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The document is a technical presentation about the IBM System x3850 X5 server from March 2009. It provides an overview of the flagship 4-socket, 4U rack-optimized server including specifications such as support for 4 Intel Xeon 7500-series CPUs, 64 DDR3 DIMMs, 6 PCIe slots, RAID support, and 2 10Gb Ethernet ports. Details are given about optimal configurations for database and virtualization workloads.

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© 2009 IBM Corporation IBM Confidential x3850 X5 Technical Presentation March 30, 2009 Ralph M. Begun System Development Lead begun@us.ibm.com Michelle Gottschalk WW Product Manager mgottsc@us.ibm.com
© 2009 IBM Corporation System x and BladeCenter 2 IBM Confidential NDA DISCLOSURE ONLY x3850 X5 overview
© 2009 IBM Corporation System x and BladeCenter 3 IBM Confidential NDA DISCLOSURE ONLY IBM System x3850 X5 Flagship System x platform for leadership scalable performance and capacity Versatile 4-socket, 4U rack-optimized scalable enterprise server provides a flexible platform for maximum utilization, reliability and performance of compute- and memory-intensive workloads. System Specifications  4x Intel Xeon 7500-series CPUs  64 DDR3 DIMMs, up to 96 with MAX5  6 open PCIe slots (+ 2 additional)  Up to 8x 2.5” HDDs or 16x 1.8” SSDs  RAID 0/1 Std, Optional RAID 5/6  2x 1GB Ethernet LOM  2x 10GB Ethernet SFP+ Virtual Fabric / FCoEE  Scalable to 8S, 128 DIMM  Internal USB for embedded hypervisor  IMM, uEFI & IBM Systems Director Maximize Memory – 64 threads and 1TB capacity for 3.3x database and 3.6x the virtualization performance over industry 2-socket x86 (Intel Xeon 5500 Series) systems – MAX5 memory expansion for 50% more virtual machines and leadership database performance Minimize Cost – Lower cost, high performance configurations reaching desired memory capacity using less expensive DIMMs – eXFlash 480k internal IOPs for 40x local database performance and $1.3M savings in equal IOPs storage Simplify Deployment – Pre-defined database and virtualization workload optimized systems for faster deployment and faster time to value
© 2009 IBM Corporation4 System x® and BladeCenter MAX5 x3850 X5 and x3950 X5 Models x3850 X5 – Four Socket Scalable Server IBM System x high end four-socket server with Intel 7500 Series processors, IMM, RAID 0,1, dualGigE, Emulex 10GigE, 2x1975W power supplies x3850 X5 x3850 X5 – Memory Expanded Four Socket Scalable Server IBM System x high end four-socket scalable server with MAX5, IMM, RAID 0,1, dualGigE, Emulex 10GigE, 1x4QPI cable kit, 2x1975W power supplies . Workload Optimized Models Richly-configured models optimized for virtualization environments or database workloads x3850 X5 7145-1RY 2x E7520 4 Core 1.86GHz18MB x4.8 95W (S4S), 4x4GB 7145-2RY 2x E7530 6 Core 1.86GHzT,12MB x5.86 105W (S4S), 4x4GB 7145-3RY 2x E7540 6 Core 2.0GHzT,18MB x6.4 105W (S8S), 4x4GB 7145-4RY 2x X7550 8 Core 2.0GHzT,18MB x6.4 130W (S8S), 4x4GB 7145-5RY 2x X7560 8 Core 2.27GHzT,24MB x6.4 130W (S8S), 4x4GB 7145-E4Y 2x X7550 8 Core 2.0GHzT,18MB x6.4 130W (S8S), 