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Growth and Characterization of
                Ln-doped Bismuth Titanate Thin Films.


                                  B.Tech Project Report




Submitted by: Sumeet Kumar                                 Project Guide: Dr.Ashish Garg
B. Tech                                                    Assistant Professor
Department of Materia and Metal
                        ls         lurgical Engineering.   Department of Mater als and Metal
                                                                                 i           lurgical Engineering
Indian Inst tute of Technology Kanpur (I K )
           i                             IT .              Indian Institute of Technology Kanpur (I K).
                                                                                                   IT
Kanpur-208016.                                             Kanpur-208016
India.                                                     India.
E mail sum eetkv @ g m ail m,
      :                   .co                              E mail ashishg @ii
                                                                 :            tk.ac.in
        s meet
         u     .ku mar @rediffmail m
                                  .co                      Tel : +91-512-2597904 (Office) 2598372 (Residence)
                                                                                          ,
Tel +91-9415540761(Mob.),
   :                                                       Fax : +91-512-2597505
     +91-512-2561650(Residence).



Signature:                                                 Signature:




                                                                                                                1
Acknowledgement
Firs ly I would l
    t            ike to thank Dr. Ashish Garg for being my guide in this course and bel eving in m e.
                                                                                              i
Although Electronics was my dee med field of study but r       ight fro m the t ime I took the course on
Electronic Materials under the guidance of Dr. Ashish Garg I developed a liking towards it so m uch so that I
                                                                                          ,
a m looking forward to do my research in this area.

I would also like to na m e a few persons without w ho m this project would never have reached a stage i has
                                                                                                        t
reached now. These include: Kart kyen (SE M Lab incharge) for helping me to take SE M i mages out of turn,
                                  i                          ,
Nitin, Gaurav, Abhinav, Abhishek, Dipthi Mr. A m ol, Mr. Tripathi (He made sure that al the Laboratory
                                           ,                                                l
equip ments were working).

I think that these people are the reason for whatever I a m able to do today and I suppose that they wil keep
                                                                                                        l
m otivating m e to do such great things in future.




                                                                                                                2
Chapters

•   A bstract                                         Page – 4.
•   Introduct ion                                     Page – 5 to 6.
•   O bjectives and Results                           Page – 7 to 9.
•   O ptical Images                                  Page – 10.
•   H ypothesis of Thin Films                        Page – 11 to 12.
•   SE M I mages                                     Page – 13 to 17.
•   C- V Characteris ics
                    t                                Page – 18.
•   C- V Curves                                      Page – 19 to 23.
•   Film thickness measurem ents                     Page – 24.
•   X R D Pat terns                                  Page – 25.
•   Intensi rat o Vs Annealing Time, Te mperature
           ty i                                  .   Page – 26.
•   Conclusion and Future w ork                       Page – 27 to 28.
•   References                                        Page – 29.




                                                                         3
Abstract
In recent years the fa m i of bismuth layer str
                ,         ly                       uctured ferroelectrics has received m uch at tention as the
candidate for ferroelectric rando m access me mor . Bi4Ti3O12 (BiT) or bismuth oxides are extensively
                                                     ies
studied mem bers of the Aurivi ll ius fa mily for their large spontaneous polar ization along the a- axis (~50
       2
µ C/c m ), low processing te mperature high Curie temperature and Pb-free mater l . Ho wever, i suffered
                                       ,                        ,                    ia s            t
                                         6
severe polarization suppression af ter 10 switchi cycles when deposi ed on Pt/Si substrates It has been
                                                   ng                     t                      .
                                       i ion of Bi in the perovski unit cel of Bi4Ti3 O12 by a lanthanide
sho wn by previous studies that subst tut                            te       l
ele ment such as La leads to re markable improvem ent in the fatigue behavior of i f l on Pt/Si substrates
                                                                                  ts i ms                    .
H o wever t research in this area is far from co mplete. Our at
         , he                                                         tempt is to dope Bi4 Ti3 O1 2 with other
lanthanides such as La, N d, S m either separately or together to understand the effect of size of dopants on
the structure and ferroelectr proper ies of the f lms as size difference is a key elem ent to the creat
                             ic       t            i                                                    ion of
remanent polar ization in the ferroelectr Bi4Ti3O12 f lms. W e wil use spin coat
                                         ic             i            l             ing technique to fabricate
the f lms and study the structure of the f lms using X-ray diffract
     i                                    i                        ion, Scanning electron microscopy, ato mic
force microscopy and ferroelectr measure ments wi l made t understand the electr cal behavior.
                                 ic                   l       o                      i




                                                                                                                 4
Introduction
There have been extensive effor to enhance the rel
                                   ts                      iabi i of perovski es based ferroelectr thin f lms for
                                                               l ty            t                     ic        i
use in non-volat le ferroelectr rando m access m e m ory devices FRAM’s are non-volat le mem ory devices;
                 i              ic                                    .                         i
i . data stored is not lost once the po wer is switched off In F R A M inform ation is st
 .e                                                            .                             ored in the polar   ization
state of the ferroelectr c mater l Structure of FR A M is similar to D R A M, in w hich me m ory cel are
                         i        ia .                                                                            ls
arranged in a square mat ix and infor mation is stored in terms of sign of charge. Earl , Lead Zirconate
                            r                                                                    ier
Titanate (PZ T) e merged as an important candidate for F R A M s. Ho wever i f lms show ed a serious
                                                                                     , ts i
                                                                       7
degradat ion of ferroelectr propert af
                           ic         ies ter being subjected to 10 read/wri switching cycles when deposi
                                                                                 te                                  ted
on Pt electrodes. Later i was sho w n that layered ferroelect ics such as Stront m Bis muth Titanate (SB T )
                           t                                        r                  iu
sho wed superior fat igue resistances, sho wn in Fig. 1, as co m pared to Pt PZ T/Pt capaci
                                                                             /               tors as show n in Fig. 2.
                                              [1]
H o wever the high processing te mperature
         ,                                         of S B T above 750 °C is an obstacle in integrat   ion with si icon
                                                                                                                   l
devices Bism uth t tanate (BT O) e m erged as a later candidate for these appl
       .            i                                                              ications due to i high re manent
                                                                                                    ts
polarization in bulk state but undoped BT O sho wed high fat          igue fai ures but with an advantage of low
                                                                              l
processing te mperature This is expla
                        .                ined in terms of the volat le nature of Bis muth ato m, and as Bi was
                                                                       i
supposed to bind the Oxygen ato m s together w hen i is gone the oxygen ato ms also beco me free to move,
                                                  ,         t
                                                                                                            [2]
thus creating vacancies and i is this vacancy that has been postulated as a reason for f igue fai
                              t                                                             at         lures .

Also, people have exper  imental proved this fact by replacing al the stront m ato ms by bism uth ions and
                                 ly                                   l           iu
                                                                                                   [1]
half of the Ta ions with Ti ions in order to maintain charge neutral ty and f
                                                                      i        inal get Bi3 TiTa O9 . The resul
                                                                                   ly                               t
of such an at tempt was al  though good in terms of the electr     ical properties but i sho wed serious fat
                                                                                         t                       igue
                                                                                                             [1]
failures suggest
        ,        ing that Bi ions do affect fat  igue characteris ics I was sho wn later by Park et al
                                                                  t . t                                     . that
Lanthanide ele ments doping into the BT O thin f lms increases the fat gue resis
                                                     i                      i          tance by several folds, as
                                                                                                       [ 2]
sho wn in Fig. 1, but the re manent polar  ization (2Pr) decreased in Lanthanu m doped Thin Fi m . This is
                                                                                                   l
thought to be due to s m aller size difference between La and Bi which reduces the overal dis tl   tor ion in the
perovski l
         te ayers and hence low 2Pr. Thus, we are probing into this proble m by doping i with Sam ariu m ions
                                                                                            t
since i has got bigger size than La, therefore dis t
       t                                             tor ion of the crystal l t
                                                                             at ice wil occur and so the oxygen
                                                                                       l
binding capabi i and t
               l ty     hus the fatigue resistance increases quite a lot.

                                                                        [4]
Thin f lms of BT O have already been prepared by sol–gel process . A m ong the various techniques avai
      i                                                                                               lable
for the fabrication of B T O thin f lms, sol–gel processing has been em ployed in this study w hich offers
                                   i
excellent uniformity over large area; easy co mposi ion control shor fabricat
                                                      t          ,    t         ion time, as w ell as low
temperature process a co mparat
                     t          ively low cost.

            [4]
In sol–gel      process t che mical stabi i of the solut
                       , he                l ty            ion is very im portant In our case, the che mical
                                                                                  .
instabi i of the solut
       l ty            ion has been overco me by the addi i of acetyl acetone in the precursor solut
                                                         t on                                          ion and
f lms wil be prepared by spin-coat ng technique and their st
 i        l                         i                        ructural morphological and co mposi ional of the
                                                                     ,                            t
B T O thin f l are to be syste matical studied in the near future Also the p H of the Sol should be around 3.5
            i ms                      ly                         .
                                                [6]
for obtaining highly c-axis oriented Thin Films .




                                                                                                                           5
Comparison of PZT, SBT, BLT deposited on Pt Substrate




                                    Fig. 1 NATURE Volume 401 14th October 1999




                           Fig. 2                                                  Fig. 3

             Results of Fatigue tests at 1 MHz                     La-Substituted BLT on SBT/Pt/SiO2/Si

 (a)P-E hysteresis loop for Pt/Si film before
(filled circles) & after (open circles) at 3 x 1010 Cycles.
(b) Variation of Psw, Pns when negative read voltage is applied.

                                         NATURE Volume 401 14th October 1999.




