Train Set of 3D Computer Arrays of Processors or Clusters
HPC, Big Data & IoT: Scalable modules for servers.
or clusters from one module to acreage and beyond.
2. THECOST OF DATACENTER DOWNTIME IS RISING
Problem: Downtime costs for the most data center-dependent
businesses are rising faster than average.
Cost: The average cost of a data center outage has steadily
increased from $505,502 in 2010 to $740,357.
Failure: UPS system failure continues to be the number one cause
of unplanned data center outages, accounting for one-quarter of all
such events. Cybercrime represents 22% of data center outages.
Impact: Maximum downtime costs increased 32 percent since
2013 and 81 percent since 2010. Maximum downtime costs for 2016
are $2,409,991.
Solution: Investing in improved equipment was the top way
respondents indicated they could prevent unplanned outages in the
future.
Loss: The average cost of a data center outage rose from $690,204
in 2013 to $740,357 in this report, a 7 percent increase. The cost of
downtime has increased 38 percent since the first study in 2010.
Ponemon Institute 2016 Study sponsored by EmersonNetwork Power http://www.emersonnetworkpower.com/Downtime
3. Key Advantages of HEXTRADENSE
HPC, Big Data & IoT: Scalable modules for servers
or clusters from one module to acreage and beyond.
Higher Component Density
Planar and multi-planar configurations reduce real estate requirements.
Ease of Maintenance
System delivers modules for repair replacement and modification with hot-swap.
System Availability
Multi-planar module and hotspot with. g ghosting helps eliminate unplanned
outages.
Interconnection Enhancements
•Improved data connection features.
•Dynamic configuration of system structure elements allowing hot-swap.
addition/removal of CPU, GPU, and FEP modules – enhanced utility model.
•Total or incremental reconfiguration of system by 3D train set from spur lines.
Cost Savings
•Fluid/gas/air heat exchange options that achieve flow rates comparable to some
carburetors and help reduce thermal management costs.
•Construction cost savings by using many industry standard components.
•Designed in-heat transfer.
4. Enclosure Mechanics
Conventional cabinet rack systems with pizza box enclosures
A typical data center is composed of non-optimized rows of cabinet
racks with dead space aisles and limited vertical expansion.
Each enclosure rack slot generally contains one component, e.g.,
motherboard with processors.
A typical data enclosure when stacked in 3D doesn’t allow access or
heat transfer from the modules in the middle.
5. Computer processors, clustersor other assembliesare assembled into HextraDense
modules.
HextraDense 3d arrays with optional track system.
Reduces realestate acreage andattendantcosts by anominaltwo-thirds depending on
the3Darrayconfigurationwithtracksystems;includingcolumndepth.
6. The fabrication of modules for integration as 3D arrays.
Integrationof3Darraymoduleswithrailsystemstoincludesupporting
infrastructure.Thisstage includes prototype development, initial trials,
and firstclient installation.
Integrate direct connectivity withoperating systems.
HPC, Big Data & IoT: Scalablemodulesforserversorclustersfrom
onemoduletoacreageandbeyond.
7. System Development
License standard andcustom
enclosure/array systemsand
infrastructure.
Develop software applications for
network configurationand
maintenance management with
an emphasis on open source.
Partner with existing intelligent
rack providers, e.g., HP,IBM to
design datacenters.
Licensepatented design
methodology to hardware
manufacturers.
Consulting & Licensing
8. RichardA. Dunn,Jr.
I started out asa stock boy. employed as a inventor, purchasing agent, contract
administrator, estimator, production control, IT manager, programmer, system
builder and teacher. I enjoyed machine shop courses and engineering with a
degree in marketing. My objective is to advance sustainable technology to
increase the pie for all.
781.986.3604
richdunn@gmail.com
ABOUT
