Successfully reported this slideshow.
We use your LinkedIn profile and activity data to personalize ads and to show you more relevant ads. You can change your ad preferences anytime.

Omnex semiconductor1 may_2000

507 views

Published on

  • Be the first to comment

  • Be the first to like this

Omnex semiconductor1 may_2000

  1. 1. ISO 9001:2000 ISO 9004:2000 TS-16949:1999 Chad Kymal - Omnex Ron Ramos - Philips Standards Affecting the Future OMNEX
  2. 2. Proposed SAC Quality System Standard SAC Quality System Standard = ISO 9001 + ISO 9004 + ISO/TS 16949 + QS-9000 Semiconductor Supplement + SAC Value added practices SAC Requirements ISO 9004:2000 + TS-16949 ISO 9001:2000
  3. 3. ISO 9001:2000 <ul><li>Currently released as a Draft International Standard </li></ul><ul><li>The ISO 9001:2000 International Standard will be released in the fourth quarter </li></ul><ul><li>Companies will have to conform to the new standard by fourth quarter 2003 </li></ul>Process Model PLAN PLAN CHECK/ ACT DO
  4. 4. ISO 9004:2000 <ul><li>Fully embraces the management principles of current management theory </li></ul><ul><li>Synergistic with ISO 9001:2000 and provides guidelines for implementation and overall performance enhancement </li></ul><ul><li>Enhances ISO 9001:2000 </li></ul>Management Principles
  5. 5. ISO 9001:2000 A Business Model <ul><li>Quality defined as - “meeting the needs and expectations of customers and interested parties” </li></ul><ul><li>Process model focusing on process management </li></ul><ul><li>Quality/Business objectives at each relevant function and level </li></ul><ul><li>Business processes for product realization </li></ul><ul><li>Measurement of business process </li></ul><ul><li>Measurement of customer satisfaction </li></ul><ul><li>Improvement of processes and customer satisfaction </li></ul>This is the quality standard your management always wanted
  6. 6. ISO/TS 16949:1999 <ul><li>ISO/TS 16949 harmonizes the supplier quality system requirements of Standards from the US, Germany, Italy, and France with the purpose of having a single document and registration scheme that the European and US industries would accept. </li></ul>
  7. 7. ISO/TS 16949:1999 <ul><li>This document follows the same structure as ISO 9001:1994 and is acceptable in lieu of (some conditions apply): </li></ul><ul><ul><li>QS-9000 Quality System Requirements, 3rd Edition </li></ul></ul><ul><ul><li>VDA 6, Part 1: Quality System Audit </li></ul></ul><ul><ul><li>AVSQ’94 Guida per l’applicazione (guidelines for use) </li></ul></ul><ul><ul><li>Evaluation Aptitude Qualité Fournisseur (EAQF 94) </li></ul></ul>
  8. 8. ISO/TS 16949 Influences QS 9000 ISO 9001:2000 VDA 6.1 Other European Standards TS 16949: 1999
  9. 9. Future of ISO/TS 16949 & Implications to QS-9000 <ul><li>2000-2001: ISO 9000:2000 & ISO/TS 16949, 2nd Edition (harmonized US, European, and Asia-Pacific Standard) </li></ul><ul><ul><li>planned for release in mid-2001 </li></ul></ul><ul><ul><li>Note: Asia-Pacific includes: Japan, Korea, and Malaysian automotive manufacturers </li></ul></ul><ul><li>QS-9000 is not getting revised to include ISO 9001:2000 </li></ul><ul><li>ISO has imposed 3-year deadlines (end of ISO 2003) to adopt ISO 9001:2000 </li></ul><ul><ul><li>QS-9000 registered companies stand to lose ISO certification </li></ul></ul>
  10. 10. Why ISO 9001 + ISO/TS 16949 + ISO 9004 + Semiconductor Supplement <ul><li>ISO 9001:2000 will be released in the 4th quarter of 2000 and ISO 9001:1994 will become obsolete </li></ul><ul><li>ISO/TS 16949 is already internationally accepted </li></ul><ul><ul><li>USA and Europe today </li></ul></ul><ul><ul><li>USA, Europe, and Asia-Pacific mid next year </li></ul></ul><ul><li>ISO/TS 16949 will be upgraded to ISO 9001:2000 while QS-9000 will not </li></ul>The Semiconductor industry—as leaders—always stay ahead the pack
