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Apple iOS Device 2013
- 2. Apple iPad Air Apple iPhone 5s Apple iPad mini with Retina Display Apple iPhone 5c Apple TV (3rd Generation, Rev. 2) 2013 Q1 Q2 Q3 Q4 2014
- 5. SK Hynix H2JTCG8T22MBR, NAND Flash USI 339S0203, Broadcom BCM4334 WiFi/BT Soc Apple A5 processor, Single Core, 32nm process Elpida B4432BABH‐1D‐F, 4Gb LPDDR2 Apple 338S1127‐A5, PMIC for Apple A5 processor Texas Instruments TPS54218 PMIC SMSC LAN8742 Ethernet Controller DELTA 8456E‐R Unknown
- 6. Device Function Apple Apple A5 ‧1GHz, ARM CortexTM‐A9, Single‐core ‧Imagination PowerVR 543MP2+ GPU ‧SAMSUNG 32nm HKMG process Elpida B4432BABH ‧4Gb LPDDR2 Hynix H2JTCG8T22MBR ‧8GB MLC NAND Flash BCM4334 (USI 339S0203) Broadcom BCM4334 ‧ Dual‐band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n Wi‐Fi connectivity ‧ Single‐stream IEEE 802.11n support for 20 MHz and 40 MHz channels provides PHY layer rates up to 150 Mbps for typical upper‐layer throughput in excess of 90 Mbps ‧ Supports the IEEE 802.11n STBC (space‐time block coding) and LDPC (low‐density parity check) options for improved range and power efficiency ‧ Complies with Bluetooth Core Specification Version 4.0 + HS with provisions for supporting future specifications ‧ Bluetooth Class 1 transmitter operation SMSC LAN8742 RMII 10/100 Ethernet transceiver (PHY) Apple 338S1127‐A5 ‧PMIC for Apple A5 CPU TPS54218 TI 211 Power management IC, 2.95V to 6V Input, 2A Synchronous Step‐Down SWIFT™ Converter Manufacturer ▼Processor ▼Memory ▼Radio Frequency Broadcom ▼Ethernet ▼PMIC ▼Others Texas Instruments Delta DELTA 8456E‐R
- 14. Model A1533 Model A1530 PCB Photo Source: Techinsights & iFixit
- 15. PCB Photo Source: Techinsights & iFixit Model A1533 Model A1530 Skyworks SKY77355 AVAGO A7900720 TriQuint TQM6M6224 Skyworks SKY77810 AVAGO A7900 Different model (different band support) has different PA design.
- 16. Texas Instruments 36ATLC1 65730A0P; unknown function WiFi module from Murata. Broadcom BCM4334 WiFi/BT SoC Texas Instruments 37CCVHI 343S0645 Broadcom BCM5976A0KUB2G Bosch Sensortech BMA220 3‐axis accelerometer SK Hynix E2NAND 3.0 STM 3‐axis gyroscope Apple 338S1216‐A2 PMIC (Dialog Semiconductor) Apple 338S1201 audio codec (Cirrus Logic) Apple 338S1202 Class D audio amplifier (Cirrus Logic) NXP 1610A1, unknown function Qualcomm PM8018, PMIC for MDM9615M PA chips for Model A1533 PCB Photo Source: Techinsights, iPhone 5S Model A1533
- 17. AKM AK8963 compass Apple M7 coprocessor, NXP LPC1800 series micro processor Apple A7 application Processor, PoP package ElpidaF8164A1PD‐GD‐F , Dual‐channel, LPDDR3‐1600, 8Gb, PoP package Qualcomm MDM9615M baseband processor Qualcomm WTR1605L transceiver PCB Photo Source: Techinsights, iPhone 5S Model A1533
