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Muhammad Jawad Nasir
SP22-RPH-003
Presentation Topic
“The detailed description of sputtering”
Presented to
D r. Kashif Tufail Chaudhry And My Class
Associate Professor Batch MS/Spring 2022
Department Of Physics Date: 12-Dec-2022
COMSATS University Islamabad , Lahore Campus
Basic Terminologies
what are thin films ?
Thin film is the layer of material ranging from fraction of nanometer(monolayer)
to several micrometer in thickness.
Muhammad Jawad Nasir
What is the Substrate ?
It is a solid substance or medium to which another substance is applied
and to which that second substance adhere.
Semiconductor
Nobel Metals
Ceramics
Muhammad Jawad Nasir
Muhammad Jawad Nasir
Thin Film Deposition
Physical
Deposition
Chemical
Deposition
Evaporation Sputtering CVD ALD
What Is Sputtering
sputtering, is a physical process in which atoms in a solid state (target) are released and
passed into the gas phase by bombardment with energetic ion.
Metallic Films : Al-Alloy, Ti, Tantalum,
Nickle, Cobalt, Gold etc.
Muhammad Jawad Nasir
General Mechanism
Evaporation
Transport and
Deposition
Muhammad Jawad Nasir
Gas Phase
Solid Phase
(Changes In Physical Morphology)
Requirements For Sputtering
Vacuum
Inert Gas
Power Supply
Substrate of your
choice
Muhammad Jawad Nasir
Sputtering Steps
◊ Ions are generated and directed at a targeted
◊ The ions sputter target atom
◊ The ejected atoms are transported to the substrate
◊ Atoms condense and form a thin film
Muhammad Jawad Nasir
Sputtering Yield
Defined as the number of atoms ejected per incident ion.
Determine the deposition rate
Depends Upon :
• Mass of bombarding ion.
• Energy of the bombarding ion.
• Direction of incidence of ions (angle).
• Pressure.
Muhammad Jawad Nasir
Energy Of The Bombarding Ions
Ion energy vs. Sputter Yield
Source: Introduction to micro
electronics fabrication.
Richard C. Jaeger P.132 Chap 6
Muhammad Jawad Nasir
Types Of Sputtering Deposition
1 - Magnetron Sputtering
2- Ion-Beam Sputtering
3-Reactive Sputtering
4- Ion-assisted deposition
5- High Target Utilization Sputtering (Hi TUS)
6-High Power Impulse Magnetron Sputtering (Hi PIMS)
7- Gas Flow Sputtering
Muhammad Jawad Nasir
Magnetron Sputtering
•Magnetron Sputtering is the most commonly used method for sputter
deposition.
•It usually utilize a strong electric and magnetic fields to trap electrons close
to the surface of the magnetron, which is the ‘Target’.
•The electrons follow helical paths around the magnetic fields line undergoing
more ionizing collisions with gaseous neutrals near the target surface.
•The extra Argon ions created as a result of these collisions leads to a higher
deposition rate . It also mean the plasma can be sustained at lower pressure.
Muhammad Jawad Nasir
Muhammad Jawad Nasir
Illustration Of Magnetron Sputtering
M + e- M+• + 2e-
Muhammad Jawad Nasir
Why Magnetron Sputtering ?
1-Super Hard Coating:
TiN, TiC , and other super hard coatings, coating the surface of tools to enhance
performance and prolonged service life.
2-Solid Lubricating Film:
Commonly used are soft metals (Ag, Au, Pb, Sn etc.) layered substances (MoS2,
WS2, Graphite, etc.) polymer material (nylon, polytetrachloroethylene, etc.)
3-Transparent Conductive Film:
Its thickness is thin, its transparency is close to that of glass, and its conductivity is close to
that of metal ,such as Indium Tin Oxide(ITO), Aluminum-Doped Zinc oxide (ZAO),etc. These
films used in LCD , Touch Screen, and Thin Film Solar Cell.
Muhammad Jawad Nasir
1- Nearly All Type Of Materials Can 1-Plasma Instability
be deposited regardless of their melting
temperature 2-Non uniformly removal of particles
from the target results the non-
2-Source can be placed scaled and uniform films on the substrate.
positioned anywhere in the chamber.
3-An erosion track in the target, leads
3-Films of compounds and alloys can to poor efficiency of sputtering yield
be deposited vs target volume.
Muhammad Jawad Nasir
Ion-Beam Sputtering
Ion beam sputtering utilize ion source to generate a focused ion beam directed at
target to be sputtered.
The ion source consists of a cathode and anode
with a common central axis.
Applying a high voltage (2-10kv) to anode creates
an electrostatic field inside ion source.
