This document discusses print dot gain and how dot geometry affects it. It presents theoretical and empirical models of the mechanisms behind dot gain. Specifically, it examines how dot shoulder angle influences contact patch size and compression force, and thus dot gain. It also analyzes case studies on corrugated board printing where dot shape impacts gain due to variable surface compression, and on highlight dots where smaller dots experience more gain. The document proposes further study of how ink flow behavior is impacted by dot shape and printing pressure.
Microbial fuel cells (MFCs) are able to convert organic matter in wastewater into electricity through catalytic reactions by microorganisms under anaerobic conditions. MFCs can also treat wastewater by breaking down organic compounds. This study examines using ethanol production wastewater as a substrate in MFCs to generate electricity and degrade organic matter in the wastewater. The factors that affect MFC performance include substrate, inoculum source, MFC type, and operating conditions. While MFCs have potential applications, their low power output and high material costs currently limit widespread usage.
The intent of this study is to evaluate three step stencil technologies and measure their effectiveness in applying different volumes of paste on the same board during the printing process. The step technologies to be evaluated are chemically etched, laser welded and micro-machined. The step down areas for each technology will be physically measured for accuracy.
This document summarizes the development of a robust SMT process for placing 03015 components, which are only 0.3mm x 0.15mm in size. Through testing different solder pastes and stencil materials, the author developed a process using a laser-cut fine grain stainless steel stencil with an electro polish and nano coating that achieved over 80% transfer efficiency. Taguchi experiments were used to optimize print parameters. Initial tests achieved placement of 03015 components with 0 defects out of 36,000 placements. The printing process achieved a DPMO of 15. Further work is still needed to optimize the process for thinner stencils required by smartphones.
Six Sigma aims to reduce defects and variation in processes to improve customer satisfaction and increase profits. It originated to improve manufacturing but was later applied more broadly. The Six Sigma process involves Define, Measure, Analyze, Improve, and Control (DMAIC) to first identify issues and their causes, test solutions, and ensure gains are sustained. Key aspects include defining critical metrics, measuring current performance, analyzing processes statistically to determine root causes of defects, improving processes by addressing these causes, and controlling processes ongoing to maintain results.
The document discusses superresolution technology that can improve the resolution of infrared camera images. It begins by explaining the basic problem that small objects may be invisible or measured incorrectly in infrared images due to pixel size limitations. It then describes how superresolution works by using multiple images and deconvolution algorithms to effectively decrease pixel pitch by 1.6x and increase usable resolution also by 1.6x compared to normal images. Experimental results show that superresolution detects spatial frequencies about 50% higher than the camera's detector cutoff and improves temperature measurement accuracy compared to interpolation. The technology will be available as a software update for all current Testo infrared cameras.
This study evaluated three step stencil technologies - chemically etched, laser welded, and micro-machined - to determine their effectiveness in applying different volumes of solder paste. Measurements found that etched steps were deeper than nominal values, while welded and machined steps were closer to targets. Across all technologies, solder paste volumes were higher closer to step edges (10-20 mils) than further away (30-50 mils), indicating squeegee difficulty. A fluoropolymer nano-coating slightly increased volumes. Overall, the technologies were viable for step stencils, but further investigation is needed to differentiate their performance.
The document discusses overcoming limitations of 3D printing flexible plastics by using Arnitel ID filament from DSM. Flexible filaments can buckle during printing, interrupting the process. Arnitel ID reduces this issue through its low surface friction, enabled by lubricating additives, allowing higher printing speeds of 50-60 mm/s while maintaining interlayer adhesion. DSM analyzed how material properties, filament diameter, and printing speed affect critical buckling length to successfully print with flexible plastics.
This master's thesis presentation examines the influence of plate thickness on contact time during elastic, elastic-plastic, and plastic impacts of brass spheres on thin glass plates. The experimental setup involves dropping brass spheres from varying heights onto glass plates of different thicknesses to impact at different velocities. Contact time is measured using an electrical circuit. Results show that contact time increases with sphere diameter and decreases with increasing plate thickness and impact velocity. Measured contact times are slightly higher than values predicted by existing theoretical models.
Microbial fuel cells (MFCs) are able to convert organic matter in wastewater into electricity through catalytic reactions by microorganisms under anaerobic conditions. MFCs can also treat wastewater by breaking down organic compounds. This study examines using ethanol production wastewater as a substrate in MFCs to generate electricity and degrade organic matter in the wastewater. The factors that affect MFC performance include substrate, inoculum source, MFC type, and operating conditions. While MFCs have potential applications, their low power output and high material costs currently limit widespread usage.
The intent of this study is to evaluate three step stencil technologies and measure their effectiveness in applying different volumes of paste on the same board during the printing process. The step technologies to be evaluated are chemically etched, laser welded and micro-machined. The step down areas for each technology will be physically measured for accuracy.
This document summarizes the development of a robust SMT process for placing 03015 components, which are only 0.3mm x 0.15mm in size. Through testing different solder pastes and stencil materials, the author developed a process using a laser-cut fine grain stainless steel stencil with an electro polish and nano coating that achieved over 80% transfer efficiency. Taguchi experiments were used to optimize print parameters. Initial tests achieved placement of 03015 components with 0 defects out of 36,000 placements. The printing process achieved a DPMO of 15. Further work is still needed to optimize the process for thinner stencils required by smartphones.
Six Sigma aims to reduce defects and variation in processes to improve customer satisfaction and increase profits. It originated to improve manufacturing but was later applied more broadly. The Six Sigma process involves Define, Measure, Analyze, Improve, and Control (DMAIC) to first identify issues and their causes, test solutions, and ensure gains are sustained. Key aspects include defining critical metrics, measuring current performance, analyzing processes statistically to determine root causes of defects, improving processes by addressing these causes, and controlling processes ongoing to maintain results.
The document discusses superresolution technology that can improve the resolution of infrared camera images. It begins by explaining the basic problem that small objects may be invisible or measured incorrectly in infrared images due to pixel size limitations. It then describes how superresolution works by using multiple images and deconvolution algorithms to effectively decrease pixel pitch by 1.6x and increase usable resolution also by 1.6x compared to normal images. Experimental results show that superresolution detects spatial frequencies about 50% higher than the camera's detector cutoff and improves temperature measurement accuracy compared to interpolation. The technology will be available as a software update for all current Testo infrared cameras.