4x4GB x3850 X5 7145-2SY 4x E7530 6 Core 1.86GHzT,12MB x5.86 105W (S4S), 8x4GB + eX5 MAX5, 2x2GB 7145-4SY 4x X7550 8 Core 2.0GHzT,18MB x6.4 130W (S8S) 8x4GB + eX5 MAX5, 2x2GB 7145-5SY 4x X7560 8 Core 2.27GHzT,24MB x6.4 130W (S8S) 8x4GB + eX5 MAX5, 2x2GB x3950 X5 Virtualization Optimized Models 7145-4DX 4x X7550 Turbo 2.0GHz/6.4GTS-18MB 8C 130W. 64x4GB, +eX5 MAX5, 32x4GB, VMWare ESXi Hypervisor USB key x3850 X5 Database Optimized Models 7145-5DY 2x X7560 Turbo 2.26GHz/6.4GTS-24MB 8C 4QPI, 8x4GB, 2x1975W, IMM, 1 x Intruder backplane, dual GigE, Emulex 10GigE 7145-4FY 4 x X7550 Turbo 2.0GHz/6.4GTS-18MB 8C 130W, 32x4GB, 16x1.8” 200GB SSD,RAID 5,6 7145-5GY 4 x X7560 Turbo 2.26GHz/6.4GTS-24MB 8C 130W, 32x4GB, 16x1.8”200GB SSD,RAID 5,6 x3850 X5 w/ MAX5
© 2009 IBM Corporation5 System x® and BladeCenter Intel Xeon chipset
© 2009 IBM Corporation6 System x® and BladeCenter Intel Boxboro-EX 4S design • Connectivity – Fully-connected (4 Intel® QuickPath interconnects per socket) – 6.4, 5.86, or 4.8 GT/s on all links – Socket-LS – With 2 IOHs: 82 PCIe lanes (72 Gen2 Boxboro lanes + 4 Gen1 lanes on unused ESI port + 6 Gen1 ICH10 lanes) • Memory – CPU-integrated memory controller – Registered DDR3-1066 DIMMs running at speeds of 800, 978 or 1066 MHz via on- board memory buffer – 64 DIMM support (4:1 DIMM to buffer ratio) • Technologies & Enabling – Intel® Intelligent Power Node Manager – Virtualization: VT-x, VT-d, & VT-c – Security: TPM 1.2, Measured Boot, UEFI – RAS features MB MBMB MBMB MBMB MB MB MBMB MBMB MBMB MB Intel® QuickPath interconnects BoxboroBoxboro X4 ESI BoxboroBoxboro ICH 10* XeonXeon XeonXeon x8x8 2x4 x8 x4x8 x8x8 x16 x8 x4x8 x16 2x4 2x4 2x4 X4PCIeGen1 XeonXeon XeonXeon 6
© 2009 IBM Corporation7 System x® and BladeCenter • Modified Boxboro-EX ingredients to offer a new high-memory 2S platform • Xeon 2S will only be validated with up to 2 IOHs • Xeon 2S SKUs cannot scale natively (w/ QPI) beyond 2skts • Xeon 2S SKUs can scale beyond 2skts with a node controller • Comparison w/ Boxboro-EX & Tylersburg-EP: Boxboro-EX 2S (2 IOH) Tylersburg-EP (2 IOH) # of cores per CPU Up to 8 Up to 4 QuickPath Interconnect 4^ 2 # of DIMMs 32 18 PCIe lanes 72+10 72+6 BoxboroBoxboro X4 ESI BoxboroBoxboro ICH 10* XeonXeon XeonXeon x8x8 2x4 x8 2x2 x4x8 x8x8 x16 x8 2x2 x4x8 x16 2x4 2x4 2x4 X4PCIeGen1 Intel® QuickPath interconnects Intel Boxboro-EX 2S Platform Validated Configuration 7
© 2009 IBM Corporation8 System x® and BladeCenter Xeon® 7500/6500 Platform Memory  4 Socket platform capability (64 DIMMs): – Up to 16 DDR3 DIMMs per socket via up to four Scalable Memory Buffers – Support for up to 16GB DDR3 DIMMs – 1TB with 16GB DIMMS  Memory types supported: – 1066MHz DDR3 – Registered (RDIMM) – Single-rank (SR), dual-rank (DR), quad-rank (QR)  Actual system memory speed depends on specific processor capabilities. (see NHM-EX SKU stack for max SMI link speeds per SKU): – 6.4GT/s SMI link speed capable of running memory speeds up to 1066Mhz – 5.86GT/s SMI link speed capable of running memory speeds up to 978Mhz** – 4.8GT/s SMI link speed capable of running memory speeds up to 800Mhz RDI MM RDI MM RDI MM RDI MM SMB XeonXeon 7500/65007500/6500 4 SMI 2 DDR3 Up to 16 DIIMS ^SMI^SMI/SMB = Intel Scalable Memory Interconnect / Scalable Memory Buffer ^SMI^SMI/SMB = Intel Scalable Memory Interconnect / Scalable Memory Buffer ** Memory speed sett by UEFI ; All channels in a system will run at the fastest common frequency 8
