Design for Testability (DFT) is not a new concept. It has been used with electronic appliance design for over 50 years. The reason there is simple: if you want to be able to test an built-in circuit both during the design stage and later in development, you have to design it so that it can be tested. Contact for design for testability, @ http://www.vayoinfo.com/design-for-testability/

1. intelligent software, pleasant work
www.vayoinfo.com
Design for Ttestability
Intelligent DFx analysis

2. Stage Defects Remark
Design
• No thermal
consideration
• Annual ring small
• Silkscreen error
• Silkscreen
incomplete
• …
>30% PCB
design
comes with
problem.
Manufacturi
ng
• Short
• Open
• Tombstone
• Cold solder
• Void
• …
>60%
defects
could be
found prior
to build
Post-sales
• Solder joint crack
• Solder joint peeloff
• …
Repair rate
for
consumer
product:
5%~37% in
initial 3
years
 Quality/reliability defects
IPC research:
80% defects could be found and resolved at NPI
stage.
Crack risk
No thermal consideration,
leads to cold solder, impact
solder strength
Silkscreen cross brings
build and rework risk
Via is too close to parts, it
leads to poor solder joint,
impact solder joint strength
NonwettingTombstone Bridge Void
Are you always willing to stay with those issues?

3. Past Yesterday Today
Vayo DFx software help you detect defects from the initial beginning.
Above issues puzzles most of us. Vayo customer solved this issue.
Ex.: Venture/SurfaceArt/Sierra/Sandisk…
They may still happen at your side.
Change from DFx

4.  Founded on Jan of 2005, headquarter in China/Shanghai;
 Dedicates to intelligent NPI software to accelerate design to manufacturing;
 Fully in-house development, owns copyrights and patents;
 Product installed >20 countries and regions worldwide;
 Strategy partnership with equipment and EDA provider: Keysight/ViTrox/TRI/Fuji/Panasonic/Altium…
>10 years dedication on NPI technology brings up the world-class product.
Company introduction

5.  Predict defect opportunity,
increase manufacturing quality
and reduce cost
IPC research:
80% defects could be found and
resolved at NPI stage.
With DFx consideration:
Increase process difficulty &
steps; rapid solder/assembly
defects; increase rework rate
and work loading; lower work
efficiency and increase
manufacturing cost
Why DFx: predict/solve process issue

6. Thanks!intelligent software, pleasant work
www.vayoinfo.com