This study evaluated three step stencil technologies - chemically etched, laser welded, and micro-machined - to determine their effectiveness in applying different volumes of solder paste. Measurements found that etched steps were deeper than nominal values, while welded and machined steps were closer to targets. Across all technologies, solder paste volumes were higher closer to step edges (10-20 mils) than further away (30-50 mils), indicating squeegee difficulty. A fluoropolymer nano-coating slightly increased volumes. Overall, the technologies were viable for step stencils, but further investigation is needed to differentiate their performance.
The document discusses overcoming limitations of 3D printing flexible plastics by using Arnitel ID filament from DSM. Flexible filaments can buckle during printing, interrupting the process. Arnitel ID reduces this issue through its low surface friction, enabled by lubricating additives, allowing higher printing speeds of 50-60 mm/s while maintaining interlayer adhesion. DSM analyzed how material properties, filament diameter, and printing speed affect critical buckling length to successfully print with flexible plastics.
This master's thesis presentation examines the influence of plate thickness on contact time during elastic, elastic-plastic, and plastic impacts of brass spheres on thin glass plates. The experimental setup involves dropping brass spheres from varying heights onto glass plates of different thicknesses to impact at different velocities. Contact time is measured using an electrical circuit. Results show that contact time increases with sphere diameter and decreases with increasing plate thickness and impact velocity. Measured contact times are slightly higher than values predicted by existing theoretical models.
The document describes a new thermoformability testing device called Technoform. It aims to address limitations of current testing methods by evaluating materials under conditions that closely mimic the full thermoforming process. Technoform tests specimens through heating, 3D stretching, forming, and cooling. It provides quantitative data on various metrics like sag distance, forming force, and shrinkage. The document outlines Technoform's design and capabilities, and provides several examples showing how it can evaluate the effects of various material and process parameters on thermoformability.
This document discusses 5 key technologies for the next 10 years: mobile, internet of things, machine learning, robotics, and blockchain. It emphasizes that collaboration will be critical for innovation in these areas. Specific opportunities and challenges are described for each technology, including the need for collaboration between companies and with research organizations to drive new applications and solutions. Examples of collaborative projects already underway in Western Australia are provided.
This document provides information about quality circles and their operation. It discusses the objective of quality circles as improving problem identification, data collection and analysis, finding causes and solutions, and making successful presentations. Quality circles are defined as small groups that regularly meet to identify, analyze, discuss and solve work-related problems. The document outlines the roles of various people involved like the steering committee, coordinator, facilitator, leader and members. It also describes various quality circle tools and techniques like check sheets, histograms, scatter diagrams, Pareto charts, cause-and-effect diagrams and brainstorming that can be used to solve problems in a systematic manner.
IRJET- Optimisation of Draw-Bead Design in Sheet Metal Forming of an Asymmetr...IRJET Journal
This document summarizes an optimization study of draw-bead design for sheet metal forming of an asymmetric part using Response Surface Methodology (RSM) and LS-DYNA software. The study models a five-sided cup part in DYNAFORM and simulates it in LS-DYNA, varying draw-bead depth and length while keeping other parameters constant. Elemental shell thickness and mean strain results are imported into MINITAB for RSM analysis. The analysis identifies draw-bead depth of 0.65mm and length of 93mm as providing the optimum shell thickness of 1.768mm and mean strain of 0.204. Contour and surface plots of the responses from the RSM are presented.
The document discusses Moore's Law extending into the third dimension through vertical miniaturization and integration techniques. It outlines two steps: 1) thinning chips using atmospheric downstream plasma etching and handling thin wafers without damage, and 2) vertically stacking thinned chips using through-silicon vias to integrate components in 3D space. This vertical integration using techniques like thinning, through-silicon vias and 3D stacking will allow doubling components in a package every 18-24 months, extending Moore's Law into the third dimension.
This document discusses solder paste printing and reflow troubleshooting. It provides details on different squeegee types and their effects on printing speed. Compaction issues that can occur are described, along with factors affecting preheat shape and profile. Wetting issues are explored, such as effects of component finishes, gold content, and reflow atmosphere. Defects like tombstones and head-in-pillow are explained. Overall it provides an overview of solder paste process parameters and how to address common problems.
This document discusses various factors that affect solder paste printing and reflow, including:
- Squeegee type and sharpness can impact printing speed, with polymer and sharper squeegees printing faster than metal.
- Stencil material and quality also impacts paste release and required squeegee pressure.
- Reflow atmosphere, specifically using nitrogen versus oxygen, can improve wetting and reduce defects like solder balls.
- Component and board factors like coplanarity, gold content on pads, and surface finish thickness can cause wetting or voiding issues if not within specifications.
The document discusses challenges and guidelines for printing solder paste with step stencils. It analyzes how factors like squeegee speed, pressure, angle, and material affect the amount of paste residue near step edges. Testing showed circular apertures near steep step downs had lower transfer efficiency than oblong apertures due to more residue. Guidelines recommend reducing speed, increasing pressure, changing the angle to 45°, and using a polymer squeegee to minimize residue for consistent paste transfer. Apertures far from step edges showed high transfer efficiency regardless of geometry or step height.
In this presentation given at TheIJC USA in Chicago, Meteor's Jonathan Wilson explores the challenges we face with regard to inkjet printing: Inkjet is no stranger to complex engineering, from printheads to ink delivery systems and drive electronics. The growing demand for high speed, single pass industrial inkjet systems in a myriad of applications presents ever more tricky challenges including cross web calibration, mottling and nozzle out detection/compensation. Tackling these issues requires a multi-disciplinary approach, uniting skills from hardware, software and color management to successfully exceed reliability and print consistency requirements.
