Jeremy Hergert has over 20 years of experience in semiconductor manufacturing, holding roles such as Production Supervisor and Manufacturing Supervisor. He has a B.S. in Mathematics from Western Oregon State College and skills in leadership, accountability, and competitive drive. Currently he is a Senior Production Supervisor at Jireh Semiconductor, where his responsibilities include overseeing a shift of 40 employees, updating production reports, and mentoring other supervisors.

1. Jeremy Hergert
17607 SW Falling Leaf Ct. (503) 810-9311
Beaverton, Oregon 97003 jeremyvinh@gmail.com
EDUCATION
Western Oregon State College,Monmouth,Oregon
B.S. in Mathematics,June 1996
Minor in Physical Education
SKILLS/TRAITS
 Analytical T hinker –Before making critical decisions try to see situations from multipleangles and
possibilities to maximize best outcome.
 Leadership –Take charge mentality but humble and accountable in approach to get the best out ofindividuals.
 Integrity –Always willing to stand up when mistakes are made and believe in not “passing the buck.”
 Accountability –Fulfill responsibilities by taking ownership in the process and completion ofrequested items.
 Competitive- Putting forth effort and having the desire to be the best I can at what I do.
SUMMARY
Production oriented,efficient and versatile manager. Proven ability to lead, direct and motivatelarge group ofemployees.
Presently responsiblefor supervising shift operations and diversegroup ofemployees in a power semi-conductor
manufacturing company.
EXPERIENCE
Jireh Semiconductor –Hillsboro,Oregon
May 2013 – Present Sr. Production Supervisor
 Promoted to Sr. Production Supervisorand moved to fronthalfday shift to Lead Supervisor Role and point of
contactfor entire shift of40+ employees. Responsiblefor entire building safety, employee personnel and site-
wide operations on Sundays when no upper management on-duty.
 Responsible for daily pull points ofMonthly Production Output on Key Platforms. Update report daily and
display for Fab Team members to utilize for escalation purposes.
 Successfully implemented Production fan-out ofmajor Production Platforms to improve throughputand
availability at several process layers in Photolithography.
 Update Critical Equip Charts on a daily basis via Microsoft Excel and email the updateto Vice President, Fab
Director, Production manager and all key management personnel across the company to communicate daily
activities,ships, and key tools impacting production.
 Lead daily Photolithography area meeting to discuss daily agenda with Equipment and Engineering groups.
Communicate all equipmentneeds,process testing, production related items to ensuresynergy between all
groups.
 Run daily site manager meeting in Fab Managers stead. Highlight key fab needs for production focus , detail
obstacles preventing output and review all down toolsets with Fab Director.
 Successfully hired and integrated12 new hires into existing teams on front halfday shift.
 Mentor and develop new supervisoron front halfnight shift on how to juggle priorities with production needs to
help overall 24hr operations on front halfofthe week.
 DevelopedTraining Matrix to track certifications ofall Production technicians ensuring all major tool sets and
production operation needs are covered by multiplepersonnel.
Jireh Semiconductor –Hillsboro,Oregon
February 2012 –May 2013 Production Supervisor
 Supervise group of17 employees in Photolithography, Etch and Sort.
 Distribute daily objectives to shift leads and identify key obstacles on a daily basis.

2. Jeremy Hergert
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 Strategically plan toolsets to maximize daily activity output.
 Monitor area production ensuring priority material being processed.
 Coordinate R&D hot lots into daily production plan assisting futureproduct development and company growth.
 Escalate tool or production lot issues to equipment or engineering,minimizing idle time, downtimeor time at
operation to maintain high level ofproductivity.
 Complete management forms: General Fab Passdown, Daily Critical Equipmentsummary, Daily Critical Line
Item summary and Daily Production Activity Passdown summary for upper management and on-coming
supervisors to reflect 24hr numbers and all current tool issues needing addressed.
 Brought Etch and Sort production teams to #1 in activities, leading across all 4 shifts and held steady over a three-
year timeframe by integrating7 new employees as well as getting personnel additional cross-training.
 Received highestreview score for all supervisors this review cycle with a 1.06 scorewith an Outstanding rating.
Integrated Device Technology –Hillsboro,Oregon
June 2010 – February 2012 Manufacturing Supervisor II
 Successfully closed out IDTproduction operations and transfer goals for move to foundry overseas.
 Shipped record 30K+ wafers in final full operating quarter.
 Selected by Fab Manager to lend production perspectiveand assist in researching and implementing production
practices for new companies planned Epitaxial wafer center.
 Through re-organization, cross-training and coaching a better focus, lead Etch team to first in activities across the
company, Photolithography to 2nd from last in production activities.
September 2008 –June 2010 Manufacturing Supervisor I
 Raised manufacturing productivity on front halfnight shift from 82% to 94% first quarter after promotion.
 Overhauled and upgraded production teamsthrough reorganization and incorporating 6 new hires .
 Monitored ship schedules using companies 200 report and maintained 98%+ company OTD.
 Promoted to Manufacturing Supervisor IIin June 2010.
April 2006 –September 2008 Lead/Dispo CMPT echnician
 Led CMP in quality all 28 months oflead technician responsibilities in manual CMP operation area .
 Responsible for dispositioning overpolishedmaterial, attaching FCM’s for product scans/alerts and writing
Optiprobe recipes for new products.
 Performed disk and pad changes, head rebuilds for Ipec and Mirra production polishers.
September 2002 –April 2006 Fab IV CMPT echnician IV
 Certified/Operated Westech IPEC47 2,Materials Mirra, Ontrak Scrubber,Verteq, Semitool, Optiprobe.
 Maintained ZERO human errors while processing wafersin a manual CMP environment.
 Calculated polish times for production material utilizing spec provided formulas and algorithms.
January 1997 –September 2002 Fab IV Sort T echnician II
 Tested SRAM, DRAM, Logic wafers using tools such as Keithley’s,P-8 Probers, XRL Lasers, KLA Off-line Inker
 Trained, Certified to inspect fuse blows, adjust laser power, new product training and dispositioning
 Assisted engineering in mass product transfers from Fab II to Fab IV by creating and training new setups on
probers.
 Used engineering navigatorsoftware to create wafer bitmaps for new products.
January 1997 –February 2008 Emergency Response Team Member (ERT )
4PointPlay Men’s Basketball League –Beaverton,Oregon
September 2004 –September 2008 Referee
 Referee basketball games two nights a week in highly competitive men’s league.
 Upheld integrity ofleague,implementing all rules and holding player conductaccountable.

3. Jeremy Hergert
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Western Oregon State College –Monmouth,Oregon
1995-1996 Intramural Building and Activity Supervisor
 Overseer ofmiscellaneous campus activities such as basketball, softball, soccer, and volleyball.
 Responsible for obtaining building keys, activity equipment and safety ofthe building and activity participants.
Big Bend Community College,T reasure Valley Community College
1990-1992 Basketball,Baseball player
 Two years scholarship experiencein collegeathletics
 Devoted considerabletime, energy toward team goals and accomplishments.