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2 7 2 2 6 S A W Y E R R O A D • M E N I F E E , C A 9 2 5 8 4
P H O N E 3 3 6 - 4 0 4 - 5 2 9 8 • E - M A I L D _ K R A U S E _ 1 @ Y A H O O . C O M
P R O F I L E : H T T P : / / W W W . L I N K E D I N . C O M / I N / D A N K R A U S E
D A N I E L K R A U S E
OBJECTIVE
To further enhance a career goal in the industry as an Engineer.
SUMMARY OF QUALIFICATIONS
Working as an RF Applications Engineer with Qualcomm, Inc., has been a great learning experience. I am
Responsible for supporting Qualcomm's growing portfolio of RF products. Work closely with the
Qualcomm design team and other members of the applications team to create chipset documentation,
reference schematics, training material, and assist customers in feature definition, provide design
assistance, and debugging. This position also requires background knowledge in RF design and cross-
functional interaction that requires excellent written and oral communication skills. Other skills include
schematics and PCB review design and bench testing. I contribute to the development of concepts and
techniques, completing complex tasks in creative and effective ways. Work on complex assignments
requiring independent action and a high degree of initiative to resolve issues. Area of expertise include:
ENGINEERING SKILLS
S-parameters, PA’s, FEM, PLL, Filters, Semiconductors, LNA, Transceiver’s, Front end, Soldering
experience, Design review, Circuit Design, ISO Standards, Schematics and PCB Design and Layout, Network
Analysis, Solid State, LTE, CDMA, GPS, GSM, EDGE, LTE, GPRS, Blue Tooth, WIFI, Handset Design
TROUBLESHOOTING EQUIPMENT
Network Analyzer, Spectrum analyzer, Signal Generator, Digital multi-meter, Power supplies, Frequency
generator, Frequency counter, Power meter, 8960, CMU200/500, Oscilloscope, Cascade Wafer Probe,
Various de-soldering units, X-ray Machine, Laser Trimming,
COMPUTER SKILL'S
MS Access, MS Power Point, Unix, Altium Designer, Cadence, MS Word, Visio, Linux, QXDM, QDART,
Lab-View, MS Excel, QPST, C/C++ Programming, Agile, ADS
PROFESSIONAL EXPERIENCE
Qualcomm Technologies, Inc. Aug 11 – Present
RF Application Engineer,
• Responsible for supporting Qualcomm's growing portfolio of RF products.
• Support Qualcomm Hardware issues for customers.
• Supported in the creation of Antenna Tuner (QFE1510) evaluation board and measured
performance/created data package before handing off to customers
• Help/direct customer engineers to resolve the issues in using QCT solution no matter it is QCT
problem or not.
• Play consultant role, trouble shooting, identify problem reported by customers, analysis and report
issues to developer team, help developer team to narrow down the root cause and fix problems.
• Interfacing with handset developers. Training, assisting customers with Hardware design, integration,
development, system debugging, handling customer Q&A, and interfacing closely with internal
developers.
• Work with the Qualcomm design team and other members of the applications team to create chipset
documentation, reference schematics, training material, and assist customers in feature definition,
provide design assistance, do troubleshooting, and provide training.
• Understand Qualcomm's RF calibration process, tree properties, as well as interpreting calibration
results.
• Understanding of phone design cycle and risks associate throughout the process
• Meeting with customers to assist in schematic and layout reviews and provide feedback.
Kyocera Wireless Corp, Inc. Apr 08 – July 11
Hardware Engineer,
• Hardware Lead for engineering development of RF, digital, and power designs on CDMA handsets.
• Performs debugging, integration, schematic capture and PCB layout placement.
• Develop test procedures and assists in writing designs and manufacturing documentation and
present at design and product reviews.
• Perform module and circuit level testing, characterization, impedance matching, receiver sensitivities,
noise figure, spurious, VSWR, RF amplifier performance.
• Responsible for RF development phases from system definition through manufacturing.
• Perform qualification and integration testing of modules, and/or components; and evaluates
performance against predicted results and documents the test results.
• Leads cost reduction and alternate sourcing efforts to continually reduce BOM cost.
