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Some Samples of My Previous Design, Simulation & Test
Projects, and Product Development Responsibilities
By: Farzad Mirshams, M.S.M.E.
Professional Industry Experience: 25 Yrs
6
Air Velocity (LFPM) Measurement Results for Air Flow Through the Chassis Slots.
Measurements Were Taken Using Hot Wire Anemometer Probe.
Air Velocity (LFPM) Measurement Results for Air Flow Through the Chassis Slots.
Measurements Were Taken Using Hot Wire Anemometer Probe.
87
88
M23-17inch-Rev01 HEAT LOADS
CPU Chip 48 W
GPU Chip 12 W
U3-Bridge Chip 10 W
Motherboard PCB Uniform Spread 45 W
DIMM 4 W
Display Panel 15 W
HDD 13 W
ODD 7 W
Power Supply 30 W
Fans 4W X 3 =12 W
TOTAL 196 W
89
90
91
92
2/10/05 93
Thermal Analysis, Digeo Inc
Electronic Cooling Solutions Inc
612 National Avenue, Mountain View, CA 94043 Phone: (650) 988-1155
Farzad Mirshams
2/10/05
2/10/05 94
Model Description
Physical Model
• Chassis Size (inside dimensions): 16.9 inch X 2.5 inch X 11.5 inch
• Chassis Material: 0.03 inch thick, cold rolled steel
• PCB Assembly: 0.063 inch thick FR4 / 8 layers. Effective (board averaged) in-
plane, and normal to the plane conductivities modeled. Critical heat dissipating
components are modeled as isothermal blocks with uniform volumetric heat
generation
• Fan: Panasonic, Panaflo FBA06A12M1A, 60 X 60 X 25.5 mm / 16.6 CFM / 3.95
mmH2O / 28 dB-A / Hydro Wave Bearing. Fan curve modeled
• Hard Drive: modeled as hollow blocks with uniform heat generation inside a
thin conductive outer shell, and in dry metal on metal contact with the chassis
inside surface
• Power Supply: modeled as a porous “sponge” block with uniform volumetric
heat generation. Flow impedance along the three axes is characterized using
quadratic loss coefficients
2/10/05 95
Fig-1: Two Proposed layouts for Chassis
Assembly are Modeled, Isometric Views
2/10/05 96
Fig-2: Two Proposed Layouts
Modeled, Side Views
2/10/05 97
Fig-3: Grille Areas, as Modeled
2/10/05 98
Model Description
Boundary Conditions
• Ambient Temperature: 40 C
• Chassis Top Surface: Natural convection & Radiation
• Chassis Bottom Surface: Radiation only
• Chassis Sides: Natural convection & Radiation
• Chassis Front Panel / Bezel: Insulated
• Chassis Rear Panel: Intake & Exhaust Grilles (65% open area ratio)
• Natural convection from external chassis surfaces are modeled using
empirical film coefficients for horizontal, and vertical plates
• Radiation from external chassis surfaces are assumed to an infinite
black body at the ambient temperature
2/10/05 99
Model Description
Heat Loads / Power Dissipation
HD 12.5 W
PCB ASSEMBLY 70 W (Fig-4 & 5)
POWER SUPPLY 30 W
FAN <1.5 W (ignored)
TOTAL 112.5 W
2/10/05 100
Fig-4: PCB assembly power dissipation,
Top Side
2/10/05 101
Fig-5: PCB assembly power dissipation, Bottom
Side
2/10/05 102
Model Results
• Total volumetric airflow thru the chassis: 12.1 CFM
• Mean processor heat sink's base temperature: 68.6 C
• Mean rear exhaust temperature: 52.4 C
• Temperature and air velocity plots are shown on the
following slides:
2/10/05 103
2/10/05 104
2/10/05 105
2/10/05 106
2/10/05 107
2/16/05 110
Fig-1: Modified Chassis Assembly Model, Fan Orientation Changed, Top View
2/16/05 111
Model Results
• Total volumetric airflow thru the chassis: 12.4 CFM
• Mean exhaust temperature: 51.8 C
• Mean air temperature thru the fan: 45.6 C
• Mean processor heat sink’s base temperature: 69.0 C
• Mean HDD skin temperature: 53.9 C
• Total volumetric airflow thru the chassis: 12.2 CFM
• Mean exhaust temperature: 52.9 C
• Mean air temperature thru the fan: 48.4 C
• Mean processor heat sink’s base temperature: 76.8 C
• Mean HDD skin temperature: 54.9 C
Fan Blowing Air on the PCB:
Fan Pulling Air on the PCB
2/16/05 112
2/16/05 113
2/16/05 114
2/16/05 115
2/16/05 116
2/16/05 117
Fig-1: XCVRs Shelf Natural Frequency & Modes Of Vibration
Fig-2: XCVRs Shelf Static Deflection, and Von Mises Stress; Total Load: 97 lbs.
