Michael V. Ascerno is a senior engineering professional with over 35 years of experience in semiconductor engineering, manufacturing, and development. He has comprehensive knowledge of all aspects of engineering including equipment maintenance, modifications, design, manufacturing, operations, and training. His experience includes positions at NXP Semiconductors, Freescale Semiconductor, Motorola, Microelectronics and Computer Technology Corporation, and the United States Air Force where he has managed projects, assembly lines, and maintenance teams.

1. Michael V. Ascerno
Austin, TX 78735  512-545-8757
SecondBase58@yahoo.com  https://www.linkedin.com/in/mike-ascerno-826b2625
Senior Engineering Professional
A Recognized Expert in Semiconducting, Experienced in All Aspects of Engineering
Comprehensive background in semiconductor engineering with 35 years of manufacturing and
development experience. Knowledgeable in all things engineering including equipment maintenance and
modifications. Capable over designing, manufacturing, operating and training company personnel on
assembly line equipment. Advanced knowledge on packaging development and reverse engineering.
Practical experience in testing equipment and failure analysis.
CORE COMPETENCIES
Semiconductor Packaging Analysis  Electronic Testing  Oscilloscopes  Spectrum Analyzers 
RF Generators MS Office  Mechanical Assembly  Fabrication  Leadership 
Bonding & Soldering  Process Development  Characterization
EXPERIENCES AND ACHIEVEMENTS
NXP SEMICONDUCTORS/ FREESCALE SEMICONDUCTOR, Austin, TX January 2010 – July 2016
A semiconductor research, design and development company.
Sr. Advanced Semiconductor Packaging Development Technician
Managed the design of experiment (DOE) stress tests, in order to qualify automotive under hood
qualifications of new packaging technologies and materials. Reverse engineered competitor
Microelectromechanical systems (MEMs) sensors, observing pressure, humidity and accelerometers.
Performed semiconductor research and development Used Failure Analysis (FA) technique to qualify
new technology and product introductions, supported by Computer Science and Applied Mathematics
(CSAM), X- Ray, X-sectioning, wire pull and shear variations. Observed Joint Electron Device
Engineering Council (JEDEC) standards. Mentored and trained engineers within the department.
Responsible professional capable of managing multiple projects and meeting deadlines in a timely
fashion.
 Successfully analyzed intermetallic growth and failure analysis for copper (Cu) wire bonds,
testing advanced high temperature automotive reliability.
MOTOROLA/ FREESCALE SEMICONDUCTOR, Austin, TX January 1994 – January 2010
A semiconductor research, design and development company.
Sr. Equipment & Process Technician  January 2003 – January 2010
Performed electrical test and failure analysis for new product packaging introduction. Worked on more
than 10 new product introductions. Worked on the technical process development for 0306 Surface
Mount Capacitor attach and developed and implemented a Laser Marking Process. Also, development
and characterization expert on the Motorola BAT-1.
 Started and managed $2 million assembly line.
 Oversaw transfer of $10 million assembly line to KLM.
Sr. Equipment & Process Technician  January 1998 – January 2003
Responsible for 5 full flip chip BGA integrated assembly lines, wire bond assembly, advanced packaging
technology and MV Electronics. Also, set up tooling, characterized, and qualified new products into the BAT-1
Assembly Line. Aided development of a new bare die Known Good Die Process.
 Characterized and qualified the Die Level KGD process. Trained maintenance and manufacturing personnel.

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Maintenance Lead  January 1994 – January 1998
Performed assembly line equipment maintenance. Modified assembly line electronics to meet required
specifications. Supervised a team of 5 maintenance technicians. Oversaw repairs for assembly line
equipment to minimize down time. Maintained and calibrated all assembly line and lab equipment.
Knowledgeable of the following equipment: WireBonder, DicingSaw, DieBonder, Lasers, TAB Bonders
and analysis equipment. Documented all engineering data.
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Microelectronics and Computer Technology Corporation (MCC), Austin, TX, January 1988 – January
2010, Sr. Development Technician
Sound Communication Systems, Austin, TX, January 1983- January 1988, Service Manager
United States Air Force, Goldsboro, NC, November 1976- November 1980, Staff Sergeant
EDUCATION
Coursework toward Associates in Pre-Engineering,
Austin Community College, Austin, TX
Certificate in Applied Electronics Technology, Analog & Digital,
Southwest School of Electronics, Austin, TX