                                                                                                          6
Objective of the Present work
• Deposit of S m doped Bi4 Ti3 O12 thin fi
          ion                              lms
• Investigation of the structure, morphology, co mpositional hom ogenei and thickness uniformity of the f lms.
                                                                        ty                               i
• Ferroelectric Measure ments: Dielectric constant, Re manent polarization and coercive field.




Experiments and Results
W e have prepared a Sol; see Fig. 4, using anhydrous Sa marium nitrate Bismuth ni ra e, Ti
                                                                        ,            t t     taniu m IsoPropoxide
mixed into glacial acet acid and acetyl acetone added as stabi izer Our goal is to f
                       ic                                       l .                   ind the effect of doping S m,
   [1]
La and s  tudy the fatigue resistance of the Thin Film by deposi ing i on Ti/Si substrates
                                                                t     t                    .
Further anneal
       ,       ing of Sam ariu m / Nd doped Bism uth Ti tanate Thin f lms of different thickness wil be done and
                                                                     i                               l
   [1]
Pr , the rem anent Polar ion, wil be calculated for each case.
                         izat       l




                                           Fig. 4 The final Sol Prepared.




                                                                                                                      7
Solution Preparation & Hot plate calibration:


Calculations:




                                                     Fig. 7

Here we have to prepare a 0.1 M solut ion. I a m presently consider ng the case of X= 0.5, thus we are
                                                                   i
m aking Bi3.85Sm0.5Ti3012 Sol Fig. 4.




Weighing:

Weight of Bi(NO3)3.5H2O required(see Fig. 7): For 7.5 m m ol of solution => 7.5*10-3 *484.99*3.85 =
14.00408625 gra ms.

Here 484.99 is the Molecular weight of Bi(NO3)3.5H2O and 3.85 being the actual no. of moles of Bi required.
N ote: We have taken 10% excess Bi as i i volati .
                                       t s      le

Si milarly we can get the weights of Nd Nitrate, Samarium nitrate, Lanthanum Nitrate
(for La(NO3)3 doped– BLT deposit on ) and Ti Isopropoxide. We have m ade the volum e as half, thus gett ~
                                     i                                                                   ing
38 ml of solution finally, with acetic acid as solvent and the weights have also been taken as half the above
calculated.




                                                                                                                8
Drying:

 W e have dried the respective ni ra
                                  t tes after weighing the m on the electronic balance Fig. 8 and then put them into
 the paddy discs for drying into the Oven for 12 Hrs .

          Problems : The Bi(NO3)3 obtained had melted and stuck onto the botto m of the paddy disc. Sa me
          happened with Lanthanum Nitrate.

          Remedy : Possible solution may be controlled heating in the oven or dissolving the m elted salts into the
          glacial acet c acid by putt
                      i                                 , igure 1, on the Magnetic St r , Fig. 9 and heat
                                     ing the paddy discs f                           i rer                   ing to
                                      0
          Te mperature of about 60-70 C.




                     Fig. 8                                                              Fig. 9

             The Electronic Balance                                      The Magnetic Stirrer and Hot plate.




            Fig. 5   Calibration of the Heater surface.                   Fig. 6   Calibration of Distilled water.




                                                                                                                       9
Optical Images




 Bi3.85S m 0 .5 Ti3 O12 _5_ Drops_60 rp m                   Bi3.85 S m0.5 Ti3 O12 _5_ D rops_60 rp m
not annealed_10 X _Centre_Scaled_4 Coats  .                   not annealed_5 X_Edge_Scaled_4 Coats




  Bi3.85S m 0 .5 Ti3 O12 _5_ Drops_60 rp m                      Bi3.85S m 0 .5 Ti3 O12 _5_ Drops_60 rp m
not annealed_10 X_Centre_Scaled_5 Coats    .                 not annealed_5 X_ Cent      re_Scaled_5 Coats.



                                               Figure 42.




                                                                                                              10
Hypothesis of Thin Films

If a fluid of viscosity µ
and density ρ is initially flat, it remains flat during the spin coating process.

Assu mptions:
Steady s te si
         ta     tuation                                         h(t)
Flo w is axial sy m metr c
               ly         i
Radial veloci >> z-veloci
               ty            ty
Film is thin
Surface tension can be neglected
Stresses ar ising fro m shear s resses do minate
                               t




Continuity equation:




                                                       In r direction.




Star ing with the Navier-Stokes’ equat
    t                                 ion:

Using the assu mptions s ated above we get
                        t                 :




r-direction:




z-direction:

                                                                                    11
At t=0


 At h
 Final we should get
      ly            :




 At z=0
 & at z=h




                                   The general equation for fluid flow as th f lm.
                                                                            in i




                                                                                                            [5]
     Variation of height of Sol as a funct on of densi y, angular veloci , ini i height viscosi , and t
                                          i           t                 ty    t al     ,       ty      ime.




                                                            [5]
     Height variation when evaporat on is considered .
                                   i

O n Plot ing the curve on Matlab we find approxim ate relat
        t                                                  ionships of Hf after so me long time of spin coating,
say 1 minute (60 seconds) .The curve decreased som e w hat steeply for the i ia few seconds and then varied
                                                                            nit l
as constant f the rest of the t
             or                ime.
The ini ia height was taken as ~ 3 mm (The diam eter of the drop)
       t l                                                        .




                      The Mathematical Plots for different viscosity SOL and angular velocities.
                                                                                                                   12
SEM Images
 The var ious microstructures depicted by the optical Images and the SEM i mage are sho wn below to depict the
 uniformity of the f lms deposi
                    i          ted and the change in the morphology of the f lm. Note the changes which occur
                                                                            i
 as the f l anneal
         im        ing temperatures is increased (I gets coarser)
                                                   t             .




Figure 10, 750 OC, 60 Min. Annealed, 5 Drops & 5 Coats.          Figure 11, 750 OC, 60 Min. Annealed, 5 Drops & 5 Coats.

    Sa mple 1 (Centre I age-25,000 X)
             .         m                                               Sa mple 1. (Centre Image-50,000 X)




Figure 12, 750 OC, 60 Min. Annealed, 5 Drops & 5 Coats            Figure 13, 750 OC, 60 Min. Annealed, 5 Drops & 5 Coats

      Sa mple 1. (Edge Im age-25,000 X)                                Sa mple 1. (Edge Image-25,000 X, BSE)




                                                                                                                       13
Figure 14, 750 OC, 30 Min. Annealed, 5 Drops & 5 Coats    Figure 15, 750 OC, 30 Min. Annealed, 5 Drops & 5 Coats
    Sa mple 2. (Centre Image-25,000X, SE)                    Sa mple 2 (Centre Image-25,000 X, BSE)
                                                                      .




 Figure 16, 750 OC, 30 Min. Annealed, 5 Drops & 5 Coats    Figure 17, 750 OC, 30 Min. Annealed, 5 Drops & 5 Coats
    Sa mple 2. (Edge Image-25,000X, SE)                        Sam ple 2. (Edge Image-25,000 X, BSE)




 Figure 18, 750 OC, 15 Min. Annealed, 5 Drops & 5 Coats   Figure 19, 750 OC, 15 Min. Annealed, 5 Drops & 5 Coats.
    Sa mple 3. (Centre Image-25,000X, SE)                    Sa mple 3 (Centre Image-25,000 X, BSE)
                                                                      .
                                                                                                                    14
Figure 20, 750 OC, 15 Min. Annealed, 5 Drops & 5 Coats   Figure 21, 750 OC, 15 Min. Annealed, 5 Drops & 5 Coats
    Sa mple 3. (Edge Image-25,000 X, SE)                     Sa m ple 3. (Edge Image-25,000 X, BSE)




Figure 22, 650 OC, 60 Min. Annealed, 5 Drops & 5 Coats   Figure 23, 650 OC, 60 Min. Annealed, 5 Drops & 5 Coats
  Sa mple 4. (Centre Image-25,000 X, SE)                   Sa mple 4. (Centre Image-25,000 X, BSE)




Figure 24, 650 OC, 60 Min. Annealed, 5 Drops & 5 Coats    Figure 25, 650 OC, 60 Min. Annealed, 5 Drops & 5 Coats
   Sa mple 4. (Edge Image-25,000 X, SE)                      Sa m ple 4. (Edge Image-25,000 X, BSE)
                                                                                                                   15
Figure 26, 650 OC, 30 Min. Annealed, 5 Drops & 5 Coats   Figure 27, 650 OC, 30 Min. Annealed, 5 Drops & 5 Coats
   Sa mple 5. (Centre Image-25,000X, SE)                    Sa m ple 5. (Centre Image-25,000 X, BSE)




Figure 28, 650 OC, 30 Min. Annealed, 5 Drops & 5 Coats   Figure 29, 650 OC, 30 Min. Annealed, 5 Drops & 5 Coats
   Sa mple 5. (Edge Image-25,000 X, SE)                      Sa m ple 5. (Edge Image-25,000 X, BSE)




                                                                                                                  16
Samples annealed for same time but at different Temperatures
                                              (650 oC, 650 oC, 700 oC).




Figure 30, 600 OC, 60 Min. Annealed, 5 Drops & 5 Coats           Figure 31, 600 OC, 60 Min. Annealed, 5 Drops & 5 Coats
   Sa mple 6. (Centre Image-25,000 X, SE)                            Sa mple 6. (Centre Image-25,000 X, BSE)




 Figure 32, 650 OC, 60 Min. Annealed, 5 Drops & 5 Coats          Figure 34, 650 OC, 60 Min. Annealed, 5 Drops & 5 Coats
   Sa mple 7. (Centre Image-25,000 X, SE)                           Sa mple 7 (Centre I age-25,000 X, BSE)
                                                                             .         m




Figure 35, 700 OC, 60 Min. Annealed, 5 Drops & 5 Coats           Figure 36, 700 OC, 60 Min. Annealed, 5 Drops & 5 Coats
    Sa mple 8. (Centre Image-25,000X, SE)                           Sa m ple 8. (Centre Image-25,000 X, BSE)


                                                                                                                          17
C-V Characteristics
 Taken for different sweeps.

 U= up sweep   i.e. from -10 volt to +10 volt.
 D= down sweep i.e. from +10 volt to -10 volt.