Fig-1: MicroCITE Chassis Front Cover(Door) Static Deflection
Fig-1: Bracket Stress Analysis
Fig-1: XCVR-PA Aluminum Casting FEA Thermal Analysis
Figure-1: Proposed 60K Load-Lock Chamber ModelFig-1: Load-Lock Vacuum Chamber Structural/FEA Analysis
F.Mirshams 4/28/2006
FEA Modeling of Proposed 60K Test Stand Load-Lock Chamber, Case Studies
Model Description
CASE #1:
Side Plates Thickness: 3.0 inch
Top/Bottom Plates Thickness: 3.5 inch
Lid-Cover Thickness: 3.5 inch
Lid-Cover Rib Design: NO RIBS
CASE #2:
Side Plates Thickness: 3.0 inch
Top/Bottom Plates Thickness: 3.5 inch
Lid-Cover Thickness: 3.5 inch
Lid-Cover Rib Design: Open Web, 4 inch
tall
CASE #3:
Side Plates Thickness: 3.0 inch
Top/Bottom Plates Thickness: 3.5 inch
Lid-Cover Thickness: 3.5 inch
Lid-Cover Rib Design: Open Web, 5 inch
tall
CASE #4:
Side Plates Thickness: 3.0 inch
Top/Bottom Plates Thickness: 3.5 inch
Lid-Cover Thickness: 3.5 inch
Lid-Cover Rib Design: Closed Web, 4
inch tall
CASE #5:
Side Plates Thickness: 3.5 inch
Top/Bottom Plates Thickness: 4.0 inch
Lid-Cover Thickness: 3.5 inch
Lid-Cover Rib Design: Closed Web, 5
inch tall
The 60K load-lock model is shown in Figure-1. Five proposed design
variations were modeled, as listed below:
F.Mirshams 4/28/06
• The assumed model boundary conditions are shown in Figure-2. Only 1/2 of the actual assembly was
modeled, taking advantage of symmetry in the geometry, and boundary conditions.
• The maintenance access opening’s bolted-in cover plate is not considered structurally significant,
thus it is not included in the model.
• Load-Lock chamber and lid-cover are made of Aluminum 6061-T6, with the following properties:
– Elastic Modulus = 10.0e+6 psi
– Poisson’s Ratio = 0.33
– Density = 0.0981 lb/in**3
• The computed deformation plots, and deformation animation movies are displayed in the follow up
slides.