When Argon gas is injected into the ion source the
high E-field ionize it creating plasma,
The ions accelerated from anode to exit aperture creating a collimated ion beam which
hits the target and via momentum transfer b/w ion and target sputter the material on the
substrate.
Muhammad Jawad Nasir
Uses Of Ion-Beam Sputtering
Vanadium oxide microbolometer
Precision Optics (Lasers, IR detectors)
VCSEL anti reflective coatings
High efficiency solar cells
Thermal imaging
Muhammad Jawad Nasir
Reactive Sputtering
In reactive sputtering, the sputtered
particle from a target material undergo a
chemical reaction aiming to deposit a film
with different composition on substrate.
The chemical reaction that the particles
undergo is with a reactive gas introduced
into the sputtering chamber such as oxygen
and nitrogen , enabling the production
of oxide and nitride respectively.
Muhammad Jawad Nasir
Types Of Reactive Gases and Their Uses
1-oxygen:
Is used for deposition of oxide films e.g., Al2O3, SiO2 , TiO2 etc.
2-Nitrogen:
This aids the deposition of nitride films e.g., TiN, ZrN, CrN, etc,
3-Acetylene C2H2
One od the gases that can aid the deposition of metal-DLC,
hydrogenated carbide, carbo-nitride films.
Muhammad Jawad Nasir
Uses Of Reactive Sputtering
It has become a valuable commercial process for depositing
Dielectrics
Resistors
Semiconductors
For Example:
The reactive sputtering of tantalum nitride is one of
the most widely used processes for depositing resistors.
Muhammad Jawad Nasir
Summary
what is sputtering ?
Magnetron sputtering
Ion beam sputtering
Reactive Sputtering
Their Applications and uses.
Monday 11-Dec-2022 A.D
References (URL's)
1- en.wikipedia.org/wiki/thin_film
2- www.techtarget.com/whatis/definition/substrate%3famp=1
3- https://nanografi.com/blog/sputtering-process-types-and-
uses/#:~:text=Sputtering%20is%20a%20physical%20process,(mainly%20no
ble%20gas%20ions).
4- Introduction to microfabrication electronics 2nd edition by Richard C. Jaeger
5-https://www.sputtertargets.net/blog/an-overview-of-magnetron-
sputtering.html
6-https://www.dentonvacuum.com/what-is-ion-beam-deposition
7-https://www.lesker.com/newweb/ped/applications/reactive-sputtering-
research.cfm
Animations
The animated videos are taken from YouTube
THANK YOU

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mjawwadnasir003.pdf

  • 1. Muhammad Jawad Nasir SP22-RPH-003 Presentation Topic “The detailed description of sputtering” Presented to D r. Kashif Tufail Chaudhry And My Class Associate Professor Batch MS/Spring 2022 Department Of Physics Date: 12-Dec-2022 COMSATS University Islamabad , Lahore Campus
  • 2. Basic Terminologies what are thin films ? Thin film is the layer of material ranging from fraction of nanometer(monolayer) to several micrometer in thickness. Muhammad Jawad Nasir
  • 3. What is the Substrate ? It is a solid substance or medium to which another substance is applied and to which that second substance adhere. Semiconductor Nobel Metals Ceramics Muhammad Jawad Nasir
  • 4. Muhammad Jawad Nasir Thin Film Deposition Physical Deposition Chemical Deposition Evaporation Sputtering CVD ALD
  • 5. What Is Sputtering sputtering, is a physical process in which atoms in a solid state (target) are released and passed into the gas phase by bombardment with energetic ion. Metallic Films : Al-Alloy, Ti, Tantalum, Nickle, Cobalt, Gold etc. Muhammad Jawad Nasir
  • 6. General Mechanism Evaporation Transport and Deposition Muhammad Jawad Nasir Gas Phase Solid Phase (Changes In Physical Morphology)
  • 7. Requirements For Sputtering Vacuum Inert Gas Power Supply Substrate of your choice Muhammad Jawad Nasir
  • 8. Sputtering Steps ◊ Ions are generated and directed at a targeted ◊ The ions sputter target atom ◊ The ejected atoms are transported to the substrate ◊ Atoms condense and form a thin film Muhammad Jawad Nasir
  • 9. Sputtering Yield Defined as the number of atoms ejected per incident ion. Determine the deposition rate Depends Upon : • Mass of bombarding ion. • Energy of the bombarding ion. • Direction of incidence of ions (angle). • Pressure. Muhammad Jawad Nasir
  • 10. Energy Of The Bombarding Ions Ion energy vs. Sputter Yield Source: Introduction to micro electronics fabrication. Richard C. Jaeger P.132 Chap 6 Muhammad Jawad Nasir
  • 11. Types Of Sputtering Deposition 1 - Magnetron Sputtering 2- Ion-Beam Sputtering 3-Reactive Sputtering 4- Ion-assisted deposition 5- High Target Utilization Sputtering (Hi TUS) 6-High Power Impulse Magnetron Sputtering (Hi PIMS) 7- Gas Flow Sputtering Muhammad Jawad Nasir
