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Christopher C. Greci
Email: cgreci@gmail.com
Phone: (857) 352-7282
Address: 43 Charlton St #B307
Everett, MA
LinkedIn: www.linkedin.com/in/chrisgreci
I am looking for an engineering opportunity that will advance my technical and
leadership proficiency in reliability, materials, statistics, and electrical
engineering. I’m a globally minded individual seeking a transparent, high-energy,
and ambitious environment. My top priority is finding like-minded individuals
that collaborate pro-actively and efficiently across their organization and beyond.
I don't limit myself to my current industry, but rather like to discuss reliability
engineering outside of semiconductors, as well as in related industries.
Experience Semiconductor Reliability Engineer at Analog Devices, Inc.
804 Woburn St, Wilmington, MA 01887
May 2006 to Present
Corporate Profile: ADI designs and manufactures integrated circuits that play a fundamental
role in converting, conditioning, and processing the real-world into electrical signals.
Responsibilities: Develop qualification requirements. Researching new technologies for
reliability performance (CMOS, BiPolar, MEMS, and SiGe Optical). Supporting qualifications;
capital needs, failure mechanisms, FMEA analysis, analysis of electrical, materials, and physical
data, providing conclusions in written technical reports. Interface and provide guidance to
quality, assembly, test, and external foundry groups. Schedule and manage the execution of
reliability testing.
Projects: Technical lead on corporate worldwide reliability database development and
maintenance. Worldwide manufacturing award (August 2009) for the analysis and
improvement of processes, workflow, and metrics. Copper wire qualification for package cost
reduction.
Education TUFTS Gordon Institute, Medford, Massachusetts
Masters of Science Engineering Management
August 2010 to May 2012
Profile: Tufts has re-engineered the MBA especially for engineers. Strategically designed for
ambitious pragmatists in science, technology, and engineering, the MSEM from Tufts’
renowned Gordon Institute is crafted to be deeply relevant and highly valued in the
marketplace.
University of Connecticut, Storrs, Connecticut
Bachelors of Science Electrical Engineering, Minor Mathematics
August 1999 to May 2004
Expertise &
Proficiencies
Core Competencies; technical report writing, statistical analysis, semiconductor
physics, manufacturing, materials analysis, physical analysis, FMEA analysis,
product life testing, statistical lifetime prediction, ESD, device level
characterization, wire bonding, plastic package delamination, time dependent
breakdown, and data visualization
Industry Standards and Best Practices; AEC-Q100 Qualification, JEDEC Standards,
J-STD-020, JESD22, MIL-STD-883, ESD Association, Production Part Approval
Process (PPAP), 8D Documentation, IPC
Packaging Technologies; multi die plastic, cavity (LGA), flex circuits, system on
chip, and high power chip scale (CSP) packaging.
Christopher C. Greci
Page 2 of 2 www.linkedin.com/in/chrisgreci cgreci@gmail.com
Computer Science; Microsoft Office®, Visual Basic, MS Project, MS SQL, MS
Access, ASP.NET, VB.NET, SAS JMP, QlikView®
Training Graduate Training: Microelectronics Processing, Digital Integrated Circuit Layout,
Analog Circuit Analysis, Control Systems, Probability and Random Variables
Professional Training: Quick Start™ Micro Training LLC course in Integrated
Circuit Reliability. August 2006. Analog Devices Team Members/Leaders.
August 2009.
Other Creative
Energies
Gardening, Kiteboarding , Spanish Language, Latin Dancing, Handyman

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2015-11-24 Chris Greci

  • 1. Christopher C. Greci Email: cgreci@gmail.com Phone: (857) 352-7282 Address: 43 Charlton St #B307 Everett, MA LinkedIn: www.linkedin.com/in/chrisgreci I am looking for an engineering opportunity that will advance my technical and leadership proficiency in reliability, materials, statistics, and electrical engineering. I’m a globally minded individual seeking a transparent, high-energy, and ambitious environment. My top priority is finding like-minded individuals that collaborate pro-actively and efficiently across their organization and beyond. I don't limit myself to my current industry, but rather like to discuss reliability engineering outside of semiconductors, as well as in related industries. Experience Semiconductor Reliability Engineer at Analog Devices, Inc. 804 Woburn St, Wilmington, MA 01887 May 2006 to Present Corporate Profile: ADI designs and manufactures integrated circuits that play a fundamental role in converting, conditioning, and processing the real-world into electrical signals. Responsibilities: Develop qualification requirements. Researching new technologies for reliability performance (CMOS, BiPolar, MEMS, and SiGe Optical). Supporting qualifications; capital needs, failure mechanisms, FMEA analysis, analysis of electrical, materials, and physical data, providing conclusions in written technical reports. Interface and provide guidance to quality, assembly, test, and external foundry groups. Schedule and manage the execution of reliability testing. Projects: Technical lead on corporate worldwide reliability database development and maintenance. Worldwide manufacturing award (August 2009) for the analysis and improvement of processes, workflow, and metrics. Copper wire qualification for package cost reduction. Education TUFTS Gordon Institute, Medford, Massachusetts Masters of Science Engineering Management August 2010 to May 2012 Profile: Tufts has re-engineered the MBA especially for engineers. Strategically designed for ambitious pragmatists in science, technology, and engineering, the MSEM from Tufts’ renowned Gordon Institute is crafted to be deeply relevant and highly valued in the marketplace. University of Connecticut, Storrs, Connecticut Bachelors of Science Electrical Engineering, Minor Mathematics August 1999 to May 2004 Expertise & Proficiencies Core Competencies; technical report writing, statistical analysis, semiconductor physics, manufacturing, materials analysis, physical analysis, FMEA analysis, product life testing, statistical lifetime prediction, ESD, device level characterization, wire bonding, plastic package delamination, time dependent breakdown, and data visualization Industry Standards and Best Practices; AEC-Q100 Qualification, JEDEC Standards, J-STD-020, JESD22, MIL-STD-883, ESD Association, Production Part Approval Process (PPAP), 8D Documentation, IPC Packaging Technologies; multi die plastic, cavity (LGA), flex circuits, system on chip, and high power chip scale (CSP) packaging.
  • 2. Christopher C. Greci Page 2 of 2 www.linkedin.com/in/chrisgreci cgreci@gmail.com Computer Science; Microsoft Office®, Visual Basic, MS Project, MS SQL, MS Access, ASP.NET, VB.NET, SAS JMP, QlikView® Training Graduate Training: Microelectronics Processing, Digital Integrated Circuit Layout, Analog Circuit Analysis, Control Systems, Probability and Random Variables Professional Training: Quick Start™ Micro Training LLC course in Integrated Circuit Reliability. August 2006. Analog Devices Team Members/Leaders. August 2009. Other Creative Energies Gardening, Kiteboarding , Spanish Language, Latin Dancing, Handyman