I-Byte Technology April 2021

IT Shades
Engage & Enable
I-Bytes
Technology
April Edition 2021
Email us - marketing@itshades.com
Website : www.itshades.com

IT Shades
Engage & Enable
For any queries, Please write to marketing@itshades.com
About Us
Who We are Aim of this IByte Reasons to talk to us
ITShades.com has been founded with
singular aim of engaging and
enabling the best and brightest of
businesses, professionals and
students with opportunities,
learnings, best practices,
collaboration and innovation from IT
industry.
This document brings together a set
of latest data points and publicly
available information relevant for
Technology Industry. We are very
excited to share this content and
believe that readers will benefit from
this periodic publication immensely.
1. Publishing of your company’s solutions/
announcements in this document.
2. Subscribe to this and other periodic
publications i.e. I-Bytes, Solution Letters from
ITShades.com.
3. For placement of your company's click-able
logo and advertisements.
4. Feedback for us to improve the content and
format of these periodic publications.

IT Shades
Engage & Enable
Feel free to contact us at marketing@itshades.com for any queries
Sponsoring Companies for this Edition
LOGO 1 LOGO 2 LOGO 3
LOGO 4 LOGO 5

IT Shades
Engage & Enable
Table of Contents
1. Financial, M & A Updates...................................................................................................................................1
2. Solution Updates.................................................................................................................................................10
3. Rewards and Recognition Updates...................................................................................................................57
4. Customer Success Updates................................................................................................................................64
5. Partnership Ecosystem Updates.......................................................................................................................67
6. Environment & Social Updates........................................................................................................................81
7. Miscellaneous Updates......................................................................................................................................88

IT Shades
Engage & Enable
Financial, M & A
Updates Technology Industry

Lore Lorem
ipsum
dolor sit
amet,
consec-
tetuer
Financial, M&A Updates
IT Shades
Engage & Enable
Applied Materials (USA) Announces Update on Kokusai Electric Acquisition
Agreement
Applied Materials, Inc. announced that the amended Kokusai Electric Corporation share purchase agreement with
KKR HKE Investment L.P. may have terminated in accordance with its terms on March 19, 2021 after the parties were
unable to confirm timely regulatory approval in China. If Applied does not receive confirmation of timely approval
prior to the March 26, 2021 deadline for payment of the termination fee, Applied will treat the agreement as
terminated and pay KKR a termination fee of $154 million in cash. The Applied Materials Board of Directors has
approved a new $7.5 billion stock buyback authorization, supplementing the previous authorization which has
approximately $1.3 billion remaining.
Description
1

Lorem
ipsum
dolor sit
amet,
consec-
tetuer
IT Shades
Engage & Enable
Autodesk (USA) Completes Acquisition of Innovyze, Provider of Smart Water
Infrastructure Modeling, Simulation, and Predictive Technologies
Autodesk, Inc. has announced the completion of its acquisition of Innovyze, Inc.
for $1 billion net of cash subject to working capital and tax closing adjustments.
The acquisition positions Autodesk as a leading global provider of end-to-end
digital solutions from design to operations of water infrastructure, accelerates
Autodesk’s digital twin strategy, and creates a clearer path to a more sustainable
and digitized water industry. Autodesk and Innovyze’s complementary
technologies and long-list of shared customers offer significant value to the
industry at large. Additionally, the acquisition will enhance Autodesk’s growth
potential by expanding Innovyze’s global footprint and presence across the water
infrastructure value chain from design through construction to operations and
maintenance. Innovyze’s innovative software for the water industry is trusted by
approximately 3,000 customers worldwide. Customers include public and private
utility companies in many of the most populous cities across five continents.
These include a majority of ENR’s top design firms, and leading environmental
and engineering consultancies.
Executive Commentary
“We make investment decisions based on the potential value to Autodesk and
to our customers, and increasingly, we give significant consideration to an
investment’s impact on sustainability, as we did with our Spacemaker
acquisition last year,” said CEO and president of Autodesk. “Innovyze is no
different. Responsibly managing our use of water runs parallel to successfully
sustaining life. This is a software acquisition, but also a clear statement of
Autodesk’s corporate commitment to improve our planet.”
Description
2

Lorem
ipsum
dolor sit
amet,
consec-
tetuer
IT Shades
Engage & Enable
pbb (Germany) provides €115mn financing for a logistics portfolio in Poland
acquired by Ares Management
pbb Deutsche Pfandbriefbank has provided an investment loan facility
totalling €115mn to a fund managed by the Real Estate Group of Ares
Management Corporation (Ares), which will utilise the proceeds for the
acquisition financing of a logistics portfolio in Poland. pbb acted as
arranger and sole lender under the facility. The portfolio consists of four
assets along key logistic destinations across northern, central and southern
Poland. All properties are newly built Class A warehouse assets located in
Gdansk, Katowice Sosnowiec, Poznan and Wroclaw. The portfolio
comprises a total of 285,500m² gross lettable area let to over 30 reputable
tenants such as Rhenus, LPP and GEFCO. This is the second transaction
between Ares and pbb within a short timeframe. In Q4/2020, pbb provided
a €30mn medium term financing for the acquisition of a logistics portfolio
comprising 83,200m² gross lettable area with assets located along the main
logistic routes in Spain like A2, AP-7 and A3 motorways.
Head of International Clients, UK, CEE & USA at pbb Deutsche
Pfandbriefbank said: "We are very pleased to support Ares in their
logistics acquisitions across Europe. Both – Poland and Spain – are
important markets for pbb, and we are looking forward to continue
working with Ares in the logistics sector in Poland, Spain and beyond.”
Description
3

Lorem
ipsum
dolor sit
amet,
consec-
tetuer
IT Shades
Engage & Enable
pbb (Germany) provides around EUR 80 million for the acquisition of ABC-Bogen
in Hamburg
pbb Deutsche Pfandbriefbank is providing around EUR Institutional
Investment Partners GmbH around EUR 80 million for the acquisition
of the ABC-Bogen office property in Hamburg. The fully let property
serves as Google Germany's headquarters and is located in a central
inner-city location in Hamburg, not far from Gänsemarkt. The
building, designed by Hadi Teherani, has an attractive design: on the
street front, the corrugated façade follows the structure of the
neighbouring building, while the rear building forms a semi-circular
shape and offers particularly bright office space thanks to storey-high
glazing. The property has a lettable area of around 15,000 m² and 140
underground parking spaces.
Head of Real Estate Germany at pbb, said: "The prime location and
good facilities make the ABC-Bogen a sustainably attractive office
property."
Description
4

Lorem
ipsum
dolor sit
amet,
consec-
tetuer
IT Shades
Engage & Enable
Fujifilm (Japan) Announces New Investment in Inkjet Pigment Dispersion
Manufacturing Plant
FUJIFILM Imaging Colorants, Inc. a U.S. subsidiary of FUJIFILM Corporation, will
construct a new production plant for pigment dispersions, which is a colorant for
water-based pigment inkjet inks, in order to accelerate the growth of the global inkjet
business. Construction will start in April 2021 and is scheduled for completion by
2022. The investment for this construction is approximately 19 million USD. Inkjet
technology has the capability to deliver fast, versatile, print production at short or
long run-lengths with variable data. Applications for inkjet are expanding into
industrial fields such as packaging printing in addition to commercial and publishing
printing. In particular, there is a growing need to use water-based pigment inkjet inks,
which have low environmental impact and potential to meet requirements for food
packaging safety compliance. Currently, FFIC Inc. in the U.S. is a water-based inkjet
ink manufacturing facility. By adding the new production plant for pigment
dispersions (the main colorant in water-based pigment inkjet inks), it will be able to
produce consistent, fully-featured water-based pigment inkjet inks built with
Fujifilm’s own core dispersion technology.
“RxD is a key technology for current and next-generation water-based inkjet
inks,” said President & Chief Operating Officer of FFIC Inc. “Expansion of our
manufacturing capacity is part of a commitment to ensure we can meet increasing
demand to support our global customer base. We are already manufacturing a
very high-quality, high-purity product in the U.K. In this venture we are using the
design and project management expertise of our U.K. team to execute this project
in the U.S. This, alongside expert knowledge, technology and processes will
ensure that we manufacture RxD dispersions to the same exceptional standard
across both sites.”
Description
5