© 2009 IBM Corporation9 System x® and BladeCenter x3850 X5 system specifics
© 2009 IBM Corporation10 System x® and BladeCenter x3850 X5 – Chipset Basics Intel Xeon Intel Xeon Intel Xeon Intel Xeon MB1MB 1 MB 1 MB1 MB1MB1 MB1MB1 Intel Xeon Intel Xeon MB1MB 1 MB 1 MB1 MB1MB1MB1MB1 Intel Xeon Intel Xeon Intel BoxboroPCI-E Intel Boxboro PCI-E DDR3 Memory DIMMs Memory Buffer SMI Link to CPU Memory Card MB1 MB2 1 3 8 6 2 4 7 5 Memory Controller (1 of 2 per CPU) CPU’s connect via QPI bus 6.4 GT/s max Quick Path Interconnect
© 2009 IBM Corporation11 System x® and BladeCenter x3850 X5 – Block Diagram Intel Xeon Rack , Westmere EX drop in design, 4 CPUs, 64 DDR3, 7 PCIE, 8 HDD, QPI Cable to 8-socket 6.4GT/s SMI (FBD2) 16 buses Each @ 6.4GT/s (2B Rd/1B Wr) Cable or Wrap Xeon CPU4 QPI 64 DDR3 DIMMs 32 buses @ 1066M 2 DIMMs per bus QPI Xeon CPU1 Xeon CPU2 x8 x8 x8 Slot 6 QPI QPI Xeon CPU3 QPIQPI Slot 1x16 x4 x8 x8 Slot 2 SAS Slot 3 PC3-10600R LP DIMMs 1GB, x8, 1R, 1Gb 2GB, x8, 2R, 1Gb 4GB, x8, 4R, 1Gb 8GB, x8, 4R, 2Gb 16GB, x4, 4R, 2Gb Xeon 8-core 2.27 GHz IBM CONFIDENTIAL Boxboro1 ESI x4 ICH10 Southbridge USB LPC DVD 5709 EN ESI x4 x8 Slot 7 Slot 5 x4 + x4 Dual Gb 0 2 0 3 3 1 3 0 3 2 2 2 0 1 x4 Slot 4 1 0 1 0 1 1 Boxboro2 Memory Card 1 PROWL I/O and Power card PCIe SAS connector on CPU card MB1 MB2 1 3 2 4 8 6 7 50 01 1 1 2 Memory Card 3 MB1 MB2 1 3 2 4 8 6 7 50 01 1 2 1 Memory Card 4 MB1 MB2 2 4 1 3 7 5 8 6 0 01 1 3 4 Memory Card 7 MB1 MB2 1 3 2 4 8 6 7 50 01 1 2 1 Memory Card 8 MB1 MB2 2 4 1 3 7 5 8 6 0 01 1 3 4 Memory Card 2 MB1 MB2 2 4 1 3 7 5 8 6 0 01 1 4 3 Memory Card 5 MB1 MB2 1 3 2 4 8 6 7 50 01 1 1 2 Memory Card 6 MB1 MB2 2 4 1 3 7 5 8 6 0 01 1 4 3 STARSCREAM CPU Card iBMC, TPM 4 Back, 2 Front 8 Memory Cards Cable or Wrap 2 Int, 2 iBMC SATA PCIe Slots 1-4 Full Length Slot 2 has x8 connector PCIe Slots 5-7 Half Length Dual 10Gb
© 2009 IBM Corporation12 System x® and BladeCenter x3850/x3950 X5 - 4 Socket 4U EX platform 6 Fans 2x – 1975 W P/S 4U Rack Mechanical Chassis Front view (2x) 1975W Rear Access Hot Swap, Redundant P/S (4x) Intel Xeon EX CPU’s (8x) Memory Cards – 8 1066MHxDDR3 DIMMs per card 7x - PCIe Gen2 Slots 2x 60mm Hot Swap Fans (8x) Gen2 2.5” Drives (2x) 120mm Hot Swap Fans Dual USB DVD Drive Light Path Diagnostics RAID Card
© 2009 IBM Corporation13 System x® and BladeCenter x3850 X5 rear view QPI cables (2x) 1975W Rear Access Hot Swap, Redundant P/S w/120mm fan (4x) PCIe full length (3x) PCIe half length x8 Emulex 10Gb Ethernet Dual Backplane – SAS & SSD
© 2009 IBM Corporation14 System x® and BladeCenter x3850 X5 front view (2x) 1975W Rear Access Hot Swap, Redundant P/S (4x) Intel Xeon EX CPU’s (8x) Memory Cards – 8 1066MHxDDR3 DIMMs per card 7x - PCIe Gen2 Slots 2x 60mm Hot Swap Fans (8x) Gen2 2.5” Drives (2x) 120mm Hot Swap Fans Dual USB Light Path Diagnostics RAID Card DVD Drive 10Gb Ethernet Adapter
