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scheme-samsung-np_r560.pdf
1. Samsung
Confidential
SRP Sheet Number: 1 of 76
Sheet 50
Sheet 51.
Sheet 66.
Sheet 52.
Sheet 67.
Sheet 53.
Sheet 68.
Sheet 54.
Sheet 69.
Sheet 55.
Sheet 70.
Sheet 56.
Sheet 71.
Sheet 57.
Sheet 72-73.
Sheet 14-16.
Sheet 74.
Sheet 17-21
Sheet 22.
Sheet 23.
Sheet 24-28
Sheet 29.
Sheet 38-40
Sheet 41-45.
Sheet 46.
GFx_External_NB9X
Sheet 30-34
Graphics_Memory
Sheet 35-37.
LAN_Marvell_8055
Sheet 47-48.
PCIE_Minicard_Slot
Sheet 49.
Express_Card
A
Multi_MV_AU6372
SPI ROM & Debug Connector
HDD_IF_Conn
D
ODD_IF_Conn
SAMSUNG PROPRIETARY
USB_1Port
HDA_Modem
USB_2Port
B
Bluetooth_IF
1
Sheet 12. Clock Generator -CK505
Debug_Port
Sheet 58.
MICOM_Renesas2110
Sheet 59.
KBD_IF
Sheet 60.
Touchpad_IF
Sheet 61.
PWR_Switchbutton
Sheet 62.
MIO_Switch
Sheet 63.
LED_Switch
Sheet 64.
LID_Switch
Sheet 65.
PWR_MV_Charger
ICH,PERIPHERALS BLOCK
PWR_MV_3V_5V
GFX, LAN, AUDIO&MODEM BLOCK
PWR_MV_Switched
POWER DC/DC BLOCK
PWR_CPU_MV_SC452
# Mobile Intel Santa Rosa Platform Design Guide 0.5 (Dec, 2005)
PWR_MV_Cantiga
SAMSUNG
PWR_MV_Memory
B
PWR_GFX_MV_Ext
4
Sheet 13.
3
PBA Name :
D
PCB Code :
X
CHECK
C
SAMSUNG ELECTRONICS CO’S PROPERTY.
4
PROPRIETARY INFORMATION THAT IS
2
1.1
Oslo2_DDR3
Penryn-6M CPU
TH LEE
Signature :
1
# Mobile Intel Crestline Platform Checklist TBD (TBD)
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
Thermal Sensor & FAN
Graphic Interface
Camera_IF
MAIN
DDR3 SODIMM B
Cantiga-GMCH
Sheet 8.
Diagram (Block/Power) & Annotations
BA41-00866A
ICH9-M
DRAW
C
3
Chip Set :
Model Name :
Montevina Platform
A
OSLO2
CPU,MCH/DDR3, CLK, THERMAL BLOCK
Sheet 9.
Sheet 11.
Sheet 10.
Cover
THIS DOCUMENT CONTAINS CONFIDENTIAL
DDR3 SODIMM A
High Definition Audio (ALC262 REV-C)
EXCEPT AS AUTHORIZED BY SAMSUNG.
Dev. Step :
SEC Mobile R & D
Remarks :
TH LEE
PWR_MV_DisCharger
BA41-00867A
CPU :
ELECTRONICS
MP
Intel Penryn-6M (1067/800) MHz
Intel Cantiga & ICH9M
T.R. Date :
MS YANG
2
Sheet 1.
Owner :
2008. 05.15
APPROVAL
Revision :
MK KIM
Sheet 2-7.
2. Samsung
Confidential
Samsung
Confidential
Samsung
Confidential
SRP Sheet Number: 2 of 76
PG 41
Lane 2
ELECTRONICS
D
PG 71
A
LPC
2
Modem
DDR III
C
DDR III
Lane X
SATA
PROPRIETARY INFORMATION THAT IS
MICOM
USB 4
88E8055
PG 52
CK-505
Lane 3
1299 FCBGA
PG 44
NB9X
PG 48
FAN
HDA0
SODIMM 0
PG 17 - 21
Express Card
PG 13
SATA
PG 22
KBD
PCIE x1
4 Pin
USB 10
PG 66
Module
3
Bluetooth
PG 46
D
HDMI
SAMSUNG ELECTRONICS CO’S PROPERTY.