Geo-Designer, is a powerful upfront Design forManufacturing (DFM) tools for designers and manufacturing engineers with innovative technology. It accelerates the design process for functions, manufacturability, enabling designs to move to production better and faster. Compared with other traditional tools, Geo-Designer is powerful, flexible, fast and easy to use and provides savings in downstream costs by quality improvement at the design stage. Geo-Designer offer a new method to study the part geometry in 3D Iso-surface with flexible transparently, it is similar the x-ray and CT method in industrial.
Geo-Designer can analysis the product thickness in ray method and the thickness level method. Users can select the analysis method flexibility based on the geometry of the part for improved results.
A Study on Thermo-Mechanical Analysis of Hot Rolling & Estimation of Residual...IOSR Journals
The major problem in rolling process is the defects like fire cracks, severe sticking in a billet mill,
and etc. This paper deals with the study on reducing or minimizing the defects of rolling process. The analysis
has been carried out for different temperature i.e. 100°c, 150°c, 200°c, 250°c. As the temperature goes on
increasing correspondingly the residual stresses decreases. Hot rolling process helps in reduced residual
stresses at high temperature & helps in formation of smooth granular structure of product. Due to the symmetry
of the rolling components, half the model is built & the analysis is carried out with 4 roller sizes varying from
8mm to 20mm with 4mm increment & the results were tabulated by using ANSYS. This will helps in estimation
of residual stresses.
The document discusses the key factors in screen printing including frame, tension, stencil, off contact, and printing technique. A stable frame is important for consistent print quality. Proper tension eliminates variables and improves sharpness, registration, and ink deposit consistency. Choosing the right stencil parameters like mesh size and thread thickness controls ink flow and print resolution. Correct off contact and parallelism are needed to avoid issues with ink deposit thickness. The printing sequence and technique put all the elements together for quality printing.
The document describes research on optimizing the mechanical properties of specimens produced using fused deposition modeling (FDM) 3D printing with polylactic acid (PLA) plastic. Specimens were printed on a MakerBot Replicator2 using variations of printing parameters and tested according to ASTM standards. A statistical design of experiments approach called Taguchi Method was used to reduce the number of specimens needed from 1152 to 144. Results from tensile and fracture tests showed that density, thickness, and temperature had the greatest influence on material properties. Orientation also influenced properties. The research aims to find parameter settings that optimize strength for consumer end-use applications of 3D printed parts.
- Motorola developed the concept of Six Sigma in 1987 to improve quality standards and reduce defects.
- Six Sigma aims to reduce defects to 3.4 defects per million opportunities by focusing on statistical process control and reducing variation. It was later adopted by other companies like GE.
- The key purpose of Six Sigma is to make customers happier by meeting their requirements and reducing defects, while also increasing company profits through cost savings from quality improvements.
The document discusses a study on the influence of layer thickness on the impact property of 3D-printed polylactic acid (PLA) samples. Samples were printed with layer thicknesses of 0.1, 0.15, 0.2, 0.25 and 0.3 mm and tested according to ISO 180 standards. Results showed that impact strength increased with thicker layer thicknesses, with the optimal strength found at 0.3 mm. Increasing layer thickness also decreased printing time. Overall, the study found that layer thickness is an important parameter that influences the mechanical properties of 3D printed parts, with thicker layers improving impact strength but increasing print time.
The document discusses strategies for reducing paper waste and optimizing printing in offices. It recommends taking a 3 step approach: 1) Define printing policies and optimize device usage, 2) Implement managed print services for ongoing monitoring and improvements, and 3) Conduct process reviews to identify digitization opportunities and further reduce unnecessary printing. Case studies show these approaches can reduce printing volumes by 50% or more and lower annual printing budgets significantly.
1. The study aimed to determine the optimal 3D printing parameters of temperature, speed, and resolution to produce ABS parts with the highest flexural strength using Taguchi Method and ANOVA analysis.
2. The results found that the optimal printing parameters were 240°C for temperature, 30 mm/s for speed, and 250 μm for resolution.
3. The ANOVA analysis concluded that printing speed had the most significant effect on flexural strength, followed by resolution and then temperature.
In this webinar you will learn specific tips on how to obtain the best accuracy from 3D printing machines for your parts from 3D Systems, Objet, and Stratasys. Each manufacturer will give you 5 tips that will ensure accurate dimensions in your built parts. These tips will cover various design, material, and machine factors that can influence the final outcome of your part.
All registrants will also receive free copies of these white papers following the webinar:
- Top Five Reasons to Integrate 3D Printing into your Product Development Lifecycle
- How 3D Printing works: The Vision, Innovation and Technologies Behind Inkjet 3D Printing
This document presents a presentation on 3D printing given by Harshavardhan C M at Jawaharlal Nehru National College of Engineering. The presentation covers the general principles of 3D printing including modeling, printing, and finishing. It describes various 3D printing methods such as selective laser sintering, stereolithography, fused deposition modeling, and laminated object manufacturing. Applications in areas such as rapid prototyping, medical, automotive, and defense are discussed. Advantages include faster development and potential in medical industries. Disadvantages include limited size and materials.
Examination of Tensile Test Specimens Produced in Three-Dimensional Printer by Fuat Kartal* in Crimson Publishers: Applied mechanical engineering
In this study, the effect of different parameters on tensile test specimens produced by joint manufacturing with open source code and equipment using PLA type filament was investigated experimentally. Tensile specimens were designed and manufactured according to ASTM IV type tensile test standards. The test design was based on the L9 orthogonal array of the Taguchi Method and experiments was designed according to this plan. According to the results, Parameters of layer thickness and filling scan range parameters were found to provide significant improvement in the tensile strength increase
Building Production Ready Search Pipelines with Spark and MilvusZilliz
Spark is the widely used ETL tool for processing, indexing and ingesting data to serving stack for search. Milvus is the production-ready open-source vector database. In this talk we will show how to use Spark to process unstructured data to extract vector representations, and push the vectors to Milvus vector database for search serving.
Digital Marketing Trends in 2024 | Guide for Staying AheadWask
https://www.wask.co/ebooks/digital-marketing-trends-in-2024
Feeling lost in the digital marketing whirlwind of 2024? Technology is changing, consumer habits are evolving, and staying ahead of the curve feels like a never-ending pursuit. This e-book is your compass. Dive into actionable insights to handle the complexities of modern marketing. From hyper-personalization to the power of user-generated content, learn how to build long-term relationships with your audience and unlock the secrets to success in the ever-shifting digital landscape.