FEA Modeling of Proposed 60K Test Stand Load-Lock Chamber, Case Studies
Figure-2: Assumed Boundary Conditions for the proposed 60K Load-Lock FEA Model
Bolted Fixed Frame Support Areas are shown in teal color
Surface Pressure Areas are shown in blue color
Surface Pressure Areas are shown in blue color
Figure-3: A Typical FEA Mesh for the proposed 60K Load-Lock Model
ANSYS Element Types Used:
1. SOLID 187 / 10 Nodes Tetrahedral / Quadratic Displacement Function
2. CONTA174 & TARGE170 / Surface to Surface Contact Pair (Frictionless Non-
Bonded Contact Option)
# of Nodes:
367,956
# of Elements:
233,188
Figure-4: A Typical FEA Mesh for the proposed 60K Load-Lock Model
ANSYS Element Types Used:
1. SOLID 187 / 10 Nodes Tetrahedral / Quadratic Displacement Function
2. CONTA174 & TARGE170 / Surface to Surface Contact Pair (Frictionless Non-
Bonded Contact Option)
# of Nodes:
392,225
# of Elements:
248,743
CASE #3:
Side Plates Thickness: 3.0 inch
Top/Bottom Plates Thickness: 3.5 inch
Lid-Cover Thickness: 3.5 inch
Lid-Cover Rib Design: Open Web, 5 inch tall
Figure-13: Deformation
CASE #2:
Side Plates Thickness: 3.0 inch
Top/Bottom Plates Thickness: 3.5 inch
Lid-Cover Thickness: 3.5 inch
Lid-Cover Rib Design: Open Web, 4 inch tall Figure-12: Von-Mises Stress
CASE #2:
Side Plates Thickness: 3.0 inch
Top/Bottom Plates Thickness: 3.5 inch
Lid-Cover Thickness: 3.5 inch
Lid-Cover Rib Design: Open Web, 4 inch tall
Figure-8: Deformation in the Y-Direction
CASE #4:
Side Plates Thickness: 3.0 inch
Top/Bottom Plates Thickness: 3.5 inch
Lid-Cover Thickness: 3.5 inch
Lid-Cover Rib Design: Closed Web, 4 inch tall
Figure-15: Deformation in the Y-Direction
CASE #5:
Side Plates Thickness: 3.5 inch
Top/Bottom Plates Thickness: 4.0 inch
Lid-Cover Thickness: 3.5 inch
Lid-Cover Rib Design: Closed Web, 5 inch tall
Figure-22: Deformation in the X-Direction
F.Mirshams 4/16/2006
FEA Modeling of 60K/50K Ceramic Assemblies / Camlock CB Hole Size Study
• Two proposed design variations were modeled, per CAD files listed below:
• 1. CAD file: “60K 125 taper 17 shaft 8 cbored camlocks”
• 2. CAD file: “50K assembly larger camlock cbores”
• Two levels of structural modeling were performed for each assembly, as follows:
• 1. The ceramic assembly was modeled as fully-bonded parts composing a single ceramic piece. Thus no possible gapping
or slippage between assembly parts were allowed in the model.
• 2. The ceramic assembly was modeled as separate piece parts in non-bonded frictionless contact, using ANSYS surface to
surface contact elements. Thus assembly parts could flex individually causing gaps to form.
• The assumed model boundary conditions are shown in the follow up slides. Only ¼ of the actual assembly
was modeled, taking advantage of symmetry in the geometry, and boundary conditions.
• Locating pins & camlock fasteners are not considered structurally significant, thus they were not included in
the model.
• Assembly parts are made of COORSTEK / AD-96 Ceramic material with the following properties:
• Elastic Modulus = 44.0e+6 psi
• Poisson’s Ratio = 0.21
• Density = 0.135 lb/in**3
• The computed Maximum Principal stress plots are displayed in the follow up slides.