Lore Lorem
ipsum
dolor sit
amet,
consec-
tetuer
IT Shades
Engage & Enable
Fujifilm (Japan) invests in a biotech venture, Cuorips
FUJIFILM Corporation announces that it signed an agreement to invest 100 million yen into a biotech venture, Cuorips Inc. through underwriting its third-party
allocation of shares. Cuorips is a biotech venture for developing and commercializing iPSC-based treatment for heart failure. Coinciding with the investment, Fujifilm
also signed a business partnership agreement concerning the contract development and manufacturing of a regenerative medicine product, currently under R&D by
Cuorips, the United States. Heart failure refers to a condition in which the heart becomes incapable of pumping blood sufficiently, leading to symptoms such as
breathing difficulty. It is caused by heart diseases such as ischemic cardiomyopathy. Heart failure is treated with pharmacotherapy at present, but it is difficult to achieve
a complete recovery. Many patients require repeated hospital treatments as their conditions worsen, and heart transplantation is performed on severe cases. However,
there is a need for developing a new treatment option because it is difficult to secure enough number of donors. Cuorips is a biotech venture originated from Osaka
University, aimed at commercializing an allogeneic iPSC-derived cardiomyocyte sheet, developed by a team led by Professor, head of department for Cardiovascular
Surgery, Osaka Graduate School of Medicine. Cuorips is assisting investigator-initiated clinical research of the allogeneic iPSC-derived cardiomyocyte sheet,
conducted by Osaka University on patients suffering from serious heart failure. The company is also working on establishing a supply system, commencing the
operation of cell culture and processing facilities for manufacturing investigational agents for the sheet and producing the sheet in commercial quantities. Fujifilm has
decided to invest in Cuorips to expand business through the partnership with this biotech venture. The investment also coincides with the signing of a business
partnership agreement between the two companies, which gives Fujifilm the priority negotiation right for contract development and manufacturing of Cuorips’
allogeneic iPSC-derived cardiomyocyte sheet in the United States.
Description
6

Lorem
ipsum
dolor sit
amet,
consec-
tetuer
IT Shades
Engage & Enable
Jabil (USA) Announces Global Investment in Paper Packaging Solutions to Meet
Heightened CPG Sustainability Demand
Jabil Inc. announced expansion plans for its newly acquired paper bottle technology with a
$25 million investment in subsidiary Ecologic’s Manteca, California, location and the
buildout of a new paper bottle plant in its Sustainability Center of Excellence in Tortosa,
Spain. This expansion will create the first paper-based scaled technology in the market, as
Jabil delivers Ecologic’s innovative pulp molding capabilities to new geographies and
enables production of hundreds of millions of new paper packages. Jabil is making this
investment in response to significant consumer packaged goods (CPG) market demand.
According to Euromonitor, consumers reported that they are three times more likely to prefer
paper-based packaging over alternatives that leverage metal or plastic. Jabil’s global
investment includes a footprint expansion, as well as the delivery of new equipment and
automation, unlocking tremendous potential for CPG brands. This investment accelerates the
maturation of paper packaging in commercial settings, from niche application to global
brand scale. The enhancement of the two facilities in the Jabil Packaging Solutions (JPS)
division significantly enriches Jabil’s sustainable packaging platform and offerings for CPG
customers. This expansion of the JPS footprint is a continuation of the process begun in
January 2021, when Jabil acquired Ecologic Brands, a leading provider of sustainable
packaging specializing in paper bottle and paper-based packaging solutions.
“As consumers become more informed about the environmental impact of plastic waste,
they are looking for new, sustainable packaging solutions such as paper. The challenge
for packaging providers is the ability to scale production to meet this demand,” said
senior vice president of Jabil and CEO of Jabil Packaging Solutions. “The expansion of
these two facilities will result in a significant increase in packaging capacity for the
North American and European markets, helping CPG brands in pursuit of challenging
sustainability goals.”
Description
7

Lorem
ipsum
dolor sit
amet,
consec-
tetuer
IT Shades
Engage & Enable
Rexel (France) implements its strategic roadmap with 2 bolt-on acquisitions to
reinforce its software and services capabilities in green energy
Rexel announced it has acquired a minority stake in Trace Software
International, a software edition company specialized in electrical
design and calculation for non-residential building activity and
100% of Freshmile Services, an independent electrical vehicle
charging station operator offering both services and supervision
software. The ambition underpinning these 2 acquisitions is
twofold:
• Complete the current range of software solutions with a new
proposition dedicated to the non-residential market to facilitate the
daily work of our customers.
• Offer a full range of services to end users, from installed base
monitoring to remote maintenance.
“The two transactions we are announcing are the first building
blocks in software and services that are part of the strategy we
presented at our strategic update on February 11th. Through
these bolt-on acquisitions, we will reinforce our positioning and
extend our addressable market with innovative adjacent
activities. These two deals demonstrate our intention to play an
active role across the value chain and to seize new market
opportunities. They strengthen our capabilities in the day-to-day
software used by our customers and allow us to enter the services
segment in the EV business”. Said CEO of Rexel.
Description
8

Lorem
ipsum
dolor sit
amet,
consec-
tetuer
IT Shades
Engage & Enable
Qualcomm (USA) Completes Acquisition of NUVIA
Qualcomm Incorporated announced that its subsidiary, Qualcomm
Technologies, Inc., has completed its acquisition of the world-class
CPU and technology design company, NUVIA for $1.4 billion before
working capital and other adjustments. Qualcomm Technologies
expects to integrate next generation CPUs across a wide portfolio of
products, including powering flagship smartphones, laptops, and
digital cockpits, as well as Advanced Driver Assistance Systems,
extended reality, and infrastructure networking solutions. The first
Qualcomm® Snapdragon™ platforms to feature Qualcomm
Technologies’ new internally designed CPUs are expected to sample
in the second half of 2022 and will be designed for high performance
ultraportable laptops.
“The world-class NUVIA team enhances our CPU roadmap,
extending Qualcomm’s leading technology position with the
Windows, Android and Chrome ecosystems,” said President and
CEO-Elect, Qualcomm Incorporated. “The broad support of this
acquisition from across industries validates the opportunity we
have to provide differentiated products with leading CPU
performance and power efficiency, as on-demand computing
increases in the 5G era.”
Description
9