- 19. Manufacturer Device Function Apple A7 Microprocessor (Apple APL0698) ‧Dual‐core, ARMv8 architecture, 1.3GHz ‧Imagination PowerVR 6 series GPU ‧Manufactured by SAMSUNG 28nm HKMG process ‧PoP package NXP LPC18A1 (Apple M7 Processor) ‧NXP LPC1800 series micro processor ‧ARM Cortex‐M3 F8164A1PD‐GD‐F ‧32‐bit, Dual‐channel, 8Gb LPDDR3‐1600 ‧PoP package ▼Processor Apple NXP ▼Memory Elpida Storage ECC free NAND Flash Murata 339S00205 (BRCM BCM4334 SDIO WiFi/ High Speed UART BT SoC) ‧16GB/32GB/64GB ‧Supplier: SK Hynix E2NAND 3.0 ▼Radio Frequency Qualcomm Broadcom BCM4334 ‧ Dual‐band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n Wi‐Fi connectivity ‧ Single‐stream IEEE 802.11n support for 20 MHz and 40 MHz channels provides PHY layer rates up to 150 Mbps for typical upper‐layer throughput in excess of 90 Mbps ‧ Supports the IEEE 802.11n STBC (space‐time block coding) and LDPC (low‐density parity check) options for improved range and power efficiency ‧ Complies with Bluetooth Core Specification Version 4.0 + HS with provisions for supporting future specifications ‧ Bluetooth Class 1 transmitter operation MDM9615M Baseband Processor ‧Rel 9 LTE TDD/FDD Cat 3(100/50Mbps) ‧Rel 9 DCHSPA+(42/5.76Mbps) ‧TD‐SCDMA(4.2/2.2Mbps) ‧QICE ‧Integrated Memory WTR1605L Multi‐band plus 700/1500/2600/B41 GPS+Glonass
- 23. Model A1532 Model A1529 PCB Photo Source: Techinsights & iFixit
- 24. Skyworks SKY77810 Model A1532 AVAGO A792503 Skyworks SKY77572 PCB Photo Source: Techinsights & iFixit RF Micro RF3763 Skyworks SKY77496 Model A1529 AVAGO A7900720 TriQuint TQF6414 TriQuint TQM6M6224 Skyworks SKY77355 Skyworks SKY77810 AVAGO A7900 Different model (different band support) has different PA design.
- 25. Texas Instruments 36ATLC1 65730A0P; unknown function WiFi module from USI/Murata. Broadcom BCM4334 WiFi/BT SoC Texas Instruments 37CCVHI 343S0645 Broadcom BCM5976A0KUB2G Bosch Sensortech BMA220 3‐axis accelerometer STM 3‐axis gyroscope SK Hynix E2NAND 3.0 Apple 338S1164‐B2 PMIC (Dialog Semiconductor) Apple 338S1116 audio codec (Cirrus Logic) Apple 338S1202 Class D audio amplifier (Cirrus Logic) NXP 1610A1, unknown function Qualcomm PM8018, PMIC for MDM9615M PA chips for Model A1532 PCB Photo Source: Techinsights, iPhone 5S Model A1532
- 26. AKM AK8963 compass There is no NXP LPC1800 series microprocessor Apple A6 application Processor, PoP package Elpida/SK Hynix , Dual‐channel, LPDDR2‐1066, 8Gb, PoP package Qualcomm MDM9615M baseband processor Qualcomm WTR1605L transceiver PCB Photo Source: Techinsights, iPhone 5S Model A1532
- 28. Manufacturer Device Function Apple A6 Microprocessor ‧1.26GHz, ARMv7, Dual‐core ‧Imagination PowerVR SGX 543MP3 ‧SAMSUNG 32nm HKMG process ▼Processor Apple ▼Memory System Memory 8Gb LPDDR2‐1066 Storage ‧32‐bit, Dual‐channel, 8Gb, LPDDR2‐1066 ‧Supplier: Elpida: B8164B3PM‐1D‐F SK Hynix: H9TKNNN8KDMRBR NAND Flash ‧16GB/32GB ‧Supplier: SK Hynix/Toshiba Murata: 339S0209 USI: 339S0204 (BRCM BCM4334 SDIO WiFi/ High Speed UART BT SoC) Broadcom BCM4334 ‧ Dual‐band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n Wi‐Fi connectivity ‧ Single‐stream IEEE 802.11n support for 20 MHz and 40 MHz channels provides PHY layer rates up to 150 Mbps for typical upper‐layer