The document describes a new thermoformability testing device called Technoform. It aims to address limitations of current testing methods by evaluating materials under conditions that closely mimic the full thermoforming process. Technoform tests specimens through heating, 3D stretching, forming, and cooling. It provides quantitative data on various metrics like sag distance, forming force, and shrinkage. The document outlines Technoform's design and capabilities, and provides several examples showing how it can evaluate the effects of various material and process parameters on thermoformability.
This document discusses 5 key technologies for the next 10 years: mobile, internet of things, machine learning, robotics, and blockchain. It emphasizes that collaboration will be critical for innovation in these areas. Specific opportunities and challenges are described for each technology, including the need for collaboration between companies and with research organizations to drive new applications and solutions. Examples of collaborative projects already underway in Western Australia are provided.
This document provides information about quality circles and their operation. It discusses the objective of quality circles as improving problem identification, data collection and analysis, finding causes and solutions, and making successful presentations. Quality circles are defined as small groups that regularly meet to identify, analyze, discuss and solve work-related problems. The document outlines the roles of various people involved like the steering committee, coordinator, facilitator, leader and members. It also describes various quality circle tools and techniques like check sheets, histograms, scatter diagrams, Pareto charts, cause-and-effect diagrams and brainstorming that can be used to solve problems in a systematic manner.
IRJET- Optimisation of Draw-Bead Design in Sheet Metal Forming of an Asymmetr...IRJET Journal
This document summarizes an optimization study of draw-bead design for sheet metal forming of an asymmetric part using Response Surface Methodology (RSM) and LS-DYNA software. The study models a five-sided cup part in DYNAFORM and simulates it in LS-DYNA, varying draw-bead depth and length while keeping other parameters constant. Elemental shell thickness and mean strain results are imported into MINITAB for RSM analysis. The analysis identifies draw-bead depth of 0.65mm and length of 93mm as providing the optimum shell thickness of 1.768mm and mean strain of 0.204. Contour and surface plots of the responses from the RSM are presented.
The document discusses Moore's Law extending into the third dimension through vertical miniaturization and integration techniques. It outlines two steps: 1) thinning chips using atmospheric downstream plasma etching and handling thin wafers without damage, and 2) vertically stacking thinned chips using through-silicon vias to integrate components in 3D space. This vertical integration using techniques like thinning, through-silicon vias and 3D stacking will allow doubling components in a package every 18-24 months, extending Moore's Law into the third dimension.
This document discusses solder paste printing and reflow troubleshooting. It provides details on different squeegee types and their effects on printing speed. Compaction issues that can occur are described, along with factors affecting preheat shape and profile. Wetting issues are explored, such as effects of component finishes, gold content, and reflow atmosphere. Defects like tombstones and head-in-pillow are explained. Overall it provides an overview of solder paste process parameters and how to address common problems.
This document discusses various factors that affect solder paste printing and reflow, including:
- Squeegee type and sharpness can impact printing speed, with polymer and sharper squeegees printing faster than metal.
- Stencil material and quality also impacts paste release and required squeegee pressure.
- Reflow atmosphere, specifically using nitrogen versus oxygen, can improve wetting and reduce defects like solder balls.
- Component and board factors like coplanarity, gold content on pads, and surface finish thickness can cause wetting or voiding issues if not within specifications.
The document discusses challenges and guidelines for printing solder paste with step stencils. It analyzes how factors like squeegee speed, pressure, angle, and material affect the amount of paste residue near step edges. Testing showed circular apertures near steep step downs had lower transfer efficiency than oblong apertures due to more residue. Guidelines recommend reducing speed, increasing pressure, changing the angle to 45°, and using a polymer squeegee to minimize residue for consistent paste transfer. Apertures far from step edges showed high transfer efficiency regardless of geometry or step height.
In this presentation given at TheIJC USA in Chicago, Meteor's Jonathan Wilson explores the challenges we face with regard to inkjet printing: Inkjet is no stranger to complex engineering, from printheads to ink delivery systems and drive electronics. The growing demand for high speed, single pass industrial inkjet systems in a myriad of applications presents ever more tricky challenges including cross web calibration, mottling and nozzle out detection/compensation. Tackling these issues requires a multi-disciplinary approach, uniting skills from hardware, software and color management to successfully exceed reliability and print consistency requirements.
Geo-Designer, is a powerful upfront Design forManufacturing (DFM) tools for designers and manufacturing engineers with innovative technology. It accelerates the design process for functions, manufacturability, enabling designs to move to production better and faster. Compared with other traditional tools, Geo-Designer is powerful, flexible, fast and easy to use and provides savings in downstream costs by quality improvement at the design stage. Geo-Designer offer a new method to study the part geometry in 3D Iso-surface with flexible transparently, it is similar the x-ray and CT method in industrial.
Geo-Designer can analysis the product thickness in ray method and the thickness level method. Users can select the analysis method flexibility based on the geometry of the part for improved results.
A Study on Thermo-Mechanical Analysis of Hot Rolling & Estimation of Residual...IOSR Journals
The major problem in rolling process is the defects like fire cracks, severe sticking in a billet mill,
and etc. This paper deals with the study on reducing or minimizing the defects of rolling process. The analysis
has been carried out for different temperature i.e. 100°c, 150°c, 200°c, 250°c. As the temperature goes on
increasing correspondingly the residual stresses decreases. Hot rolling process helps in reduced residual
stresses at high temperature & helps in formation of smooth granular structure of product. Due to the symmetry
of the rolling components, half the model is built & the analysis is carried out with 4 roller sizes varying from
8mm to 20mm with 4mm increment & the results were tabulated by using ANSYS. This will helps in estimation
of residual stresses.
