Omnex semiconductor1 may_2000


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Omnex semiconductor1 may_2000

  1. 1. ISO 9001:2000 ISO 9004:2000 TS-16949:1999 Chad Kymal - Omnex Ron Ramos - Philips Standards Affecting the Future OMNEX
  2. 2. Proposed SAC Quality System Standard SAC Quality System Standard = ISO 9001 + ISO 9004 + ISO/TS 16949 + QS-9000 Semiconductor Supplement + SAC Value added practices SAC Requirements ISO 9004:2000 + TS-16949 ISO 9001:2000
  3. 3. ISO 9001:2000 <ul><li>Currently released as a Draft International Standard </li></ul><ul><li>The ISO 9001:2000 International Standard will be released in the fourth quarter </li></ul><ul><li>Companies will have to conform to the new standard by fourth quarter 2003 </li></ul>Process Model PLAN PLAN CHECK/ ACT DO
  4. 4. ISO 9004:2000 <ul><li>Fully embraces the management principles of current management theory </li></ul><ul><li>Synergistic with ISO 9001:2000 and provides guidelines for implementation and overall performance enhancement </li></ul><ul><li>Enhances ISO 9001:2000 </li></ul>Management Principles
  5. 5. ISO 9001:2000 A Business Model <ul><li>Quality defined as - “meeting the needs and expectations of customers and interested parties” </li></ul><ul><li>Process model focusing on process management </li></ul><ul><li>Quality/Business objectives at each relevant function and level </li></ul><ul><li>Business processes for product realization </li></ul><ul><li>Measurement of business process </li></ul><ul><li>Measurement of customer satisfaction </li></ul><ul><li>Improvement of processes and customer satisfaction </li></ul>This is the quality standard your management always wanted
  6. 6. ISO/TS 16949:1999 <ul><li>ISO/TS 16949 harmonizes the supplier quality system requirements of Standards from the US, Germany, Italy, and France with the purpose of having a single document and registration scheme that the European and US industries would accept. </li></ul>
  7. 7. ISO/TS 16949:1999 <ul><li>This document follows the same structure as ISO 9001:1994 and is acceptable in lieu of (some conditions apply): </li></ul><ul><ul><li>QS-9000 Quality System Requirements, 3rd Edition </li></ul></ul><ul><ul><li>VDA 6, Part 1: Quality System Audit </li></ul></ul><ul><ul><li>AVSQ’94 Guida per l’applicazione (guidelines for use) </li></ul></ul><ul><ul><li>Evaluation Aptitude Qualité Fournisseur (EAQF 94) </li></ul></ul>
  8. 8. ISO/TS 16949 Influences QS 9000 ISO 9001:2000 VDA 6.1 Other European Standards TS 16949: 1999
  9. 9. Future of ISO/TS 16949 & Implications to QS-9000 <ul><li>2000-2001: ISO 9000:2000 & ISO/TS 16949, 2nd Edition (harmonized US, European, and Asia-Pacific Standard) </li></ul><ul><ul><li>planned for release in mid-2001 </li></ul></ul><ul><ul><li>Note: Asia-Pacific includes: Japan, Korea, and Malaysian automotive manufacturers </li></ul></ul><ul><li>QS-9000 is not getting revised to include ISO 9001:2000 </li></ul><ul><li>ISO has imposed 3-year deadlines (end of ISO 2003) to adopt ISO 9001:2000 </li></ul><ul><ul><li>QS-9000 registered companies stand to lose ISO certification </li></ul></ul>
  10. 10. Why ISO 9001 + ISO/TS 16949 + ISO 9004 + Semiconductor Supplement <ul><li>ISO 9001:2000 will be released in the 4th quarter of 2000 and ISO 9001:1994 will become obsolete </li></ul><ul><li>ISO/TS 16949 is already internationally accepted </li></ul><ul><ul><li>USA and Europe today </li></ul></ul><ul><ul><li>USA, Europe, and Asia-Pacific mid next year </li></ul></ul><ul><li>ISO/TS 16949 will be upgraded to ISO 9001:2000 while QS-9000 will not </li></ul>The Semiconductor industry—as leaders—always stay ahead the pack