throughput in excess of 90 Mbps Supports the IEEE 802.11n STBC (space‐time block coding) and LDPC (low‐density ‧ parity check) options for improved range and power efficiency Complies with Bluetooth Core Specification Version 4.0 + HS with provisions for ‧ supporting future specifications Bluetooth Class 1 transmitter operation ‧ MDM9615M Baseband Processor ‧Rel 9 LTE TDD/FDD Cat 3(100/50Mbps) ‧Rel 9 DCHSPA+(42/5.76Mbps) ‧TD‐SCDMA(4.2/2.2Mbps) ‧QICE ‧Integrated Memory WTR1605L Multi‐band plus 700/1500/2600/B41 GPS+Glonass ▼Radio Frequency Murata/USI Qualcomm
- 30. iPhone 5s iPhone 5c ▼Processor Application Processor ‧Dual core ‧ARM v8 architecture ‧Imagination PowerVR 6 series GPU ‧SAMSUNG 28nm HKMG process ‧Dual core ‧ARM v7 architecture ‧Imagination PowerVR SGX544MP3 GPU ‧SAMSUNG 32nm HKMG process Apple M7 Coprocessor N/A ▼Memory System Memory ‧ Dual‐Channel ‧ LPDDR3‐1600 ‧ 8Gb density Storage ‧ ECC‐Free NAND Flash ‧ Dual‐Channel ‧ LPDDR2‐1066 ‧ 8Gb density
- 31. iPhone 5s ▼Radio Frequency WiFi/BT ‧ Broadcom BCM4334 ‧ Murata & USI module Baseband Processor ‧Qualcomm MDM9215M ‧Qualcomm WTR1605L PA Chips ‧ Avago ‧ RF Micro ‧ Skyworks ‧ TriQuint ▼PMIC PMIC for AP ‧ Dialog Semiconductor PMIC for BP Processor ‧ Qualcomm PM8018 ▼Audio Audio Codec Class D audio amplifier iPhone 5c
- 35. Skyworks SKY73614 TriQuint TQF6514 Skyworks SKY77575‐13/Skyworks SKY77493‐19/Skyworks SKY77494‐22 Avago A7920720 Qualcomm WTR1605L transceiver Qualcomm MDM9615M baseband processor Qualcomm PM8018, PMIC for MDM9615M STM 3‐axis gyroscope Bosch Sensortech BMA220 3‐axis accelerometer Apple 338S1116 audio codec (Cirrus Logic) Apple M7 coprocessor, NXP LPC1800 series micro processor Apple 343S0655‐A1 PMIC (Dialog Semiconductor) Apple A7 application Processor ElpidaF8164A1MD‐GD‐F , Dual‐channel, LPDDR3‐1600, 8Gb Main storage, 16/32/64/128GB density NXP 1610A1, unknown function Broadcom BCM8976A0KUB2G touch screen controller WiFi module from USI. Broadcom BCM43241 WiFi/BT SoC Maxim MAX98304 Mono 3.2W Class D Audio Amplifier
- 36. OmniVision OV2C2BBB Broadcom BCM5976 Broadcom BCM5976 9.7” 2048x1536 Touch Screen iSight Front camera, ALS Parade OmniVision OV2E0BNN DP655 FaceTime camera eDP I2C STM Gyroscope LPDDR3 AKM Elpida NXP I2C/SPI AK8963 Bosch BMP220 LPDDR3 LPC18A1 I2C/SPI Maxim MAX98304 Apple M7 NAND Flash F8164A1MD‐GD‐F 8Gb LPDDR3 16/32/64GB NAND Flash Apple Apple 338S1116 Audio Codec 343S0655‐A1 PMIC UART SDIO For 4G LTE model Skyworks Avago A7920720 Skyworks SKY77493‐19 TriQuint TQF6514 Qualcomm SKY77575‐13 Skyworks SKY77494‐12 Qualcomm WTR1605L MDM9615M Qualcomm PM8018 NXP 1610A1 Lightning USI 339S0213 Broadcom BCM43241 Dialog Semiconductor D2089A