• Specify, design, implement, test, integrate and/or maintains RF sub-systems used on mobile phones.
• Provide input on component usages and selection.
• Design according to industry and internal standards.
• Coordinates BOM scrubs, layout and schematic reviews, build readiness, and create ECO’S, BOM’s
and Deviation’s.
• Coordinates with other engineering groups including CAD, CM, Manufacturing, Mechanical, Test
Engineering, Software and Systems.
RFMD, Inc. Mar 07 – Apr 08
Support Engineer,
• Cadence CIS/ PCB design to generate schematics, PCB layouts, fabrication files, and supporting
documentation for all PCB types including Evaluation, Qualification, Reference Design,
Characterization, Reliability, and Production Test.
• Assembly and modifications of evaluation PCB’s, components and verification of quality testing.
• Interactions with development and/or manufacturing engineering personnel.
• Participate in project and product teams to provide technical input on design and layout issues
during all phases of product development.
• Serve as technical interface with external fabrication and layout services to order bare PCBs and
resolve technical issues.
• Interface with Prototype Assembly and Engineering to insure designs are compliant with design
guidelines and manufacturability requirements.
• Perform a wide variety of RF and DC measurements, which include impedance matching, IIP3, stop
band attenuation, wideband response, filter tuning measurements, Noise Figure, Laser trimming and
wafer die probing in support of TX Module Design development at the MMIC and module level.
Kyocera Wireless Corp, Inc. Feb 00 - Jan 07
Support Engineer
• Module and circuit level testing and characterization, impedance matching, receiver sensitivities,
Spurious, VSWR, RF amplifier performance.
• Develops test procedures and assists in writing designs and manufacturing documentation and
presents at design and product reviews.
• Performs qualification and integration testing of recently redesigned circuit cards, modules, and
components; and evaluates performance against predicted results and documents the test results.
• Worked on problems of moderate scope where analysis of situations or data requires a review of a
variety of factors. Exercises judgment to determine appropriate action.
• Sustaining, collecting and reporting data to Engineers on new product returns and prototypes builds,
and give possible solutions and design changes.
• Reliability testing (SLT, DVT, IRT).
• Trained repair floor technicians and Authorize Service Centers on troubleshooting new product
returns and help set up line configurations.
Qualcomm, Inc. (Manpower) Aug 99 - Feb 00
Engineering Technician
• Responsible for troubleshooting digital and RF circuits to the component level that is basic to
moderate in difficulty.
• Repairs and verifies a high volume of product defects.
• Performs equipment set-up and calibration.
• Determines and develop test specifications, methods and procedures from blueprints, drawings and
diagrams.
• Tests and troubleshoots assemblies and final systems.
• Performs root cause analysis of incoming product and provides feedback and improvements to
manufacturing supervisors, leads in the SMT and repair departments, engineers and management.
Presents detailed analysis and prepares technical reports to engineering summarizing findings related
to new software bugs, limit issues, design issues, and repair utility tools, and recommends solutions.
EDUCATION
Heald College. Associates of Applied Science Degree in Electronics’ and Computer Technology.
GPA 3.3.
ITT Technical Institute. Bachelor of Science Degree in Electronics’ and Communications Engineering.
GPA 3.4.
AWARDS RECEIVED
Awarded QualStar - Qualcomm
Awarded Three Kyocera Golden Key Awards.
Recipient of Dean’s Award at Heald College and ITT.
ADDITIONAL PROFESSIONAL ACTIVITIES
U.S. Navy – Held Secret Clearance 90-94
Attended CDMA 2000 with CDMA One Overview for Non Engineers.
Attended CDMA2000 1xRTT (IS-95 - IS-2000-A) (for Engineers).
Attended professional development courses such as; creating high performing teams, communication styles,
making your message count, reaching agreement and selecting exceptional employees.
Cadence Allegro schematic and PCB design training.
Agilent Presentations.
Signal Integrity: system, EM and Circuit Co-design using ADS.
Complete MMIC Design Flow Solution in ADS.
LTE throughput test using SystemVue.
