1. Some Samples of My Previous Design, Simulation & Test
Projects, and Product Development Responsibilities
By: Farzad Mirshams, M.S.M.E.
Professional Industry Experience: 25 Yrs
88. 88
M23-17inch-Rev01 HEAT LOADS
CPU Chip 48 W
GPU Chip 12 W
U3-Bridge Chip 10 W
Motherboard PCB Uniform Spread 45 W
DIMM 4 W
Display Panel 15 W
HDD 13 W
ODD 7 W
Power Supply 30 W
Fans 4W X 3 =12 W
TOTAL 196 W
94. 2/10/05 94
Model Description
Physical Model
• Chassis Size (inside dimensions): 16.9 inch X 2.5 inch X 11.5 inch
• Chassis Material: 0.03 inch thick, cold rolled steel
• PCB Assembly: 0.063 inch thick FR4 / 8 layers. Effective (board averaged) in-
plane, and normal to the plane conductivities modeled. Critical heat dissipating
components are modeled as isothermal blocks with uniform volumetric heat
generation
• Fan: Panasonic, Panaflo FBA06A12M1A, 60 X 60 X 25.5 mm / 16.6 CFM / 3.95
mmH2O / 28 dB-A / Hydro Wave Bearing. Fan curve modeled
• Hard Drive: modeled as hollow blocks with uniform heat generation inside a
thin conductive outer shell, and in dry metal on metal contact with the chassis
inside surface
• Power Supply: modeled as a porous “sponge” block with uniform volumetric
heat generation. Flow impedance along the three axes is characterized using
quadratic loss coefficients
95. 2/10/05 95
Fig-1: Two Proposed layouts for Chassis
Assembly are Modeled, Isometric Views
98. 2/10/05 98
Model Description
Boundary Conditions
• Ambient Temperature: 40 C
• Chassis Top Surface: Natural convection & Radiation
• Chassis Bottom Surface: Radiation only
• Chassis Sides: Natural convection & Radiation
• Chassis Front Panel / Bezel: Insulated
• Chassis Rear Panel: Intake & Exhaust Grilles (65% open area ratio)
• Natural convection from external chassis surfaces are modeled using
empirical film coefficients for horizontal, and vertical plates
• Radiation from external chassis surfaces are assumed to an infinite
black body at the ambient temperature
99. 2/10/05 99
Model Description
Heat Loads / Power Dissipation
HD 12.5 W
PCB ASSEMBLY 70 W (Fig-4 & 5)
POWER SUPPLY 30 W
FAN <1.5 W (ignored)
TOTAL 112.5 W
102. 2/10/05 102
Model Results
• Total volumetric airflow thru the chassis: 12.1 CFM
• Mean processor heat sink's base temperature: 68.6 C
• Mean rear exhaust temperature: 52.4 C
• Temperature and air velocity plots are shown on the
following slides:
111. 2/16/05 111
Model Results
• Total volumetric airflow thru the chassis: 12.4 CFM
• Mean exhaust temperature: 51.8 C
• Mean air temperature thru the fan: 45.6 C
• Mean processor heat sink’s base temperature: 69.0 C
• Mean HDD skin temperature: 53.9 C
• Total volumetric airflow thru the chassis: 12.2 CFM
• Mean exhaust temperature: 52.9 C
• Mean air temperature thru the fan: 48.4 C
• Mean processor heat sink’s base temperature: 76.8 C
• Mean HDD skin temperature: 54.9 C
Fan Blowing Air on the PCB:
Fan Pulling Air on the PCB
131. F.Mirshams 4/28/2006
FEA Modeling of Proposed 60K Test Stand Load-Lock Chamber, Case Studies
Model Description
CASE #1:
Side Plates Thickness: 3.0 inch
Top/Bottom Plates Thickness: 3.5 inch
Lid-Cover Thickness: 3.5 inch
Lid-Cover Rib Design: NO RIBS
CASE #2:
Side Plates Thickness: 3.0 inch
Top/Bottom Plates Thickness: 3.5 inch
Lid-Cover Thickness: 3.5 inch
Lid-Cover Rib Design: Open Web, 4 inch
tall
CASE #3:
Side Plates Thickness: 3.0 inch
Top/Bottom Plates Thickness: 3.5 inch
Lid-Cover Thickness: 3.5 inch
Lid-Cover Rib Design: Open Web, 5 inch
tall
CASE #4:
Side Plates Thickness: 3.0 inch
Top/Bottom Plates Thickness: 3.5 inch
Lid-Cover Thickness: 3.5 inch
Lid-Cover Rib Design: Closed Web, 4
inch tall
CASE #5:
Side Plates Thickness: 3.5 inch
Top/Bottom Plates Thickness: 4.0 inch
Lid-Cover Thickness: 3.5 inch
Lid-Cover Rib Design: Closed Web, 5
inch tall
The 60K load-lock model is shown in Figure-1. Five proposed design
variations were modeled, as listed below:
132. F.Mirshams 4/28/06
• The assumed model boundary conditions are shown in Figure-2. Only 1/2 of the actual assembly was
modeled, taking advantage of symmetry in the geometry, and boundary conditions.