- 37. Manufacturer Device Function Apple A7 Microprocessor (Apple APL5698) ‧Dual‐core, ARMv8 architecture, 1.4GHz ‧Imagination PowerVR 6 series GPU ‧Manufactured by SAMSUNG 28nm HKMG process NXP LPC18A1 (Apple M7 Processor) ‧NXP LPC1800 series micro processor ‧ARM Cortex‐M3 F8164A1MD‐GD‐F ‧32‐bit, Dual‐channel, 8Gb LPDDR3‐1600 NAND Flash ‧16GB/32GB/64GB 343S0655‐A1 PMIC for Apple A7 Processor PM8018 PMIC for Qualcomm MDM9615M baseband processor Apple 338S1116(Cirrus Logic) Audio Codec MAX98304 Mono 3.2W Class D Audio Amplifier 331 microphones BCM5976C1KUB6G Touch Screen Controller Package markings B329 MEMS motion sensor: three‐axis digital output gyroscope BMA220 Ultra small triaxial, low‐g acceleration sensor with digital interfaces AK8963 Electronic Compass ‐ 3‐Axis, w/ built‐in ADC & 14‐16‐bit selectable digital output OV2C2BBB iSight camera front , 5 Mp CIS OV2E0BNN FaceTime camera front , 1.2 Mp CIS ▼Processor Apple NXP ▼Memory Elpida Storage ▼PMIC Apple Qualcomm ▼Audio Apple Maxim STMicroelectronics ▼Touch Screen Controller Broadcom ▼MEMs STMicroelectronics Bosch Sensortech AKM ▼Camera OmniVision
- 38. Manufacturer Device Function 339S0213 (Broadcom BCM43241) Broadcom BCM43241 ‧ Dual‐band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n Wi‐Fi connectivity ‧ 2x2 multiple input/multiple output (MIMO) dual‐band combo chip ‧ Single‐stream IEEE 802.11n support for 20 MHz and 40 MHz channels provides PHY layer rates up to 300 Mbps for typical upper‐layer throughput in excess of 200 Mbps ‧ Supports the IEEE 802.11n STBC (space‐time block coding) and LDPC (low‐density parity check) options for improved range and power efficiency ‧ Complies with Bluetooth Core Specification Version 4.0 + HS with provisions for supporting future specifications ‧Bluetooth Class 1 or Class 2 transmitter operation MDM9615M Baseband Processor ‧Rel 9 LTE TDD/FDD Cat 3(100/50Mbps) ‧Rel 9 DCHSPA+(42/5.76Mbps) ‧TD‐SCDMA(4.2/2.2Mbps) ‧QICE ‧Integrated Memory WTR1605L Multi‐band plus 700/1500/2600/B41 GPS+Glonas TQF6514 RF Power Amplifier/Duplexer Module SKY77575‐13 RF Power Amplifier/Duplexer Module SKY77493‐19 RF Power Amplifier/Duplexer Module SKY77494‐22 RF Power Amplifier/Duplexer Module SKY73614 RF Power Amplifier/Duplexer Module A7920720 RF Power Amplifier/Duplexer Module E50 filter bank AWH switch/filter module TPS65143 LCD Bias with Integrated Gamma Reference for Notebook PCs, Tablet PCs and Monitors Parade Technologies DP655 LCD timing controller (Tcon) 1610A1 Unknown function ▼Radio Frequency USI Qualcomm TriQuint Skyworks Avago Murata ▼Others Texas Instruments Parade Technologies NXP
- 41. Wi‐Fi Could be reserved area for optional WWAN module Main storage, 16/32/64/128GB density Apple M7 coprocessor, NXP LPC1800 series micro processor Apple 338S1213 audio codec (Cirrus Logic) Bosch Sensortech BMA220 3‐axis accelerometer AKM AK8963 electronic compass STM 3‐axis gyroscope Apple 338S11199(Cirrus Logic) Class D Audio Amplifier Apple A7 application Processor, APL0698, PoP package ElpidaF8164A1PD‐GD‐F , Dual‐channel, LPDDR3‐1600, 8Gb, PoP package Apple 343S0656‐A1 PMIC (Dialog Semiconductor) Fairchild FDMC6676BZ Fairchild FDMC6683 NXP 1610A1, unknown function USI WiFi/BT combp module. Broadcom BCM43241 WiFi/BT SoC