The document discusses the key factors in screen printing including frame, tension, stencil, off contact, and printing technique. A stable frame is important for consistent print quality. Proper tension eliminates variables and improves sharpness, registration, and ink deposit consistency. Choosing the right stencil parameters like mesh size and thread thickness controls ink flow and print resolution. Correct off contact and parallelism are needed to avoid issues with ink deposit thickness. The printing sequence and technique put all the elements together for quality printing.
The document describes research on optimizing the mechanical properties of specimens produced using fused deposition modeling (FDM) 3D printing with polylactic acid (PLA) plastic. Specimens were printed on a MakerBot Replicator2 using variations of printing parameters and tested according to ASTM standards. A statistical design of experiments approach called Taguchi Method was used to reduce the number of specimens needed from 1152 to 144. Results from tensile and fracture tests showed that density, thickness, and temperature had the greatest influence on material properties. Orientation also influenced properties. The research aims to find parameter settings that optimize strength for consumer end-use applications of 3D printed parts.
- Motorola developed the concept of Six Sigma in 1987 to improve quality standards and reduce defects.
- Six Sigma aims to reduce defects to 3.4 defects per million opportunities by focusing on statistical process control and reducing variation. It was later adopted by other companies like GE.
- The key purpose of Six Sigma is to make customers happier by meeting their requirements and reducing defects, while also increasing company profits through cost savings from quality improvements.
The document discusses a study on the influence of layer thickness on the impact property of 3D-printed polylactic acid (PLA) samples. Samples were printed with layer thicknesses of 0.1, 0.15, 0.2, 0.25 and 0.3 mm and tested according to ISO 180 standards. Results showed that impact strength increased with thicker layer thicknesses, with the optimal strength found at 0.3 mm. Increasing layer thickness also decreased printing time. Overall, the study found that layer thickness is an important parameter that influences the mechanical properties of 3D printed parts, with thicker layers improving impact strength but increasing print time.
The document discusses strategies for reducing paper waste and optimizing printing in offices. It recommends taking a 3 step approach: 1) Define printing policies and optimize device usage, 2) Implement managed print services for ongoing monitoring and improvements, and 3) Conduct process reviews to identify digitization opportunities and further reduce unnecessary printing. Case studies show these approaches can reduce printing volumes by 50% or more and lower annual printing budgets significantly.
1. The study aimed to determine the optimal 3D printing parameters of temperature, speed, and resolution to produce ABS parts with the highest flexural strength using Taguchi Method and ANOVA analysis.
2. The results found that the optimal printing parameters were 240°C for temperature, 30 mm/s for speed, and 250 μm for resolution.
3. The ANOVA analysis concluded that printing speed had the most significant effect on flexural strength, followed by resolution and then temperature.
In this webinar you will learn specific tips on how to obtain the best accuracy from 3D printing machines for your parts from 3D Systems, Objet, and Stratasys. Each manufacturer will give you 5 tips that will ensure accurate dimensions in your built parts. These tips will cover various design, material, and machine factors that can influence the final outcome of your part.
All registrants will also receive free copies of these white papers following the webinar:
- Top Five Reasons to Integrate 3D Printing into your Product Development Lifecycle
- How 3D Printing works: The Vision, Innovation and Technologies Behind Inkjet 3D Printing
This document presents a presentation on 3D printing given by Harshavardhan C M at Jawaharlal Nehru National College of Engineering. The presentation covers the general principles of 3D printing including modeling, printing, and finishing. It describes various 3D printing methods such as selective laser sintering, stereolithography, fused deposition modeling, and laminated object manufacturing. Applications in areas such as rapid prototyping, medical, automotive, and defense are discussed. Advantages include faster development and potential in medical industries. Disadvantages include limited size and materials.
Examination of Tensile Test Specimens Produced in Three-Dimensional Printer by Fuat Kartal* in Crimson Publishers: Applied mechanical engineering
In this study, the effect of different parameters on tensile test specimens produced by joint manufacturing with open source code and equipment using PLA type filament was investigated experimentally. Tensile specimens were designed and manufactured according to ASTM IV type tensile test standards. The test design was based on the L9 orthogonal array of the Taguchi Method and experiments was designed according to this plan. According to the results, Parameters of layer thickness and filling scan range parameters were found to provide significant improvement in the tensile strength increase
Building Production Ready Search Pipelines with Spark and MilvusZilliz
Spark is the widely used ETL tool for processing, indexing and ingesting data to serving stack for search. Milvus is the production-ready open-source vector database. In this talk we will show how to use Spark to process unstructured data to extract vector representations, and push the vectors to Milvus vector database for search serving.
Digital Marketing Trends in 2024 | Guide for Staying AheadWask
https://www.wask.co/ebooks/digital-marketing-trends-in-2024
Feeling lost in the digital marketing whirlwind of 2024? Technology is changing, consumer habits are evolving, and staying ahead of the curve feels like a never-ending pursuit. This e-book is your compass. Dive into actionable insights to handle the complexities of modern marketing. From hyper-personalization to the power of user-generated content, learn how to build long-term relationships with your audience and unlock the secrets to success in the ever-shifting digital landscape.
Dive into the realm of operating systems (OS) with Pravash Chandra Das, a seasoned Digital Forensic Analyst, as your guide. 🚀 This comprehensive presentation illuminates the core concepts, types, and evolution of OS, essential for understanding modern computing landscapes.
Beginning with the foundational definition, Das clarifies the pivotal role of OS as system software orchestrating hardware resources, software applications, and user interactions. Through succinct descriptions, he delineates the diverse types of OS, from single-user, single-task environments like early MS-DOS iterations, to multi-user, multi-tasking systems exemplified by modern Linux distributions.
Crucial components like the kernel and shell are dissected, highlighting their indispensable functions in resource management and user interface interaction. Das elucidates how the kernel acts as the central nervous system, orchestrating process scheduling, memory allocation, and device management. Meanwhile, the shell serves as the gateway for user commands, bridging the gap between human input and machine execution. 💻
The narrative then shifts to a captivating exploration of prominent desktop OSs, Windows, macOS, and Linux. Windows, with its globally ubiquitous presence and user-friendly interface, emerges as a cornerstone in personal computing history. macOS, lauded for its sleek design and seamless integration with Apple's ecosystem, stands as a beacon of stability and creativity. Linux, an open-source marvel, offers unparalleled flexibility and security, revolutionizing the computing landscape. 🖥️
Moving to the realm of mobile devices, Das unravels the dominance of Android and iOS. Android's open-source ethos fosters a vibrant ecosystem of customization and innovation, while iOS boasts a seamless user experience and robust security infrastructure. Meanwhile, discontinued platforms like Symbian and Palm OS evoke nostalgia for their pioneering roles in the smartphone revolution.