• The maintenance access opening’s bolted-in cover plate is not considered structurally significant,
thus it is not included in the model.
• Load-Lock chamber and lid-cover are made of Aluminum 6061-T6, with the following properties:
– Elastic Modulus = 10.0e+6 psi
– Poisson’s Ratio = 0.33
– Density = 0.0981 lb/in**3
• The computed deformation plots, and deformation animation movies are displayed in the follow up
slides.
FEA Modeling of Proposed 60K Test Stand Load-Lock Chamber, Case Studies
133. Figure-2: Assumed Boundary Conditions for the proposed 60K Load-Lock FEA Model
Bolted Fixed Frame Support Areas are shown in teal color
Surface Pressure Areas are shown in blue color
Surface Pressure Areas are shown in blue color
134. Figure-3: A Typical FEA Mesh for the proposed 60K Load-Lock Model
ANSYS Element Types Used:
1. SOLID 187 / 10 Nodes Tetrahedral / Quadratic Displacement Function
2. CONTA174 & TARGE170 / Surface to Surface Contact Pair (Frictionless Non-
Bonded Contact Option)
# of Nodes:
367,956
# of Elements:
233,188
135. Figure-4: A Typical FEA Mesh for the proposed 60K Load-Lock Model
ANSYS Element Types Used:
1. SOLID 187 / 10 Nodes Tetrahedral / Quadratic Displacement Function
2. CONTA174 & TARGE170 / Surface to Surface Contact Pair (Frictionless Non-
Bonded Contact Option)
# of Nodes:
392,225
# of Elements:
248,743
136. CASE #3:
Side Plates Thickness: 3.0 inch
Top/Bottom Plates Thickness: 3.5 inch
Lid-Cover Thickness: 3.5 inch
Lid-Cover Rib Design: Open Web, 5 inch tall
Figure-13: Deformation
137. CASE #2:
Side Plates Thickness: 3.0 inch
Top/Bottom Plates Thickness: 3.5 inch
Lid-Cover Thickness: 3.5 inch
Lid-Cover Rib Design: Open Web, 4 inch tall Figure-12: Von-Mises Stress
138. CASE #2:
Side Plates Thickness: 3.0 inch
Top/Bottom Plates Thickness: 3.5 inch
Lid-Cover Thickness: 3.5 inch
Lid-Cover Rib Design: Open Web, 4 inch tall
Figure-8: Deformation in the Y-Direction
139.
140. CASE #4:
Side Plates Thickness: 3.0 inch
Top/Bottom Plates Thickness: 3.5 inch
Lid-Cover Thickness: 3.5 inch
Lid-Cover Rib Design: Closed Web, 4 inch tall
Figure-15: Deformation in the Y-Direction
141. CASE #5:
Side Plates Thickness: 3.5 inch
Top/Bottom Plates Thickness: 4.0 inch
Lid-Cover Thickness: 3.5 inch
Lid-Cover Rib Design: Closed Web, 5 inch tall
Figure-22: Deformation in the X-Direction
142. F.Mirshams 4/16/2006
FEA Modeling of 60K/50K Ceramic Assemblies / Camlock CB Hole Size Study
• Two proposed design variations were modeled, per CAD files listed below:
• 1. CAD file: “60K 125 taper 17 shaft 8 cbored camlocks”
• 2. CAD file: “50K assembly larger camlock cbores”
• Two levels of structural modeling were performed for each assembly, as follows:
• 1. The ceramic assembly was modeled as fully-bonded parts composing a single ceramic piece. Thus no possible gapping
or slippage between assembly parts were allowed in the model.