© 2009 IBM Corporation15 System x® and BladeCenter System Images - Interior PS1 PS2 Boxborro 2 Boxborro1 M5015 RAID HS Fan Pack PCIe x16 PCIe x4 PCIe x8 PCIe x8 PCIe x8 PCIe x8 PCIe x8 USB System Recovery Jumpers CPU1 CPU2 CPU3 CPU4Slot 7 Slot 6 Slot 5 Slot 4 Slot 3 Slot 2 Slot 1 Mem Card 1 Mem Card 2 Mem Card 3 Mem Card 4 Mem Card 5 Mem Card 6 Mem Card 7 Mem Card 8 SAS Backplanes + HDD Cage
© 2009 IBM Corporation16 System x® and BladeCenter New x3850 X5 memory card Specifications : 64 DDR3 DIMMs 32 buses @ 1066M 2 DIMMs per bus SMI - 16 buses Each @ 6.4GT/s (2B Rd/1B Wr) PC3-10600R LP DIMMs 1GB, x8, 1R, 1Gb 2GB, x8, 2R, 1Gb 4GB, x8, 4R, 1Gb 8GB, x8, 4R, 2Gb 16GB, x4, 4R, 2Gb
© 2009 IBM Corporation System x and BladeCenter 17 IBM Confidential NDA DISCLOSURE ONLY System Images – Chassis View Front Access 120mm fans Rear I/O Shutttle Rear Access HS PSUs - lift up on handle then pull out QPI Scalability Ports / Cables
© 2009 IBM Corporation System x and BladeCenter 18 IBM Confidential NDA DISCLOSURE ONLY System Images – CPU and Memory Memory Cards CPU and Heatsink installation
© 2009 IBM Corporation System x and BladeCenter 19 IBM Confidential NDA DISCLOSURE ONLY System Images - Options M1015 RAID card and Installation bracket 8 HDD SAS Backplane
© 2009 IBM Corporation System x and BladeCenter 20 IBM Confidential NDA DISCLOSURE ONLY 20 CPU MC2 MC1 Memory Buffer 2 Memory Buffer 2 Memory Buffer 1 Memory Buffer 1 DIMM 2 DIMM 1 DIMM 4 DIMM 3 DIMM 7 DIMM 5 DIMM 8 DIMM 6 DIMM 6DIMM 8 DIMM 7 DIMM 1 DIMM 3 DIMM 2 DIMM 4 DIMM 5 Memory Card 1 Memory Card 2 SMI Lane 1 SMI Lane 4 SMI Lane 2 SMI Lane 3 Channel 0 Channel 0 Channel 0 Channel 0 Channel 1 Channel 1 Channel 1 Channel 1 x3850 X5 DIMM Population Rules General Memory Population Rules • DIMM’s must be installed in matching pairs • Each memory card requires at least 2 DIMM’s Memory Population Best Practices • Populate 1 DIMM / Memory Buffer on each SMI lane 1st • Populate 1 DIMM / Memory Buffer across all cards before moving to populate the next channel on the Memory Buffer • Populate DIMMs furthest away from Memory Buffer 1st (ie – 1, 8, 3, 6) before populating 2nd DIMM in channel • Memory DIMMs should be plugged in order of DIMM size • Plug largest DIMMs first, followed by next largest size • Each CPU & memory card should have identical amounts of RAM Optimally expandable memory config is 2 memory cards / CPU, 4 DIMMs / memory card, equal amounts of memory / card 20
© 2009 IBM Corporation System x and BladeCenter 21 IBM Confidential NDA DISCLOSURE ONLY 21 Card # PCIe Slot # 1 1 2 5 3 3 4 6 5 4 6 7 7 2 x3850 X5 PCIe Slot Population Plug one PCIe card / Boxboro before moving to next set of slots 21
