1. Voice of the
Customer
Presentation of
Design Ideas
Engineering
Analysis
Rapid
Prototyping
Validation
Testing
Quality
Inspection
Procedures
INTERNSHIP EXPERIENCE
PRODUCT DEVELOPMENT ENGINEERING
RETENTION MECHANISM DESIGN
A spring retention issue was observed in
customer’s designed LEC connector and
demonstrated in the 3D printed prototype.
The design was modified by TE to improve its
robustness and manufacturability.
Presented by: Anjali Dhobale, M.S in Mechanical Engineering (2017), The Pennsylvania State University
FEA ANSYS MODELLING
TOLERANCE ANALYSIS OF EMI GASKET COMPRESSION
CLAMPING FORCE ANALYSIS
TE Manufacturing Engineer proposed a
design change request (DFM) to modify the
latch width dimension from 2.75mm to
1.45mm.
Using FEA Analysis and cantilever beam
approximation, the clamping force was
estimated to reduce by drastic 47%.
This proposal was not adopted and an
alternate solution was proposed.
FAILURE ANALYSIS LEC HOUSING CRACKING
DURABILITY TESTING OF PULL TAB TAPE CONCEPT PART TOOLING REVIEW
LESSONS LEARNED
• Deliver value to the internal/external customer using the best technical knowledge and engineering tools
• Possess a mindset to evaluate design ideas for potential issues that may limit success
• Communicate as clearly & concisely as possible to gain the customer’s confidence
• Create a simple, profitable and reliable product
Special Thanks to Mr. Randall Henry, Mr. Kevin Weidner and the I/O Data and Devices BU
In this test, the connector was cycled up to
100 operation cycles to test the reliability of
tape pull tab concept.
The nominal compression on the EMI
gasket was estimated using a 3 sigma level
tolerance equation and Crystal Ball
statistical tool software.
Fig. 1: Spring Deflection in the housing Fig.2 : Designed Ribs & Grooves
Fig.3: Modified 3D Model & Prototype of LEC Connector
Fig.4: Stress Result under external displacement using ANSYS
Developed FEA model to simulate
experimental test setup conditions to predict
design changes outcome.
The contact design model was modified to
eliminate preload condition. The force
deflection curve and stress analysis data was
used to make design change strategies.
Fig.5: Force Deflection curve of the modified design
Fig.6: Clamp Feature & Dimensions of the MicroQSFP Connector
Fig.7: Excel Spreadsheet Load Analysis of Design Modification
Fig.8: 3 Sigma Level Crystal Ball Analysis Fig.9: Stacked MicroQSFP EMI Gasket
Fig.10: Probability Distribution of 10,000 parts
To determine the root cause of LEC
housing cracking, we conducted
experiments to troubleshoot:
• Critical Design Features
• Production Process
• Mold Flow Analysis
Resolved by changing gate locations
of the plastic overmold housing.
The first parts produced out of the new tooling were evaluated for
drawing compliance. The inspection data and BKM was reviewed
with the supplier and corrective actions were implemented to
ensure the part is within specifications.
Fig.11: Housing Cracking in LEC Connector
Fig.11: Deflection of the contacts causing
housing to crack
Fig.12: Tensile Test conducted on the tape & its load deflection curve. Fig.13: Connector with Fixture Fig.15: Resolved Actions of Inspection Data
Fig.14: Part #2293155 Tooling Inspection