1. DO YOU LACK DEDICATED THERMAL ANALYSIS STAFF?
ARE YOUR CRITICAL DESIGN SCHEDULES BEING DELAYED?
I CAN HELP YOU MEET YOUR SCHEDULES!
I have extensive expertise in the field of Mechanical Engineering and Thermal
Management related to the design of:
Computer hardware
Telecommunications equipment
Military and aerospace electronics
Outdoor equipment
I WILL HELP YOU DEVELOP RELIABLE PRODUCTS MUCH FASTER
Using a faster classic thermal network method of analysis, I develop models in wire
frame with an array of nodes and resistors. The model is designed based upon the
complete Engineering specifications provided.
I will create a mathematical model of your electronic chassis and printed
circuit boards and analyze the thermal behavior, the component
placement and the cooling strategies.
I perform the analysis under natural convection, conduction, radiation and
forced convection cooling.
I analyze the model based upon the environmental specifications
provided and calculate the temperatures of all components and identify
the hot spots.
I will provide temperature contour plots.
I will perform transient analysis of individual components.
I WILL HELP YOU MEET DESIGN SCHEDULES
Using licensed software created exclusively for the thermal analysis,
not a finite element program totally unsuited for the analysis of
electronic equipment.
I help you reduce prototype development, time consuming tests and
design changes.
Contact
Martin Acevedo
Product Design and Development
Electronic Packaging
77 Warren Road
Ashland, MA 01721
E-mail: acevlock@verizon.net
Phone: 508-561-6044
PCB TEMPERATURE CONTOURS
COMPONENT TRANSIENT ANALYSIS
PLOTS
DUTY CYCLE TRANSIENT
ELECTRONIC CHASSIS ASSEMBLY
ANALYSIS
CUSTOM HEAT SINK DESIGN AND
ANALYSIS
Temperature vs. Time Plot
-------------------------
0.00 10.00 20.00 30.00
0
100
200
300
Time (minutes)
Temp (°C) S1 (junct)
S1 (case)
Room Amb
Temperature vs. Time Plot
-------------------------
0.00 5.00 10.00
0
100
200
Time (minutes)
Temp (°C) S1 (junct)
S1 (case)
MID-SINK
S1
S2
S4
S3
X
Y
Z
Temp °C
130.81
121.87
112.92
103.98
95.03
86.08
77.14
68.19
59.25
50.30
41.35
Steady State
THERMAL MANAGEMENT OF PRINTED
CIRCUITS & ELECTRONIC BOXES
S1
S2
X
Y
Z
X
Y
Z
S1
Temp °C
78.67
76.71
74.74
72.78
70.81
68.85
66.88
64.92
62.95
60.99
59.03
Steady State