- 43. Manufacturer Device Function Apple A7 Microprocessor (Apple APL0698) ‧Dual‐core, ARMv8 architecture, 1.3GHz ‧Imagination PowerVR 6 series GPU ‧Manufactured by SAMSUNG 28nm HKMG process NXP LPC18A1 (Apple M7 Processor) ‧NXP LPC1800 series micro processor ‧ARM Cortex‐M3 F8164A1PD‐GD‐F ‧32‐bit, Dual‐channel, 8Gb LPDDR3‐1600, PoP package NAND Flash ‧16GB/32GB/64GB 343S0656‐A1 PMIC for Apple A7 Processor PM8018 PMIC for Qualcomm MDM9615M baseband processor Apple Apple 338S1213(Cirrus Logic) Audio Codec Apple Apple 338S1199(Cirrus Logic) Class D Audio Amplifier BCM5976C1KUB6G Touch Screen Controller Package markings B334 MEMS motion sensor: three‐axis digital output gyroscope BMA220 Ultra small triaxial, low‐g acceleration sensor with digital interfaces AK8963 Electronic Compass ‐ 3‐Axis, w/ built‐in ADC & 14‐16‐bit selectable digital output OV2C2BBB iSight camera front , 5 Mp CIS OV2E0BNN FaceTime camera front , 1.2 Mp CIS ▼Processor Apple NXP ▼Memory Elpida Storage ▼PMIC Apple Qualcomm ▼Audio ▼Touch Screen Controller Broadcom ▼MEMs STMicroelectronics Bosch Sensortech AKM ▼Camera OmniVision
- 44. Manufacturer Device Function 339S0213 (Broadcom BCM43241) Broadcom BCM43241 ‧ Dual‐band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n Wi‐Fi connectivity ‧ 2x2 multiple input/multiple output (MIMO) dual‐band combo chip ‧ Single‐stream IEEE 802.11n support for 20 MHz and 40 MHz channels provides PHY layer rates up to 300 Mbps for typical upper‐layer throughput in excess of 200 Mbps ‧ Supports the IEEE 802.11n STBC (space‐time block coding) and LDPC (low‐density parity check) options for improved range and power efficiency ‧ Complies with Bluetooth Core Specification Version 4.0 + HS with provisions for supporting future specifications ‧Bluetooth Class 1 or Class 2 transmitter operation MDM9615M Baseband Processor ‧Rel 9 LTE TDD/FDD Cat 3(100/50Mbps) ‧Rel 9 DCHSPA+(42/5.76Mbps) ‧TD‐SCDMA(4.2/2.2Mbps) ‧QICE ‧Integrated Memory WTR1605L Multi‐band plus 700/1500/2600/B41 GPS+Glonas TQF6514 RF Power Amplifier/Duplexer Module SKY77575‐13 RF Power Amplifier/Duplexer Module SKY77493‐19 RF Power Amplifier/Duplexer Module SKY77494‐22 RF Power Amplifier/Duplexer Module SKY73614 RF Power Amplifier/Duplexer Module A7920720 RF Power Amplifier/Duplexer Module E50 filter bank AWH switch/filter module ▼Radio Frequency USI For 4G LTE model Qualcomm TriQuint Skyworks Avago Murata
- 46. iPad Air iPad mini with Retina Display ▼Processor Application Processor ‧Dual core ‧ARM v8 architecture ‧Imagination PowerVR 6 series GPU ‧SAMSUNG 28nm HKMG process ‧Dual core ‧ARM v8 architecture ‧Imagination PowerVR 6 series GPU ‧SAMSUNG 28nm HKMG process ‧ Dual‐Channel ‧ LPDDR3‐1600 ‧ 8Gb density ‧ Dual‐Channel ‧ LPDDR3‐1600 ‧ 8Gb density Apple M7 Coprocessor ▼Memory System Memory Storage ‧ ECC‐Free NAND Flash
- 47. iPad Air ▼Radio Frequency WiFi/BT ‧ Broadcom BCM4334 ‧ Murata & USI module Baseband Processor ‧Qualcomm MDM9215M ‧Qualcomm WTR1605L PA Chips ‧ Avago ‧ Skyworks ‧ TriQuint ▼PMIC PMIC for AP ‧ Dialog Semiconductor PMIC for BP Processor ‧ Qualcomm PM8018 ▼Audio Audio Codec Class D audio amplifier iPad mini with Retina Display