CRT
DDR III Power
3
L2 Cache : 6/3MB
4
Circuit
PG 64
Battery
CLINK
USB 8
PCIE x1
LED
MCH-M
PG 46
ICH9-M
Dual channel
Clocking DC/DC
USB 0,6,2
ON BOARD
676 BGA
Channel A (Reverse)
VCCP / DC-DC
PM45
SPKR R
AU6371
OPTION
PG 50
PG 49
PG 51
PG 56
80
Port
478pin
Penryn-6M
MIC-IN
MDC
Cantiga-PM PG 23
TMKBC (TBD)
Aud.
SPDIF.
PG 53
PG 61
PEG x16
PG 29
Camera
FSB
SPKR L
AMP
ANT
667/800 MT/S
A
Mobile Processor
PCIE x1
RJ11
PG 47
DDR III 1067/800
RJ45
SAMSUNG
12P
PG 51
USB 5
PAD
B
DDR III 1067/800
Lane 1
PG 69
OPTION
PG 59
External Graphics
IMVP-6
(TBD)
1
PG 39
2
PG 57
CPU
PG 49
PCIE x1
SATA 1
PG 56
ODD
52P
Thermistor
Mini Card 2
Mini Card 1
HDA1
PG 54,55
1
USB 3
PG 70
SODIMM 1
LCD
SATA 0
Smart
DC/DC
Direct Media Interface
7 IN 1
Ext. PEG
HDAUDIO
CPU
LCD
ANT
4
HP
PG 39
CRT
FSB 1067
SAMSUNG PROPRIETARY
Channel B (Reverse)
EXCEPT AS AUTHORIZED BY SAMSUNG.
PG 60
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
PG 30 - 34
PG 40
HDA2
PG 42
ALC262
THIS DOCUMENT CONTAINS CONFIDENTIAL
PG 42,43
PG 66
RESERVED FOR
PG 24 - 28
x4, 1.5V
PG 14,15,16
SPI ROM
PG 38
M/S(SD...)
H8S-2110B
PG 13
Audio
PG
58
USB 0,6,2
52P
Touch
C
High Definition Audio
3.3V LPC, 33MHz
B
HDD
PG 12
Charging
SPI
3. Samsung
Confidential
Samsung
Confidential
Samsung
Confidential
SRP Sheet Number: 3 of 76
A
P1.5V_AUX
P3.3V_MICOM
P0.75V
VTT for CPU, Crestline & ICH9-M
1.5V switched power rail (off in S3-S5)
P1.5V
5.0V switched on power rail (off in S4-S5)
P5.0V_AUX
GFX_CORE Core Voltage for GPU
3.3V always power rail (for Micom)
0.75V power rail for DDR (off in S3-S5)
P5.0V_ALW 5.0V always power rail
SYSTEM PORT 1
C
4
ELECTRONICS
BOARD INFORMATION
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
SAMSUNG ELECTRONICS CO’S PROPERTY.
SAMSUNG
-
-
E
-
-
-
I C / SMB Address
Devices Address
ICH9-m
CPU Thermal Sensor
SODIMM0
SODIMM1
Master
0111 101x
1
A
4
B
PROPRIETARY INFORMATION THAT IS
SAMSUNG PROPRIETARY
C
P3.3V
P5.0V
USB PORT Assign
PORT # ASSIGNED TO
Express Card
4
Bluetooth
0
1
2
3
See rev notes for more information.
PCI Devices
Devices IDSEL#
Cardbus
F
REVISION HISTORY
SCHEMATIC ANNOTATIONS AND BOARD INFORMATION
D
2 1
B
EXCEPT AS AUTHORIZED BY SAMSUNG.