  11. 11. SAC Best Practices <ul><li>Key Performance Measures </li></ul><ul><ul><li>Overall yield percentage </li></ul></ul><ul><ul><li>Outgoing PPM </li></ul></ul><ul><ul><li>Cycle Time </li></ul></ul><ul><ul><li>On time delivery/performance to schedule </li></ul></ul><ul><ul><li>Cost trend </li></ul></ul><ul><ul><li>Number of customer complaints </li></ul></ul><ul><ul><li>Customer complaint response time </li></ul></ul>
  12. 12. SAC Best Practices <ul><li>Process performance measures </li></ul><ul><ul><li>Design first pass success </li></ul></ul><ul><ul><li>Percent Cpk > 1.67 </li></ul></ul><ul><ul><li>Productivity trend </li></ul></ul><ul><ul><li>Operating Equipment Efficiency (OEE) </li></ul></ul><ul><ul><li>Equipment uptime trend </li></ul></ul><ul><ul><li>Equipment MTBF/MTTR </li></ul></ul><ul><ul><li>Tool lifetime limits prevent tool wear from affecting the process/products </li></ul></ul>
  13. 13. SAC Best Practices <ul><li>FMEA usage to prevent problems and improve processes </li></ul><ul><li>Processes and product </li></ul><ul><ul><li>Characterization </li></ul></ul><ul><ul><li>Optimization </li></ul></ul><ul><li>Package and process qualification standard </li></ul><ul><li>Suppliers use SAC requirements </li></ul><ul><li>Computer-based identification and traceability </li></ul>
  14. 14. SAC Best Practices <ul><li>Environmental controls </li></ul><ul><ul><li>Temperature </li></ul></ul><ul><ul><li>Relative Humidity (RH) </li></ul></ul><ul><li>Process control and monitor guidelines </li></ul><ul><li>Statistical Process Controls </li></ul><ul><ul><li>Effective - result in improvement </li></ul></ul><ul><ul><li>Require action for all out-of-control events </li></ul></ul><ul><ul><li>Reduce number of out-of-control events </li></ul></ul><ul><li>Continuous improvement in all activities </li></ul>
  15. 15. SAC Results <ul><li>Productivity improvements </li></ul><ul><ul><li>Equipment 10 - 30% </li></ul></ul><ul><ul><li>People 10 - 30% </li></ul></ul><ul><li>Yield improvement </li></ul><ul><ul><li>Subcontractor yield - 99.88% (higher than Mfg) </li></ul></ul><ul><li>Performance to schedule improvement </li></ul><ul><ul><li>Attaining 100% </li></ul></ul><ul><li>Number of customer complaints decreases </li></ul><ul><ul><li>Up to 10x reduction </li></ul></ul>
  16. 16. SAC Results <ul><li>Cost reduction </li></ul><ul><ul><li>Plating chemicals 10 - 30% </li></ul></ul><ul><ul><li>Tooling (increased lifetimes) 10 - 30% </li></ul></ul><ul><li>Outgoing PPM </li></ul><ul><ul><li>Mechanical < 10 PPM </li></ul></ul><ul><ul><li>Electrical < 5 PPM </li></ul></ul><ul><li>Cpk > 1.67 97% </li></ul><ul><li>Cycle time < 3 Days </li></ul>
  17. 17. Measurables and Controlables <ul><li>Wafer Saw - chips/cracks/backside cracks </li></ul><ul><ul><li>Blade RPM & feed speed, blade exposure </li></ul></ul><ul><li>Die attach - glue line thickness/die tilt </li></ul><ul><ul><li>Force/time & glue amount/distribution </li></ul></ul><ul><li>Wire bond - ball shear/wire pull/nonstick on pad/post </li></ul><ul><ul><li>1st bond power/force/time </li></ul></ul><ul><ul><li>2nd bond power/force/time </li></ul></ul><ul><ul><li>Capillary lifetime </li></ul></ul>
  18. 18. Measurables and Controlables <ul><li>Mold - bubbles/voids/incomplete fill - DPM mold flash thickness & amount/bleedout </li></ul><ul><ul><li>Temperature/time/compound moisture content </li></ul></ul><ul><ul><li>Mold wear </li></ul></ul><ul><li>Ink mark - legibility/light mark/smeared mark/incomplete characters </li></ul><ul><ul><li>Ink viscosity/platen pressure/pad wear </li></ul></ul><ul><li>Laser mark - contrast/incomplete characters </li></ul><ul><ul><li>Beam power/pulse duration & frequency </li></ul></ul>
  19. 19. Measurables and Controlables <ul><li>Solderplate - minimum & maximum thickness/composition </li></ul><ul><ul><li>Bath composition/replenishment frequency </li></ul></ul><ul><li>Trim/form/singulation - burr length/lead coplanarity & dimensions </li></ul><ul><ul><li>tool lifetime </li></ul></ul>