            Metallization Steps                              Conclusions and Results.
The sa m ples were prepared for taking C-V                 We can say that the Thin Fi  lms produced w ere of very
character t in the fol
          is ics        lowing s eps:
                                 t                    good qual t and were non conducting as on running the up
                                                                iy
                                                      and do wn sweeps we obtained almost the sa me C- V curve and
a)       Sa mples after the deposi ion of Bis muth
                                   t                  no “ Hyster sis” were developed, which are obtained due to
                                                                 i
Titanate Thin f lms on Pt/Si substrate and
                    i                                 m obile charges in the f l etc
                                                                              i ms  .
subsequent anneal     ing in pure O2 (Grade-I)        A pri 16, 2005
                                                           l
environ ment were sent for Metal izatl   ion in the   H o wever there was so m e Oxide leakage at high voltages as is
Sa mtel Centre for Display Technology.                observed from the bending of the curves at the ends.
 Here we did the m etal izat
                        l ion of gold
contacts (see f . on the Thin Fi
               ig )              lms. The
samples were put with a mask in a machine
 which vaporizes gold by subjecting i to
                                     t
      -6
2X 10 Pa.

b)       After Metall ion we t ied to take the C-
                     izat         r
V of
the f lms but were unsuccessful due to the
     i
presence of the back surface oxide layer,
 which ho wever was taken care of by exposing a
small top portion of the substrate by HF etching.

c)      W e also did try to take the C-V by
deposi ing Indiu m dots with the help of soldering
       t
iron, at the back of the substrate but st l proper
                                  ,      il
contacts were not achieved and hence C- V was not                           figure 45.
taken.




                                                                                                                    18
C-V Curves for different frequencies and Sweeps.


                 @_U_10KHz, Sample 1, Location2                              @_D_10KHz, Sample 1, Location2.

                              6.00E-09                                                       6.00E-09
                              5.00E-09                                                       5.00E-09
Capacitance




                                                             Capacitance
                              4.00E-09                                                       4.00E-09
                              3.00E-09                                                       3.00E-09
                              2.00E-09                                                       2.00E-09
                              1.00E-09                                                       1.00E-09
                                0.00E+00                                                     0.00E+00
              -1.50E+ -1.00E+ -5.00E+ 0.00E+ 5.00E+ 1.00E+                 -1.50E+ -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0
                 01      01      00      00    00     01                      01      01      00      0       0       1
                                Voltage                                                       Voltage




                 @_U_1KHz, Sample 1, Location2                                @_D_1KHz, Sample 1, Location2

                             8.00E-09                                                         8.00E-09
                             7.00E-09                                                         7.00E-09
                             6.00E-09
Capacitance




                                                                                              6.00E-09
                                                             Capacitance




                             5.00E-09                                                         5.00E-09
                             4.00E-09                                                         4.00E-09
                             3.00E-09                                                         3.00E-09
                             2.00E-09                                                         2.00E-09
                             1.00E-09                                                         1.00E-09
                            0.00E+00                                                         0.00E+00
              -1.50E -1.00E -5.00E 0.00E+ 5.00E+ 1.00E+                    -1.50E+ -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0
                +01    +01    +00     00    00     01                         01      01      00       0      0       1
                               Voltage                                                        Voltage




                                                                                                                             19
@ _D_10 KHz, Sample 1, Location1.                                     @_U_10 KHz, Sample 1, Location1.

                                6.00E-09                                                              6.00E-09
                                5.00E-09                                                              5.00E-09
Capacitance




                                                                Capacitance
                                4.00E-09                                                              4.00E-09
                                3.00E-09                                                              3.00E-09
                                2.00E-09                                                              2.00E-09
                                1.00E-09                                                              1.00E-09
                                0.00E+00                                                              0.00E+00
              -1.50E+ -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0                       -1.50E+ -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0
                 01      01      00      0       0       1                             01      01      00      0       0       1
                                 Voltage                                                               Voltage




                @ _D_1 KHz, Sample 1, Location1.                                        @U_1KHz, Sample 1, Location1.

                                 8.00E-09                                                               8.00E-09
                                 7.00E-09                                                               7.00E-09
                                 6.00E-09                                                               6.00E-09
Capacitance




                                                                      Capacitance




                                 5.00E-09                                                               5.00E-09
                                 4.00E-09                                                               4.00E-09
                                 3.00E-09                                                               3.00E-09
                                 2.00E-09                                                               2.00E-09
                                 1.00E-09                                                               1.00E-09
                                0.00E+00                                                               0.00E+00
              -1.50E+ -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0                        -1.50E+ -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0
                 01      01      00       0      0       1                              01      01      00       0      0       1
                                 Voltage                                                                Voltage




                                                                                                                                       20
@_U_10MHz, Sample 1, Location1.                                         @ _D_10 MHz, Sample 1, Location1.

                             1.40E-09                                                                1.40E-09
                             1.20E-09                                                                1.20E-09




                                                                       Capacitance
Capacitance




                             1.00E-09                                                                1.00E-09
                             8.00E-10                                                                8.00E-10
                             6.00E-10                                                                6.00E-10
                             4.00E-10                                                                4.00E-10
                             2.00E-10                                                                2.00E-10
                            0.00E+00                                                                0.00E+00
              -1.50E -1.00E -5.00E 0.00E+ 5.00E+ 1.00E+ 1.50E+                        -1.50E -1.00E -5.00E 0.00E+ 5.00E+ 1.00E+ 1.50E+
                +01    +01    +00     00    00     01     01                            +01    +01    +00     00    00     01     01
                                  Voltage                                                                 Voltage




                 @_U_1MHz, Sample 1, Location1.                                        @ _D_1 MHz, Sample 1, Location1.

                            2.50E-09                                                               2.50E-09

                            2.00E-09                                                               2.00E-09
                                                                 Capacitance
Capacitance




                            1.50E-09                                                               1.50E-09

                            1.00E-09                                                               1.00E-09

                            5.00E-10                                                               5.00E-10

                            0.00E+00                                                               0.00E+00
              -1.50E -1.00E -5.00E 0.00E+ 5.00E+ 1.00E+ 1.50E+                       -1.50E -1.00E -5.00E 0.00E+ 5.00E+ 1.00E+ 1.50E+
                +01    +01    +00    00     00     01     01                           +01    +01    +00    00     00     01     01
                                                                                                         Voltage
                                  Voltage




                                                                                                                                         21
@_U_10kHz, Sample 2, Location1.                                 @_D_10KHz, Sample 2, Location1.

                        6.00E-09                                                        6.00E-09
                        5.00E-09                                                        5.00E-09
Capacitance




                                                                Capacitance
                        4.00E-09                                                        4.00E-09
                        3.00E-09                                                        3.00E-09
                        2.00E-09                                                        2.00E-09
                        1.00E-09                                                        1.00E-09
                        0.00E+00                                                        0.00E+00
              -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0 1.50E+0                 -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0 1.50E+0
                 01      00      0       0       1       1                       01      00      0       0       1       1
                                   Voltage                                                         Voltage




                @_D_10MHz, Sample 2, Location1.                                 @_U_10MHz, Sample 2, Location1.

                         1.60E-09                                                        1.60E-09
                         1.40E-09                                                        1.40E-09
                         1.20E-09
Capacitance




                                                                                         1.20E-09
                         1.00E-09                               Capacitance
                                                                                         1.00E-09
                         8.00E-10                                                        8.00E-10
                         6.00E-10                                                        6.00E-10
                         4.00E-10                                                        4.00E-10
                         2.00E-10                                                        2.00E-10
                        0.00E+00                                                        0.00E+00
              -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0 1.50E+0                 -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0 1.50E+0
                 01      00       0      0       1       1                       01      00       0      0       1       1
                                   Voltage                                                         Voltage




               @_U_100kHz, Sample 2, Location1.                                @_D_100KHz, Sample 2, Location1.

                        2.50E-09                                                        3.00E-09
                        2.00E-09                                                        2.50E-09
Capacitance




                                                                Capacitance




                        1.50E-09                                                        2.00E-09
                                                                                        1.50E-09
                        1.00E-09
                                                                                        1.00E-09
                        5.00E-10
                                                                                        5.00E-10
                        0.00E+00                                                        0.00E+00
              -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0 1.50E+0                 -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0 1.50E+0
                 01      00      0       0       1       1                       01      00      0       0       1       1
                                   Voltage                                                         Voltage




                                                                                                                                22
@_U_1MHz, Sample 2, Location1.                                    @_D_1MHz, Sample 2, Location1.

                         2.50E-09                                                          2.50E-09

                         2.00E-09                                                          2.00E-09
Capacitance




                                                                   Capacitance
                         1.50E-09                                                          1.50E-09
                         1.00E-09                                                          1.00E-09

                         5.00E-10                                                          5.00E-10

                        0.00E+00                                                           0.00E+00
              -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0 1.50E+0                    -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0 1.50E+0
                 01      00      0       0       1       1                          01      00      0       0       1       1
                                     Voltage                                                          Voltage




                 @_U_1kHz, Sample 2, Location1.                                     @_D_1kHz, Sample 2, Location1.