Model Description
Boundary Conditions, CAD Model: “60K 125 taper 17 shaft 8 cbored camlocks”
ANSYS Element Types Used:
1. SOLID 187 / 10 Nodes Tetrahedral / Quadratic Displacement Function
2. CONTA174 & TARGE170 / Surface to Surface Contact Pair (Frictionless Non-Bonded Contact Option)
Fully Bonded Model Mesh
# of Nodes: 42,689
# of Elements: 24,900
Non-Bonded Model Mesh
# of Nodes: 127,683
# of Elements: 80,227
CAD Model: “60K 125 taper 17 shaft 8 cbored camlocks”
Max Deformation = 0.095 inch
CAD Model: “60K 125 taper 17 shaft 8 cbored camlocks”
C/Bore size: 1.0” Diameter, 0.125” Round
Fully Bonded Model
C/Bore size: 1.0” Diameter, 0.125” Round
C/Bore size: 1.0” Diameter, 0.125” Round
CAD Model: “60K 125 taper 17 shaft 8 cbored camlocks”
Non-Bonded Model, “Gaps Allowed”
Max Deformation = 0.17 inch
Max Gap = 0.013 inch
C/Bore size: 1.0” Diameter, 0.125” Round
CAD Model: Modified “60K 125 taper 17 shaft 8 cbored camlocks”
Non-Bonded Model, “Gaps Allowed”
C/Bore size: 2.0” Diameter, 0.25” Round
C/Bore size: 2.0” Diameter, 0.25” Round
C/Bore size: 1.0” Diameter, 0.125” Round, Location Change C/Bore size: 1.5” Diameter, 0.25” Round, Location change
0.25” Round
0.125” Round
Boundary Conditions, CAD Model: “50K assembly larger camlock cbores”
ANSYS Element Types Used:
1. SOLID 187 / 10 Nodes Tetrahedral / Quadratic Displacement Function
2. CONTA174 & TARGE170 / Surface to Surface Contact Pair (Frictionless Non-Bonded Contact Option)
Fully Bonded Model Mesh
# of Nodes: 25,285
# of Elements: 14,166
Non-Bonded Model Mesh
# of Nodes: 106,222
# of Elements: 66,124
CAD Model: “50K assembly larger camlock cbores”
CAD Model: “50K assembly larger camlock cbores”
Fully Bonded Model
Max Deformation = 0.12 inch
CAD Model: “50K assembly larger camlock cbores”
Non-Bonded Model, “Gaps Allowed”
Max Deformation = 0.22 inch
Max Gap = 0.019 inch
F.Mirshams 6/12/2006
FEA Modeling of 25K Ceramic Assembly
• The FEA model is created per CAD file listed below:
• CAD file: “25K IPS Support Ceramics”
• Two possible loading configuration for the ceramic plates, by the Susceptor, were modeled:
• 1. Susceptor’s weight is supported evenly between the outer ceramic plates load pad areas
• 2. Susceptor’s weight is supported evenly by the outer ceramic plates load pad areas, and an Aluminum shim at the main
ceramic plate’s center hole
• The assumed model boundary conditions are shown in the follow up slides. Only ¼ of the actual assembly was modeled, taking
advantage of symmetry in the geometry, and boundary conditions. Locating pins & camlock fasteners are not considered
structurally significant, thus they were not included in the model.
Ceramic assembly parts are made of COORSTEK / AD-96 with the following properties:
• Elastic Modulus = 44.0e+6 psi
• Poisson’s Ratio = 0.21
• Density = 0.135 lb/in**3
Center shim is made of Aluminum-6061 with the following properties:
• Elastic Modulus = 10.0e+6 psi
• Poisson’s Ratio = 0.33
• Density = 0.0981 lb/in**3
• The computed deformation & Maximum Principal stress plots are displayed in the follow up slides.
Model Description
Boundary Conditions, CAD Model: “25K IPS Support Ceramics”
Bonded Contact
Non-bonded Contact
Bonded Contact
Non-bonded Contact
No Center Shim With Center Shim
“With Center Shim” Model Mesh
# of Nodes: 157,753
# of Elements: 93,598
CAD Model: “25K IPS Support Ceramics”
ANSYS Element Types Used:
1. SOLID 187 / 10 Nodes Tetrahedral / Quadratic Displacement Function
2. CONTA174 & TARGE170 / Surface to Surface Contact Pair (Frictionless Non-Bonded Contact Option)
Deformation, No Center Shim
Deformation, With Center Shim
CAD Model: “25K IPS Support Ceramics”
With Center Shim
CAD Model: “25K IPS Support Ceramics”
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer
Farzad Mirshams, Mechanical / Thermal Engineer

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Farzad Mirshams, Mechanical / Thermal Engineer

  • 1. Some Samples of My Previous Design, Simulation & Test Projects, and Product Development Responsibilities By: Farzad Mirshams, M.S.M.E. Professional Industry Experience: 25 Yrs
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  • 84. Air Velocity (LFPM) Measurement Results for Air Flow Through the Chassis Slots. Measurements Were Taken Using Hot Wire Anemometer Probe.
