Growth of WindEnergy
Year Capacity (MW)
2005 6,270
2010 16,084
2014 23,354
2015 26,769
2016 32,280
2017 34,046
2018 35,626
2019 37,669
2020 38,785
2021 40,355
2022 42,633
2023 45,887
Large hydro
Small hydro
Solar
Wind
Bio mass
other
Renewable Energy Share
Large hydro Small hydro Solar Wind Bio mass other
Data from Wikepedia
4
Off Shore windpower in India
Off Shore wind capacity yet
unexplored
Huge potential as long coastal line
Govt. aims to tap 140GW by 2030
First Off shore 1GW wind power
plant in Gujrat and TamilNadu
https://mnre.gov.in/off-shore-wind/
9
Stages of Conversion
Wind Power to Aerodynamic Power
Aerodynamic Power to Electrical Power
All modern wind turbines designed on principles of aerodynamics and not
on thrust of wind
15
Wind power electronicconverters
Bin Wu, Y. Lang, N. Zargari and S. Kouro, “Power conversion and control of wind energy systems”, IEEE Wiley, 2011
33
34.
Wind power electronicconverters (cont.)
Bin Wu, Y. Lang, N. Zargari and S. Kouro, “Power conversion and control of wind energy systems”, IEEE Wiley, 2011
34
35.
Wind power electronicconverters (cont.)
Bin Wu, Y. Lang, N. Zargari and S. Kouro, “Power conversion and control of wind energy systems”, IEEE Wiley, 2011
35
36.
Wind power electronicconverters (cont.)
Bin Wu, Y. Lang, N. Zargari and S. Kouro, “Power conversion and control of wind energy systems”, IEEE Wiley, 2011
36
37.
Wind power electronicconverters (cont.)
Bin Wu, Y. Lang, N. Zargari and S. Kouro, “Power conversion and control of wind energy systems”, IEEE Wiley, 2011
37
38.
Wind power electronicconverters (cont.)
Bin Wu, Y. Lang, N. Zargari and S. Kouro, “Power conversion and control of wind energy systems”, IEEE Wiley, 2011
38
Existing Power ElectronicDevices
Device Application
Rectifier diode Low frequency, low to high power AC-
DC conversion
Schottky diode High frequency, low power DC-DC
Fast recovery diode Medium frequency, medium power
Power MOSFET Low voltage high current, DC-DC
IGBT Medium power DC-AC
Thyristor High power low frequency AC-DC
applications
40
* Source: Googleimage
Pictures of different diodes*
A K
Anode
Drift region
Substrate (cathode)
Cathode metalization
A
K
n+
n-
p+
Anode metalization
Power Diodes
42
43.
MOSFET
MOSFET
* Source: Googleimage
Pictures of MOSFETs*
drain
N -
P (body)
N +
N +
N +
N +
N +
P (body)
(drift region)
parasitic
BJT iD
integral
diode
channel
length
body-source
short
source gate conductor
field oxide
gate oxid
Power MOSFET
43
44.
u v w
P+
N-
Drift Region
P+
N+
P+
N+
Collector (c)
Emitter (E) Gate (G) Oxide (insulating
the gate)
Note the P+
layer
Collector (C)
Emitter (E)
Gate (G)
IGBT
* Source: Google image
Pictures of IGBTs*
IGBT
44
45.
Internal structure ofan integrated module*
* Source: A. Wintrich, U. Nicolai, W. Tursky, T. Reimann, Application Manual Power Semiconductors, 2015, [Online]. Available https://www.semikron.com/service-support/application-manual.html
Inside IGBT module
Inside Power Device
45
46.
Increase in WindTurbine and Power
https://www.energy.gov/eere/articles/wind-turbines-bigger-better
46
47.
Limitation due todevice ratings
Two Level Inverter
SC-
SB-
SA-
P
A
N
C
SA+
B
ia,b,c
C
SB+ SC+
Vdc
47
48.
Limitation due todevice ratings (cont..)
Three Level Inverter
A
B C
Ia,b,c
NPT
DAp
DAn
DBp
DBn
DCp
DCn
Vc
Vc
48
Key Requirements –Future Power
Electronics
High Efficiency
High Power Density
High Temperature
Compact design for same power rating
51
52.