IT Shades
Engage & Enable
Solutions Updates
Technology Industry

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
minim veniam, quis nostrud exerci tation
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
adipiscing elit, sed diam
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
AMD (USA) Brings Power of “Zen 3” to World’s Best Mobile Processors
for Business¹ -- AMD Ryzen PRO 5000 Series Mobile Processors
10
Solution Description
AMD announced the AMD Ryzen™ PRO 5000 Series Mobile Processors, bringing the uncompromising performance and efficiency of the “Zen 3” core architecture to
premium business laptops. Paired with AMD PRO technologies that offer strengthened multi-layer enterprise-class security features and powerhouse productivity, the new
AMD Ryzen PRO 5000 Series Mobile Processors are built to meet the demands of the modern workforce. With broad availability from HP and Lenovo expected starting in Q2,
the number of AMD-powered enterprise notebooks is expected to triple by the end of 2021. AMD Ryzen PRO 5000 Series Mobile Processors are built to provide a powerful
computing experience with security features for today’s demanding business environments. The AMD Ryzen 7 PRO 5850U processor, with 8 cores and 16 threads, delivers
leadership CPU performance, offering up to 57%2 more multi-threaded performance than the competition. AMD Ryzen 7 PRO 5850U processor is designed for the increased
demand in productivity, offering up to 23%3 faster performance for home and office productivity than the competition. Built for all-day battery life and productivity, along with
the optimized 7nm “Zen 3” core architecture, the AMD Ryzen 7 PRO 5850U processor offers up to 17.54 hours of battery life. AMD PRO security provides a multi-layered
approach to security features by embedding defenses at every level, from silicon through operating system. AMD Memory Guard, exclusive to AMD Ryzen PRO processors
and automatically enabled on Microsoft Secured-Core PCs, helps enable data and identity protection, while AMD Shadow Stack helps provide hardware enabled protection
against malware attacks. AMD PRO manageability enables a full manageability feature set for simplified deployment, imaging and management that is compatible with modern
IT infrastructures. AMD Ryzen PRO processors offer full support for Microsoft Endpoint Manager to deliver a flexible and integrated cloud management solution. AMD PRO
business ready technologies bring enterprise-grade computing solutions designed for quality and reliability, in addition to platform longevity. AMD Ryzen PRO processors
feature 18-months of planned software stability and 24-months of planned availability.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
AMD (USA) EPYC™ 7003 Series CPUs Set New Standard as Highest
Performance Server Processor
11
AMD announced the new AMD EPYC™ 7003 Series CPUs, which includes the AMD EPYC 7763, the world’s highest-performing server processor2. The new EPYC 7003 series processors
help HPC, cloud and enterprise customers do more, faster, by delivering the best performance of any server CPU with up to 19% more instructions per clock. Available immediately, AMD
EPYC 7003 Series Processors have up to 64 “Zen 3” cores per processor and introduce new levels of per-core cache memory, while continuing to offer the PCIe® 4 connectivity and
class-leading memory bandwidth4 that defined the EPYC 7002 series CPUs. 3rd Gen AMD EPYC processors also include modern security features through AMD Infinity Guard, supporting
a new feature called Secure Encrypted Virtualization-Secure Nested Paging (SEV-SNP). SEV-SNP expands the existing SEV features on EPYC processors, adding strong memory integrity
protection capabilities to help prevent malicious hypervisor-based attacks by creating an isolated execution environment. You can read more about new 3rd Gen AMD EPYC features here. All
these features and capabilities combine to help drive faster time to results and improve business outcomes for HPC, cloud and enterprise customers.
• For HPC customers that demand the most throughput computing capabilities to do more simulations in a given time period, or use bigger data sets or more complex models, AMD EPYC
7003 Series processors enable faster time to discovery with more I/O5 and memory throughput, and powerful “Zen 3” cores that deliver up to twice the performance for HPC workloads
compared to the competition6.
• For cloud providers who need compute density and security capabilities, AMD EPYC 7003 Series processors offer the highest core density7, advanced security features and up to twice
the integer performance compared to the competition8.
• For the enterprise, where performance and time to value are critical to support the new “work from anywhere” environment, AMD EPYC 7003 Series processors help improve efficiency,
and deliver value and performance. The new processors increase transactional database processing by up to 19%9, improve Hadoop big data analytic sorts by up to 60% with 61% better price
to performance than the competition10, and offer superior performance for flexible Hyperconverged Infrastructure - all of which help CIOs turn data into actionable insights faster.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
Alps Alpine (Japan) Develops, Starts Shipping Samples of 5G NR Module
for Automotive Use
12
Alps Alpine Co., Ltd. has developed the UMNZ1 Series 5G NR1 Module for Automotive Use, a first for a Japanese corporation. Sample shipments
began in March with aims to accelerate social implementation of 5G solutions for automobiles. Fifth-generation (5G) mobile communications
technology featuring ultra-fast speeds, ultra-low latency and mass connectivity has a vital role to play within communications infrastructure of
future society. The automotive industry is well poised to benefit from the technology given the major transformation already underway
characterized by the CASE trends of connected cars, autonomous driving, sharing and services, and electrification. Used in combination with
vehicle-to-everything (V2X) systems giving vehicles the capability to communicate and interact with everything around them, such as road
infrastructure, other vehicles and pedestrians, 5G is expected to contribute to greater sophistication of IVI
（In Vehicle Infotainment）
; for example,
real-time integration of traffic conditions into navigation applications and instant downloading of high-definition video to watch on a cabin display.
It will also spur integration of Internet of Things (IoT) technology that will improve the efficiency of car maintenance and inspections by keeping
an eye on the condition of a vehicle via a range of different sensors. One highly anticipated application is in enabling functions essential for fully
autonomous driving that existing V2X systems have been unable to sufficiently support, such as adjusting speed in response to traffic signals and
other vehicles on the road.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
Alps Alpine (Japan) Expands Compact Waterproof Detector Switch
Lineup
13
Alps Alpine Co., Ltd. has expanded its SPVQ8 Series lineup of compact switches for use in detecting the opening and closing of
vehicle doors and has newly introduced the SPVQ8H Series. Alps Alpine’s popular SPVQ8 Series of compact detector switches are
amongst the smallest in the industry and are available in extensive variety. We are now expanding the lineup further as part of ongoing
efforts to accommodate broadening customer needs. Electrification of vehicles is progressing and the electronic components inside
them need to be made even smaller and lighter. Door latches, too, require smaller detector switches in keeping with a general trend
toward thinner, more compact structures. Because of a growing need for long-stroke switches to elevate design freedom for customers
and enable diverse latch cam* operation, Alps Alpine is bolstering its existing SPVQ8 Series lineup of compact detector switches
with the addition of actuator-included varieties. Actuator-included switches widen limits of detection (vertically and sideways) and
enhance consistency. They also help to extend operating life by cushioning impact. For hood latches and side door latches, detector
switch wire harnesses need to have high tensile strength and actuators must be durable. Alps Alpine is therefore launching the
SPVQ8H Series, adding casings to existing products to enhance robustness and improve mounting compatibility.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
Amadeus (Spain) and airport company Finavia team up to modernize
passenger experience at 11 airports in Finland
14
Finavia is moving towards the final stages of the large development programmed of Helsinki Airport. The investment programmed that started
in 2013, increases among other things the terminal area by 45%, growing baggage handling and passport control capacity by 50%. The
investment strengthens Helsinki Airport’s role as a bridge between Europe and Asia, positioning the group to capture future demand. The
development programmed has been an opportunity for modernizing Finavia’s technology infrastructure, e.g., check-in and boarding systems
with Amadeus as it supports Finavia’s aim to deliver an exceptional passenger experience. Finavia serves more than 50 airlines that operate
scheduled flights and their ground handling companies and has over 600 check-in desks at the airports. The airport company chose Amadeus
Flow, an integrated cloud solution, to modernize all aspects of passenger handling including software, hardware and services. With the new
cloud platform, a single internet link connects Finavia’s airports to Amadeus where any airline application can be easily deployed in a matter
of hours. Frictionless payment allows travelers to pay more easily with contactless technology. This is just one example of an additional
innovation delivered via Amadeus and the first to be implemented. Amadeus’Airport Pay solution will be deployed from the cloud allowing
passengers to pay for ancillary services such as extra baggage or lounge access conveniently and in a contactless manner at all check-in desks.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
Amadeus (Spain) Safe Travel Ecosystem addresses global passenger
health verification needs
15
Anyone who has flown recently will know that the need to show proof of health checks or vaccination status is creating customer pain points along
the journey. There are a myriad of digital apps and health wallets aiming to eliminate the paper trail, but not all travelers are keen to download yet
another app that they don’t use frequently. This is why Amadeus has added new capabilities to Traveler ID, a secure platform for its travel provider
customers, that connects, digitizes and automates traveler identification and document validation across the traveler journey, while meeting
regulatory requirements. This platform connects the health certification touchpoints end-to-end, integrating multiple stakeholders involved in the
process, providing a secure and frictionless way for passengers to show that they have the health documentation needed to travel. Privacy and
security have been central to the design of Traveler ID, ensuring that passengers choose when and where they want to provide digital evidence of
their health status. For airlines and airports, this solution can be integrated directly into their own digital channels. It sits natively within their IT
systems, meaning travelers don’t need to be redirected to unfamiliar third-party apps in order to verify their health documentation. It can be used
by the passenger either before departure or while at the airport, when checking in at the airline desk, at a self-service kiosk or bag drop. This new
capability, which is agnostic for any airline PSS, can easily be integrated into airline systems as a standalone option without having to contract the
full Traveler ID platform.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
Apple (USA) Arcade launches its biggest expansion yet, growing its
award-winning catalog to more than 180 games
16
Apple announced it is introducing two entirely new game categories and adding more than 30 incredible titles to Apple Arcade, its popular
gaming subscription service for players of all ages. Apple Arcade offers breakthrough, unique benefits players love: no ads, no in-app
purchases, support for Apple’s high user privacy standards, and one all-inclusive subscription offer with access for up to six family
members. In addition to new exclusive Arcade Originals, including “NBA 2K21 Arcade Edition,” “Star Trek: Legends,” and “The Oregon
Trail,” the service is introducing two new game categories, Timeless Classics and App Store Greats. Arcade Originals are playable across
iPhone, iPad, Mac, and Apple TV. Timeless Classics and App Store Greats are available on iPhone and iPad. Timeless Classics includes
universally loved, quintessential genres with titles like “Good Sudoku by Zach Gage,” “Chess - Play & Learn,” and “Backgammon,”