• 2. The ceramic assembly was modeled as separate piece parts in non-bonded frictionless contact, using ANSYS surface to
surface contact elements. Thus assembly parts could flex individually causing gaps to form.
• The assumed model boundary conditions are shown in the follow up slides. Only ¼ of the actual assembly
was modeled, taking advantage of symmetry in the geometry, and boundary conditions.
• Locating pins & camlock fasteners are not considered structurally significant, thus they were not included in
the model.
• Assembly parts are made of COORSTEK / AD-96 Ceramic material with the following properties:
• Elastic Modulus = 44.0e+6 psi
• Poisson’s Ratio = 0.21
• Density = 0.135 lb/in**3
• The computed Maximum Principal stress plots are displayed in the follow up slides.
Model Description
149. ANSYS Element Types Used:
1. SOLID 187 / 10 Nodes Tetrahedral / Quadratic Displacement Function
2. CONTA174 & TARGE170 / Surface to Surface Contact Pair (Frictionless Non-Bonded Contact Option)
Fully Bonded Model Mesh
# of Nodes: 25,285
# of Elements: 14,166
Non-Bonded Model Mesh
# of Nodes: 106,222
# of Elements: 66,124
CAD Model: “50K assembly larger camlock cbores”
150. CAD Model: “50K assembly larger camlock cbores”
Fully Bonded Model
Max Deformation = 0.12 inch
151. CAD Model: “50K assembly larger camlock cbores”
Non-Bonded Model, “Gaps Allowed”
Max Deformation = 0.22 inch
Max Gap = 0.019 inch
152.
153. F.Mirshams 6/12/2006
FEA Modeling of 25K Ceramic Assembly
• The FEA model is created per CAD file listed below:
• CAD file: “25K IPS Support Ceramics”
• Two possible loading configuration for the ceramic plates, by the Susceptor, were modeled:
• 1. Susceptor’s weight is supported evenly between the outer ceramic plates load pad areas
• 2. Susceptor’s weight is supported evenly by the outer ceramic plates load pad areas, and an Aluminum shim at the main
ceramic plate’s center hole
• The assumed model boundary conditions are shown in the follow up slides. Only ¼ of the actual assembly was modeled, taking
advantage of symmetry in the geometry, and boundary conditions. Locating pins & camlock fasteners are not considered
structurally significant, thus they were not included in the model.
Ceramic assembly parts are made of COORSTEK / AD-96 with the following properties:
• Elastic Modulus = 44.0e+6 psi
• Poisson’s Ratio = 0.21
• Density = 0.135 lb/in**3
Center shim is made of Aluminum-6061 with the following properties:
• Elastic Modulus = 10.0e+6 psi
• Poisson’s Ratio = 0.33
• Density = 0.0981 lb/in**3
• The computed deformation & Maximum Principal stress plots are displayed in the follow up slides.
Model Description
154. Boundary Conditions, CAD Model: “25K IPS Support Ceramics”
Bonded Contact
Non-bonded Contact
Bonded Contact
Non-bonded Contact
No Center Shim With Center Shim
155. “With Center Shim” Model Mesh
# of Nodes: 157,753
# of Elements: 93,598
CAD Model: “25K IPS Support Ceramics”
ANSYS Element Types Used:
1. SOLID 187 / 10 Nodes Tetrahedral / Quadratic Displacement Function
2. CONTA174 & TARGE170 / Surface to Surface Contact Pair (Frictionless Non-Bonded Contact Option)
156. Deformation, No Center Shim
Deformation, With Center Shim
CAD Model: “25K IPS Support Ceramics”