Answer – WideBandgap Devices
High Switching Frequency
Withstand high temperatures
Low device losses
High blocking voltages
J. Millán, P. Godignon, X. Perpiñà, A. Pérez-Tomás and J. Rebollo, "A Survey of Wide Bandgap Power Semiconductor Devices," in IEEE Transactions on Power Electronics, vol. 29, no. 5, pp. 2155-2163, May 2014
52
53.
SiC Device Development
X.She, A. Q. Huang, Ó. Lucía and B. Ozpineci, "Review of Silicon Carbide Power Devices and Their Applications," in IEEE Transactions on Industrial Electronics, vol. 64, no. 10, pp. 8193-8205, Oct. 2017
53
54.
SiC Diodes
X. She,A. Q. Huang, Ó. Lucía and B. Ozpineci, "Review of Silicon Carbide Power Devices and Their Applications," in IEEE Transactions on Industrial Electronics, vol. 64, no. 10, pp. 8193-8205, Oct. 2017
Forward direction
Equivalent slope
resistance
Threshold voltage
Conducting area V
I
Blocking area
Reverse
direction
Break through
54
55.
SiC Diode (cont..)
SiC Schottky barrier diode
(SBD)
Almost no reverse recover
current
Small ON state voltage
drop
Upto 600 V due to high
leakage current
SiC junction barrier Schottky
(JBS) diode
600V-3.3kV
SiC PIN diode
Ultra high range 10kV-20kV
55
X. She, A. Q. Huang, Ó. Lucía and B. Ozpineci, "Review of Silicon Carbide Power Devices and Their Applications," in IEEE Transactions on Industrial Electronics, vol. 64, no. 10, pp. 8193-8205, Oct. 2017
56.
SiC Diode (cont..)
•Lower leakage current in SiC PIN as compared
with JBS or SBD, ideal for higher temperature
operation.
• 3 V knee voltage, which is determined by the SiC
material, makes SiC PIN ineffective from the
conduction point of view when blocking voltages
below 3.3 kV. SiC JBS diodes preferred in these
voltage ranges.
• Because of the minority carrier stored in the
device, sizeable reverse recovery current in the
SiC PIN diode
56
X. She, A. Q. Huang, Ó. Lucía and B. Ozpineci, "Review of Silicon Carbide Power Devices and Their Applications," in IEEE Transactions on Industrial Electronics, vol. 64, no. 10, pp. 8193-8205, Oct. 2017
57.
SiC Diode (cont..)
PartIF, VDC VF QC Irr
IDW40G65C5 40 A,
650 V
1.5 V 55 nC 2.2 μA
RURG8060_F085 80 A,
600 V
1.6 V 130 nC 2 mA
Si Diode vs SiC diode comparison
57
Google Image
58.
SiC Switch
58
X. She,A. Q. Huang, Ó. Lucía and B. Ozpineci, "Review of Silicon Carbide Power Devices and Their Applications," in IEEE Transactions on Industrial Electronics, vol. 64, no. 10, pp. 8193-8205, Oct. 2017
59.
SiC MOSFET
Two typicalSiC MOSFET structures: (a) planar and (b) trench.
Upto 3.3 kV range
Majority carrier device
Lower switching loss and high
speed
3.38 MHz for 1.2 kV SiC MOSFET
High gate voltage requirement
18-20 V
Upto 15 kV SiC MOSFETs reported
Beyond 10 kV ON state voltage
drop is very high
59
60.
SiC MOSFET (cont..)
PartIDS, VDS RDS (on) QG
IPB65R045C7 46 A, 650 V 45 mΩ 93 nC
IPB95R450PFD7 13.3 A, 950 V 450 mΩ 43 nC
Part IDS, VDS RDS (on) QG
IMBG65R048M1H 45 A, 650 V 48 mΩ 78 nC
IMW120R040M1H 55 A, 1200 V 40 mΩ 39 nC
Si MOSFETs
SiC MOSFETs
60
SiC IGBT (cont..)
Summaryof high-voltage SiC IGBTs
62
X. She, A. Q. Huang, Ó. Lucía and B. Ozpineci, "Review of Silicon Carbide Power Devices and Their Applications," in IEEE Transactions on Industrial Electronics, vol. 64, no. 10, pp. 8193-8205, Oct. 2017
63.
