ABSOLUTELY UNACCEPTABLE TO LEAVE THE LASER CUTTER
UNATTENDED.
2.2) Have your output files reviewed by the instructor, tutors, or TA.
2.3) Cut the parts from 3/16” MDF (Medium Density Fiberboard), using the Laser Cutter.
2.4) Assemble the parts of the platform. Do not glue. Demonstrate it to the instructor, tutors, or
TA.
2.5) Fit/glue the parts together (NOT the motors). Demonstrate it to the instructor, tutors, or TA.
In the report: Include printouts of the SolidWorks/CorelDraw files that you created to help you cut out the
foamcore/MDF.
3. CMPE 118/218 Lab Number 2 Due by 6:00 PM on January 28, 2009 3
Part 3 Building Your Detector Circuit
Reading: None.
Assignment: Take the design that you created in Lab 1 and build a working version that you will use on your
final project.
3.1) Make sure you use a circuit that actually works well (talk to your classmates about this, see
whose design really worked well from Lab 2, and try to make one like it).
3.2) Have your design reviewed by the instructor, tutors, or TA. Make sure that your design
includes an LED to indicate when the beacon is detected. This will help with debugging later.
3.3) Do NOT dissemble you working one off of your protoboard, instead, replicate the design on
the perf board, and solder or wirewrap the parts together.
3.4) Test your assembly and make sure it works, if not, debug. Again, incremental development
here; build a little, test a little, build a little more, test a little more, until the whole thing
functions reliably. Test front to back and back to front in stages. Make sure there is an
indicator LED that helps to debug the circuit.
3.5) Demonstrate it to the instructor, tutors, or TA.
In the report: Include a schematic of the final circuit you built, and if you can, add in a digital picture of the final
board, top and bottom. If you did a simulation of the circuit, include that too.
4. CMPE 118/218 Lab Number 2 Due by 6:00 PM on January 28, 2009 4
Lab #2
Time Summary
Be sure to turn this in with your lab report
This information is being gathered solely to produce statistical information to help improve the lab assignments.
Pre-Lab Preparing Outside of the lab ____________ In the lab working this part__________
Part 1 Preparing Outside of the lab ____________ In the lab working this part__________
Part 2 Preparing Outside of the lab ____________ In the lab working this part__________
Part 3 Preparing Outside of the lab ____________ In the lab working this part__________
Report Preparing the Lab Report ______________