The Value of X-parameters.
Understanding Vector Signal Analyzers and their use.
Troubleshooting Digitally Modulated RF Systems.

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DK_Eng_Resume

  • 1. 2 7 2 2 6 S A W Y E R R O A D • M E N I F E E , C A 9 2 5 8 4 P H O N E 3 3 6 - 4 0 4 - 5 2 9 8 • E - M A I L D _ K R A U S E _ 1 @ Y A H O O . C O M P R O F I L E : H T T P : / / W W W . L I N K E D I N . C O M / I N / D A N K R A U S E D A N I E L K R A U S E OBJECTIVE To further enhance a career goal in the industry as an Engineer. SUMMARY OF QUALIFICATIONS Working as an RF Applications Engineer with Qualcomm, Inc., has been a great learning experience. I am Responsible for supporting Qualcomm's growing portfolio of RF products. Work closely with the Qualcomm design team and other members of the applications team to create chipset documentation, reference schematics, training material, and assist customers in feature definition, provide design assistance, and debugging. This position also requires background knowledge in RF design and cross- functional interaction that requires excellent written and oral communication skills. Other skills include schematics and PCB review design and bench testing. I contribute to the development of concepts and techniques, completing complex tasks in creative and effective ways. Work on complex assignments requiring independent action and a high degree of initiative to resolve issues. Area of expertise include: ENGINEERING SKILLS S-parameters, PA’s, FEM, PLL, Filters, Semiconductors, LNA, Transceiver’s, Front end, Soldering experience, Design review, Circuit Design, ISO Standards, Schematics and PCB Design and Layout, Network Analysis, Solid State, LTE, CDMA, GPS, GSM, EDGE, LTE, GPRS, Blue Tooth, WIFI, Handset Design TROUBLESHOOTING EQUIPMENT Network Analyzer, Spectrum analyzer, Signal Generator, Digital multi-meter, Power supplies, Frequency generator, Frequency counter, Power meter, 8960, CMU200/500, Oscilloscope, Cascade Wafer Probe, Various de-soldering units, X-ray Machine, Laser Trimming, COMPUTER SKILL'S MS Access, MS Power Point, Unix, Altium Designer, Cadence, MS Word, Visio, Linux, QXDM, QDART, Lab-View, MS Excel, QPST, C/C++ Programming, Agile, ADS PROFESSIONAL EXPERIENCE Qualcomm Technologies, Inc. Aug 11 – Present RF Application Engineer, • Responsible for supporting Qualcomm's growing portfolio of RF products. • Support Qualcomm Hardware issues for customers. • Supported in the creation of Antenna Tuner (QFE1510) evaluation board and measured performance/created data package before handing off to customers • Help/direct customer engineers to resolve the issues in using QCT solution no matter it is QCT problem or not. • Play consultant role, trouble shooting, identify problem reported by customers, analysis and report issues to developer team, help developer team to narrow down the root cause and fix problems. • Interfacing with handset developers. Training, assisting customers with Hardware design, integration, development, system debugging, handling customer Q&A, and interfacing closely with internal developers.