Cost Benefit
Potential systemcost benefit from SiC devices
Cost of a 17 kW solar
inverter reduced by 20%
with SiC JFETs and SiC
diodes
63
X. She, A. Q. Huang, Ó. Lucía and B. Ozpineci, "Review of Silicon Carbide Power Devices and Their Applications," in IEEE Transactions on Industrial Electronics, vol. 64, no. 10, pp. 8193-8205, Oct. 2017
64.
SiC Roadmap
SiC deviceapplication roadmap predicted by Yole
K. Madjour, "Silicon carbide market update: From discrete devices to modules", PCIM Europe, 2014
64
Solar PV Inverter
GE1MW SiC inverter installed in Berlin Efficiency curve of GE SiC megawatt
photovoltaic inverter
M. H. Todorovic et al., "SiC MW solar inverter", Proc. PCIM Europe, pp. 645-652, 2016.
66
67.
UPS
Toshiba SiC 500kW G2020 UPS efficiency curve
"G2020 Series SiC 500–750 kVA", 2016, [online] Available: http://www.toshiba.com/tic/power-electronics/ uninterruptible-power-systems/g2020-series-sic-500-to-750-kva.
67
68.
EV
• EV EverywhereChallenge 2013: 35% reduction in
size and 40% reduction in weight and loss
• Toyota’s goal to reduce PCU size by 80%
• Ford Motor Company’s : switching losses reduced
by 40% when SiC MOSFETs used, with an overall 5%
improvement in fuel efficiency
Toyota SiC power control unit
Jan. 2015, [online] Available: http://newsroom.toyota.co.jp/en/detail/5692153.
68
69.
Traction
Mitsubishi all-SiC modulesbased traction converter
2016, [online] Available: http://www.MitsubishiElectric.com/products/transportation/.
• Mitsubishi developed a 3.3 kV/1500 A
module for all-SiC traction inverters,
including a two-level inverter for a 1.5 kV
input dc system for the Odakyu Electric
Railway and a three-level inverter for 2.5
kV ac input for the central Japan railway
• First full-SiC traction system developed for
N700 Shinkansen bullet trains on the
central Japan railway
• Compared with the existing design, it
reduces the inverter size by 55% and
weight by 35%
69
70.
Solid State Transformers(SST)
Ratings 60Hz Power
Transformer
High frequency (HF)
Power Transformer
Voltage and
frequency
100kV, 60Hz 140kV, 20kHz
Current 20A RMS 20A RMS
Power 2MW 1MW
Weight 32000Kg 204Kg
Loss Approx. 35kW Approx. 3kW at 2MW
Low
Frequency
Power
electronic
converter
Power
electronic
converter
Solid State Transformer (SST)
High Frequency
(HF) Transformer
Low
Frequency
Advantages:
About 150 times lighter
Greatly reduced size
Asynchronous link - primary and secondary
at different frequencies
Power flow control
Easy to transport
70
71.
SST (cont..)
Solid-state transformerbased on 15 kV SiC MOSFET
D. P. Sadik et al., "Short-circuit protection circuits for silicon-carbide power transistors", IEEE Trans. Ind. Electron., vol. 63, no. 4, pp. 1995-2004, Apr. 2016.
• 1 MVA solid state transformer based on a 15
kV/120 A SiC MOSFET module.
• Compared with a traditional transformer with
the same rating, it facilitates a 50% reduction
in size and 75% reduction in weight while
achieving 98% efficiency.
71
72.
Power Density Comparison
20kVAmatrix converter with SiC-JFETs size 12.2cm x
6.2cm x 11.7cm weight 1.7kg developed by Infineon
600VA Dimensions (W x D x
H): 10.1 x 27.9 x 14.2 cm Net
Weight: 4.2 Kg
T. Friedli, S.D. Round, and J.W. Kolar. A 100 khz sic sparse matrix converter. In Power Electronics Specialists Conference, 2007. PESC 2007. IEEE, pages 2148 -2154, june 2007.
72
73.
Efficiency Comparison
Efficiency andpower density of Si vs SiC
J. Biela, M. Schweizer, S. Waffler and J. W. Kolar, "SiC versus Si—Evaluation of Potentials for Performance Improvement of Inverter and DC–DC Converter Systems by SiC Power Semiconductors," in IEEE Transactions on Industrial
Electronics, vol. 58, no. 7, pp. 2872-2882, July 2011
73
74.
Acknowledgement
In this ppt,several pictures and diagrams are copied from google images. So,
I would like to acknowledge all those websites and their authors, whose
pictures, I have downloaded and used in these power point slides.