The journey concludes with a reflection on the ever-evolving landscape of OS, underscored by the emergence of real-time operating systems (RTOS) and the persistent quest for innovation and efficiency. As technology continues to shape our world, understanding the foundations and evolution of operating systems remains paramount. Join Pravash Chandra Das on this illuminating journey through the heart of computing. 🌟
Your One-Stop Shop for Python Success: Top 10 US Python Development Providersakankshawande
Simplify your search for a reliable Python development partner! This list presents the top 10 trusted US providers offering comprehensive Python development services, ensuring your project's success from conception to completion.
GraphRAG for Life Science to increase LLM accuracyTomaz Bratanic
GraphRAG for life science domain, where you retriever information from biomedical knowledge graphs using LLMs to increase the accuracy and performance of generated answers
Nunit vs XUnit vs MSTest Differences Between These Unit Testing Frameworks.pdfflufftailshop
When it comes to unit testing in the .NET ecosystem, developers have a wide range of options available. Among the most popular choices are NUnit, XUnit, and MSTest. These unit testing frameworks provide essential tools and features to help ensure the quality and reliability of code. However, understanding the differences between these frameworks is crucial for selecting the most suitable one for your projects.
Have you ever been confused by the myriad of choices offered by AWS for hosting a website or an API?
Lambda, Elastic Beanstalk, Lightsail, Amplify, S3 (and more!) can each host websites + APIs. But which one should we choose?
Which one is cheapest? Which one is fastest? Which one will scale to meet our needs?
Join me in this session as we dive into each AWS hosting service to determine which one is best for your scenario and explain why!
Skybuffer AI: Advanced Conversational and Generative AI Solution on SAP Busin...Tatiana Kojar
Skybuffer AI, built on the robust SAP Business Technology Platform (SAP BTP), is the latest and most advanced version of our AI development, reaffirming our commitment to delivering top-tier AI solutions. Skybuffer AI harnesses all the innovative capabilities of the SAP BTP in the AI domain, from Conversational AI to cutting-edge Generative AI and Retrieval-Augmented Generation (RAG). It also helps SAP customers safeguard their investments into SAP Conversational AI and ensure a seamless, one-click transition to SAP Business AI.
With Skybuffer AI, various AI models can be integrated into a single communication channel such as Microsoft Teams. This integration empowers business users with insights drawn from SAP backend systems, enterprise documents, and the expansive knowledge of Generative AI. And the best part of it is that it is all managed through our intuitive no-code Action Server interface, requiring no extensive coding knowledge and making the advanced AI accessible to more users.
5th LF Energy Power Grid Model Meet-up SlidesDanBrown980551
5th Power Grid Model Meet-up
It is with great pleasure that we extend to you an invitation to the 5th Power Grid Model Meet-up, scheduled for 6th June 2024. This event will adopt a hybrid format, allowing participants to join us either through an online Mircosoft Teams session or in person at TU/e located at Den Dolech 2, Eindhoven, Netherlands. The meet-up will be hosted by Eindhoven University of Technology (TU/e), a research university specializing in engineering science & technology.
Power Grid Model
The global energy transition is placing new and unprecedented demands on Distribution System Operators (DSOs). Alongside upgrades to grid capacity, processes such as digitization, capacity optimization, and congestion management are becoming vital for delivering reliable services.
Power Grid Model is an open source project from Linux Foundation Energy and provides a calculation engine that is increasingly essential for DSOs. It offers a standards-based foundation enabling real-time power systems analysis, simulations of electrical power grids, and sophisticated what-if analysis. In addition, it enables in-depth studies and analysis of the electrical power grid’s behavior and performance. This comprehensive model incorporates essential factors such as power generation capacity, electrical losses, voltage levels, power flows, and system stability.
Power Grid Model is currently being applied in a wide variety of use cases, including grid planning, expansion, reliability, and congestion studies. It can also help in analyzing the impact of renewable energy integration, assessing the effects of disturbances or faults, and developing strategies for grid control and optimization.
What to expect
For the upcoming meetup we are organizing, we have an exciting lineup of activities planned:
-Insightful presentations covering two practical applications of the Power Grid Model.
-An update on the latest advancements in Power Grid -Model technology during the first and second quarters of 2024.
-An interactive brainstorming session to discuss and propose new feature requests.
-An opportunity to connect with fellow Power Grid Model enthusiasts and users.
HCL Notes and Domino License Cost Reduction in the World of DLAUpanagenda
Webinar Recording: https://www.panagenda.com/webinars/hcl-notes-and-domino-license-cost-reduction-in-the-world-of-dlau/
The introduction of DLAU and the CCB & CCX licensing model caused quite a stir in the HCL community. As a Notes and Domino customer, you may have faced challenges with unexpected user counts and license costs. You probably have questions on how this new licensing approach works and how to benefit from it. Most importantly, you likely have budget constraints and want to save money where possible. Don’t worry, we can help with all of this!
We’ll show you how to fix common misconfigurations that cause higher-than-expected user counts, and how to identify accounts which you can deactivate to save money. There are also frequent patterns that can cause unnecessary cost, like using a person document instead of a mail-in for shared mailboxes. We’ll provide examples and solutions for those as well. And naturally we’ll explain the new licensing model.
Join HCL Ambassador Marc Thomas in this webinar with a special guest appearance from Franz Walder. It will give you the tools and know-how to stay on top of what is going on with Domino licensing. You will be able lower your cost through an optimized configuration and keep it low going forward.
These topics will be covered
- Reducing license cost by finding and fixing misconfigurations and superfluous accounts
- How do CCB and CCX licenses really work?