  11. 11. SAC Best Practices <ul><li>Key Performance Measures </li></ul><ul><ul><li>Overall yield percentage </li></ul></ul><ul><ul><li>Outgoing PPM </li></ul></ul><ul><ul><li>Cycle Time </li></ul></ul><ul><ul><li>On time delivery/performance to schedule </li></ul></ul><ul><ul><li>Cost trend </li></ul></ul><ul><ul><li>Number of customer complaints </li></ul></ul><ul><ul><li>Customer complaint response time </li></ul></ul>
  12. 12. SAC Best Practices <ul><li>Process performance measures </li></ul><ul><ul><li>Design first pass success </li></ul></ul><ul><ul><li>Percent Cpk > 1.67 </li></ul></ul><ul><ul><li>Productivity trend </li></ul></ul><ul><ul><li>Operating Equipment Efficiency (OEE) </li></ul></ul><ul><ul><li>Equipment uptime trend </li></ul></ul><ul><ul><li>Equipment MTBF/MTTR </li></ul></ul><ul><ul><li>Tool lifetime limits prevent tool wear from affecting the process/products </li></ul></ul>
  13. 13. SAC Best Practices <ul><li>FMEA usage to prevent problems and improve processes </li></ul><ul><li>Processes and product </li></ul><ul><ul><li>Characterization </li></ul></ul><ul><ul><li>Optimization </li></ul></ul><ul><li>Package and process qualification standard </li></ul><ul><li>Suppliers use SAC requirements </li></ul><ul><li>Computer-based identification and traceability </li></ul>
  14. 14. SAC Best Practices <ul><li>Environmental controls </li></ul><ul><ul><li>Temperature </li></ul></ul><ul><ul><li>Relative Humidity (RH) </li></ul></ul><ul><li>Process control and monitor guidelines </li></ul><ul><li>Statistical Process Controls </li></ul><ul><ul><li>Effective - result in improvement </li></ul></ul><ul><ul><li>Require action for all out-of-control events </li></ul></ul><ul><ul><li>Reduce number of out-of-control events </li></ul></ul><ul><li>Continuous improvement in all activities </li></ul>
  15. 15. SAC Results <ul><li>Productivity improvements </li></ul><ul><ul><li>Equipment 10 - 30% </li></ul></ul><ul><ul><li>People 10 - 30% </li></ul></ul><ul><li>Yield improvement </li></ul><ul><ul><li>Subcontractor yield - 99.88% (higher than Mfg) </li></ul></ul><ul><li>Performance to schedule improvement </li></ul><ul><ul><li>Attaining 100% </li></ul></ul><ul><li>Number of customer complaints decreases </li></ul><ul><ul><li>Up to 10x reduction </li></ul></ul>
  16. 16. SAC Results <ul><li>Cost reduction </li></ul><ul><ul><li>Plating chemicals 10 - 30% </li></ul></ul><ul><ul><li>Tooling (increased lifetimes) 10 - 30% </li></ul></ul><ul><li>Outgoing PPM </li></ul><ul><ul><li>Mechanical < 10 PPM </li></ul></ul><ul><ul><li>Electrical < 5 PPM </li></ul></ul><ul><li>Cpk > 1.67 97% </li></ul><ul><li>Cycle time < 3 Days </li></ul>
  17. 17. Measurables and Controlables <ul><li>Wafer Saw - chips/cracks/backside cracks </li></ul><ul><ul><li>Blade RPM & feed speed, blade exposure </li></ul></ul><ul><li>Die attach - glue line thickness/die tilt </li></ul><ul><ul><li>Force/time & glue amount/distribution </li></ul></ul><ul><li>Wire bond - ball shear/wire pull/nonstick on pad/post </li></ul><ul><ul><li>1st bond power/force/time </li></ul></ul><ul><ul><li>2nd bond power/force/time </li></ul></ul><ul><ul><li>Capillary lifetime </li></ul></ul>
  18. 18. Measurables and Controlables <ul><li>Mold - bubbles/voids/incomplete fill - DPM mold flash thickness & amount/bleedout </li></ul><ul><ul><li>Temperature/time/compound moisture content </li></ul></ul><ul><ul><li>Mold wear </li></ul></ul><ul><li>Ink mark - legibility/light mark/smeared mark/incomplete characters </li></ul><ul><ul><li>Ink viscosity/platen pressure/pad wear </li></ul></ul><ul><li>Laser mark - contrast/incomplete characters </li></ul><ul><ul><li>Beam power/pulse duration & frequency </li></ul></ul>
  19. 19. Measurables and Controlables <ul><li>Solderplate - minimum & maximum thickness/composition </li></ul><ul><ul><li>Bath composition/replenishment frequency </li></ul></ul><ul><li>Trim/form/singulation - burr length/lead coplanarity & dimensions </li></ul><ul><ul><li>tool lifetime </li></ul></ul>

×