THIS DOCUMENT CONTAINS CONFIDENTIAL
D
2
3
3
USB2.0 #1 (USB1) : D
USB2.0 #2 (USB4) : C
25MHz
Crystal LAN Marvell LAN (88E8850)
14.318MHz
Crystal CLOCK-Generator CK-505
USB2.0 #4 (EHCI) : H
6
7
USB2.0 #3 (USB5) : E
Hex
-
7Ah
1010 000x
1010 010x
Thermal Sensor on SODIMM1
Primary DC system power supply (7 to 21V)
1.8V switched power rail (off in S3-S5)
VDC
VCC_CORE
P1.8V
P1.05V (VCCP)
Core Voltage for CPU
3.3V switched on power rail (off in S4-S5)
3.3V switched power rail (off in S3-S5)
5.0V switched power rail (off in S3-S5)
1.5V power rail for DDR (off in S4-S5)
P3.3V_AUX
B
-
LOM
NC
GLAN - -
8
9 NC
34h -
-
30h
Thermal Sensor on SODIMM0
5
LCD Pannel Detect
USB
Hub to PCI
LPC bridge/IDE/AC97/SMBUS
Internal MAC
AD25
AD29(internal)
AD30(internal)
AD31(internal)
AD24(internal)
REQ/GNT#
3
Interrupts
A,B,C
USB2.0 #0 (USB0) : A
B
HD64F2169/2160
11 NC
NC
6
12MHz
Crystal Multi Card Reader Alkor AU6371
MICOM
Battery
Master
0001011x
-
16h
A0h
Bus
SMBUS Master
Thermal Sensor (EMC2012)
-
-
Clock, Unused Clock Output Disable
A4h
D2h
2
CK-505M (Clock Generator) 1101 001x
Voltage Rails
AC Link -
0011 010x
Express Card
0011 000x
1
2
3
Mini Card 2 (ROBSON or DVB-T)
4
5
Mini Card 1 (WLAN)
NC
SYSTEM PORT 2
SYSTEM PORT 2
Mini Card
NC
10 Multi Card Reader (7-in-1)
Devices Resolution PANNEL_DETECT_0
Crystal / Oscillator
32.768KHz
Crystal
TYPE FREQUENCY DEVICE
ICH9-M
USAGE
Real Time Clock
10MHz
Crystal MICOM
SMBUS Master
Battery
Camera
(EDID)
PCI Express Assign
PORT # ASSIGNED TO
4. Samsung
Confidential
Samsung
Confidential
Samsung
Confidential
SRP Sheet Number: 4 of 76
MICOM
TOUCHPAD
AUDIO AMP
MDC
HDD
C
ICH8-M
Thermal Sensor
LCD
(CHP3_S4_STATE*)
S3
ON
MDC
CK505
P1.05V
+V*LAN
P3.3V_AUX
3
P5V_AUX
AUDIO
PENRYN
D
ON
LAN
P5.0V
ICH9-M
+V*A(LWS)
+0.9V
P1.1V
GCORE3_PWRGD
S0
Cantiga
Cantiga
ICH9-M
AUX DISPLAY
SAMSUNG PROPRIETARY
GFX PEG
(CHP3_SLPS3*)
GDDR-3 for PEG
Rev 0.1
P0.75V
PEG
USB
S0
B
LEDs
P3.3V_ALW
Cantiga
+V* (CORE)
SODIMM
ON ON
ON
ODD
+1.8V_AUX
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
+V
A
State
CK505
VCCP3_PWRGD
LAN
Power On/Off Table by S-state
THIS DOCUMENT CONTAINS CONFIDENTIAL
Mini Card
KBC3_SUSPWR
B
1
P2.5V_LAN
LAN
P12.0V_ALW
4
EGFX_CORE
D
PROPRIETARY INFORMATION THAT IS
ICH9-M
P1.5V_AUX
S5-S4
P3.3V_MICOM
P1.8V_LAN
P5.0V_ALW
nVidia GFX
MICOM
ELECTRONICS
2
S5
3
EXCEPT AS AUTHORIZED BY SAMSUNG.
ON
P1.5V
CPU_CORE
SAMSUNG
PENRYN
C
AC Adapter
(VCCP)
ON
POWER DIAGRAM
S3
ON
KBC3_PWRON
S4
1
P1.2V_LAN
VDC
P1.8V
SODIMM (DDR III)
Cantiga
SODIMM (DDR III)
ICH9-M
USB
Express Card
SODIMM (DDR III)
Battery DC
2
4
MICOM
P3.3V
ON
+V*AUX
ON
Rail
SPI
SAMSUNG ELECTRONICS CO’S PROPERTY.