                         7.00E-09                                                           7.00E-09
                         6.00E-09                                                           6.00E-09
                                                                   Capacitance
Capacitance




                         5.00E-09                                                           5.00E-09
                         4.00E-09                                                           4.00E-09
                         3.00E-09                                                           3.00E-09
                         2.00E-09                                                           2.00E-09
                         1.00E-09                                                           1.00E-09
                        0.00E+00                                                           0.00E+00
              -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0 1.50E+0                    -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0 1.50E+0
                 01      00       0      0       1       1                          01      00       0      0       1       1
                                    Voltage                                                           Voltage




                    Thus we see that the f lms are stable for
                                          i                     A nnealing at higher temperatures in the sense
                    that their Up and Dow n S weep produce      sa me C-V curve.




                                                                  Figure 44.
                                                                 The Ideal C-V Curve for a p - type substrate.
                                                                 Just take a mirror image for the case of n-Type.


                                                                                                                                   23
The Film    Thickness Measurements




 Figure 37.                                   Figure 38.



                 Sample annealed at 650 oC.




Figure 39.                                    Figure 40.
                                      o
                Sample annealed at 750 C.
                                                           24
XRD Patterns




                  XRD Patterns for 600, 650, 700, 750 oC annealed Samples.
                                         Figure 41.

  The X-Ray diffract ion patterns were studied and peaks characterized for t different phases present
                                                                            he                       .
  X-ray diffraction profiles were obtained using a Cu Kα radiation source at 30 kV and 20 m A tube current and a
  sweep rate of 3 ° / min.
                 .0

Te mperature °C          I 006/ I 117           I 111/ I 117            I 200/ I 117           I 311/ I 117
750 (15 min)             12/20                  5/20                    3/20                   2/20
750 (30 min)             26/57                  13/57                   7/57                   3/57
750 (60 min)             5.69/15.82             2.6/15.82               1.31/15.82             2.49/15.82
600                      18.37/25               11.25/25                5/25                   2/25
650                      46.72/76.37            24.10/76.37             8.27/76.37             5.50/76.37
700                      30/65.26               15/65.26                11/65.26               4/65.26
750                      5.69/15.82             2.6/15.82               1.31/15.82             2.49/15.82
A nnealing Time( min)    60                     60                      60                     60




                                                                                                                   25
Intensity Variation as a function of annealing time and temperature


                        Variation of Intensity ratio Vs                                                Variation of Intensity Ratio Vs Temperature
                               Annealing Time                                                              at Constant annealing time(60 min.)

             0.7                                                                                     0.8
             0.6




                                                                             In te n s ity R a tio
             0.5                                                 I006/I117                           0.6                                        I006/I117
I / I m ax




             0.4                                                 I111/I117                                                                      I111/I117
                                                                                                     0.4
             0.3                                                 I200/I117                                                                      I200/I117
             0.2                                                 I311/I117                           0.2                                        I311/I117
             0.1
               0                                                                                      0
                   0         20       40        60       80                                            600      650       700       750   800
                                  Time (min).                                                                         Temperature

                                                                     Figure 43.




       The following points can be concluded fro m the above plots:

                       The X R D pat terns sho w the f lms are polycrystal i with preferred ~(117) or
                                                      i                   l ne                         ientation.
                       Pyrochlore phase is absent  .
                       Correct peak posi ions i
                                          t     ndicate that S m ions dissolve into the pseudo perovski s ructure.
                                                                                                       te t
                       The (117) peak intensi increased w. . o
                                               ty              r t ther peaks with increasing annealing temperature and t m e
                                                                                                                         i
                       indicating i s preferred nature.
                                   t




                                                                                                                                                     26
Conclusion and Future work
The B T O solut ion was prepared by mixing Bism uth ni rate, Sa mariu m nitrate and t taniu m IsoPropoxide in
                                                           t                       ,        i
glacial acet c acid. Ini i ly bismuth ni rate was dissolved in acet acid in a ref
            i            t al               t                          ic                 lux condenser heated at a
                                  [4]
temperature of ~80 °C for 2 hrs . W h en the solut    ion becam e transparent t taniu m IsoPropoxide was mixed
                                                                              , i
in a proper m olar rat with constant st r ing at roo m te mperature to form a yel
                       io                   ir                                         low-gold Fig. 4, t ransparent
solution. However, for B T O syste m the problem is in solution, the bism uth precursor reacts easi with H2 O
                                                                                                        ly
                                      [1]
to yield white precipi t BiO N O 3
                       ta e               and hence the solution is unstable and deco mposes within a short t   ime.
Therefore, i is necessary to f
             t                 ind another path to synthesize Sols having stabi i over longer per
                                                                                   l ty                 iod. Earl ier
                                                                                      [4]
studies on the stabi i of the Sols sho wed that the alkoxide–alkanola mine
                       l ty                                                                syste m has an excel lent
dissolving po wer for many inorganic sal and a long-term stabil ty to hydrolysis and condensat
                                            ts                      i                                ion. Alkoxide–
                                                                                        [1]
alkanola mine was thus very effect ve in preparing PbTiO3 thin f lms and their resul sho w ed that lead
                                      i                               i                          ts
acetate of acetyl acetone gives a clear and stable solut     ion. Based on this concept, we have added acetyl
acetone, and the precursor solut  ion was found to be stable against precipi t ta ion for several days indicat
                                                                                                        ,        ing
that the addition of alcohol prevents Bi(N O3 )3 fr m hydrolysis
                                                   o              .

In the future study, Pt/Si(1 0 0) and bare si icon substrates are going to be used for the deposi ion of BT O thin
                                             l                                                      t
f lms. The substrates will be cleaned in acetone, Carbon Tetra Chlor
 i                                                                            ide and rinsed in de-ionised water     ,
followed by a drying process A plat m layer of thickness ~500 Å will be deposi ed on the (1 0 0) oriented
                               .       inu                                               t
Si substrates at roo m tem perature to act as the botto m electrode for electr ical character ization. The precursor
                                                                                                        [3]
solut ion wil be spin coated onto the substrates by using a spin coater at 2300 rp m for so me 60 s . After spin
             l
coat ing the substrates t f lms will to be kept in a mbient air for 1 h to form gel f lms by hydrolysis and
                       , he i                                                               i
poly merizat on. Spin coat
             i              ing process wil be repeated 3–5 t
                                             l                     imes to obta f lms with desired thickness
                                                                                 in i                                ,
                                                            [3]
followed by pyrolysis of each layer at 350 °C for 10 min . Heat t     reatment of dried f l wil be carr
                                                                                           im      l        ied out in
a tube furnace at the tem perature range 400–600 °C for 1 h in an atmosphere of ei          ther flowing oxygen or
    [3]
air . Crystal izat
               l ion, densif  ication and microstructure of the f lms wil be exa mined by X-ray diffracto meter
                                                                  i         l
                                                                        [3]
with Cu K• radiat  ion ( =1.5405 Å) and/or a mic force microscope .
                                               to

To su m marize:

       The X R D pat   terns Figure 41, 43 are sho wing the preferred ~ (171) {Excluding the substrate peak}
       orientat ion, and thus there is no pyrochlore phase. The correlat    ion of the diffract  ion peaks of the
       B S m T thin films with those of BIT im plies that S m subst tution does not affect the layered-perovski
                                                                   i                                           te
       structure of BIT.

       This fact indicates that the S m ions in the BS m T films do not form a pyrochlore phase, but dissolve
       into the pseudo perovski st
                                 te ructure. Therefore, i see ms that S m ions ~1.0 Å can readily subst tute for
                                                         t                                             i
       Bi ions ~1.03 Å in pseudo perovski e structure, and part l subst tut
                                            t                    ia       i ion of S m ions for Bi ions in BIT
       influenced by the s ructure of the Bi l
                          t                   ayer.

       Having deposi  ted the Thin Fi lms at various te mperature ranges and checked the f lms for oxide
                                                                                                i
       leakage charges by doing the C-V measure ments and character
                                                          ,               ization done for the X R D pat  terns
       obtained, we look forward to do the A F M analysis for microstructure level analysis and further we will
       be doing the Polarization Vs E measurements  .




                                                                                                                         27
The peak intensi ies increased, and the ful width at hal maximum of the peaks decreased with
                     t                           l              f
   increasing anneal ing tem perature; i can be assu med that the grain size was increasing with anneal
                                        t                                                              ing
   temperature.
   (Figure 10) sho ws the surface FE-SE M micrographs of BSm T thin f l     i ms as funct ons of anneal
                                                                                         i             ing
   temperatures The surface morphology is very sensi ive to the anneal
                 .                                      t                 ing te mperature The BSm T thin
                                                                                          .
   f lm annealed at 750 °C @ Fig. 2 exhibi
    i                                         ted coarse grains and considerable a mounts of secondary
   structures am ong the grains.
   The grain s ze of the BSm T fi
               i                 lms increased with increasing anneal ing tem perature .
   See figures (10–36).
   The (Bi: Sm): Ti :: 1 58 : 1. {Expected rat 1
                         .                    io: .33: 1}.
   The pH of our Sol was found to be ~1-2.



These facts can be concluded:

      1. The crystal growth is preceded and the ferroelectr propert
                                                            ic         ies of the BS m T fi m s can be
                                                                                           l
         improved by increasing t anneal
                                  he      ing temperature.
      2. The BS m T films annealed at 700 °C have round-plate- ike grains of ~300 nm (Figure 36).
                                                              l
      3. The Thickness of the f l varies around 0.5 Micro meters (Figure 37)
                               i ms                                           .