- Understanding the DLAU tool and how to best utilize it
- Tips for common problem areas, like team mailboxes, functional/test users, etc
- Practical examples and best practices to implement right away
Skybuffer SAM4U tool for SAP license adoptionTatiana Kojar
Manage and optimize your license adoption and consumption with SAM4U, an SAP free customer software asset management tool.
SAM4U, an SAP complimentary software asset management tool for customers, delivers a detailed and well-structured overview of license inventory and usage with a user-friendly interface. We offer a hosted, cost-effective, and performance-optimized SAM4U setup in the Skybuffer Cloud environment. You retain ownership of the system and data, while we manage the ABAP 7.58 infrastructure, ensuring fixed Total Cost of Ownership (TCO) and exceptional services through the SAP Fiori interface.
In the rapidly evolving landscape of technologies, XML continues to play a vital role in structuring, storing, and transporting data across diverse systems. The recent advancements in artificial intelligence (AI) present new methodologies for enhancing XML development workflows, introducing efficiency, automation, and intelligent capabilities. This presentation will outline the scope and perspective of utilizing AI in XML development. The potential benefits and the possible pitfalls will be highlighted, providing a balanced view of the subject.
We will explore the capabilities of AI in understanding XML markup languages and autonomously creating structured XML content. Additionally, we will examine the capacity of AI to enrich plain text with appropriate XML markup. Practical examples and methodological guidelines will be provided to elucidate how AI can be effectively prompted to interpret and generate accurate XML markup.
Further emphasis will be placed on the role of AI in developing XSLT, or schemas such as XSD and Schematron. We will address the techniques and strategies adopted to create prompts for generating code, explaining code, or refactoring the code, and the results achieved.
The discussion will extend to how AI can be used to transform XML content. In particular, the focus will be on the use of AI XPath extension functions in XSLT, Schematron, Schematron Quick Fixes, or for XML content refactoring.
The presentation aims to deliver a comprehensive overview of AI usage in XML development, providing attendees with the necessary knowledge to make informed decisions. Whether you’re at the early stages of adopting AI or considering integrating it in advanced XML development, this presentation will cover all levels of expertise.
By highlighting the potential advantages and challenges of integrating AI with XML development tools and languages, the presentation seeks to inspire thoughtful conversation around the future of XML development. We’ll not only delve into the technical aspects of AI-powered XML development but also discuss practical implications and possible future directions.
Programming Foundation Models with DSPy - Meetup SlidesZilliz
Prompting language models is hard, while programming language models is easy. In this talk, I will discuss the state-of-the-art framework DSPy for programming foundation models with its powerful optimizers and runtime constraint system.
TrustArc Webinar - 2024 Global Privacy SurveyTrustArc
How does your privacy program stack up against your peers? What challenges are privacy teams tackling and prioritizing in 2024?
In the fifth annual Global Privacy Benchmarks Survey, we asked over 1,800 global privacy professionals and business executives to share their perspectives on the current state of privacy inside and outside of their organizations. This year’s report focused on emerging areas of importance for privacy and compliance professionals, including considerations and implications of Artificial Intelligence (AI) technologies, building brand trust, and different approaches for achieving higher privacy competence scores.
See how organizational priorities and strategic approaches to data security and privacy are evolving around the globe.
This webinar will review:
- The top 10 privacy insights from the fifth annual Global Privacy Benchmarks Survey
- The top challenges for privacy leaders, practitioners, and organizations in 2024
- Key themes to consider in developing and maintaining your privacy program
1. The Effect of Flexo Dot Geometry
on Print Performance:
Theoretical and Empirical Models of Dot Gain
Mechanisms
Timothy Gotsick
May 28, 2013
MacDermid Printing Solutions
2. A little bit about myself…
2
In my natural
habitat, waiting for
a delayed flight.
Timothy Gotsick, VP Technology
• R&D
• Application Development
• Based in Atlanta, GA
• 10 years with MacDermid
• Background in organic chemistry
• Still being tutored in print technology
• Management of new product development
in chemical industries
• Strong interest in understanding print fundamentals
3. Outline
• What is Print Gain?
• Why and where is it a problem?
• What causes Print Gain?
• The effect of shoulder angle on print gain
• Case Study: Corrugated Postprint “Fluting”
• Case Study: Highlight dot gain
• Further work: Effects of dot shape on ink distribution
9. What are the root causes of dot gain?
Mechanism
Factors
Type of Effect
Print Result Dot Gain
Mechanical
Ink
Spreading
Ink Rheology
Substrate-Ink
Interaction
Dot
Deformation
Inking
(Anilox)
Printing
(Substrate)
Optical
Density
Uniformity Smoothness
10. Truly Big Dots
• Molded from 32 Shore A photopolymer
• 7 cm tall
• 1 cm tip
• Θ = 53 , 62 , 71 , 79
Θ
20. Board vs Dot
• Board structure changes the impression level experienced by dots
across the surface of the board
– Dots printing on flute „tip‟ are harshly compressed
– Dots printing on flute „valley‟ are minimally compressed
21. Print Pressure Variations
“Striping on Flexo Post-printed Corrugated Board”
Martin Holmvall, Thesis
Fibre Science and Communication Network, Department of Natural Sciences, Mid Sweden University, SE-851
70 Sundsvall, Sweden, 2007
29. Conclusions (pt. 1)
• Fluting is caused by differences in the impression
environment the dots are subjected to at the flute tips
and valleys
• Dot shoulder angle influences dot gain because:
– Contact patch size (gain) increases with impression, but it
increases less for dots with shallower shoulder angles
– Impression force increases with impression, but it increases
less for dots with shallower shoulder angles
• The dot shoulder angle model of gain prediction
seems to explain empirical results well
31. The Quest for the Smallest Dot
1% <1%
Dot size vs stability: How low can you go?
