1. Prepared Checked Approved
12 June 2017
Contents :
AGENDA
1 IQC lot ratio
2 IQC objective and throughout process
3 History problem and CPAR (main issue)
4 Improvement Activity
5 Management Set Up Plan
6 Performance Conclusion
Annual Report
Agung Yoke B
Juni 2017
Periode : July 2016 – June 2017
2. 2.IQC LOT ACCEPTANCE RATIO
Month
2016 2017
Q1 Q2 Q3 Q4 Q1 Apr May
LOT Accept 100.00% 99.97% 100.00% 99.87% 99.74% 99.81% 100.00%
Target 100.00% 100.00% 100.00% 100.00% 100.00% 100.00% 100.00% 100.00% 100.00% 100.00% 100.00% 100.00%
99.00%
99.20%
99.40%
99.60%
99.80%
100.00%
Q1 Q2 Q3 Q4 Q1 Apr May Jun Jul Aug Sept Oct
2016 2017
LOT Accept
Target
IQC LOT Acceptance Trend Chart
2017
3. 2. Objects of Incoming Quality Control
Establishing Quality
Standard
Smooth Production
Processs
Detecting Deviation
in production process
• Raw Material
• Function Part
• Model change
• Shorted
• In line Reject
• Material Rejected
• Measurement part
Responsibility for Quality Control
- The standard(s) to which the construction or assembly of a
building component has been incorporated into the project’s
design. (QC)
- Is all those planned and systematic actions necessary to provide
adequate confidence that an entity will fulfill requirements for
quality. (QA)
5. RAW
MATERIAL,PARTS
AND SUPPLIES
PROCUCTION
PROCESSESS
PRODUCT AND
SERVICES
CONTROL CHARTS
AND ACCEPTANCE
PLANS
CONTROL CHARTS
CONTROL CHARTS
AND ACCEPTANCE
PLANS
INPUTS CONVERSION OUTPUTS
QUALITY OF
INPUTS
QUALITY OF
PARTIALLY
PROCESSED
PRODUCTS
QUALITY OF
OUTPUTS
IQC THROUGHOUT PRODUCTION SYSTEM
2. Objects of Incoming Quality Control
9. Mar-16 Apr-16 May-16 Aug-16 Sep-16 Oct-16 Nov-16 Dec-16 Jan-17 Feb-17
Braket(1004
5-18751)
Holder Lead
Wire
Holder Lead
Wire
Holder Lead
Wire
Braket
(10045-
18751)
Braket A
(K15)
Braket A
(K15)
Case
sensor 1
Case
Sensor 1
Holder lead
wire
Koito Mitsuba Mistuba Mistuba Koito Koito Koito Mitsuba Mitsuba Mitsuba
Short Mold
NG 5 / 1000
(1%)
Burry
NG 5/1000
(0,5%)
Broken
NG 2/1000
(0,2%)
Broken
NG 12/1750
(0,69)
Broken
NG 3/2217
(0,14%)
Dimension
NG 9/250
(3,6%)
Short Mold
NG 4/250
(1,6%)
Short Mold
NG 4/100
(4%)
Burry
NG 9/100
(9%)
Deformation
NG 7/40 (17,5
%)
Holder Lead
Wire
Holder lead
wire
Case sensor
Holder
Lead Wire
Braket B Holder Lead
wire
Holder lead
wire
Mitsuba Mitsuba Mistuba Mitsuba Koito Mitsuba Mitsuba
Crack
NG 3/2217
(0,14%)
Burry
NG 5/1000
(1%)
Broken
NG 5/8000
(0.06%)
Broken
NG 1/4000
(0,03%)
Melting
NG 3/200
(1.5%)
Short Mold
NG 14/100
(14%)
Broken
NG 2/40
(5%)
Bracket
(10057-
18690)
Holder Lead
Wire
Case
sensor
Bracket X-43
Koito
Model : X43
Mitsuba Mitsuba Koito
Short mold
NG 2/250
(0,8%)
Melting
NG 3/100
(3%)
PCB cannot
Insert
Diameter hole
over
NG 262/433
(60,5%)
Holder Lead
Wire
Mitsuba
Burry
NG 35/100
(35%)
CPAR : IMC
3. History Problem and CPAR (main issue)
10. Aug-16 Sep-16 Oct-16 Nov-16 Jan-17 Feb-17 Mar-17 Apr-17 May-17 Jun-17
Lens
Bending
NG Step 40
(Knop
lighting)
> 2300
NG Step
39
(NG >
22300)
NG Step 15 Foreign
Material
NG Step 36
Spec : 1200
Act : - 1180
- 960
NG Dented
Switch Assy
Spec : 1200
Act : 1180
IQC
On prod.