while App Store Greats brings some of the best award-winning games from the App Store to Apple Arcade, including “Threes!,” “Mini
Metro,” and “Fruit Ninja Classic,” all ad-free and fully unlocked. These two new categories join Arcade Originals to bring the service’s
catalog to over 180 outstanding games for the entire family to enjoy at a great value, with no ads or additional in-app purchases. Apple
Arcade is included as part of Apple One or for a low monthly subscription of INR 99 with a one-month free trial.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
Applied Materials (USA) Ai(X) Platform Harnesses the Power of Big Data and
Ai To Accelerate Semiconductor Technology Breakthroughs from Lab to Fab
17
Applied Materials, Inc. announced AIx TM, an innovative platform that accelerates the discovery, development and commercial deployment of new chip technologies. AIx, which stands for Actionable
Insight Accelerator, enables engineers to see into semiconductor processes in real-time, take millions of measurements across wafers and individual chips, and optimize thousands of process variables
to improve semiconductor performance, power, area-cost and time to market (PPACt). The AIx platform works across all Applied Materials process equipment, eBeam metrology systems and
inspection systems and is extendable from lab to fab. By providing engineers with the ability to fingerprint innovative recipes during R&D, AIx accelerates their transfer and ramp into high-volume
manufacturing (HVM). AIx is already in use today, improving the PPACt of both logic and memory chips. The AIx platform includes:
• ChamberAITM: New sensors and machine learning algorithms for Applied Materials process chambers that provide engineers with real-time analytics of variables including chemistry, energy,
pressure, temperature and duration.
• On-board metrology: Unique in-vacuum metrology that enables new films to be measured as they are being deposited, with angstrom-level precision.
• Inline metrology: Unique algorithms based on Applied eBeam metrology which can provide a 100-fold increase in measurement speed versus legacy approaches along with 50 percent higher
resolution. Engineers can obtain over one million 3D wafer measurements per hour to make nanometer-scale assessments of how miniscule changes in recipes affect on-chip devices and structures.
• AppliedPROTM: Process Recipe Optimizer generates digital process maps that help accelerate materials and recipe development, reduce variability and widen process windows. AppliedPRO can
be used to optimize individual chambers and tools as well as accelerate matching across a fleet of systems.
• Digital twins: The AIx platform includes digital twin models of select Applied Materials chambers and systems that enable virtual experiments which accelerate recipe development, improve
matching and ramp transfer, and optimize output and yield in high-volume production.
• Computing: The AIx platform includes the computing resources needed to store and analyze massive data using machine learning and AI algorithms.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
HPE GreenLake Cloud Services Now Available via ArrowSphere (USA)
18
Arrow Electronics, Inc. announced HPE GreenLake cloud services are now available via its ArrowSphere cloud
marketplace at pre-configured and pre-priced offers through the Swift Sales Program. Available in over 35 countries
globally, and with thousands of channel partners and hundreds of thousands of end customers active in the platform,
ArrowSphere helps simplify the complexity of delivering hybrid cloud solutions while providing customers with the
necessary business intelligence for their operations. HPE GreenLake provides customers with flexible cloud services
that can run on-premises—at the edge, in data centers or in colocations. The HPE GreenLake cloud services portfolio
offers a range of cloud services for compute, container management, data protection, HPC, machine-learning
operations, networking, SAP HANA, storage, VDI, and VMs.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
ASUS (Taiwan) Republic of Gamers Presents ROG Phone 5 Series and Gaming
Headsets
19
ASUS Republic of Gamers (ROG) unveiled the powerful new ROG Phone 5 series and a lineup of gaming headsets and accessories
at the For Those Who Dare virtual launch event. The event also featured a live all-star showmatch for leading gaming influencers
from around the world to compete against each other. ROG Phone 5 series, including ROG Phone 5, ROG Phone 5 Pro and ROG
Phone 5 Ultimate, is the latest and most powerful incarnation of the world's most advanced gaming smartphone. Unleashing the
power of the latest Qualcomm® Snapdragon™ 888 5G Mobile Platform with advanced 5G communications, ROG Phone 5 series
offers a 144 Hz / 1 ms AMOLED HDR10+ certified display from Samsung, an upgraded GameCool 5 cooling system and a monster
6000 mAh battery. ROG Phone 5 Pro and ROG Phone 5 Ultimate also boost user experiences with the cutting-edge ROG Vision, a
novel rear matrix display that shows animations in tune with the phone’s status. For incredible gaming audio to complement ROG
Phone 5 series, the lineup also includes ROG Strix Go BT, a gaming headset that delivers exceptional wireless audio for immersive
gaming experiences; ROG Cetra II, gaming headphones with Active Noise Cancelation, a USB-C® connector and liquid silicone
rubber (LSR) drivers; and ROG Cetra II Core, gaming headphones with LSR drivers and extensive multiplatform compatibility.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
Autodesk (USA) Expands Preconstruction Offering with Global Launch
of Autodesk Takeoff
20
Autodesk, Inc. announced the worldwide availability of Autodesk Takeoff, a new product that empowers estimators to perform 2D and 3D quantification workflows from
a common data environment to increase collaboration, speed and accuracy during the estimation process. Originally announced at Autodesk University in November
2020, Autodesk Takeoff will join Autodesk Build and Autodesk BIM Collaborate as part of the Autodesk Construction Cloud unified platform. The announcement comes
one month after Autodesk Build and Autodesk BIM Collaborate were made available globally for Autodesk Construction Cloud customers. Now available worldwide,
Autodesk Takeoff allows estimating teams to:
• Better visualize project scope with aggregated 2D and 3D takeoff – Takeoff types can be used across both 2D and 3D quantification workflows, allowing teams to
leverage aggregated quantities from plans and models in an organized, customizable view. Teams can visualize project scope from detailed 3D takeoffs to identify gaps
in producing accurate costs and estimates.
• See updates in real-time with cloud-based document management – Estimating teams can access the most up-to-date construction documents, drawings and models
within Autodesk Docs, the centralized document management solution that underpins both Autodesk Build and Autodesk BIM Collaborate. Working from one
centralized platform gives teams access to updates in real time for improved collaboration across projects. With data stored in one location, teams can feel confident they
are not duplicating efforts and doing takeoffs more than once.
• Provide multi-user access to projects – Multiple estimators can simultaneously access the same project files to review and perform 2D and 3D takeoff, creating a
synchronous workflow experience. Estimating teams are notified when a document set is updated to ensure they are always working from the latest information.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
Garmin India adds more excitement to International Women’s Day
Launches the all-new smartwatch ‘Lily’ for today’s women
21
Garmin India, a unit of Garmin Ltd. launched an incredibly small, smart and modern smartwatch - ‘Lily’ with exceptional
features designed by women, for women. This stylish smartwatch is the first of its kind from Garmin India starting from Rs.
20,990. Inspired by classic, jewelry-like timepieces, Lily offers women’s health features, including menstrual cycle tracking
and newly launched pregnancy tracking feature sharing mother-to-be a snapshot of their pregnancy alongside their other
health, wellness and activity data. Through the Garmin Connect app and compatible Garmin smartwatch¹, users can log
pregnancy-related symptoms, track baby movement, blood glucose levels, create customizable reminders, receive exercise
and nutrition tips and more. Further, users can also access stress tracking, body battery monitoring and can enjoy multiple
sports activities. Making it special for women, Lily is crafted with a 34mm watch case, unique T-bar lugs, and slender 14mm
band along with six trendy and classic color options which enhances the overall feminine aesthetic. It also features a unique
metallic patterned lens that reveals a bright liquid crystal monochromatic touchscreen display that disappears when not in use.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
FUJIFILM (Japan) Holdings establishes new organizations for Healthcare,
Imaging, and Graphic fields
22
FUJIFILM Holdings Corporation (President: Kenji Sukeno) establishes new organizations for Healthcare, Imaging, and Graphic fields to accelerate the generation of further synergies
and new businesses in each business field.
• Healthcare Field: Reorganization will take place to further accelerate the expansion of healthcare business, a growth driver of Fujifilm. This involves a division into the Medical
System, mainly consisting of medical devices for diagnoses, and the Life Sciences, covering businesses such as Bio CDMO and drug development support. The Life Sciences Strategy
Headquarters will be newly established to lead the businesses for the Life Sciences. The Life Sciences Strategy Headquarters will plan and promote a comprehensive, integrated
strategy including business portfolio management, M&A, alliances and R&D, to generate further synergies and new businesses within its business field.
• Imaging Field: The Photo Imaging Products Division and the Optical Device & Electronic Imaging Products Division will be integrated into the Imaging Solutions Division in
order to continue offering new value and products that cater to diversifying needs in images and videos. The needs for images and videos from the society and daily life are diversifying
amidst rapid advancement in various technologies, as seen in the diversification of image-recording devices such as smartphones, introduction of high-speed 5G network, advancement
in AI technology and progress toward data-oriented society.
• Graphic Field: In order to accelerate the creation of group-wide synergy and offer even greater values to the printing industry globally, Fujifilm’s Graphic Systems Business
Division and Fuji Xerox’s Graphic Communication Services Business Group will be integrated into the Graphic Communication Business Division as of July 1 this year. Fujifilm’s
Graphic Systems business, which boasts far-reaching customer base primarily in commercial printing and packaging printing, will be combined with the marketing, technological and
product strengths of FUJIFILM Business Innovation’s Production business, whose strength lies in digital printing technology. The integration allows Fujifilm to deploy end-to-end
solutions covering both analogue and digital printing to become the industry’s driving force toward digitization.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
Fujifilm (Japan) launches “FUJIFILM COVID-19 Ag Test”, a SARS-CoV-2 antigen rapid diagnostic
test with a highly-sensitive detection technology based on silver halide amplification, in Europe
23
FUJIFILM Corporation is pleased to announce that the “FUJIFILM COVID-19 Ag Test” (COVID-19 Ag Test), an antigen test kit for detecting
SARS-CoV-2, will be released in Europe early April of 2021. The kit, to be sold as in-vitro diagnostic medical device, was developed with the use
of highly-sensitive detection technology based on silver halide amplification used in the photo-developing process. Amidst the global COVID-19
pandemic, rapid antigen test kits can be used not only for diagnostic purposes at medical institutions but also in periodic testing on workers at
medical and aged-care facilities as well as for surveillance purposes at testing labs set up at airports and various event venues. Antigen testing is a
quick and easy test method that is expected to be used in an even greater variety of situations. However, its sensitivity is lower than that of PCR
testing, generating calls for sensitivity improvement. The COVID-19 Ag Test was developed with antibodies supplied by Public University
Corporation Yokohama City University (Kanagawa, Japan, Yokohama City University), which are capable of detecting SARS-CoV-2 antigens.
Using cultured viruses and clinical specimens, Fujifilm and Yokohama City University jointly evaluated the detection capability of the antibodies