A
5. Samsung
Confidential
Samsung
Confidential
Samsung
Confidential
SRP Sheet Number: 5 of 76
EXCEPT AS AUTHORIZED BY SAMSUNG.
0.9V( TBD A )
0.1 A (TBD)
VDC
INV
(
TBD
A
)
D
3.3V
3.3V
3.3V
3.3V
LAN (88E8055)
SAMSUNG ELECTRONICS CO’S PROPERTY.
5V
ELECTRONICS
( ~ 2.0 W )
B
1.5 A (TBD)
5V
19V (VDC INV)
0.08 A (TBD)
Value by Datasheet/Application notes
0.01 A (TBD)
4
P1.2V_LAN
HD Audio
4
0.08 A (TBD)
CPU CORE ( TBD A )
A
( 35 W )
3.3V (LCD 3V)
5.0V_AUX
(
TBD
A
)
3.3V
0.2 A (TBD)
PROPRIETARY INFORMATION THAT IS
1 A (TBD)
C
0.9V
ITP
5V
Battery
3.3V
SAMSUNG PROPRIETARY
MICOM 3V
3.3V
2
3.3V
0.15 A (TBD)
1.5V
VGA
CORE
(TBD
A)
1.05V ( TBD A )
3.3V ( TBD A )
SAMSUNG
3.3V_AUX
A
SD Card
SATA
2 A (TBD)
0.5 A (TBD)
1.5 A (TBD)
3
0.5 A (TBD)
(Dual slots)
1.8V
1.05V
1.13 A (TBD)
3
MICOM 3V
D
5V
5V
( ~ 5.0 W )
3.1 A (TBD)
0.29 A (TBD)
5V_AUX
1
FAN
THIS DOCUMENT CONTAINS CONFIDENTIAL
1.5 A (TBD) Audio AMP
P1.8V/2.5V_LAN
0.015 A (TBD)
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
3.3V
C
Penryn-6M
5.0V ( TBD A )
0.13 A (TBD)
2
1.05V (VCCP)
B
3.3V
Touch Pad
1.25V
0.2 A (TBD)
ICH9-M
KeyBoard
GDDR
3.3V_AUX
(
TBD
A
)
RTC_Battery
1.05V (VCCP)
PWR LED
3.3V
0.5 A (TBD)
3.3V
0.67 A (TBD)
LAN
Adapter
0.75 A (TBD)
1
0.001 A (TBD)
1.8V_AUX ( TBD A )
1.0V-1.1V (EGFX CORE)
MICOM 3V ( TBD A )
3.3V_AUX
1.25V ( TBD A )
0.125 A (TBD)
RTC_Battery
0.33 A (TBD)
1.8V ( TBD A )
6.53 A (TBD)
(Value by measurement)
1.5V
0.06 A (TBD)
DDR-3
3.3V_AUX
1.5V
0.08 A (TBD)
0.374 A (TBD)
220V
7.7 A (TBD)
(8 - 8.5 W )
0.006 A (TBD)
CLOCK
SPI
ODD
0.67 A (TBD)
0.16 A (TBD)
PEG
PEX
IO
(TBD
A)
1.05V (MCH CORE)
P3.3V_AUX
Thermal
0.1 A (TBD)
0.1 A (TBD)
0.07 A (TBD)
GMCH
5V
POWER RAILS ANALYSIS
USB (x 3)
1.05V
0.25 A (TBD)
3.79 A (TBD)
1.5V ( TBD A )
Mini Card X 2
1.8V
0.001 A (TBD)
3.3V
1.8V_AUX
3.1 A (TBD)
1.75 A (TBD)
KBD LED
0.209 A (TBD)
3.3V_AUX
0.22 A (TBD)
3.3V_AUX
41 A (TBD)
0.75A (TBD)
5V
0.6 A (TBD)
Cantiga
LCD
17.75 A (TBD)
KBC
5V
2.43A (TBD)
1.8V_AUX
SATA HDD
1.2V (PEX IO)
Sensor
1.5V
MDC
Rev. 0.6 (060920)
5V
CPU CORE
2.4A (TBD)
1.8V
4.48 A (TBD)
4.5 A (TBD)