Process
On Prod
process
On Prod
process
On prod.
Process
On process
IQC
On prod.
process
Qty NG :
1/208
Qty NG:
2 /128
Qty NG :
4/128
Qty NG :
2/128
Qty NG :
2/128
Qty NG :
2/128
Qty NG :
3/144
Qty NG :
1 / 128
Knob no
white line
NG Scratch
/
Dented
NG Dented Peel Off NG Crack
IQC IQC On IQC IQC ON Proses
NG : 1/208 Qty NG :
3/544
Qty NG :
1/128
Qty NG 1/
144
Qty NG :
1/28
Lens Broken NG Peel Off
IQC IQC
NG : 1/120 Qty NG :
23/936
Lens NG
IQC
NG : 6/224
CPAR : SSI
3. History Problem and CPAR (main issue)
11. Aug’16 Sep’16 Okt’16 Nov’16 Dec’16 Jan’17 Feb’17 Mar’17 Apr’17 May’17
Panel Assy Panel assy
Panel
Instrument
Panel Assy Panel Assy Panel assy
Panel
Instrument
IQC In process IQC On prod.
Proses
IQC IQC IQC
Scrath :
5/160
Scratch
1 / 176
Dented
1 / 128
Scrath :
1/128
No Printing :
6 /128
Scratch :
1/256
Short mold ;
1/128
Panel Assy
IQC
Scrath :
10 / 144
CPAR : EATI
3. History Problem and CPAR (main issue)
13. Okt’16 Nov’16 Dec’16 Jan’17 Feb’17 Mar’17 Apr’17 May’17 Jun’17
PCB K15G PCB D22D PCB D22D PCB Sharp PCB D22D
PCB
JACKAMP
PCB : HT502,
HT507
Koito Cust : AJI Cust : AJI Cust: Sharp Cust : AJI Cust : RolandSankyo
No Printing :
32/ 1500
No Hole :
2/200
NG Pad :
5/200
NG Dirty :
4/1500
NG
Dimension :
23
Scratch :
96 / 300
Abormal
PCB D22D PCB K15G
Cust : AJI Koito
Cutting NG :
8/200
No Printing :
4/ 500
CPAR : Kyosha
3. History Problem and CPAR (main issue)
14. Okt’16 Nov’16 Dec’16 Jan’17 Feb’17 Mar’17 Apr’17 May’17 Jun’17
PCB Bare
X53
PCB A9839 PCB 03F
Koito Mitsuba Koito
NG : 150/150 Broken : 5 / 25
sheet
Differernt color
: 270
Scrath : 22
Dirty : 6
Smlal Crack :
18
CPAR : CMK
3. History Problem and CPAR (main issue)
15. 4. Improvement Activity
Define problem Control and result
Measurement and Improvement Activity
Analysis
Case sensor ( IMC )
Short Mold On Case Sensor 1 (28-Des-2016) Happen in Production Line Mitsuba
16. 4. Improvement Activity
Define problem Control and result
Measurement and Improvement Activity
Analysis
Customer Claim ( Koito )
Base on Information from Koito Indonesia 20 December 2017, has problem with glue not full
From wire harness with supplier Onamba (Cord Assy C – K53)
1. Revision Working Instruction
Additional Glue MUST cover all the
hole bushing
2. Improvement methode Change
Direction after add glue at process
drying
3. Revision Standar Visual
Checking Additional
glue on gromet hole MUST
full
4. Make Sample part &
Limit Sample Of
Additiional Glue
17. 4. Improvement Activity
Define problem Control and result
Measurement and Improvement Activity
Analysis
10/6 during trial, the wire harness assembly process (hand soldering) any problem on pcb hole.