- 49. Graphics performance up to CPU performance up to ARM® v8 architecture, DC Imagination PowerVR 6 series Faster Faster ARM® v7 architecture, DC Imagination PowerVR SGX543MP3 ARM® CortexTM‐A9, SC Imagination PowerVR SGX543MP2 339S0073 339S0030 ARM11, SC Imagination MBX Lite 2007 339S0036 ARM11, SC Imagination MBX Lite ARM® CortexTM‐A8, SC Imagination PowerVR SGX535 ARM® CortexTM‐A8, SC Imagination PowerVR SGX535 2014
- 50. APL5698 ARM® ARMv8 DC, 28nm HKMG APL0698 APL0698 ARM® ARMv8 DC, 28nm HKMG ARM® ARMv8 DC, 28nm HKMG APL0598 ARM® ARMv7 DC, 32nm HKMG APL7498 ARM® CortexTM‐A9 SC, 32nm HKMG 2013 Q1 Q2 Q3 Q4 2014
- 52. Apple A7 APL5698 Apple iPad Air 338S1166 Audio Codec Apple A7 APL0698 iPhone 5s Apple A7 APL0698 iPad mini with Retina display 338S1201 338S1202 338S1213 338S1199 Audio Codec Class‐D Amplifier Audio Codec Class‐D Amplifier Apple A6 APL0598 iPhone 5c 338S1116 Audio Codec 2013 Q1 Q2 Q3 Q4 2014
- 53. Year 2013 2012 2013 2013 APL7498 (S5L8947) APL0598 (S5L8950) APL0698 (S5L8947) APL5698 (S5L9865) Process SAMSUNG 32nm HKMG SAMSUNG 32nm HKMG SAMSUNG 28nm HKMG SAMSUNG 28nm HKMG Die Size 37.8 mm2 96.71 mm2 102 mm2 102 mm2 Package FCSP PoP PoP FCBGA SC, ARM® CortexTM‐A9 DC, ARM® v7‐s architecture DC, ARM® v8‐A architecture DC, ARM® v8‐A architecture Apple 338S1127‐A5 Apple 338S1164‐B2 Apple 338S1216‐A2(iPhone) Apple 338S0656‐A1(iPad mini) Apple 338S0655‐A1 N/A Apple 338S1116 Apple 338S1202(Amp) Apple 338S1201 Apple 338S1202(Amp) Apple 338S1213 Apple 338S1199(Amp) Apple 338S1116 32‐bit Single‐Channel LPDDR2 32‐bit Dual‐Channel LPDDR2 32‐bit Dual‐Channel LPDDR3 32‐bit Dual‐Channel LPDDR3 Imagination PowerVR SGX543MP2+ Imagination PowerVR SGX543MP3+ Imagination PowerVR 6 Series GPU Imagination PowerVR 6 Series GPU I2C/I2S/SPI SDIO HS‐UART HDMI NAND Flash Ethernet MAC I2C/I2S/SPI SDIO HS‐UART MIPI‐DSI/MIPI‐CSI USB OTG NAND Flash I2C/I2S/SPI SDIO HS‐UART MIPI‐DSI/MIPI‐CSI eDP USB OTG NAND Flash I2C/I2S/SPI SDIO HS‐UART MIPI‐CSI eDP USB OTG NAND Flash Product Code Processor Core PMIC Audio Codec Memory GPU Peripheral Interface
- 54. 338S1127‐A5 PMIC
- 57. Touch Screen Controller iSight Front camera Display ALS FaceTime camera MIPI LPDDR2 Gyroscope I2C/SPI LPDDR2 eCompass Accelerator Dual‐channel LPDDR2 PoP Package I2C/SPI NAND Flash I2C/SPI 16/32/64GB NAND Flash 338S1164‐B2 PMIC 338S1202 Class‐D Amplifier 338S1116 Audio Codec UART Qualcomm Transceiver Qualcomm MDM Modem Qualcomm PMIC NXP 1610A1 Lightning WiFi/BT SoC SDIO
- 63. Touch Screen Controller iSight Front camera 7.9” 2048x1536 ALS I2C/SPI FaceTime camera eDP Gyroscope LPDDR3 I2C/SPI eCompass Accelerator I2C/SPI 338S1199 Class‐D Amplifier LPDDR3 Dual‐channel LPDDR3 PoP Package NXP LPC18A1 NAND Flash 338S1213 Audio Codec 338S0656‐A1 PMIC For 4G LTE model Qualcomm Transceiver 16/32/64GB NAND Flash Qualcomm MDM Modem UART NXP 1610A1 Qualcomm PMIC Lightning WiFi/BT SoC SDIO