deposition technique

1. PHYSICAL VAPOR
DEPOSITION
SPUTTERING TECHNIQUE
ROLL NO : 15251510-002

2. CONTENTS:
• What is sputtering?
• Why we use sputtering?
• Conditions
• Energy for sputtering
• Energy and Momentum conservation law
• Requirement
• Process
• Sputtering yield
• Applications or Advantages

3. SPUTTERING
A mechanism in which atoms are ejected from the surface of a target material when
that surface is struck by sufficient energetic particles.
Discovered in 1852 and developed as a thin film deposition technique by
LANGMUIR in 1920.

4. WHY WE USE SPUTTERING?
• For high melting point materials
• Thickness of thin film is easily controlled
• Formation of uniform thickness by large area target
• Better quality of thin film is achieved

5. CONDITIONS
• Choice of particular ion
• Suitable cathode voltage
• Correct angle for high sputtering yield
• Consistent substrate voltage and temperature for clean film
• 3-10kev energy for sputtering but can vary with nature of gas

6. ENERGY AND MOMENTUM LAW
• Key principle of sputtering is energy and momentum must be conserved

7. REQUIREMENTS
• Vacuum
• Inert gas
• Power supply
• Sputtering gas

8. SPUTTERING YIELD
o 𝑠𝑝𝑢𝑡𝑡𝑒𝑟𝑖𝑛𝑔 𝑦𝑒𝑖𝑙𝑑 𝑠 =
𝑛𝑜 𝑜𝑓 𝑒𝑚𝑖𝑡𝑡𝑒𝑑 𝑝𝑎𝑟𝑡𝑖𝑐𝑙𝑒𝑠
𝑛𝑜 𝑜𝑓 𝑖𝑛𝑐𝑖𝑑𝑒𝑛𝑡 𝑝𝑎𝑟𝑡𝑖𝑐𝑙𝑒𝑠
o Rate of deposition proportional to the sputter yield.
o It depends on
 Type of target atom
 Binding energy of target atom
 Mass of ion and atoms
 Incident ion energy
 Angle of incidents of ion

9. APPLICATIONS
• In microelectronics such as cell phone, IPod, watches, batteries.
• Solar panel
• For antireflective coating on cars, jewelry, cutting tools
• In chemical industries