1. XU HUAN SU
4i, Wonder Building, 161-175 Fuk Wa St. , Sham Shui Po, Kowloon, Hong Kong 999077
Phone: (852) 6497 0647  Email: xuhuansu@gmail.com
MECHANICAL/AEROSPACE ENGINEER | RESEARCH & DEVELOPMENT
A top performing engineer with an MPhil degree in Mechanical and Aerospace Engineering, a Bachelor degree in
Physics and Mathematics and five years of experience in process engineering, research and development.
KEY SKILLS
 Process Development
 Process Engineer
 Research & Development
 Mechanical Engineering
 Physics & Mathematics
 Machine UPH improvement
 Machine MTBA improvement
 High performance LED
 Narrow Bandwidth Laser
 Thermal Interface Properties
 Design FMEA
 Trace Pro, Solid Edge
 MATLAB, JavaScript
 Microsoft Office
 Languages (Putonghua, English, Cantonese)
KEY ACHIEVEMENTS
 Increased contact image sensor active alignment machine’s UPH from 500 to 700 while ensuring the
performance reliability and stability.
 Increased high speed flip chip bonder machine’s UPH by 50% from 6K to 9K by conducting an intensive
process study on reliability, vibration, thermal, control and bonding performance.
 Handled all field issues to elongate the machine MTBA from 10 minutes to 60.
 Designed photonic crystals on patterned sapphire substrate LED which increased the extraction efficiency by
three fold compared with conventional LED.
 Designed and assembled narrow bandwidth laser with external cavity and control system with 10 times
better peak concentration than commercial laser diode.
PROFESSIONAL EXPERIENCE
ASM PACIFIC TECHNOLOGY, LTD. AUGUST, 2015 – PRESENT
PRE-FOCUS PROCESS DEVELOPMENT FOR CONTACT IMAGE SENSOR (CIS)
PROCESS ENGINEER, PRODUCT TEAM
 Responsible for new packaging process development including expansion to new pre-focus market segments.
 Involved in machine set up and buy off, and troubleshooting field issues.
 Increased contact image sensor active alignment machine’s UPH from 500 to 700 while ensuring the
performance reliability and stability.
 Wrote the DFMEA (Design Failure Mode and Effect Analysis) to new pre-focus machine development.
ASM PACIFIC TECHNOLOGY, LTD. SEPTEMBER, 2014 – JULY, 2015
PROCESS STUDY FOR HIGH SPEED FLIP CHIP BONDER
PROCESS ENGINEER, R&D TEAM
 Developed the new wafer handler machine process.
 Increased high speed flip chip bonder machine’s UPH by 50% from 6K to 9K by conducting an intensive
process study on reliability, vibration, thermal, control and bonding performance.
 Handled field issues to elongate the machine MTBA from 10 minutes to 60.

2. Xu Huansu Resume, Page 2
DEPARTMENT OF MECHANICAL AND AEROSPACE ENGINEERING, HKUST JUNE, 2012 – AUGUST, 2014
PHOTONIC CRYSTAL APPLICATION IN LIGHT EMITTING DIODE (LED)
 Designed and fabricated photonic crystals on patterned sapphire substrate LED which increased the
extraction efficiency by three fold compared with conventional LED.
 Conducted Trace Pro simulation of light output for Philips Lumileds cost saving adhesive development
project.
DEPARTMENT OF PHYSICS, HKUST JUNE, 2010 – SEPTEMBER, 2011
NARROW BANDWIDTH LASER DEVELOPMENT FOR LASER COOLING SYSTEM
 Designed and assembled narrow bandwidth laser with external cavity and control system with 10 times
better peak concentration than commercial laser diode.
 Participated in “Magneto-Optical Trap System” development aiming to cool atoms down to -273°C.
EDUCATION
Master of Philosophy, Mechanical & Aerospace Engineering, Hong Kong University of Science & Technology
Bachelor of Science, Physics & Mathematics, Hong Kong University of Science & Technology
AWARDS
HKUST’s University Scholarship
Department Dean's List
PUBLICATIONS
“Exceptional Thermal Interface Properties of a Three-Dimensional Graphene Foam”. Carbon. Volume 66,
January 2013. Pages 201–209
PATENT
Three-Dimensional Interconnected Porous Graphene-Based Thermal Interface Materials. US Patent 61-795,536.