   C- V measure ments show that there is approxim ately the sa me path reversed for both the Up S weep
   and Do wn Sweep, which implies that the leakage through the oxide layer i smalls       .
   O n Overlapping the C-V curves for different frequencies one f       inds a sort of Hysteresis loop being
   generated. This is due to the slow ST A T E S, which do not e mpty out fast enough even to slow D C
   S weeps.
   Study the thermal stabi i of such fi
                           l ty          lms by anneal  ing at different temperatures for different lengths of
   time.
   W e wil also study the deposi
           l                      ted f l propert in terms of Vacancies and Stress / St ins present via
                                       im          ies                                         ra
   various methods l  ike X-Ray Diffraction, TE M.
   X R D and SE M Characterizat  ion.
   The surface roughness of the f lm is also an important para m eter taking into account the possibi i of
                                   i                                                                     l ty
   further metal izat
                  l ion on the ferroelect ic f lm in the FeR A M s device fabricat
                                          r i                                          ion process. Thus, AF M
   micrographs of the BS m T thin f lms as funct
                                     i            ions of anneal ing te mperature wil be taken to probe m ore
                                                                                       l
   into this feature.
                                                                             [5]
   Fro m these analyses we are looking to f
                        ,                    ind that t root mean square ~r ms surface roughness of the
                                                       he
   B S m T thin f lms increases with increasing anneal
                 i                                      ing te mperature. An effect which m ay be related to
   the increase of the grain size with increasing anneal   ing te mperature The rms surface roughnesses of
                                                                           .
   B S m T thin films are expected to vary fro m 4.01 to 6.74 n m for anneal   ing te mperatures n the range of
                [5]
   650–750 °C .




                                                                                                                  28
References:
1. Lanthanum-Substituted Bismuth Titanate for use in non-volatile
   memories;
   B.H.Park,B.S.Kang,S.D.Bu,T.W.NOH,J.Lee & W.Jo;
   NATURE Vol 401 14th October 1999.
2. Why Lanhanum-substituted BiT becomes fatigue free in a ferroelectric
   capacitor with Pt electrodes; Y.Ding, J.S.LIU, H.X.Qin, J.S.ZHU, and
   Y.N.Wang.
    Appl. Phys. Lett.Volume 78, Number 26.
3. Growth   of   uniformly   a-axis-oriented  ferroelectric   lanthanum-
   substituted
   Bismuth titanate films on silicon substrates;
   Ho Nyung Lee,a) Dietrich Hesse, Nikolai Zakharov, Sung Kyun Lee, and
   Ulrich Go¨ sele. Max-Planck Institut fu¨r Mikrostrukturphysik,
   Weinberg 2, D-06120 Halle (Saale), Germany ~Received 25 July 2002;
   accepted 14 February 2003.
   Appl. Phys. Lett Volume 93, Number 9 1 May 2003.
4. Sol–gel synthesis and property studies of layered perovskite bismuth
   titanate thin films - S. Madeswaran, N. V. Giridharan and R.
   Jayavel;
   Materials Chemistry and Physics 80 (2003) 23–28.
5. Large remanent polarization of cerium-modified bismuth–titanate thin
   films for ferroelectric random access memories.
   Kyoung-Tae Kim and Chang-Il Kim
   School of Electrical & Electronic Engineering, Chungang University,
   221, Huksuk-Dong, Dongjak-Gu,Seoul 156-756, Korea.
   © 2003 American Vacuum Society.

6. Effects of precursor solution pH value and substrate texture on
   orientation degree of sol-gel-derived bismuth titanate thin films
   Haoshuang Gu, Wanqiang Cao, Rui Song, Xiaoyuan Zhou, John Wan
   physica status solidi (a)Volume 198, Issue 2, 2003. Pages 282-288
   Copyright © 2003 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim




                                                                           29

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B.Tech Project Report

  • 1. Growth and Characterization of Ln-doped Bismuth Titanate Thin Films. B.Tech Project Report Submitted by: Sumeet Kumar Project Guide: Dr.Ashish Garg B. Tech Assistant Professor Department of Materia and Metal ls lurgical Engineering. Department of Mater als and Metal i lurgical Engineering Indian Inst tute of Technology Kanpur (I K ) i IT . Indian Institute of Technology Kanpur (I K). IT Kanpur-208016. Kanpur-208016 India. India. E mail sum eetkv @ g m ail m, : .co E mail ashishg @ii : tk.ac.in s meet u .ku mar @rediffmail m .co Tel : +91-512-2597904 (Office) 2598372 (Residence) , Tel +91-9415540761(Mob.), : Fax : +91-512-2597505 +91-512-2561650(Residence). Signature: Signature: 1
  • 2. Acknowledgement Firs ly I would l t ike to thank Dr. Ashish Garg for being my guide in this course and bel eving in m e. i Although Electronics was my dee med field of study but r ight fro m the t ime I took the course on Electronic Materials under the guidance of Dr. Ashish Garg I developed a liking towards it so m uch so that I , a m looking forward to do my research in this area. I would also like to na m e a few persons without w ho m this project would never have reached a stage i has t reached now. These include: Kart kyen (SE M Lab incharge) for helping me to take SE M i mages out of turn, i , Nitin, Gaurav, Abhinav, Abhishek, Dipthi Mr. A m ol, Mr. Tripathi (He made sure that al the Laboratory , l equip ments were working). I think that these people are the reason for whatever I a m able to do today and I suppose that they wil keep l m otivating m e to do such great things in future. 2
  • 3. Chapters • A bstract Page – 4. • Introduct ion Page – 5 to 6. • O bjectives and Results Page – 7 to 9. • O ptical Images Page – 10. • H ypothesis of Thin Films Page – 11 to 12. • SE M I mages Page – 13 to 17. • C- V Characteris ics t Page – 18. • C- V Curves Page – 19 to 23. • Film thickness measurem ents Page – 24. • X R D Pat terns Page – 25. • Intensi rat o Vs Annealing Time, Te mperature ty i . Page – 26. • Conclusion and Future w ork Page – 27 to 28. • References Page – 29. 3
  • 4. Abstract In recent years the fa m i of bismuth layer str , ly uctured ferroelectrics has received m uch at tention as the candidate for ferroelectric rando m access me mor . Bi4Ti3O12 (BiT) or bismuth oxides are extensively ies studied mem bers of the Aurivi ll ius fa mily for their large spontaneous polar ization along the a- axis (~50 2 µ C/c m ), low processing te mperature high Curie temperature and Pb-free mater l . Ho wever, i suffered , , ia s t 6 severe polarization suppression af ter 10 switchi cycles when deposi ed on Pt/Si substrates It has been ng t . i ion of Bi in the perovski unit cel of Bi4Ti3 O12 by a lanthanide sho wn by previous studies that subst tut te l ele ment such as La leads to re markable improvem ent in the fatigue behavior of i f l on Pt/Si substrates ts i ms . H o wever t research in this area is far from co mplete. Our at , he tempt is to dope Bi4 Ti3 O1 2 with other lanthanides such as La, N d, S m either separately or together to understand the effect of size of dopants on the structure and ferroelectr proper ies of the f lms as size difference is a key elem ent to the creat ic t i ion of remanent polar ization in the ferroelectr Bi4Ti3O12 f lms. W e wil use spin coat ic i l ing technique to fabricate the f lms and study the structure of the f lms using X-ray diffract i i ion, Scanning electron microscopy, ato mic force microscopy and ferroelectr measure ments wi l made t understand the electr cal behavior. ic l o i 4
  • 5. Introduction There have been extensive effor to enhance the rel ts iabi i of perovski es based ferroelectr thin f lms for l ty t ic i use in non-volat le ferroelectr rando m access m e m ory devices FRAM’s are non-volat le mem ory devices; i ic . i i . data stored is not lost once the po wer is switched off In F R A M inform ation is st .e . ored in the polar ization state of the ferroelectr c mater l Structure of FR A M is similar to D R A M, in w hich me m ory cel are i ia . ls arranged in a square mat ix and infor mation is stored in terms of sign of charge. Earl , Lead Zirconate r ier Titanate (PZ T) e merged as an important candidate for F R A M s. Ho wever i f lms show ed a serious , ts i 7 degradat ion of ferroelectr propert af ic ies ter being subjected to 10 read/wri switching cycles when deposi te ted on Pt electrodes. Later i was sho w n that layered ferroelect ics such as Stront m Bis muth Titanate (SB T ) t r iu sho wed superior fat igue resistances, sho wn in Fig. 1, as co m pared to Pt PZ T/Pt capaci / tors as show n in Fig. 2. [1] H o wever the high processing te mperature , of S B T above 750 °C is an obstacle in integrat ion with si icon l devices Bism uth t tanate (BT O) e m erged as a later candidate for these appl . i ications due to i high re manent ts polarization in bulk state but undoped BT O sho wed high fat igue fai ures but with an advantage of low l processing te mperature This is expla . ined in terms of the volat le nature of Bis muth ato m, and as Bi was i supposed to bind the Oxygen ato m s together w hen i is gone the oxygen ato ms also beco me free to move, , t [2] thus creating vacancies and i is this vacancy that has been postulated as a reason for f igue fai t at lures . Also, people have exper imental proved this fact by replacing al the stront m ato ms by bism uth ions and ly l iu [1] half of the Ta ions with Ti ions in order to maintain charge neutral ty and f i inal get Bi3 TiTa O9 . The resul ly t of such an at tempt was al though good in terms of the electr ical properties but i sho wed serious fat t igue [1] failures suggest , ing that Bi ions do affect fat igue characteris ics I was sho wn later by Park et al t . t . that Lanthanide ele ments doping into the BT O thin f lms increases the fat gue resis i i tance by several folds, as [ 2] sho wn in Fig. 1, but the re manent polar ization (2Pr) decreased in Lanthanu m doped Thin Fi m . This is l thought to be due to s m aller size difference between La and Bi which reduces the overal dis tl tor ion in the perovski l te ayers and hence low 2Pr. Thus, we are probing into this proble m by doping i with Sam ariu m ions t since i has got bigger size than La, therefore dis t t tor ion of the crystal l t at ice wil occur and so the oxygen l binding capabi i and t l ty hus the fatigue resistance increases quite a lot. [4] Thin f lms of BT O have already been prepared by sol–gel process . A m ong the various techniques avai i lable for the fabrication of B T O thin f lms, sol–gel processing has been em ployed in this study w hich offers i excellent uniformity over large area; easy co mposi ion control shor fabricat t , t ion time, as w ell as low temperature process a co mparat t ively low cost. [4] In sol–gel process t che mical stabi i of the solut , he l ty ion is very im portant In our case, the che mical . instabi i of the solut l ty ion has been overco me by the addi i of acetyl acetone in the precursor solut t on ion and f lms wil be prepared by spin-coat ng technique and their st i l i ructural morphological and co mposi ional of the , t B T O thin f l are to be syste matical studied in the near future Also the p H of the Sol should be around 3.5 i ms ly . [6] for obtaining highly c-axis oriented Thin Films . 5
  • 6. Comparison of PZT, SBT, BLT deposited on Pt Substrate Fig. 1 NATURE Volume 401 14th October 1999 Fig. 2 Fig. 3 Results of Fatigue tests at 1 MHz La-Substituted BLT on SBT/Pt/SiO2/Si (a)P-E hysteresis loop for Pt/Si film before (filled circles) & after (open circles) at 3 x 1010 Cycles. (b) Variation of Psw, Pns when negative read voltage is applied. NATURE Volume 401 14th October 1999. 6
  • 7. Objective of the Present work • Deposit of S m doped Bi4 Ti3 O12 thin fi ion lms • Investigation of the structure, morphology, co mpositional hom ogenei and thickness uniformity of the f lms. ty i • Ferroelectric Measure ments: Dielectric constant, Re manent polarization and coercive field. Experiments and Results W e have prepared a Sol; see Fig. 4, using anhydrous Sa marium nitrate Bismuth ni ra e, Ti , t t taniu m IsoPropoxide mixed into glacial acet acid and acetyl acetone added as stabi izer Our goal is to f ic l . ind the effect of doping S m, [1] La and s tudy the fatigue resistance of the Thin Film by deposi ing i on Ti/Si substrates t t . Further anneal , ing of Sam ariu m / Nd doped Bism uth Ti tanate Thin f lms of different thickness wil be done and i l [1] Pr , the rem anent Polar ion, wil be calculated for each case. izat l Fig. 4 The final Sol Prepared. 7
  • 8. Solution Preparation & Hot plate calibration: Calculations: Fig. 7 Here we have to prepare a 0.1 M solut ion. I a m presently consider ng the case of X= 0.5, thus we are i m aking Bi3.85Sm0.5Ti3012 Sol Fig. 4. Weighing: Weight of Bi(NO3)3.5H2O required(see Fig. 7): For 7.5 m m ol of solution => 7.5*10-3 *484.99*3.85 = 14.00408625 gra ms. Here 484.99 is the Molecular weight of Bi(NO3)3.5H2O and 3.85 being the actual no. of moles of Bi required. N ote: We have taken 10% excess Bi as i i volati . t s le Si milarly we can get the weights of Nd Nitrate, Samarium nitrate, Lanthanum Nitrate (for La(NO3)3 doped– BLT deposit on ) and Ti Isopropoxide. We have m ade the volum e as half, thus gett ~ i ing 38 ml of solution finally, with acetic acid as solvent and the weights have also been taken as half the above calculated. 8
  • 9. Drying: W e have dried the respective ni ra t tes after weighing the m on the electronic balance Fig. 8 and then put them into the paddy discs for drying into the Oven for 12 Hrs . Problems : The Bi(NO3)3 obtained had melted and stuck onto the botto m of the paddy disc. Sa me happened with Lanthanum Nitrate. Remedy : Possible solution may be controlled heating in the oven or dissolving the m elted salts into the glacial acet c acid by putt i , igure 1, on the Magnetic St r , Fig. 9 and heat ing the paddy discs f i rer ing to 0 Te mperature of about 60-70 C. Fig. 8 Fig. 9 The Electronic Balance The Magnetic Stirrer and Hot plate. Fig. 5 Calibration of the Heater surface. Fig. 6 Calibration of Distilled water. 9