  • 2. • Work with the Qualcomm design team and other members of the applications team to create chipset documentation, reference schematics, training material, and assist customers in feature definition, provide design assistance, do troubleshooting, and provide training. • Understand Qualcomm's RF calibration process, tree properties, as well as interpreting calibration results. • Understanding of phone design cycle and risks associate throughout the process • Meeting with customers to assist in schematic and layout reviews and provide feedback. Kyocera Wireless Corp, Inc. Apr 08 – July 11 Hardware Engineer, • Hardware Lead for engineering development of RF, digital, and power designs on CDMA handsets. • Performs debugging, integration, schematic capture and PCB layout placement. • Develop test procedures and assists in writing designs and manufacturing documentation and present at design and product reviews. • Perform module and circuit level testing, characterization, impedance matching, receiver sensitivities, noise figure, spurious, VSWR, RF amplifier performance. • Responsible for RF development phases from system definition through manufacturing. • Perform qualification and integration testing of modules, and/or components; and evaluates performance against predicted results and documents the test results. • Leads cost reduction and alternate sourcing efforts to continually reduce BOM cost. • Specify, design, implement, test, integrate and/or maintains RF sub-systems used on mobile phones. • Provide input on component usages and selection. • Design according to industry and internal standards. • Coordinates BOM scrubs, layout and schematic reviews, build readiness, and create ECO’S, BOM’s and Deviation’s. • Coordinates with other engineering groups including CAD, CM, Manufacturing, Mechanical, Test Engineering, Software and Systems. RFMD, Inc. Mar 07 – Apr 08 Support Engineer, • Cadence CIS/ PCB design to generate schematics, PCB layouts, fabrication files, and supporting documentation for all PCB types including Evaluation, Qualification, Reference Design, Characterization, Reliability, and Production Test. • Assembly and modifications of evaluation PCB’s, components and verification of quality testing. • Interactions with development and/or manufacturing engineering personnel. • Participate in project and product teams to provide technical input on design and layout issues during all phases of product development. • Serve as technical interface with external fabrication and layout services to order bare PCBs and resolve technical issues. • Interface with Prototype Assembly and Engineering to insure designs are compliant with design guidelines and manufacturability requirements. • Perform a wide variety of RF and DC measurements, which include impedance matching, IIP3, stop band attenuation, wideband response, filter tuning measurements, Noise Figure, Laser trimming and wafer die probing in support of TX Module Design development at the MMIC and module level. Kyocera Wireless Corp, Inc. Feb 00 - Jan 07 Support Engineer • Module and circuit level testing and characterization, impedance matching, receiver sensitivities, Spurious, VSWR, RF amplifier performance. • Develops test procedures and assists in writing designs and manufacturing documentation and presents at design and product reviews.
  • 3. • Performs qualification and integration testing of recently redesigned circuit cards, modules, and components; and evaluates performance against predicted results and documents the test results. • Worked on problems of moderate scope where analysis of situations or data requires a review of a variety of factors. Exercises judgment to determine appropriate action. • Sustaining, collecting and reporting data to Engineers on new product returns and prototypes builds, and give possible solutions and design changes. • Reliability testing (SLT, DVT, IRT). • Trained repair floor technicians and Authorize Service Centers on troubleshooting new product returns and help set up line configurations. Qualcomm, Inc. (Manpower) Aug 99 - Feb 00 Engineering Technician • Responsible for troubleshooting digital and RF circuits to the component level that is basic to moderate in difficulty. • Repairs and verifies a high volume of product defects. • Performs equipment set-up and calibration. • Determines and develop test specifications, methods and procedures from blueprints, drawings and diagrams. • Tests and troubleshoots assemblies and final systems. • Performs root cause analysis of incoming product and provides feedback and improvements to manufacturing supervisors, leads in the SMT and repair departments, engineers and management. Presents detailed analysis and prepares technical reports to engineering summarizing findings related to new software bugs, limit issues, design issues, and repair utility tools, and recommends solutions. EDUCATION Heald College. Associates of Applied Science Degree in Electronics’ and Computer Technology. GPA 3.3. ITT Technical Institute. Bachelor of Science Degree in Electronics’ and Communications Engineering. GPA 3.4. AWARDS RECEIVED Awarded QualStar - Qualcomm Awarded Three Kyocera Golden Key Awards. Recipient of Dean’s Award at Heald College and ITT. ADDITIONAL PROFESSIONAL ACTIVITIES U.S. Navy – Held Secret Clearance 90-94 Attended CDMA 2000 with CDMA One Overview for Non Engineers. Attended CDMA2000 1xRTT (IS-95 - IS-2000-A) (for Engineers). Attended professional development courses such as; creating high performing teams, communication styles, making your message count, reaching agreement and selecting exceptional employees. Cadence Allegro schematic and PCB design training. Agilent Presentations. Signal Integrity: system, EM and Circuit Co-design using ADS. Complete MMIC Design Flow Solution in ADS. LTE throughput test using SystemVue. The Value of X-parameters. Understanding Vector Signal Analyzers and their use. Troubleshooting Digitally Modulated RF Systems.