The harness assembly
(terminals) do not fit tightly
against the holes but easily
fall off.
NG
Can not effectively control
lead protrusion after solder
Max 2 +0 / -0.5。
Compare with sample original
Change spesification hole pcb
D22D Cord Assy Holes -- 3 holes diameter
18. 4. Improvement Activity
Define problem Control and result
Measurement and Improvement Activity
Analysis
Missing Printing – Kyosha K15G
Based on pdrf from production, IQC check raw material and finding problem
Missing printing on PCB, this is problem original from supplier.
Pne Panel has 16pcs, defect board has 32pcs, equal to 2 Panels.
One board side has no silk component mark, defect happened at
silk screen workshop.
After investigation, we found operators need use left hand to take
out board printed and use right hand to
deliver the boards before silk printing to print at the same time.
When we print the 10th board, we need to full inspect the board to
avoid misregistration. The printing table has
one pending printing board, operators take out this board to rack
by mistake when visual inspection.
and then lead to the defect that no-silk print board.
Problem : process methode
Missing silk screen printing can be
found by AVI, escaping reason is no
separating it after inspected.
During printing, it is requested that there is no need for
operators to put next pending board in machine before
10th self-inspection board. It is to avoid missing
printing for 2 different status board on hand at the
same time
During printing, it is requested
that there is no need for
operators to put next pending
board in machine before
10th self-inspection board. It is to
avoid missing printing for 2
different status board on hand at
the same time.
Permanent Corrective Action :
1、We send the defect picture to
operators, re-inspect the 275pcs
storage, but don't find the same
defect.
2、We add special defect board
location at AVI table to identify
different status.
Poor silk
screen board
buffering area
2016/10/19
19. 4. Improvement Activity
Define problem Control and result
Measurement and Improvement Activity
Analysis
Harness Problem ( 6D1 HL HARNESS ASSY )
SEK line finding abnormal terminal pin cable, condition terminal pin has done soldered
Qty : 1pcs./250pcs.
Date : 17 November
2016
Supplier : Onamba
Problem : harness can’t
insert
Problem cause any part
abnormal
Flow out to SEK.
The pin can’t detected
by operator. 1. Add quality reminder
2. Reeducation
3. Blind test to find skill performance
inspector.
1. Sortir stock in SEK
result : 0/400pcs.
2. Sortir all stock
in onamba.
result : 0/ 2000pcs
Corrective action :
1. Make new point check.
2. Monitoring 1 month
to know effect from action
20. 4. Improvement Activity
Define problem Control and result
Measurement and Improvement Activity
Analysis
Harness D22D
When 1st M/P we found problem on harness D22d cause problem 1. Pcb hole and 2. harness
pin terminal....(oktober 2016)
10% problem cause
The harness can’t insert
( difficult to insert pcb)
Date : 28 oktober 2016
Model : D22D
Supplier : Banshu
Problem
wing of
terminal too
open
So make
problem on
pcb hole
As for Permanent Improvement:
• Banshu will modify Crimping Mold (Awaiting
proposal from supplier – Req. < 1.65mm for
E2 distance)
• Drawing part E2 distance 1.75 +/-0.15mm,
actual raw material measure around
1.88~1.89mm.
even its under spec but we need <
1.65~1.60 for easy insert to holes.
After improvement
from supplier to :
1. Control length
wings
2. IQC make new
inspection for this
part.
The problem can
reduce until 0 ppm.
21. 4. Improvement Activity
Define problem Control and result
Measurement and Improvement Activity
Analysis
Kojima LCD Holder
On september 16, has found NG LCD pin broken original in line Kojima.
Problem suspected :
1. Handling delivery
2. Packing Methode
Supplier Polymatech
Trend NG ( LCD Holder )
1. 8 Sept = 5681ppm
2. 27 sept = 2000ppm
3. 5 oktober = 1500ppm
Main improvment :
1. Supplier change qty / box
before : 200pcs 180 pcs
2. SEK request change packing
before : Up – Down (vertical)
after : Side by side
After action we don’t find NG
again In IQC or Kojima Line
Decesion :
Improvment has been
Good effect.