  • 10. Optical Images Bi3.85S m 0 .5 Ti3 O12 _5_ Drops_60 rp m Bi3.85 S m0.5 Ti3 O12 _5_ D rops_60 rp m not annealed_10 X _Centre_Scaled_4 Coats . not annealed_5 X_Edge_Scaled_4 Coats Bi3.85S m 0 .5 Ti3 O12 _5_ Drops_60 rp m Bi3.85S m 0 .5 Ti3 O12 _5_ Drops_60 rp m not annealed_10 X_Centre_Scaled_5 Coats . not annealed_5 X_ Cent re_Scaled_5 Coats. Figure 42. 10
  • 11. Hypothesis of Thin Films If a fluid of viscosity µ and density ρ is initially flat, it remains flat during the spin coating process. Assu mptions: Steady s te si ta tuation h(t) Flo w is axial sy m metr c ly i Radial veloci >> z-veloci ty ty Film is thin Surface tension can be neglected Stresses ar ising fro m shear s resses do minate t Continuity equation: In r direction. Star ing with the Navier-Stokes’ equat t ion: Using the assu mptions s ated above we get t : r-direction: z-direction: 11
  • 12. At t=0 At h Final we should get ly : At z=0 & at z=h The general equation for fluid flow as th f lm. in i [5] Variation of height of Sol as a funct on of densi y, angular veloci , ini i height viscosi , and t i t ty t al , ty ime. [5] Height variation when evaporat on is considered . i O n Plot ing the curve on Matlab we find approxim ate relat t ionships of Hf after so me long time of spin coating, say 1 minute (60 seconds) .The curve decreased som e w hat steeply for the i ia few seconds and then varied nit l as constant f the rest of the t or ime. The ini ia height was taken as ~ 3 mm (The diam eter of the drop) t l . The Mathematical Plots for different viscosity SOL and angular velocities. 12
  • 13. SEM Images The var ious microstructures depicted by the optical Images and the SEM i mage are sho wn below to depict the uniformity of the f lms deposi i ted and the change in the morphology of the f lm. Note the changes which occur i as the f l anneal im ing temperatures is increased (I gets coarser) t . Figure 10, 750 OC, 60 Min. Annealed, 5 Drops & 5 Coats. Figure 11, 750 OC, 60 Min. Annealed, 5 Drops & 5 Coats. Sa mple 1 (Centre I age-25,000 X) . m Sa mple 1. (Centre Image-50,000 X) Figure 12, 750 OC, 60 Min. Annealed, 5 Drops & 5 Coats Figure 13, 750 OC, 60 Min. Annealed, 5 Drops & 5 Coats Sa mple 1. (Edge Im age-25,000 X) Sa mple 1. (Edge Image-25,000 X, BSE) 13
  • 14. Figure 14, 750 OC, 30 Min. Annealed, 5 Drops & 5 Coats Figure 15, 750 OC, 30 Min. Annealed, 5 Drops & 5 Coats Sa mple 2. (Centre Image-25,000X, SE) Sa mple 2 (Centre Image-25,000 X, BSE) . Figure 16, 750 OC, 30 Min. Annealed, 5 Drops & 5 Coats Figure 17, 750 OC, 30 Min. Annealed, 5 Drops & 5 Coats Sa mple 2. (Edge Image-25,000X, SE) Sam ple 2. (Edge Image-25,000 X, BSE) Figure 18, 750 OC, 15 Min. Annealed, 5 Drops & 5 Coats Figure 19, 750 OC, 15 Min. Annealed, 5 Drops & 5 Coats. Sa mple 3. (Centre Image-25,000X, SE) Sa mple 3 (Centre Image-25,000 X, BSE) . 14
  • 15. Figure 20, 750 OC, 15 Min. Annealed, 5 Drops & 5 Coats Figure 21, 750 OC, 15 Min. Annealed, 5 Drops & 5 Coats Sa mple 3. (Edge Image-25,000 X, SE) Sa m ple 3. (Edge Image-25,000 X, BSE) Figure 22, 650 OC, 60 Min. Annealed, 5 Drops & 5 Coats Figure 23, 650 OC, 60 Min. Annealed, 5 Drops & 5 Coats Sa mple 4. (Centre Image-25,000 X, SE) Sa mple 4. (Centre Image-25,000 X, BSE) Figure 24, 650 OC, 60 Min. Annealed, 5 Drops & 5 Coats Figure 25, 650 OC, 60 Min. Annealed, 5 Drops & 5 Coats Sa mple 4. (Edge Image-25,000 X, SE) Sa m ple 4. (Edge Image-25,000 X, BSE) 15
  • 16. Figure 26, 650 OC, 30 Min. Annealed, 5 Drops & 5 Coats Figure 27, 650 OC, 30 Min. Annealed, 5 Drops & 5 Coats Sa mple 5. (Centre Image-25,000X, SE) Sa m ple 5. (Centre Image-25,000 X, BSE) Figure 28, 650 OC, 30 Min. Annealed, 5 Drops & 5 Coats Figure 29, 650 OC, 30 Min. Annealed, 5 Drops & 5 Coats Sa mple 5. (Edge Image-25,000 X, SE) Sa m ple 5. (Edge Image-25,000 X, BSE) 16
  • 17. Samples annealed for same time but at different Temperatures (650 oC, 650 oC, 700 oC). Figure 30, 600 OC, 60 Min. Annealed, 5 Drops & 5 Coats Figure 31, 600 OC, 60 Min. Annealed, 5 Drops & 5 Coats Sa mple 6. (Centre Image-25,000 X, SE) Sa mple 6. (Centre Image-25,000 X, BSE) Figure 32, 650 OC, 60 Min. Annealed, 5 Drops & 5 Coats Figure 34, 650 OC, 60 Min. Annealed, 5 Drops & 5 Coats Sa mple 7. (Centre Image-25,000 X, SE) Sa mple 7 (Centre I age-25,000 X, BSE) . m Figure 35, 700 OC, 60 Min. Annealed, 5 Drops & 5 Coats Figure 36, 700 OC, 60 Min. Annealed, 5 Drops & 5 Coats Sa mple 8. (Centre Image-25,000X, SE) Sa m ple 8. (Centre Image-25,000 X, BSE) 17
  • 18. C-V Characteristics Taken for different sweeps. U= up sweep i.e. from -10 volt to +10 volt. D= down sweep i.e. from +10 volt to -10 volt. Metallization Steps Conclusions and Results. The sa m ples were prepared for taking C-V We can say that the Thin Fi lms produced w ere of very character t in the fol is ics lowing s eps: t good qual t and were non conducting as on running the up iy and do wn sweeps we obtained almost the sa me C- V curve and a) Sa mples after the deposi ion of Bis muth t no “ Hyster sis” were developed, which are obtained due to i Titanate Thin f lms on Pt/Si substrate and i m obile charges in the f l etc i ms . subsequent anneal ing in pure O2 (Grade-I) A pri 16, 2005 l environ ment were sent for Metal izatl ion in the H o wever there was so m e Oxide leakage at high voltages as is Sa mtel Centre for Display Technology. observed from the bending of the curves at the ends. Here we did the m etal izat l ion of gold contacts (see f . on the Thin Fi ig ) lms. The samples were put with a mask in a machine which vaporizes gold by subjecting i to t -6 2X 10 Pa. b) After Metall ion we t ied to take the C- izat r V of the f lms but were unsuccessful due to the i presence of the back surface oxide layer, which ho wever was taken care of by exposing a small top portion of the substrate by HF etching. c) W e also did try to take the C-V by deposi ing Indiu m dots with the help of soldering t iron, at the back of the substrate but st l proper , il contacts were not achieved and hence C- V was not figure 45. taken. 18
  • 19. C-V Curves for different frequencies and Sweeps. @_U_10KHz, Sample 1, Location2 @_D_10KHz, Sample 1, Location2. 6.00E-09 6.00E-09 5.00E-09 5.00E-09 Capacitance Capacitance 4.00E-09 4.00E-09 3.00E-09 3.00E-09 2.00E-09 2.00E-09 1.00E-09 1.00E-09 0.00E+00 0.00E+00 -1.50E+ -1.00E+ -5.00E+ 0.00E+ 5.00E+ 1.00E+ -1.50E+ -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0 01 01 00 00 00 01 01 01 00 0 0 1 Voltage Voltage @_U_1KHz, Sample 1, Location2 @_D_1KHz, Sample 1, Location2 8.00E-09 8.00E-09 7.00E-09 7.00E-09 6.00E-09 Capacitance 6.00E-09 Capacitance 5.00E-09 5.00E-09 4.00E-09 4.00E-09 3.00E-09 3.00E-09 2.00E-09 2.00E-09 1.00E-09 1.00E-09 0.00E+00 0.00E+00 -1.50E -1.00E -5.00E 0.00E+ 5.00E+ 1.00E+ -1.50E+ -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0 +01 +01 +00 00 00 01 01 01 00 0 0 1 Voltage Voltage 19
  • 20. @ _D_10 KHz, Sample 1, Location1. @_U_10 KHz, Sample 1, Location1. 6.00E-09 6.00E-09 5.00E-09 5.00E-09 Capacitance Capacitance 4.00E-09 4.00E-09 3.00E-09 3.00E-09 2.00E-09 2.00E-09 1.00E-09 1.00E-09 0.00E+00 0.00E+00 -1.50E+ -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0 -1.50E+ -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0 01 01 00 0 0 1 01 01 00 0 0 1 Voltage Voltage @ _D_1 KHz, Sample 1, Location1. @U_1KHz, Sample 1, Location1. 8.00E-09 8.00E-09 7.00E-09 7.00E-09 6.00E-09 6.00E-09 Capacitance Capacitance 5.00E-09 5.00E-09 4.00E-09 4.00E-09 3.00E-09 3.00E-09 2.00E-09 2.00E-09 1.00E-09 1.00E-09 0.00E+00 0.00E+00 -1.50E+ -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0 -1.50E+ -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0 01 01 00 0 0 1 01 01 00 0 0 1 Voltage Voltage 20
  • 21. @_U_10MHz, Sample 1, Location1. @ _D_10 MHz, Sample 1, Location1. 1.40E-09 1.40E-09 1.20E-09 1.20E-09 Capacitance Capacitance 1.00E-09 1.00E-09 8.00E-10 8.00E-10 6.00E-10 6.00E-10 4.00E-10 4.00E-10 2.00E-10 2.00E-10 0.00E+00 0.00E+00 -1.50E -1.00E -5.00E 0.00E+ 5.00E+ 1.00E+ 1.50E+ -1.50E -1.00E -5.00E 0.00E+ 5.00E+ 1.00E+ 1.50E+ +01 +01 +00 00 00 01 01 +01 +01 +00 00 00 01 01 Voltage Voltage @_U_1MHz, Sample 1, Location1. @ _D_1 MHz, Sample 1, Location1. 2.50E-09 2.50E-09 2.00E-09 2.00E-09 Capacitance Capacitance 1.50E-09 1.50E-09 1.00E-09 1.00E-09 5.00E-10 5.00E-10 0.00E+00 0.00E+00 -1.50E -1.00E -5.00E 0.00E+ 5.00E+ 1.00E+ 1.50E+ -1.50E -1.00E -5.00E 0.00E+ 5.00E+ 1.00E+ 1.50E+ +01 +01 +00 00 00 01 01 +01 +01 +00 00 00 01 01 Voltage Voltage 21
  • 22. @_U_10kHz, Sample 2, Location1. @_D_10KHz, Sample 2, Location1. 6.00E-09 6.00E-09 5.00E-09 5.00E-09 Capacitance Capacitance 4.00E-09 4.00E-09 3.00E-09 3.00E-09 2.00E-09 2.00E-09 1.00E-09 1.00E-09 0.00E+00 0.00E+00 -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0 1.50E+0 -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0 1.50E+0 01 00 0 0 1 1 01 00 0 0 1 1 Voltage Voltage @_D_10MHz, Sample 2, Location1. @_U_10MHz, Sample 2, Location1. 1.60E-09 1.60E-09 1.40E-09 1.40E-09 1.20E-09 Capacitance 1.20E-09 1.00E-09 Capacitance 1.00E-09 8.00E-10 8.00E-10 6.00E-10 6.00E-10 4.00E-10 4.00E-10 2.00E-10 2.00E-10 0.00E+00 0.00E+00 -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0 1.50E+0 -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0 1.50E+0 01 00 0 0 1 1 01 00 0 0 1 1 Voltage Voltage @_U_100kHz, Sample 2, Location1. @_D_100KHz, Sample 2, Location1. 2.50E-09 3.00E-09 2.00E-09 2.50E-09 Capacitance Capacitance 1.50E-09 2.00E-09 1.50E-09 1.00E-09 1.00E-09 5.00E-10 5.00E-10 0.00E+00 0.00E+00 -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0 1.50E+0 -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0 1.50E+0 01 00 0 0 1 1 01 00 0 0 1 1 Voltage Voltage 22