in combination with Fujifilm’s proprietary silver amplification immunochromatography method. It has been subsequently confirmed that this
method has higher virus-detecting capability compared to regular immunochromatography without silver amplification.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
Fujifilm (Japan) Selects North Carolina as the Location to Build the Largest
Cell Culture Biopharmaceutical CDMO Facility in North America
24
FUJIFILM Corporation has announced the selection of Holly Springs, North Carolina as the location for its new large-scale cell culture production
site in the United States. The previously announced investment of more than 200 Billion yen (2 Billion USD) to establish the largest end-to-end
cell culture biopharmaceutical CDMO1 facility in North America will create 725 highly-skilled jobs in the area by the end of 2028. FUJIFILM
Diosynth Biotechnologies, a subsidiary of FUJIFILM Corporation, with development and manufacturing facilities across the United States, United
Kingdom, and Denmark, will operate the new facility. A rigorous data-driven evaluation process was followed to make the selection of Holly
Springs, North Carolina as the home for the new facility. Holly Springs, North Carolina was selected for its strong pool of technical talent, local
resources and partners with the right competencies, clean energy resources, and sustainability for future growth. With an existing facility in
Morrisville, North Carolina, FUJIFILM Diosynth Biotechnologies is committed to continue its strong collaboration with state and local officials,
which has been built over the years. The new facility will offer large-scale cell culture manufacturing of bulk drug substance production with 8 x
20,000L bioreactors with the potential to expand and add a further 24 x 20,000L bioreactors based on market demand. In addition, the facility will
also provide commercial scale, automated fill-finish and assembly, packaging, and labeling services. The facility is expected to be operational by
spring 2025.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
Hikvision (China) HeatPro Series brings accurate perimeter defense and
fire detection to mass market
25
Hikvision an IoT solution provider with video as its core competency, announced the launch of HeatPro, a new thermal series of cameras designed to provide
affordable all-weather deterrent and alerts. It is especially useful in perimeter protection and fire prevention applications. The HeatPro Series Cameras feature
deep-learning thermal video analytics for perimeter protection, and object temperature measurement and fire detection with real-time alarms. Features like
accurate human/vehicle classification, visual and auditory alarms for perimeter protection, and speedy temperature exception alarms for fire prevention make
them ideal for SMB (small and midsize business) applications. When securing a perimeter, higher accuracy and a low false alarm rate can help reduce
operation costs. The HeatPro Series achieves this by developing powerful video analytics based on Deep Learning algorithms, radically reducing false
alarms. The cameras focus on short-range perimeter protection (0-50meters), where they deliver target detection and classification. The use of AI means that
the cameras can distinguish between a person and a vehicle. This comes in especially useful when the two targets are close together. Traditionally, they can
only be recognised as one ‘target’, but intelligent algorithms mean that they can be detected separately, increasing accuracy. Thermal cameras are also able
to easily locate potential threats in zero visibility conditions, where a conventional camera could not. They do this by detecting the latent radiation emissivity
of an object, so not relying on visible light. This means they can operate in all-weather conditions and the darkest night. They also don’t emit light, which
means their presence is not obvious, making them useful in scenarios where they need to be hidden.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
Intuit (USA): Mint and Rocket Mortgage Introduce Fully Digital Mortgage
Solution to Empower Home Buyers
26
Intuit’s personal finance app Mint, and Rocket Mortgage - part of Rocket Companies announced an extension of their
partnership where Mint users can get approved to purchase a home entirely digitally, within the Mint app - powered by
Rocket Mortgage’s API. This new solution gives homebuyers the ability to go from application to an accurate rate
confirmation and an approval in as few as eight minutes, instead of days. Users can complete the entire process in the Mint
app and they can easily import information they have already added to their Mint account. This new mortgage experience
simplifies the previously time-consuming and confusing mortgage process and gives homebuyers an advantage in the
increasingly competitive housing market. This experience builds on Mint and Rocket Mortgage’s vision to empower
Americans to make important financial decisions, in less time, with certainty. In October, the two companies introduced a
digital refinance experience within the Mint app. Tens of thousands of homeowners have used the tool to find a lower rate
or access their home’s equity.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
Intuit (USA): QuickBooks Adds E-signature Capabilities to Help Growing
Businesses Accelerate the Estimate Process
27
Intuit launched DocuSign eSignature Connector by QuickBooks to help small businesses digitally sign estimates directly from QuickBooks Online Advanced. In addition
to saving time, customers can save an average of $36 per contract by reducing hard costs and improving employee productivity. For small and midsize businesses, the
manual tasks associated with preparing and sending estimates are often inefficient and take time away from serving customers. DocuSign eSignature Connector by
QuickBooks allows businesses to:
• Go digital for a faster, more secure turnaround of estimates using e-signature to help close deals quicker.
• Streamline sales by automating the estimate process so growing businesses quickly move from quote to cash.
• Stay on top of progress with notifications of their DocuSign documents so they can follow up with next steps immediately.
QuickBooks recently launched several integrations as part of its strategy to address the unique pain points of mid-market customers and to create an all-in-one financial
and business hub. The DocuSign eSignature Connector by QuickBooks application is the latest addition of best-in-class apps and purpose-built integrations that power
growing businesses and help them digitally transform.
• Bill.com: Bill Pay for QuickBooks Online allows customers to pay bills directly inside QuickBooks for more control and visibility.
• HubSpot: HubSpot for QuickBooks is an integrated CRM and financial management solution that allows sales and finance teams to work together more efficiently.
• LeanLaw: Legal timekeeping and billing app offers two-way integration with QuickBooks.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
KLA-Tencor (USA): Frontline's new PCB process planning solution accelerates
time to market and dramatically increases productivity for manufacturers
28
Frontline, a division of Orbotech, has launched InFlow™, a robust, automated, all-in-one engineering software
solution for PCB manufacturers. Offering full coverage of the entire engineering process, InFlow reduces planning
time by up to 60%, enabling dramatically faster time to market for even the highest design complexity and volume
level production. Orbotech is a KLA company. Through its complete automation, the InFlow system produces
standardized, high-quality, error-free manufacturing instructions, enabling operators of any experience level to
accelerate productivity and time to market. With its built-in CAM (computer aided manufacturing) graphic editor,
InFlow reduces reliance on CAM resources and allows job editing within the engineering system. It also shortens
pre-manufacturing technical query cycles with standardized automatic checklists and traceability reports.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
Next Generation Lenovo (Hong Kong) ThinkSystem Servers Accelerate a
Broader Range of Business-Critical Applications
29
Lenovo Infrastructure Solutions Group (ISG) announces the next-generation Lenovo ThinkSystem servers showcasing
a unique balance of performance, security and efficiency – all built on 3rd Gen Intel Xeon Scalable processors and
PCIe Gen4. As companies of all sizes continue to work on solving real-world challenges – they require powerful
infrastructure solutions to help them gain faster insights and remain competitive. With this new generation of
ThinkSystem solutions, Lenovo introduces innovations for real-world workloads including high performance
computing (HPC), artificial intelligence (AI), modeling and simulation, cloud, virtual desktop infrastructure (VDI) and
advanced analytics. Lenovo introduces four new servers, including ThinkSystem SR650 V2, SR630 V2, ST650 V2 and
SN550 V2, offering enhanced performance, reliability, flexibility and security to meet mission-critical demands and
customer concerns.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
Lenovo (Hong Kong) Education Solutions Reimagine a New Age of Teaching
and Learning
30
Lenovo announced a new generation of laptops designed for education and supported by wide-ranging software and
services offerings to facilitate learning in a new world. Offering a broad choice of Windows or Chromebook systems
powered by AMD® or Intel® processors, the new laptops provide durability within distinctive designs and now include
features that help students and educators transition between classroom and remote learning. They can further enhance their
collaborative learning space by adding a touch enabled ThinkVision T24t mounted on an ergonomic stand. It is estimated
that more than 1.5 billion students have been affected by school closures1 and many continue to endure disrupted agendas.
As a technology provider, Lenovo is committed to partnering with customers to develop and deliver innovative solutions
to enhance learning today and into the future. Our new laptops designed for education have evolved to withstand the
rigours of remote learning. Devices need to be more mobile than ever and are at greater risk of drops, spills and knocks.
We’ve made our devices more durable and added features more suited to all learning modalities.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
Barnes & Noble Introduces New NOOK 10” HD Tablet Designed with
Lenovo (Hong Kong)
31
Barnes & Noble, Inc., with bookstores in every state across the United States, and global technology leader Lenovo
announced a new NOOK® 10” HD Tablet designed with Lenovo – a stylish yet durable tablet with full metal body and 85
percent screen-to-body ratio. The tablet offers customers endless entertainment in one package with NOOK eBooks1,
digital newspapers and magazines, Google Play, Google Assistant, Kids Space from Google2 (a new kids mode featuring
apps, books and videos) and FM radio. It also comes fully equipped with front and rear cameras, Bluetooth® capability,
and dual audio speakers powered by Dolby Atmos® making it ideal for enjoying your favorite streaming content. Built to
be gentle on your eyes while reading, the new NOOK tablet’s display comes with TÜV Rheinland®-certified eye
protection3 to help lower harmful blue light. Lightweight at just 420 g (0.9 lbs),the NOOK 10” HD Tablet has a smooth,
sleek design and sits comfortably in your hands for a relaxed read. And for extra comfort in multiple reading positions, a
new folio case is also on the way.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
Lenovo (Hong Kong) Delivers Edge-to-Cloud Solutions with AMD EPYC™
7003 Processors, Setting a New Standard for Modern IT Architectures
32
Lenovo Data Center Group (DCG) announces new industry leading ThinkSystem and ThinkAgile hyperconverged
infrastructure (HCI) solutions to support edge-to-cloud computing. These new and enhanced hybrid cloud solutions are
designed to help organizations of all sizes, modernize, better secure their IT infrastructure, and deliver faster data insights
– all powered by the new AMD EPYC™ 7003 Series processors. Specifically optimized to run demanding cloud
computing workloads such as VDI, database and analytics, artificial intelligence and more, these solutions have built-in
security features to help protect against data integrity and firmware threats. Hetzner Online GmbH, one of the largest cloud
service providers in Europe, recently turned to Lenovo to build out their cloud infrastructure expansion with Lenovo
ThinkSystem SR635 and SR645 servers equipped with AMD EPYC™ processors. The ThinkSystem servers increased
Hetzner Online’s performance by up to 100% at the same energy costs and reduced their energy costs by 35-50%