  • 85. Air Velocity (LFPM) Measurement Results for Air Flow Through the Chassis Slots. Measurements Were Taken Using Hot Wire Anemometer Probe.
  • 86.
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  • 88. 88 M23-17inch-Rev01 HEAT LOADS CPU Chip 48 W GPU Chip 12 W U3-Bridge Chip 10 W Motherboard PCB Uniform Spread 45 W DIMM 4 W Display Panel 15 W HDD 13 W ODD 7 W Power Supply 30 W Fans 4W X 3 =12 W TOTAL 196 W
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  • 93. 2/10/05 93 Thermal Analysis, Digeo Inc Electronic Cooling Solutions Inc 612 National Avenue, Mountain View, CA 94043 Phone: (650) 988-1155 Farzad Mirshams 2/10/05
  • 94. 2/10/05 94 Model Description Physical Model • Chassis Size (inside dimensions): 16.9 inch X 2.5 inch X 11.5 inch • Chassis Material: 0.03 inch thick, cold rolled steel • PCB Assembly: 0.063 inch thick FR4 / 8 layers. Effective (board averaged) in- plane, and normal to the plane conductivities modeled. Critical heat dissipating components are modeled as isothermal blocks with uniform volumetric heat generation • Fan: Panasonic, Panaflo FBA06A12M1A, 60 X 60 X 25.5 mm / 16.6 CFM / 3.95 mmH2O / 28 dB-A / Hydro Wave Bearing. Fan curve modeled • Hard Drive: modeled as hollow blocks with uniform heat generation inside a thin conductive outer shell, and in dry metal on metal contact with the chassis inside surface • Power Supply: modeled as a porous “sponge” block with uniform volumetric heat generation. Flow impedance along the three axes is characterized using quadratic loss coefficients
  • 95. 2/10/05 95 Fig-1: Two Proposed layouts for Chassis Assembly are Modeled, Isometric Views
  • 96. 2/10/05 96 Fig-2: Two Proposed Layouts Modeled, Side Views
  • 97. 2/10/05 97 Fig-3: Grille Areas, as Modeled
  • 98. 2/10/05 98 Model Description Boundary Conditions • Ambient Temperature: 40 C • Chassis Top Surface: Natural convection & Radiation • Chassis Bottom Surface: Radiation only • Chassis Sides: Natural convection & Radiation • Chassis Front Panel / Bezel: Insulated • Chassis Rear Panel: Intake & Exhaust Grilles (65% open area ratio) • Natural convection from external chassis surfaces are modeled using empirical film coefficients for horizontal, and vertical plates • Radiation from external chassis surfaces are assumed to an infinite black body at the ambient temperature
  • 99. 2/10/05 99 Model Description Heat Loads / Power Dissipation HD 12.5 W PCB ASSEMBLY 70 W (Fig-4 & 5) POWER SUPPLY 30 W FAN <1.5 W (ignored) TOTAL 112.5 W
  • 100. 2/10/05 100 Fig-4: PCB assembly power dissipation, Top Side
  • 101. 2/10/05 101 Fig-5: PCB assembly power dissipation, Bottom Side
  • 102. 2/10/05 102 Model Results • Total volumetric airflow thru the chassis: 12.1 CFM • Mean processor heat sink's base temperature: 68.6 C • Mean rear exhaust temperature: 52.4 C • Temperature and air velocity plots are shown on the following slides:
  • 108.