  • 23. @_U_1MHz, Sample 2, Location1. @_D_1MHz, Sample 2, Location1. 2.50E-09 2.50E-09 2.00E-09 2.00E-09 Capacitance Capacitance 1.50E-09 1.50E-09 1.00E-09 1.00E-09 5.00E-10 5.00E-10 0.00E+00 0.00E+00 -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0 1.50E+0 -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0 1.50E+0 01 00 0 0 1 1 01 00 0 0 1 1 Voltage Voltage @_U_1kHz, Sample 2, Location1. @_D_1kHz, Sample 2, Location1. 7.00E-09 7.00E-09 6.00E-09 6.00E-09 Capacitance Capacitance 5.00E-09 5.00E-09 4.00E-09 4.00E-09 3.00E-09 3.00E-09 2.00E-09 2.00E-09 1.00E-09 1.00E-09 0.00E+00 0.00E+00 -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0 1.50E+0 -1.00E+ -5.00E+ 0.00E+0 5.00E+0 1.00E+0 1.50E+0 01 00 0 0 1 1 01 00 0 0 1 1 Voltage Voltage Thus we see that the f lms are stable for i A nnealing at higher temperatures in the sense that their Up and Dow n S weep produce sa me C-V curve. Figure 44. The Ideal C-V Curve for a p - type substrate. Just take a mirror image for the case of n-Type. 23
  • 24. The Film Thickness Measurements Figure 37. Figure 38. Sample annealed at 650 oC. Figure 39. Figure 40. o Sample annealed at 750 C. 24
  • 25. XRD Patterns XRD Patterns for 600, 650, 700, 750 oC annealed Samples. Figure 41. The X-Ray diffract ion patterns were studied and peaks characterized for t different phases present he . X-ray diffraction profiles were obtained using a Cu Kα radiation source at 30 kV and 20 m A tube current and a sweep rate of 3 ° / min. .0 Te mperature °C I 006/ I 117 I 111/ I 117 I 200/ I 117 I 311/ I 117 750 (15 min) 12/20 5/20 3/20 2/20 750 (30 min) 26/57 13/57 7/57 3/57 750 (60 min) 5.69/15.82 2.6/15.82 1.31/15.82 2.49/15.82 600 18.37/25 11.25/25 5/25 2/25 650 46.72/76.37 24.10/76.37 8.27/76.37 5.50/76.37 700 30/65.26 15/65.26 11/65.26 4/65.26 750 5.69/15.82 2.6/15.82 1.31/15.82 2.49/15.82 A nnealing Time( min) 60 60 60 60 25
  • 26. Intensity Variation as a function of annealing time and temperature Variation of Intensity ratio Vs Variation of Intensity Ratio Vs Temperature Annealing Time at Constant annealing time(60 min.) 0.7 0.8 0.6 In te n s ity R a tio 0.5 I006/I117 0.6 I006/I117 I / I m ax 0.4 I111/I117 I111/I117 0.4 0.3 I200/I117 I200/I117 0.2 I311/I117 0.2 I311/I117 0.1 0 0 0 20 40 60 80 600 650 700 750 800 Time (min). Temperature Figure 43. The following points can be concluded fro m the above plots: The X R D pat terns sho w the f lms are polycrystal i with preferred ~(117) or i l ne ientation. Pyrochlore phase is absent . Correct peak posi ions i t ndicate that S m ions dissolve into the pseudo perovski s ructure. te t The (117) peak intensi increased w. . o ty r t ther peaks with increasing annealing temperature and t m e i indicating i s preferred nature. t 26
  • 27. Conclusion and Future work The B T O solut ion was prepared by mixing Bism uth ni rate, Sa mariu m nitrate and t taniu m IsoPropoxide in t , i glacial acet c acid. Ini i ly bismuth ni rate was dissolved in acet acid in a ref i t al t ic lux condenser heated at a [4] temperature of ~80 °C for 2 hrs . W h en the solut ion becam e transparent t taniu m IsoPropoxide was mixed , i in a proper m olar rat with constant st r ing at roo m te mperature to form a yel io ir low-gold Fig. 4, t ransparent solution. However, for B T O syste m the problem is in solution, the bism uth precursor reacts easi with H2 O ly [1] to yield white precipi t BiO N O 3 ta e and hence the solution is unstable and deco mposes within a short t ime. Therefore, i is necessary to f t ind another path to synthesize Sols having stabi i over longer per l ty iod. Earl ier [4] studies on the stabi i of the Sols sho wed that the alkoxide–alkanola mine l ty syste m has an excel lent dissolving po wer for many inorganic sal and a long-term stabil ty to hydrolysis and condensat ts i ion. Alkoxide– [1] alkanola mine was thus very effect ve in preparing PbTiO3 thin f lms and their resul sho w ed that lead i i ts acetate of acetyl acetone gives a clear and stable solut ion. Based on this concept, we have added acetyl acetone, and the precursor solut ion was found to be stable against precipi t ta ion for several days indicat , ing that the addition of alcohol prevents Bi(N O3 )3 fr m hydrolysis o . In the future study, Pt/Si(1 0 0) and bare si icon substrates are going to be used for the deposi ion of BT O thin l t f lms. The substrates will be cleaned in acetone, Carbon Tetra Chlor i ide and rinsed in de-ionised water , followed by a drying process A plat m layer of thickness ~500 Å will be deposi ed on the (1 0 0) oriented . inu t Si substrates at roo m tem perature to act as the botto m electrode for electr ical character ization. The precursor [3] solut ion wil be spin coated onto the substrates by using a spin coater at 2300 rp m for so me 60 s . After spin l coat ing the substrates t f lms will to be kept in a mbient air for 1 h to form gel f lms by hydrolysis and , he i i poly merizat on. Spin coat i ing process wil be repeated 3–5 t l imes to obta f lms with desired thickness in i , [3] followed by pyrolysis of each layer at 350 °C for 10 min . Heat t reatment of dried f l wil be carr im l ied out in a tube furnace at the tem perature range 400–600 °C for 1 h in an atmosphere of ei ther flowing oxygen or [3] air . Crystal izat l ion, densif ication and microstructure of the f lms wil be exa mined by X-ray diffracto meter i l [3] with Cu K• radiat ion ( =1.5405 Å) and/or a mic force microscope . to To su m marize: The X R D pat terns Figure 41, 43 are sho wing the preferred ~ (171) {Excluding the substrate peak} orientat ion, and thus there is no pyrochlore phase. The correlat ion of the diffract ion peaks of the B S m T thin films with those of BIT im plies that S m subst tution does not affect the layered-perovski i te structure of BIT. This fact indicates that the S m ions in the BS m T films do not form a pyrochlore phase, but dissolve into the pseudo perovski st te ructure. Therefore, i see ms that S m ions ~1.0 Å can readily subst tute for t i Bi ions ~1.03 Å in pseudo perovski e structure, and part l subst tut t ia i ion of S m ions for Bi ions in BIT influenced by the s ructure of the Bi l t ayer. Having deposi ted the Thin Fi lms at various te mperature ranges and checked the f lms for oxide i leakage charges by doing the C-V measure ments and character , ization done for the X R D pat terns obtained, we look forward to do the A F M analysis for microstructure level analysis and further we will be doing the Polarization Vs E measurements . 27
  • 28. The peak intensi ies increased, and the ful width at hal maximum of the peaks decreased with t l f increasing anneal ing tem perature; i can be assu med that the grain size was increasing with anneal t ing temperature. (Figure 10) sho ws the surface FE-SE M micrographs of BSm T thin f l i ms as funct ons of anneal i ing temperatures The surface morphology is very sensi ive to the anneal . t ing te mperature The BSm T thin . f lm annealed at 750 °C @ Fig. 2 exhibi i ted coarse grains and considerable a mounts of secondary structures am ong the grains. The grain s ze of the BSm T fi i lms increased with increasing anneal ing tem perature . See figures (10–36). The (Bi: Sm): Ti :: 1 58 : 1. {Expected rat 1 . io: .33: 1}. The pH of our Sol was found to be ~1-2. These facts can be concluded: 1. The crystal growth is preceded and the ferroelectr propert ic ies of the BS m T fi m s can be l improved by increasing t anneal he ing temperature. 2. The BS m T films annealed at 700 °C have round-plate- ike grains of ~300 nm (Figure 36). l 3. The Thickness of the f l varies around 0.5 Micro meters (Figure 37) i ms . C- V measure ments show that there is approxim ately the sa me path reversed for both the Up S weep and Do wn Sweep, which implies that the leakage through the oxide layer i smalls . O n Overlapping the C-V curves for different frequencies one f inds a sort of Hysteresis loop being generated. This is due to the slow ST A T E S, which do not e mpty out fast enough even to slow D C S weeps. Study the thermal stabi i of such fi l ty lms by anneal ing at different temperatures for different lengths of time. W e wil also study the deposi l ted f l propert in terms of Vacancies and Stress / St ins present via im ies ra various methods l ike X-Ray Diffraction, TE M. X R D and SE M Characterizat ion. The surface roughness of the f lm is also an important para m eter taking into account the possibi i of i l ty further metal izat l ion on the ferroelect ic f lm in the FeR A M s device fabricat r i ion process. Thus, AF M micrographs of the BS m T thin f lms as funct i ions of anneal ing te mperature wil be taken to probe m ore l into this feature. [5] Fro m these analyses we are looking to f , ind that t root mean square ~r ms surface roughness of the he B S m T thin f lms increases with increasing anneal i ing te mperature. An effect which m ay be related to the increase of the grain size with increasing anneal ing te mperature The rms surface roughnesses of . B S m T thin films are expected to vary fro m 4.01 to 6.74 n m for anneal ing te mperatures n the range of [5] 650–750 °C . 28
  • 29. References: 1. Lanthanum-Substituted Bismuth Titanate for use in non-volatile memories; B.H.Park,B.S.Kang,S.D.Bu,T.W.NOH,J.Lee & W.Jo; NATURE Vol 401 14th October 1999. 2. Why Lanhanum-substituted BiT becomes fatigue free in a ferroelectric capacitor with Pt electrodes; Y.Ding, J.S.LIU, H.X.Qin, J.S.ZHU, and Y.N.Wang. Appl. Phys. Lett.Volume 78, Number 26. 3. Growth of uniformly a-axis-oriented ferroelectric lanthanum- substituted Bismuth titanate films on silicon substrates; Ho Nyung Lee,a) Dietrich Hesse, Nikolai Zakharov, Sung Kyun Lee, and Ulrich Go¨ sele. Max-Planck Institut fu¨r Mikrostrukturphysik, Weinberg 2, D-06120 Halle (Saale), Germany ~Received 25 July 2002; accepted 14 February 2003. Appl. Phys. Lett Volume 93, Number 9 1 May 2003. 4. Sol–gel synthesis and property studies of layered perovskite bismuth titanate thin films - S. Madeswaran, N. V. Giridharan and R. Jayavel; Materials Chemistry and Physics 80 (2003) 23–28. 5. Large remanent polarization of cerium-modified bismuth–titanate thin films for ferroelectric random access memories. Kyoung-Tae Kim and Chang-Il Kim School of Electrical & Electronic Engineering, Chungang University, 221, Huksuk-Dong, Dongjak-Gu,Seoul 156-756, Korea. © 2003 American Vacuum Society. 6. Effects of precursor solution pH value and substrate texture on orientation degree of sol-gel-derived bismuth titanate thin films Haoshuang Gu, Wanqiang Cao, Rui Song, Xiaoyuan Zhou, John Wan physica status solidi (a)Volume 198, Issue 2, 2003. Pages 282-288 Copyright © 2003 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim 29