compared to other CPU vendors in their data center.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
LONGi (China) Supplies 1.2 MW of Innovative Solar Modules to
Sinomachine Technologies
33
LONGi has supplied 1.2 MW of innovative Hi-MO 4 solar modules to Sinomachine Technologies, a company powered
by a German investment entity. The Morocco based company delivered the project with EPCF model. The plant was
developed with 2,663 high-efficiency LONGi Hi-MO 4 solar modules. The system is equipped with smart I-V scanning,
AFCI function, and a real zero injection protection. This high-end and efficient solar plant is predicted to save 747 tons of
standard coal per year and to reduce 715 tons CO2 emissions per year. It will help clients with their green energy vision
and from high electricity bills. The commissioning of the 1.2 MW plant contributes not only to the recovery of the local
economy and employment, but also to the development of renewable energy in Morocco. Being the world’s most
innovative solar technology company, LONGi has been working continuously towards developing and delivering high
efficiency, high reliability and high quality modules. The longer the life of a module, the more electricity can be generated,
resulting in higher project revenue, which will in turn accelerate the development of the PV industry.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
Micron (USA) Updates Data Center Portfolio Strategy to Address Growing
Opportunity for Memory and Storage Hierarchy Innovation
34
Micron Technology, Inc. announced updates to the company’s portfolio strategy to further strengthen its focus on memory and storage innovations
for the data center. Micron will increase investment in new memory products that leverage the Compute Express Link™ (CXL™), the recently
introduced industry standard interface that enables flexible connection between compute, memory and storage. With immediate effect, Micron will
cease development of 3D XPoint™ and shift resources to focus on accelerating market introduction of CXL-enabled memory products. The broad
proliferation of artificial intelligence and advances in data analytics are driving workload requirements that necessitate a change to compute
architectures. The CXL interface opens up new paths for platform innovation and optimization in the data center. Micron sees immense promise
in new classes of memory-centric solutions that utilize CXL to scale the capacity, performance and content required by applications to run on
infrastructure with greater architectural freedom. Micron has now determined that there is insufficient market validation to justify the ongoing high
levels of investments required to successfully commercialize 3D XPoint at scale to address the evolving memory and storage needs of its
customers. Micron’s portfolio changes do not impact the company’s overall technology investment levels as its focus on emerging memory
solutions remains unchanged. Micron plans to apply the knowledge it has gained from the breakthroughs achieved through its 3D XPoint initiative,
as well as related engineering expertise and resources, to new types of memory-centric products that target the memory-storage hierarchy.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
Renesas (Japan) Launches RX23W Module with Bluetooth for System
Control and Wireless Communication on IoT Devices
35
Renesas Electronics Corporation a premier supplier of advanced semiconductor solutions, introduced the RX23W Module with full Bluetooth® 5.0 Low
Energy support for system control and wireless communication on IoT endpoint devices. Featuring the RX23W 32-bit RX MCU supporting fully integrated
Bluetooth Low Energy communication, the new RX23W module is equipped with an antenna, oscillator and custom-matched circuit. The new module is
certified under Radio Law for multiple countries, including Japan and the United States (Note), and is Bluetooth SIG certified. This eliminates the need for
additional RF design work, tuning, or specialized RF knowledge, allowing customers to use the module as it is, shortening new product development time.
The very small 6.1 mm x 9.5 mm, 83-pin LGA package makes it possible to design more compact devices with fewer external components, reducing the bill
of materials (BOM) cost. This improves the development efficiency of IoT endpoint devices such as home appliance, healthcare and sports and fitness
equipment. The RX23W MCU incorporated in the new module supports full Bluetooth 5.0 Low Energy communication support including long-range and 2
Mbps data throughput. It delivers excellent communication characteristics, with reception sensitivity level of −105 dBm at 125 kbps. Built around Renesas’
RXv2 CPU core, the RX23W MCU provides outstanding computing performance, operating at a maximum clock frequency of 54 MHz together with
outstanding power efficiency, making it ideally suited for system control. The RX23W also incorporates Renesas’ exclusive security function, the Trusted
Secure IP (TSIP), that provides robust protection against threats to IoT devices such as eavesdropping, tampering, and viruses. In addition, the RX23W MCU
has a rich set of peripheral functions that is indispensable to IoT devices, including touch key, USB, and CAN functions.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
Renesas (Japan) Simplifies Safe and Power-Efficient Sensor-Less Brushless
DC Motor Control Design for Industrial and Home Appliances
36
Renesas Electronics Corporation a premier supplier of advanced semiconductor solutions, expanded its motor control solutions portfolio with two
system-in-package (SiP) solutions to simplify brushless DC (BLDC) motor control design for a wide range of cordless battery-powered applications
such as power tools, drones, water pumps, vacuums, cleaning robots, fans, and other systems. Combining multiple functions into an SiP solution, the
new RAJ306001 and RAJ306010 motor drive ICs deliver improved low-speed or high-speed rotation and high torque control compared with
competitive solutions while minimizing required board space and reducing solution cost. This results in a turnkey design for easy, efficient, and safe
BLDC motor control. The RAJ306001 and RAJ306010 are single-package motor control ICs that control three-phase BLDC motors used in a wide
range of battery-powered devices. The ICs integrate an RL78/G1F microcontroller (MCU) and pre-driver into an 8x8mm QFN package. The highly
integrated SiP form factor allows customers to eliminate as many as 30 external components shrinking the solution area by up to 50 percent and with
lower control system costs. Designed with heat management in mind, the new ICs feature self-aligned dead time (SADT) to prevent the shoot through
and offer adjustable pre-driver output current capacity – up to 500mA – to drive large-capacity MOSFETs, which makes heat dissipation design easier.
This allows the ICs to drive MOSFETs at the optimum switching timing – reducing FET switching margin times to approximately 1/10 the time
compared with conventional systems and enabling highly efficient motor drive control with reduced heat generation.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
New RA6M5 Group from Renesas (Japan) Completes Mainstream Line of
RA6 Series Arm Cortex M33-Based MCUs
37
Renesas Electronics Corporation a premier supplier of advanced semiconductor solutions, announced the expansion of its RA6 Series microcontrollers
(MCUs) with 20 new RA6M5 Group MCUs, completing the mainstream line of RA6 Series devices. The new parts offer a very wide array of
communications options, generous on-chip memory, and Renesas’ best-in-class security features, enabling customers to create new and innovative IoT
designs. The new MCUs offer numerous communication interface options, including CAN FD, Ethernet MAC with DMA, USB Full Speed and High Speed,
and multiple serial interfaces. Designers of IoT systems will have unmatched flexibility in sharing critical data using the RA6M5 Group. The new MCUs
integrate up to 2MB on-chip flash and 512KB on-chip RAM, enough to support a wide range of applications. They provide an OctaSPI interface that enables
designers to extend the on-chip flash and RAM even more. They also support error correction code (ECC) in the RAM. The memory block swap feature in
conjunction with the intrinsic security built into RA Family devices, makes the RA6M5 Group the best choice for applications where in-field firmware
updates are required. After new firmware is written to the flash using background operation (BGO), a selectable amount of 32kB flash blocks can be swapped
to the new firmware. The RA6M5 MCUs employ the Arm® Cortex®-M33 core based on Armv8-M architecture. They feature Arm TrustZone® technology
and Renesas’ Secure Crypto Engine. The Secure Crypto Engine incorporates multiple symmetric and asymmetric cryptography accelerators, advanced key
management, security lifecycle management, power analysis resistance, and tamper detection.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
Renesas (Japan) Introduces Complete Power and Functional Safety
Solution for R-Car V3H ADAS Camera Systems
38
Renesas Electronics Corporation a premier supplier of advanced semiconductor solutions, announced a new power and functional safety solution for systems
based on the R-Car V3H system-on-chip (SoC) for advanced driver assistance systems (ADAS) automotive front cameras and driver monitor cameras. The
new solution includes the RAA271050, a 42V synchronous buck ‘pre-regulator’ that accepts the vehicle’s 12V supply and steps it down to an intermediate
supply voltage of 3.3V or 5.0V. The RAA271000, a seven-channel PMIC (power management IC), then takes the RAA271050’s output and steps it down
further to the various supply voltages needed by R-Car V3H and its peripherals such as LPDDR4 memory. Both devices were developed per the ISO-26262
standard, and can support system safety requirements up to ASIL D. The solution satisfies all the power and functional safety requirements for the R-Car
V3H. It provides supply voltages with the current capability to meet all power specifications, including sequence, voltage accuracy, and load step response.
For safety, it provides all the necessary power and digital monitoring functions. Renesas’ new solution provides best-in-class efficiency, with power loss
reductions of up to 33 percent compared to competitive PMICs under comparable operating conditions. Lower power loss enables operation at higher
temperatures, reducing cooling costs and delivering better reliability. Additionally, the RAA271050 and RAA271000 were designed to match R-Car
requirements with no unnecessary overhead, reducing component cost and PCB area. Renesas is providing a reference hardware solution that includes the
new components, speeding design time and reducing testing requirements for customers.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
NVIDIA (USA) Unveils AI Enterprise Software Suite to Help Every
Industry Unlock the Power of AI
39
NVIDIA announced NVIDIA® AI Enterprise, a comprehensive software suite of enterprise-grade AI tools and
frameworks optimized, certified and supported by NVIDIA, exclusively with VMware vSphere 7 Update 2, separately
announced. Through a first-of-its-kind industry collaboration to develop an AI-Ready Enterprise platform, NVIDIA
teamed with VMware to virtualize AI workloads on VMware vSphere with NVIDIA AI Enterprise. The offering gives
enterprises the software required to develop a broad range of AI solutions, such as advanced diagnostics in healthcare,
smart factories for manufacturing, and fraud detection in financial services. With the NVIDIA AI Enterprise software
suite, IT professionals at the hundreds of thousands of enterprises that use vSphere for compute virtualization can now
support AI with the same tools they use to manage large-scale data centers and hybrid cloud environments. The NVIDIA
software suite provides scale-out, multi-node, AI application performance on vSphere that is indistinguishable from
bare-metal servers.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
Qualcomm (USA) Extends the Leadership of its 7-Series with the Snapdragon
780G 5G Mobile Platform
40
Qualcomm Technologies, Inc. announced the latest addition to its 7-series portfolio, the Qualcomm® Snapdragon™ 780G 5G Mobile Platform.
Snapdragon 780G is designed to deliver powerful AI performance and brilliant camera capture backed by the Qualcomm Spectra™ 570 triple ISP and
6th generation Qualcomm® AI Engine, allowing users to capture, enhance, and share their favorite moments seamlessly. This platform enables a
selection of premium-tier features for the first time in the 7-series, making next generation experiences more broadly accessible. Featuring the new
Qualcomm Spectra 570, Snapdragon 780G is the first 7-series platform with a triple Image Signal Processor (ISP), capable of capturing from three