Close
Saving Cost :
Benefit / Month :
246,240.00
Rp
Benefit / Year :
2,954,880.00
Rp
22. 4. Improvement Activity
Define problem Control and result
Measurement and Improvement Activity
Analysis
B/E Defect Trend BY PPM Base on
Customer
Have any problem on line cause sound abnormal for dec W1. 2016, customer Kawai and
rejected 7239 ppm
Kawai KKB - 40
Cause of Occurrence:
Sound abnormal Caused by
original material.
Because :
1. After analyze there are did
not found solderability
abnormal.
2. There are did not found
component
damage/broken
Picture of problem rubber dirty from polymatech
C/A of Flow Out:
1.IQC check rubber using microscope with
AQL level 0.65
2.Check using jig kaci-kaci to reduce NG
slow return
Polymatech :
1. Sortir all stock related last production
2. Add vacum to reduce foreign particle.
Result :
1. For 1st lot : 100% ok
iqc check : 0/ 2000pcs
2. IQC will monitoring until
1 month production
Action plan :
1. Make audit vendor to
monitoring actual
problem.
2. Conduct vendor
meeting for know detail
action.
Control
23. 4. Improvement Activity
Define problem
Saving
Control and result
Measurement and Improvement Activity
Analysis
Methode Inspection Up
Any problem in line defect cause pcb cannot insert cause hole case sensor problem in dimention
Some cavity in case sensor
Have problem with
Spesification.
Problem cavity can’t
control in IMC
Qty : 275pcs/3500
To reduce problem in line
IQC must check before
Used process.
Current check only visual
PROBLEM
Jan 20 '2017 have problem at Mitsuba line casue PCB can't insert .
Defect : 150.000ppm.
Control Case sensor
Change Inspection methode supplier sortir and IQC sampling Jan 2017
Result:0 PPM
Benefit / Month :
2,332,800.00
Rp
Benefit / Year :
27,993,600.00
Rp
Saving cost :
Jan ‘17
Close
24. 4. Improvement Activity
Define problem Control and result
Measurement and Improvement Activity
Analysis
There any suspected problem pcb warpage cause process ( smt process ).
Customer : Tokai Rika
75H228 – 7011C
To know the related SMT process
with PCB warpage we make
Some analysis.
Date : 8 Dec 2016.
Pic : Agung (IQC)
Model : 75H228
Qty : 30pcs
METODE PENGUKURAN
SIDE A, POSISI ATAS (HURUF T)
DI UKUR DARI A KE B
A
B
Before SMT : Check
SMT 1 Check
SMT 2 Check
SMT process has
effect with warpage
No pallet
With pallet
Decesion :
To reduce warpage pcb
Cause process, the process
Will using pallet when production
Pic : Ms. Dian
Mr. Boni
Pallet.
25. 4. Improvement Activity
Define problem Control and result
Measurement and Improvement Activity
Analysis
PANEL ASSY, INSTR CLUSTER FINISH happened on IQC lot inspection (dec 16)
Kojima : EATI
Appereance problem
cause scratch handling.
IQC lot incoming = NG
Qty : 6pcs
Supplier : EATI
Problem : scratch on cover
Why Defect Occured
Why 1. Scratch
Why 2. Occurs when
the process of painting,
process using a jig
Why 3. Operators do
not clean
the jig before painting
Why 4. Operator simply
focus on the process of
painting and just check
the part surface area
Why 1. The Inspector was not able to detect the
defect no knob assy
Why 2. Inspector missed a check point appeareance
and function part
Why 3. Inspector only glimpsed part & conditions
give no warranty marking process according
to the standard checks
Why 4. Inspector always hurry hurry when the check
ahead of time to rest and time to go home so
the process does not check up
Conclusion Why Send
1.Sorting all stock in
PT.EATI Qty = 128 pcs,
OK = 128 Pcs, NG = 0
Improvement Activity
1.Make a schedule and
maintenance rules cleaning
jig
2.Retraining operator
related cleaning jig before
use for painting
3.Retraining inspector
associated standardization
work according to SOP
IQC change AQL
Before : 100%
To AQL
28. 4. Debit Note and replcement 2016-2017
Based on history problem we make debit note and replcement to supplier.