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  • 110. 2/16/05 110 Fig-1: Modified Chassis Assembly Model, Fan Orientation Changed, Top View
  • 111. 2/16/05 111 Model Results • Total volumetric airflow thru the chassis: 12.4 CFM • Mean exhaust temperature: 51.8 C • Mean air temperature thru the fan: 45.6 C • Mean processor heat sink’s base temperature: 69.0 C • Mean HDD skin temperature: 53.9 C • Total volumetric airflow thru the chassis: 12.2 CFM • Mean exhaust temperature: 52.9 C • Mean air temperature thru the fan: 48.4 C • Mean processor heat sink’s base temperature: 76.8 C • Mean HDD skin temperature: 54.9 C Fan Blowing Air on the PCB: Fan Pulling Air on the PCB
  • 118.
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  • 121. Fig-1: XCVRs Shelf Natural Frequency & Modes Of Vibration
  • 122. Fig-2: XCVRs Shelf Static Deflection, and Von Mises Stress; Total Load: 97 lbs.
  • 123.
  • 124. Fig-1: MicroCITE Chassis Front Cover(Door) Static Deflection
  • 126.
  • 127. Fig-1: XCVR-PA Aluminum Casting FEA Thermal Analysis
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  • 130. Figure-1: Proposed 60K Load-Lock Chamber ModelFig-1: Load-Lock Vacuum Chamber Structural/FEA Analysis
  • 131. F.Mirshams 4/28/2006 FEA Modeling of Proposed 60K Test Stand Load-Lock Chamber, Case Studies Model Description CASE #1: Side Plates Thickness: 3.0 inch Top/Bottom Plates Thickness: 3.5 inch Lid-Cover Thickness: 3.5 inch Lid-Cover Rib Design: NO RIBS CASE #2: Side Plates Thickness: 3.0 inch Top/Bottom Plates Thickness: 3.5 inch Lid-Cover Thickness: 3.5 inch Lid-Cover Rib Design: Open Web, 4 inch tall CASE #3: Side Plates Thickness: 3.0 inch Top/Bottom Plates Thickness: 3.5 inch Lid-Cover Thickness: 3.5 inch Lid-Cover Rib Design: Open Web, 5 inch tall CASE #4: Side Plates Thickness: 3.0 inch Top/Bottom Plates Thickness: 3.5 inch Lid-Cover Thickness: 3.5 inch Lid-Cover Rib Design: Closed Web, 4 inch tall CASE #5: Side Plates Thickness: 3.5 inch Top/Bottom Plates Thickness: 4.0 inch Lid-Cover Thickness: 3.5 inch Lid-Cover Rib Design: Closed Web, 5 inch tall The 60K load-lock model is shown in Figure-1. Five proposed design variations were modeled, as listed below:
  • 132. F.Mirshams 4/28/06 • The assumed model boundary conditions are shown in Figure-2. Only 1/2 of the actual assembly was modeled, taking advantage of symmetry in the geometry, and boundary conditions. • The maintenance access opening’s bolted-in cover plate is not considered structurally significant, thus it is not included in the model. • Load-Lock chamber and lid-cover are made of Aluminum 6061-T6, with the following properties: – Elastic Modulus = 10.0e+6 psi – Poisson’s Ratio = 0.33 – Density = 0.0981 lb/in**3 • The computed deformation plots, and deformation animation movies are displayed in the follow up slides. FEA Modeling of Proposed 60K Test Stand Load-Lock Chamber, Case Studies
  • 133. Figure-2: Assumed Boundary Conditions for the proposed 60K Load-Lock FEA Model Bolted Fixed Frame Support Areas are shown in teal color Surface Pressure Areas are shown in blue color Surface Pressure Areas are shown in blue color
  • 134. Figure-3: A Typical FEA Mesh for the proposed 60K Load-Lock Model ANSYS Element Types Used: 1. SOLID 187 / 10 Nodes Tetrahedral / Quadratic Displacement Function 2. CONTA174 & TARGE170 / Surface to Surface Contact Pair (Frictionless Non- Bonded Contact Option) # of Nodes: 367,956 # of Elements: 233,188