cameras simultaneously. This feature delivers three different images captured by zoom, wide, and ultra-wide lenses at once. This platform also boasts
new low light architecture powering professional quality photos in any lighting condition. Users can also shoot like a pro with HDR10+ video capturing
over a billion shades of color. New 4K HDR with computational HDR capture provides dramatic improvements to color, contrast, and detail for brilliant
photos. Snapdragon 780G is powered by the 6th generation Qualcomm AI Engine with the Qualcomm® Hexagon™ 770 processor delivering up to 12
TOPs AI performance, which is a 2x improvement compared to its predecessor. Now, virtually every connection, video call, and phone call are
enhanced by AI to enable use cases like AI-based noise suppression and better AI-based voice assistant interactions. The platform is further enhanced
by the 2nd generation Qualcomm® Sensing Hub, which integrates a dedicated low-power AI processor for audio processing.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
Human Horizons Works with JOYNEXT, Quectel and Qualcomm (USA) to Feature
Intelligent In-Vehicle Experiences in New HiPhi X Sports Utility Vehicles
41
Qualcomm Technologies, Inc. announced the company is working with Human Horizons Technology Co., Ltd., Ningbo JOYNEXT Technology Corporation and Quectel
Wireless Solutions Co., Ltd. to support advanced vehicle connectivity innovations in 5G and cellular vehicle-to-everything (C-V2X) on HiPhi X — Human Horizons’
first super sports utility vehicle (SUV) in mass production, which is scheduled to be delivered in May. This is the achievement of the in-depth working relationship
between Qualcomm Technologies, Human Horizons, JOYNEXT and Quectel, who are working together to feature advanced technologies in telematics and C-V2X
communication. Utilizing the Qualcomm® Snapdragon™ Automotive 5G Platform with integrated C-V2X direct communications, high-precision multi-frequency
global navigation satellite system (HP-GNSS) and RF Front-End (RFFE) functionalities to support major operators across key spectrum bands globally, the HiPhi X will
be equipped to feature 5G-enabled in-vehicle experiences and be a part of a new era of future-oriented intelligent connected vehicles. The HiPhi X is Human Horizon’s
first premier-tier super SUV within the automaker’s premium electric brand in mass production. JOYNEXT's 5G-V2X OBU (On-board Unit) and Quectel’s automotive
5G module, which features the Snapdragon Automotive 5G Platform, is a combination of advanced functions and features. As an industry leading automotive-grade 5G
wireless solution, the Snapdragon Automotive 5G Platform is designed to provide strong performance and support for automotive telematics devices in functionality and
service. Its integrated C-V2X technology is designed to support HiPhi X’s ability to deliver 5G and vehicle-to-vehicle (V2X) services for various scenarios, including
V2V and vehicle-to-infrastructure (V2I) communication standards. With the Snapdragon Automotive 5G Platform’s support for concurrent multi-frequency,
multi-constellation GNSS and Qualcomm® Dead Reckoning 3 technology, and RTK data offered by China’s leading service providers, HiPhi X vehicles are optimized
to provide highly accurate location positioning with a comprehensive 3D navigation solution and can assist the vehicle with Level 3 autonomous driving functionality.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
Integrated 1.5A Synchronous Regulators from STMicroelectronics
(Switzerland) Simplify High-Efficiency Power Conversion
42
STMicroelectronics has introduced L6981 synchronous step-down regulators, extending the family of high-efficiency converters that simplify power-supply
design by integrating power elements, feedback circuitry, and safety features on-chip. Rated to deliver up to 1.5A, with 90% typical efficiency at full load,
the L6981 converters are available in two variants optimized for light-load efficiency and noise performance. The L6981C for low-current operation uses
pulse skipping to maximize efficiency at light loads extending the runtime of battery-powered devices. The L6981N prioritizes low noise by operating
permanently in PWM (pulse-width modulation) mode at constant switching frequency and minimizing voltage ripple at light loads. Both variants can accept
an input voltage from 3.5V to 38V, making them well suited to use in 24V industrial bus-powered applications, 12V and 24V battery-powered equipment,
HVAC power supplies, decentralized intelligent nodes, smart sensors, and always-on applications. The output voltage can be adjusted from 0.85V up to the
input-voltage value using external resistors. Integrated features include high-side and low-side NMOS power transistors, feedback-loop compensation,
over-voltage protection, and thermal protection. There is also soft-start circuitry that limits inrush current and ensures a constant output-voltage slope. An
Enable pin is provided, which permits power-up/power-down sequencing and allows a synchronizing clock signal to be applied to the L6981N low-noise
converters. The L6981 is included in ST’s 10-year longevity program that ensures long-term component supply. The STEVAL-L6981CDR evaluation board
for the low-current converter and STEVAL-L6981NDR for the low-noise version are available to help designers accelerate device selection in power-supply
development.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
High-Accuracy Op Amp from STMicroelectronics (Switzerland) Targets
Energy-Efficient Power Conversion
43
The STMicroelectronics TSV7722 precision high-bandwidth operational amplifier, with gain-bandwidth of 22MHz
and slew rate of 11V/μs, is well-suited for high-speed signal conditioning and accurate current measurement in
power-conversion circuits and optical sensors. The maximum input-offset voltage of 200µV (typical 50µV at 25°C)
and extremely low input-voltage noise density of 7nV/√Hz permit accurate low-side current measurements. In
addition, the typical input bias current of 2pA enables accurate photodiode-current measurement in optical-sensing
applications such as smoke detectors. Unity-gain stable, and fully specified on a load of 47pF, the TSV7722 can be
used as an input buffer for analog-to-digital converters (ADCs). With an operating-voltage range of 1.8V-5.5V, the
TSV7722 can be powered from the same supply as low-voltage CMOS components, such as a microcontroller, or from
a deeply discharged battery. Moreover, the TSV7722’s precision parameters and stability over temperature further
simplify circuit design by ensuring outstanding accuracy without precision resistors or trimming after assembly.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
Highly Integrated, Galvanically Isolated Sigma-Delta Modulators from
STMicroelectronics (Switzerland) Boost Accuracy and Reliability
44
The STMicroelectronics ISOSD61 and ISOSD61L are high-accuracy isolated, second-order sigma-delta modulators that deliver
enhanced performance and reliability in industrial applications such as motor control, electric-vehicle charging stations, solar
inverters, UPS, and server and telecom power supplies. The ISOSD61 has TTL/CMOS-compatible clock-input and data-output signal
levels, while the ISOSD61L is compatible with Low-Voltage Differential Signaling (LVDS). Both types feature 16-bit
analog-to-digital converter (ADC) resolution and a typical Signal-to-Noise Ratio (SNR) of 86dB. The embedded galvanic-isolation
technology of these devices eliminates the degradation associated with alternative opto-coupled converters, as well as lowering
power consumption and allowing much faster data transmission. The devices convert an analog input signal with an amplitude of up
to ±320mV into a high-speed 1-bit digital data stream at up to 25Msamples/s. Isolation between the two sides is guaranteed up to 6kV
maximum transient and surge isolation voltages, and up to 1.2kV maximum working voltage, under normal working conditions. The
devices also feature 30kV/μs common-mode transient immunity, ensuring excellent rejection of fast transient noise that can
frequently occur in harsh industrial environments.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
New STM32WB Wireless Microcontrollers from STMicroelectronics
(Switzerland) Deliver Affordable Convenience and Performance
45
STMicroelectronics has extended its STM32WB* Bluetooth® LE microcontroller (MCU) offering with new devices that combine entry-level
features with extra power savings for longer-lasting performance. The dual-core STM32WB15 and STM32WB10 Value Line pair an Arm®
Cortex®-M4 processor to run the main application and a Cortex-M0+ to handle Bluetooth 5.2 connectivity, ensuring real-time performance from
each. The radio stage has a 102dBm link budget to ensure reliable connections over long distances and integrates balun circuitry to save board
space and reduce the bill of materials. With a new ultra-power-saving mode that allows the radio to remain operational, and carefully tailored
peripherals and memory, the new devices are suited to cost-sensitive, power-conscious embedded applications including wearables, beacons, smart
circuit breakers, trackers, IoT endpoints, and equipment for industrial automation. The Software Development Kit (SDK) for each MCU includes
standardized radio protocol stacks and openness to proprietary protocols with a set of security mechanisms that ensure safe software updates for
brand protection and device integrity, with Proprietary Code Read-Out Protection (PCROP) to guard intellectual property. With these new devices,
the STM32WB series scales across package variants, offering options including extended GPIOs and pin-to-pin compatibility between similar
packages of the portfolio. Customers can easily migrate designs between devices to take advantage of different features and memory densities,
leveraging pin-compatibility across packages.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
World’s Smallest Micro-Mirror Scanning Technology from STMicroelectronics (Switzerland)
Chosen for Intel® RealSense™ High-Resolution LiDAR Depth Camera L515
46
STMicroelectronics a global semiconductor leader serving customers across the spectrum of electronics applications,
has developed a tiny MEMS mirror with Intel enabling spatial scanning of an environment. Intel developed a LiDAR
system based on this micro-mirror, providing high-resolution scanning for industrial applications such as robotic arms
for bin picking, volumetric measurements, logistics, and 3D scanning. Built into the Intel RealSense LiDAR1 Camera
L515, the small dimensions of the ST micro-mirror contribute to the LiDAR camera’s hockey-puck size (61mm
diameter x 26mm height). The micro-mirror enables continuous laser scanning across the entire field of view. In
combination with a custom photodiode sensor, the RealSense LiDAR Camera L515 renders a 3D depth map of the
entire scene. The L515 leverages the scanning capabilities of ST’s MEMS to deliver high-resolution depth with no
interpolated pixels, the ability to control the field of view, and provides close to zero pixel blur driven by the low 50nS
exposure time.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
TCL (China) to Launch P-series Line-up – India’s First Android 11 TV
47
Global Top-2 TV brand TCL is all set to launch its P-series 4K HDR TV in India which comes with Android 11. The brand also claims that this also a
part of their global first approach and India is the first country to have the product. Additionally, the brand is the first one to bring a TV with Android
11 in India. The TV is already revealed at the recently-held Consumer Electronics Show (CES) 2021. The launch underlines TCL’s commitment to
manufacturing smart TVs that are not only innovative and advanced but are also affordable and are created keeping Indian consumers in mind. Sporting
a metallic trim design, the latest addition to the brand’s existing arsenal features Dolby Vision and Dolby Atmos technologies for immersive viewing
and optimized audio output, respectively. The Dolby Vision offers ultra-vivid picture quality with perfectly-balanced brightness, contrast, color, and
detail by merging high dynamic range (HDR) with wide color gamut capabilities. The Dolby Atmos, on the other hand, releases a sound that revolves
around the user, hence ensuring unmatched realism with incredible clarity that one has never heard before. In terms of sound, DTS decoding technology
is another built-in feature that produces sounds akin to the quality of live-studio recordings. The device is also backed by MEMC motion picture
processing capabilities, which ensures stable, crisper, and better imagery performance, especially when it comes to watching fast-moving,
action-packed content. On top of that, it also comes equipped with hands-free voice control 2.0. This technology enables users to do so many activities
- be it switching channels, setting reminders, or exploring streaming services – all via simple voice commands.