  • 12. Magnetron Sputtering •Magnetron Sputtering is the most commonly used method for sputter deposition. •It usually utilize a strong electric and magnetic fields to trap electrons close to the surface of the magnetron, which is the ‘Target’. •The electrons follow helical paths around the magnetic fields line undergoing more ionizing collisions with gaseous neutrals near the target surface. •The extra Argon ions created as a result of these collisions leads to a higher deposition rate . It also mean the plasma can be sustained at lower pressure. Muhammad Jawad Nasir
  • 14. Illustration Of Magnetron Sputtering M + e- M+• + 2e- Muhammad Jawad Nasir
  • 15. Why Magnetron Sputtering ? 1-Super Hard Coating: TiN, TiC , and other super hard coatings, coating the surface of tools to enhance performance and prolonged service life. 2-Solid Lubricating Film: Commonly used are soft metals (Ag, Au, Pb, Sn etc.) layered substances (MoS2, WS2, Graphite, etc.) polymer material (nylon, polytetrachloroethylene, etc.) 3-Transparent Conductive Film: Its thickness is thin, its transparency is close to that of glass, and its conductivity is close to that of metal ,such as Indium Tin Oxide(ITO), Aluminum-Doped Zinc oxide (ZAO),etc. These films used in LCD , Touch Screen, and Thin Film Solar Cell. Muhammad Jawad Nasir
  • 16. 1- Nearly All Type Of Materials Can 1-Plasma Instability be deposited regardless of their melting temperature 2-Non uniformly removal of particles from the target results the non- 2-Source can be placed scaled and uniform films on the substrate. positioned anywhere in the chamber. 3-An erosion track in the target, leads 3-Films of compounds and alloys can to poor efficiency of sputtering yield be deposited vs target volume. Muhammad Jawad Nasir
  • 17. Ion-Beam Sputtering Ion beam sputtering utilize ion source to generate a focused ion beam directed at target to be sputtered. The ion source consists of a cathode and anode with a common central axis. Applying a high voltage (2-10kv) to anode creates an electrostatic field inside ion source. When Argon gas is injected into the ion source the high E-field ionize it creating plasma, The ions accelerated from anode to exit aperture creating a collimated ion beam which hits the target and via momentum transfer b/w ion and target sputter the material on the substrate. Muhammad Jawad Nasir
  • 18. Uses Of Ion-Beam Sputtering Vanadium oxide microbolometer Precision Optics (Lasers, IR detectors) VCSEL anti reflective coatings High efficiency solar cells Thermal imaging Muhammad Jawad Nasir
  • 19. Reactive Sputtering In reactive sputtering, the sputtered particle from a target material undergo a chemical reaction aiming to deposit a film with different composition on substrate. The chemical reaction that the particles undergo is with a reactive gas introduced into the sputtering chamber such as oxygen and nitrogen , enabling the production of oxide and nitride respectively. Muhammad Jawad Nasir
  • 20. Types Of Reactive Gases and Their Uses 1-oxygen: Is used for deposition of oxide films e.g., Al2O3, SiO2 , TiO2 etc. 2-Nitrogen: This aids the deposition of nitride films e.g., TiN, ZrN, CrN, etc, 3-Acetylene C2H2 One od the gases that can aid the deposition of metal-DLC, hydrogenated carbide, carbo-nitride films. Muhammad Jawad Nasir
  • 21. Uses Of Reactive Sputtering It has become a valuable commercial process for depositing Dielectrics Resistors Semiconductors For Example: The reactive sputtering of tantalum nitride is one of the most widely used processes for depositing resistors. Muhammad Jawad Nasir
  • 22. Summary what is sputtering ? Magnetron sputtering Ion beam sputtering Reactive Sputtering Their Applications and uses. Monday 11-Dec-2022 A.D
  • 23. References (URL's) 1- en.wikipedia.org/wiki/thin_film 2- www.techtarget.com/whatis/definition/substrate%3famp=1 3- https://nanografi.com/blog/sputtering-process-types-and- uses/#:~:text=Sputtering%20is%20a%20physical%20process,(mainly%20no ble%20gas%20ions). 4- Introduction to microfabrication electronics 2nd edition by Richard C. Jaeger 5-https://www.sputtertargets.net/blog/an-overview-of-magnetron- sputtering.html 6-https://www.dentonvacuum.com/what-is-ion-beam-deposition 7-https://www.lesker.com/newweb/ped/applications/reactive-sputtering- research.cfm Animations The animated videos are taken from YouTube