  • 135. Figure-4: A Typical FEA Mesh for the proposed 60K Load-Lock Model ANSYS Element Types Used: 1. SOLID 187 / 10 Nodes Tetrahedral / Quadratic Displacement Function 2. CONTA174 & TARGE170 / Surface to Surface Contact Pair (Frictionless Non- Bonded Contact Option) # of Nodes: 392,225 # of Elements: 248,743
  • 136. CASE #3: Side Plates Thickness: 3.0 inch Top/Bottom Plates Thickness: 3.5 inch Lid-Cover Thickness: 3.5 inch Lid-Cover Rib Design: Open Web, 5 inch tall Figure-13: Deformation
  • 137. CASE #2: Side Plates Thickness: 3.0 inch Top/Bottom Plates Thickness: 3.5 inch Lid-Cover Thickness: 3.5 inch Lid-Cover Rib Design: Open Web, 4 inch tall Figure-12: Von-Mises Stress
  • 138. CASE #2: Side Plates Thickness: 3.0 inch Top/Bottom Plates Thickness: 3.5 inch Lid-Cover Thickness: 3.5 inch Lid-Cover Rib Design: Open Web, 4 inch tall Figure-8: Deformation in the Y-Direction
  • 139.
  • 140. CASE #4: Side Plates Thickness: 3.0 inch Top/Bottom Plates Thickness: 3.5 inch Lid-Cover Thickness: 3.5 inch Lid-Cover Rib Design: Closed Web, 4 inch tall Figure-15: Deformation in the Y-Direction
  • 141. CASE #5: Side Plates Thickness: 3.5 inch Top/Bottom Plates Thickness: 4.0 inch Lid-Cover Thickness: 3.5 inch Lid-Cover Rib Design: Closed Web, 5 inch tall Figure-22: Deformation in the X-Direction
  • 142. F.Mirshams 4/16/2006 FEA Modeling of 60K/50K Ceramic Assemblies / Camlock CB Hole Size Study • Two proposed design variations were modeled, per CAD files listed below: • 1. CAD file: “60K 125 taper 17 shaft 8 cbored camlocks” • 2. CAD file: “50K assembly larger camlock cbores” • Two levels of structural modeling were performed for each assembly, as follows: • 1. The ceramic assembly was modeled as fully-bonded parts composing a single ceramic piece. Thus no possible gapping or slippage between assembly parts were allowed in the model. • 2. The ceramic assembly was modeled as separate piece parts in non-bonded frictionless contact, using ANSYS surface to surface contact elements. Thus assembly parts could flex individually causing gaps to form. • The assumed model boundary conditions are shown in the follow up slides. Only ¼ of the actual assembly was modeled, taking advantage of symmetry in the geometry, and boundary conditions. • Locating pins & camlock fasteners are not considered structurally significant, thus they were not included in the model. • Assembly parts are made of COORSTEK / AD-96 Ceramic material with the following properties: • Elastic Modulus = 44.0e+6 psi • Poisson’s Ratio = 0.21 • Density = 0.135 lb/in**3 • The computed Maximum Principal stress plots are displayed in the follow up slides. Model Description
  • 143. Boundary Conditions, CAD Model: “60K 125 taper 17 shaft 8 cbored camlocks”
  • 144. ANSYS Element Types Used: 1. SOLID 187 / 10 Nodes Tetrahedral / Quadratic Displacement Function 2. CONTA174 & TARGE170 / Surface to Surface Contact Pair (Frictionless Non-Bonded Contact Option) Fully Bonded Model Mesh # of Nodes: 42,689 # of Elements: 24,900 Non-Bonded Model Mesh # of Nodes: 127,683 # of Elements: 80,227 CAD Model: “60K 125 taper 17 shaft 8 cbored camlocks”