32. Gain throughout the tone range
0.00
1.00
2.00
3.00
4.00
5.00
0 10 20 30 40
DotDiameer,mils
174 lpi File Dot Size, %
Theoretical
Measured
33. Gain is a bigger problem for smaller dots
y = 3.672x-0.53
R² = 0.977
0%
50%
100%
150%
200%
250%
300%
350%
400%
0 10 20 30 40
IncreaseinDotSizefromFiletoPrint
174 lpi File Dot Size, %
Gain vs Dot Size
39. What are the root causes of dot gain?
Mechanism
Factors
Type of Effect
Print Result Dot Gain
Mechanical
Ink
Spreading
Ink Rheology
Substrate-Ink
Interaction
Dot
Deformation
Inking
(Anilox)
Printing
(Substrate)
Optical
Density
Uniformity Smoothness
44. 44
LUX: It is that simple
Existing process LUX process
Ablate
Plate
Digital
Plate
Expose
Process
Plate
Standard
Digital
Plate
Mem
brane
Remove
Membrane
LUX
Lamination
46. Optimizing Dot Profile
• Lots of dots work. Some dots work better.
– These factors seem to matter most
46
Dot Surface
Morphology Shoulder AngleValley DepthEdge definition Dot Surface
47. Thank You
47
Timothy Gotsick
VP Technology, MacDermid Printing Solutions
tgotsick@macdermid.com
http://www.macdermid.com/printing
Follow us on:
Editor's Notes
Although I previously showed pictures of dots actually undergoing impression, it is actually quite hard to visually observe dot deformation under real-world conditions. You can imagine how nervous printers get when we start asking them to remove all the safety shielding so we can try and poke microscopes inside their press! As an alternative to this perilous and messy situation, we went the other direction and made a collection of macroscopic dots. Ironically, we are much better at making millions of 70 μm x 500 μm dots (which we produce every day) than we are at making 1 cm by 7 cm dots, which required some creativity on the part of our researchers. But we did succeed in creating these macro dots from the same photopolymer used in our commercial plates, and with a variety of dot shoulder angles, as shown above.
A bit more creativity gave us a test environment where we could ‘print’ these dots in a controlled fashion using an instrument that can precisely control the distance and rate of compression while measuring the force generated during the dot’s compression.
This is a video of the instrument in action, in this case compressing the 7 cm tall dot by 2 cm. Watch closely, there is a lot going on.
One of the effects you probably noticed in the video was that as the dot was compressed, the top of the dot was pressed into the ‘substrate’ and thus the ‘contact patch’ grew in size. This is not surprising, and you would be correct in thinking that this is likely a major cause of gain. However, we wanted to be able to understand how this contact patch expansion proceeded with compression.
To do so, we located some pressure sensitive material that allowed us to visualize the contact patch at varying levels of impression. As shown in this slide, the material changes color as pressure is applied to it, revealing the actual size of the contact patch. Furthermore, this visualization technology can actually detect differences in pressure across the contact interface, as shown in the top row of samples. We are currently studying the distribution of force across the contact patch, although this work does not include such detail.
Here is the result. This graph shows the growth in the contact patch of four different dots at multiple impression levels. The four dots differed only in the angle of their shoulders, with the 53° dot having the broadest profile and the 79° dot having the narrowest profile. The most important things we learned were the following:1. All dots showed two ‘regions’ in their response to compression. At relatively low compression levels, contact patch increased relatively slowly, but at higher compression levels (between 8 and 10 mm in this graph), the contact patch growth accelerated. The onset and magnitude of this acceleration was dependent on dot shoulder angle. Broader dots (e.g. 53°) hit their inflection point at lower compression levels and the contact patch growth was faster once it did. In contrast, dots with steeper shoulders (e.g. 79°) showed less change in contact patch at all compression levels and their transition to the ‘accelerated growth’ portion of the curve occurred later in the compression cycle.
In addition to the contact patch, we also studied the change in force of the same dots during compression. Again, there were major differences in the behavior of dots with different shoulders angles. The broader the dot, the faster the growth in force during compression. What was also interesting to note was the non-linear growth in force, which actually follows a second order polynomial growth curve. This is in contrast to the expected behavior of a mechanical spring system, where force rises in direct proportion to the compression distance.
The reason for this non-linearity can be understood by considering the simultaneous expansion in contact patch that occurs during dot compression. The force rises exponentially because the contact patch increases; not only is the material being compressed more, but more material is being compressed. This is an especially relevant finding for the study of fluting. As you may recall from my description of Holmvall’s work, the print density on corrugated board rose non-linearly with pressure/force. This means that at certain portions of the print process, both print density (through force) and dot gain (through contact patch growth) are increasing exponentially at the same time.
Here is a close-up view of what is at the heart of fluting – two very different print environments experienced on the same print surface, with predictably different effects on the plate’s dots.
However, even with the use of thick, soft plates, the pressure experienced by the plates in the micro-environments of the flute peaks and valleys can be quite different, and this difference becomes even more pronounced with increasing print squeeze or impression, as shown here.
Now let’s tie all this together and explain fluting once and for all. In the ‘valleys’ of the corrugated board, the contact patch growth (and the force growth) is operating in this region of the curve, where gain is minimized and relatively stable.
But at the flute tips, the dots are operating in this region of the graph, where contact patch and force growth are both higher and on a much steeper slope. More gain and more print density. Also, note that the problems in this region are very different for dots with different shoulder angles – the broadest dot studied (53°) had a contact patch twice as large as the narrower dots (71° and 79°) at many compression levels.
The results can be seen in print and in actual observation of dots on board. Steeper shoulder angles give a dot that tolerates compression better, giving print density that is similar at the flute tips and valleys and reducing the unwanted visual effects that density variations bring.
In conclusion, I hope that I have provided a strong case for three statements.First, fluting is caused by differences in the impression that dots printing on the tips of the flutes receive compared to those printing in the valleys of the flutes.Second, that the dot shoulder angle is an important determinant of print gain behavior, becauseThe contact patch of broader dots increases faster with impression compared to narrower dots.The impression force generated by broader dots increases faster with impression compared to narrower dots.And third, the exposure technology used to make dots can have a large and beneficial effect on the shoulder angle, with new flat-topped dot technologies creating not only flat tops, but steep shoulder angles throughout the tone range, not just at the highlights, which allows corrugated plates made with this technique to print with an unprecedentedly low level of fluting AND more consistently so.