No Company Price (usd ) Date
1 Kyoei NBC Electric (thai) 127.33 09/16
Kyoei NBC Electric 4257.00 12/16
2 Siix Nagoya (japan) 59.62 02/17
3 IMC Tekno (lokal) 260 02/17
4 Nichia Corporation 1248.00 05/17
5 CMKS 1440.00 05/17
6 Banshu 1241.00 06/17
7 Leos Circuit 190.45 06/17
8 Nichia kagaku 2386.20 06/17
9 EIKEI 5944.92 06/17
T O T A L 16154.52
Rp. 216,470,568.00
29. 5.IQC Management Set UP 2017 Plan
To optimaze man power skill and related main issue in line, IQC structure and rule
Must take action for solved the problem
Before
Additional focus :
1. Material PDRF
2. Supplier Performance
3. Inventory (RTV-Claim)
Reguler Inspection
IQC lot Incoming
NCP
After
30. 5.IQC Management Set UP 2017 Plan
Visual Management Board
Bertugas Hari ini
Sr.SPV and SPV
Bertugas Hari ini
Inspector
And Location table
Emergency and
Stop call wait.
Off team / other shift
Focus : Disipline
and responsibility
31. 2.IQC Management Set UP 2017 Plan
Supplier Performance Board
QUALITY AUDIT AND FOLLOW UP
Prior to writing auditing report,
auditor explains the observations to
auditee
Corrective actions to be taken are
proposed
Audit report are written in standard
format which contain area audited,
dates of audit, persons contacted,
commendable features and
recommendations.
The report must contain status of
implementation of pending corrective
measures as per previous audit.
1. Daily Performance Monitoring.
2. Montly Performance.
3. Issue / Action.
4. Remarks
Main part Bare PCB, Molding /plastic, Wire
32. Incoming will change the methode of sampling, we will study and application to some part
This is extension of double sampling plan
At each stage of sampling the cumulated results are analysed to take decision of
accepting/rejecting the lot
If no final decision can be taken at anyy stage, then another sample is drawn to take further
decision.
5.IQC Management Set UP
33. 5.IQC Management Set UP
RTV-S Monitoring Board
Issue : when IQC has done final judment material NG and must return the part. We need regulation and
standard must be follow like exim standard and custom.
Focus : Make sure in – out material is 100%
correct and related document and
payment ( purchasing – accounting )
34. 5.IQC Management Set UP
Material deffective management controlled, to make sure the problem must be inform
To supplier. Decesion for material problem scrap, debit note or RTV-s.
Before After
Saving Cost :
USD 21,212.31
Rp. 284,244,917.82
24 930
3717
usd
35. IQC management skill up with Supplier Control Audit System (SCA)
The Principle Inspector IQC (PI) will determine that the supplier complies with purchase
order and/or quality requirements.
5.IQC Management Set UP
Evaluates the outside sources’ (e.g.
supplier) system to control parts,
materials, supplies, and services.
The SCA determines that the supplier
complies with purchase order and/or
quality requirements, including any
statistical sampling that may be
utilized.
IQC with SCA will have regulation to
Audit supplier with audit schedule or
Accident problem.
How are the process of an SCA 2017. What are the results of an SCA
1. SCA will describes each of the
identified nonconformances.
2. SCA will make clear about debit
note/replcement from SEK to Vendor.
3. SCA need supplier quality agrement
(SQA) to make sure solve the
problem.
4. Reducing risk management with
preventive action in supplier.
36. Incoming Quality will using some steps of data assessment
Preventive
Define
• Review the objectives and sampling design
• Supplier performance monitoring
Analysis
Measurement
• Select the statistical method
• Verify the assumptions of the statistical method
Improvement
Solution
• Draw conclusions from the data
• DOE analysis report
• Six Sigma Projects
5.IQC METHODE PROCESS
37. 6. Performance Conclusion 2017 Plan
CONCLUSION
Quality is a never ending prospect.....
Increase in quality, increases production, decreases
cost and increases profits
Thus quality control and inspection form an integral
part of a company’s management.