  • 145. Max Deformation = 0.095 inch CAD Model: “60K 125 taper 17 shaft 8 cbored camlocks” C/Bore size: 1.0” Diameter, 0.125” Round Fully Bonded Model C/Bore size: 1.0” Diameter, 0.125” Round
  • 146. C/Bore size: 1.0” Diameter, 0.125” Round CAD Model: “60K 125 taper 17 shaft 8 cbored camlocks” Non-Bonded Model, “Gaps Allowed” Max Deformation = 0.17 inch Max Gap = 0.013 inch C/Bore size: 1.0” Diameter, 0.125” Round
  • 147. CAD Model: Modified “60K 125 taper 17 shaft 8 cbored camlocks” Non-Bonded Model, “Gaps Allowed” C/Bore size: 2.0” Diameter, 0.25” Round C/Bore size: 2.0” Diameter, 0.25” Round C/Bore size: 1.0” Diameter, 0.125” Round, Location Change C/Bore size: 1.5” Diameter, 0.25” Round, Location change 0.25” Round 0.125” Round
  • 148. Boundary Conditions, CAD Model: “50K assembly larger camlock cbores”
  • 149. ANSYS Element Types Used: 1. SOLID 187 / 10 Nodes Tetrahedral / Quadratic Displacement Function 2. CONTA174 & TARGE170 / Surface to Surface Contact Pair (Frictionless Non-Bonded Contact Option) Fully Bonded Model Mesh # of Nodes: 25,285 # of Elements: 14,166 Non-Bonded Model Mesh # of Nodes: 106,222 # of Elements: 66,124 CAD Model: “50K assembly larger camlock cbores”
  • 150. CAD Model: “50K assembly larger camlock cbores” Fully Bonded Model Max Deformation = 0.12 inch
  • 151. CAD Model: “50K assembly larger camlock cbores” Non-Bonded Model, “Gaps Allowed” Max Deformation = 0.22 inch Max Gap = 0.019 inch
  • 152.
  • 153. F.Mirshams 6/12/2006 FEA Modeling of 25K Ceramic Assembly • The FEA model is created per CAD file listed below: • CAD file: “25K IPS Support Ceramics” • Two possible loading configuration for the ceramic plates, by the Susceptor, were modeled: • 1. Susceptor’s weight is supported evenly between the outer ceramic plates load pad areas • 2. Susceptor’s weight is supported evenly by the outer ceramic plates load pad areas, and an Aluminum shim at the main ceramic plate’s center hole • The assumed model boundary conditions are shown in the follow up slides. Only ¼ of the actual assembly was modeled, taking advantage of symmetry in the geometry, and boundary conditions. Locating pins & camlock fasteners are not considered structurally significant, thus they were not included in the model. Ceramic assembly parts are made of COORSTEK / AD-96 with the following properties: • Elastic Modulus = 44.0e+6 psi • Poisson’s Ratio = 0.21 • Density = 0.135 lb/in**3 Center shim is made of Aluminum-6061 with the following properties: • Elastic Modulus = 10.0e+6 psi • Poisson’s Ratio = 0.33 • Density = 0.0981 lb/in**3 • The computed deformation & Maximum Principal stress plots are displayed in the follow up slides. Model Description
  • 154. Boundary Conditions, CAD Model: “25K IPS Support Ceramics” Bonded Contact Non-bonded Contact Bonded Contact Non-bonded Contact No Center Shim With Center Shim
  • 155. “With Center Shim” Model Mesh # of Nodes: 157,753 # of Elements: 93,598 CAD Model: “25K IPS Support Ceramics” ANSYS Element Types Used: 1. SOLID 187 / 10 Nodes Tetrahedral / Quadratic Displacement Function 2. CONTA174 & TARGE170 / Surface to Surface Contact Pair (Frictionless Non-Bonded Contact Option)
  • 156. Deformation, No Center Shim Deformation, With Center Shim CAD Model: “25K IPS Support Ceramics”
  • 157. With Center Shim CAD Model: “25K IPS Support Ceramics”