Lorem ipsum
dolor sit amet,
consec-
tetuer
adipisc-
ing elit,
sed
diam
nonum-
my
nibh
euis-
mod
tincid-
unt ut
laoreet
dolore
magna
aliquam
erat
volutpat.
Ut wisi enim ad
ullamcorper
Lorem
ipsum dolor sit
amet, consectetuer
nonummy
nib
Solution Updates
IT Shades
Engage & Enable
Isolated Gate Driver from STMicroelectronics (Switzerland) Safely
Controls Silicon-Carbide MOSFETs
48
Joining STMicroelectronics’ STGAP family of isolated gate drivers, the STGAP2SiCS is optimized for safe control of silicon carbide (SiC)
MOSFETs and operates from a high-voltage rail up to 1200V. Capable of producing a gate-driving voltage up to 26V, the STGAP2SiCS has a
raised Under-Voltage Lockout (UVLO) threshold of 15.5V to meet the turn-on requirements of SiC MOSFETs. If the driving voltage is too low,
which can be caused by low supply voltage, the UVLO ensures the MOSFET is turned off to prevent excessive dissipation. The driver features
dual input pins that let designers determine the gate-drive signal polarity. With 6kV of galvanic isolation between the input section and the
gate-driving output, the STGAP2SiCS helps ensure safety in consumer and industrial applications. Its 4A output-sink/source capability is suited
to mid- and high-power convertors, power supplies, and inverters in equipment such as high-end home appliances, industrial drives, fans, induction
heaters, welders, and UPSes. Two different output configurations are available. One has separate output pins that allow independent optimization
of turn-on and turn-off times using a dedicated gate resistor. The second is featured for high-frequency hard switching, with a single output pin and
active Miller clamp that limits oscillation of the SiC MOSFET gate-source voltage to prevent unwanted turn-on and enhance reliability. The input
circuitry is compatible with CMOS/TTL logic down to 3.3V, which allows easy interfacing with a wide variety of control ICs.

I-Byte Technology April 2021

Recommended

Recommended

More Related Content

Similar to I-Byte Technology April 2021

Similar to I-Byte Technology April 2021 (20)

More from EGBG Services

More from EGBG Services (20)

Recently uploaded

Recently uploaded (20)

I-Byte Technology April 2021