In the field of Internet of Things, the power consumption and size of products have always been the focus of the industry. With the emergence and development of various emerging applications, Flash Memory has been put forward very clearly: low power consumption, small size, and rapid response. Zhaoyi has accumulated more than 10 billion Flash Memory in 10 years. Mr. Chen Hui, senior product marketing director of the company, believes that product planning in different application areas should be targeted, and different product definitions are needed to meet the needs of the terminal. He shared with engineers. Flash's six demand directions for the Internet of Things.
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How flash responds to different AIoT needs -- C&T RF Antennas Inc
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How Flash responds to different AIOT needs
Written By Calio Huang
In the field of Internet of Things, the power consumption and size of products have always been
the focus of the industry. With the emergence and development of various emerging applications,
Flash Memory has been put forward very clearly: low power consumption, small size, and rapid
response. Zhaoyi has accumulated more than 10 billion Flash Memory in 10 years. Mr. Chen Hui,
senior product marketing director of the company, believes that product planning in different
application areas should be targeted, and different product definitions are needed to meet the
needs of the terminal. He shared with engineers. Flash's six demand directions for the Internet of
Things:
1. Capacity
For different applications and system complexity, the capacity of Flash required for different
embedded operating systems varies greatly.
Flash storage content includes Boot Code, Kernel, Middleware, Device Driver, UI Data, Application
Data, User Data.
2. High speed
XiP is a common way to use Flash in IoT systems. Increasing Flash data throughput can greatly
shorten the read time of fixed bytes, reduce the waiting time of the main chip, and improve the
operating efficiency of the main chip.
3. Reliable
Reliability is an old topic. Flash's process is from a few hundred microns, and later to 130, 60,
45nm, etc., the product reliability requirements have not changed, no matter what products
must be guaranteed 20 years, 100,000 times.
In order to maintain the same alignment, the concept of ECC is added. This concept is applied
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Jasmine Lu (86)17322110281
with high reliability, such as on-board, which can greatly reduce the error rate of products and
prolong the service life, and define products for high-end applications.
4. Security
With the popularization of IoT devices and the layout of some key application scenarios, the
security requirements are becoming more stringent. Flash is more likely to be used as an attack
object than SoC. It is especially important to improve the security of Flash.
Common Flash security features include: Write Protect, OTP Security Register, OTP Array Protect,
Unique ID, RPMC, RPMC+MAC.
5. Power consumption
Many IoT nodes are distributed in very remote places. In a wide area, it is difficult to replace the
battery. Therefore, IoT requires high power consumption, so that the power consumption of each
device in the whole system is lower than before. The better. Therefore, the system power
consumption should be reduced as much as possible to extend battery life.
Common flash voltage range:
• 2.7V ~ 3.6V (3.3V)
• 2.1V ~ 3.6V (2.5V)
•1.65V ~ 2.1V (1.8V)
• 1.65V ~ 3.6V (wide voltage)
•1.1V ~ 1.3V (1.2V)
A small trick: After each power-on, after reading the Flash data, turn off the Flash power, so Flash
is 0 power consumption, you do not need to consider these power parameters. Of course, not all
applications can do this, and some data is read every time a new command comes in.
6. Small
The small package size and low signal leads are one of the main advantages of SPI Flash. However,
under the increasing miniaturization of IoT applications, it is imperative to further reduce the
product packaging volume.
“We have done a lot of articles on the package, and many customers have recently made more
and more packaging requirements.”
Zhaoyi introduced the industry's first 1.5x1.5mm package. The smallest in the industry was
3x2mm. Now, 1.5x1.5mm is not much larger than the nib. It is plastic-sealed and durable, which
is very suitable for soldering and installation.
WlCSP demand is very large, all kinds of new applications should be the ultimate product to the
extreme, bare die, no plastic protection, the disadvantage is that it is vulnerable to damage, the
production process has a threshold, to find manufacturers have very experienced WLCSP, in order
to better Handle this new packaged product.
Finally, for various application scenarios, Zhaoyi has planned different product series in the SPI
NOR product line, actively adapting and meeting the ever-changing needs, so that Flash Memory
can better cooperate with the IoT main chip and system application, and promote the object
together. The rapid development of the networking industry.