© 2009 IBM Corporation System x and BladeCenter 22 IBM Confidential NDA DISCLOSURE ONLY x3850X5 Supported Internal ServRAID adapters 22 ServRAID M1015 Features and Functions • Two x4 internal SAS / SATA ports • RAID Levels 0, 1, 10 • LSI SAS2008 RAID on Chip (ROC) • Low-profile PCIe ½ Length card • X8 PCIe Gen 2 host interface ServRAID M5015 Features and Functions • Two x4 internal SAS / SATA ports • X8 PCI e Gen 2 host interface • RAID Levels 0, 1, 5, 10, 50 (6, 60 Optional) • 800MHz 72-bit ECC DDR2 SDRAM Memory (512 MB) • LSI SAS2108 6Gb/s RAID on Chip • Low-profile PCIe ½ Length card • Encryption Services • Instant Secure Erase • Local Key Management • MegaRAID Management Suite • MegaRAID Storage Manager • MegaCLI (command-line interface) • WebBIOS • Intelligent Battery Backup Unit Multiple RAID Adapters to meet Multiple Performance Requirements 22 Bertram: optional for x3850 X5, std on x3690
© 2009 IBM Corporation System x and BladeCenter 23 IBM Confidential NDA DISCLOSURE ONLY Emulex 10Gb Ethernet adapters for eX5  Superior 10Gb/s performance – Dual-channel, 10Gb/s Ethernet Link speed – 3.6m packets per second (pps), full line rate – TCIP/IP stateless offloads – TCP Chimney Offload  Energy efficient design – Industry-leading performance per watt – Complements data center “green” initiatives  One platform for network and storage connection – Future-proof option to purchase an entitlement to enable storage support (i.e. change personality)* – Simplifies I/O hardware choices for IT managers •Lower Capital Expense (CapEx) •Lower Operational Expense (OpEx)  Two Options – Integrated for low cost, ordering ease – Option for expandability, flexibility Extended Edge Connector Integrated Option
© 2009 IBM Corporation System x and BladeCenter 24 IBM Confidential NDA DISCLOSURE ONLY  Rebranded Emulex CNA keyed for Slot 7 only  Initial support for 10Gb Ethernet  Shipped with Copper Connectors, SFP+ Optics are Optional  Interoperability with mutliple vendors switches – Upcoming BNT 10Gb ToR VFA Switch for vNIC/NIC and FCoE functions – Cisco N5K, Brocade 10GbE switches for NIC/FCoE  Integration into IBM UEFI menus IBM x3850X5 Integrated 10Gb NIC Extended Edge Connector 24
© 2009 IBM Corporation25 System x® and BladeCenter 25 x3850 X5 – Hardware; Speeds and Feeds Processors  4 Socket Intel Xeon 7500 series  (4) QPI Ports/Processor  (4) SMI Ports/Processor Memory  (8) Memory Cards, 2 per CPU  (16) Intel Memory Buffers total • SMI Connected  DDR3 DIMMs  (64) Total DIMM Slots  1066 MHz DDR3 speed • Processor QPI Speed Dependant  2, 4, 8 and 16GB Support • Installed In Matched Pairs  Memory Sparing and Mirroring Support • Installed in Matched Quads Chipset  (2) Intel Boxboro IOH (QPI-to-PCIe Bridge) • (36) PCIe Gen2 Lanes • (2) QPI Ports • (4) ESI Lanes To ICH10  Intel ICH10 Southbridge • (8) USB 2.0 Ports • 3Gb/s SATA DVD Connection Networking  Broadcom BCM5709C • Dual 1Gb connection • x4 PCIe Gen2 Connection  Emulex 10Gb dual port custom • IBM Specific Adapter Option • Installs in PCIe Slot 7, x8 PCIe Gen2 • V-NIC Capable PCIe Slots  Slot 1 PCIE Gen2 x16 Full Length  Slot 2 PCIE Gen2 x4 Full Length (x8 mech)  Slot 3 PCIE Gen2 x8 Full Length  Slot 4 PCIE Gen2 x8 Full Length  Slot 5 PCIE Gen2 x8 Half Length  Slot 6 PCIE Gen2 x8 Half Length  Slot 7 PCIE Gen2 x8 Half Length (10GbE) All slots 5Gb/s, full height
© 2009 IBM Corporation26 System x® and BladeCenter 26 x3850 X5 – Hardware; Speeds and Feeds Cont. 2.5” Storage Up To (8) 2.5” HDD Bays • Support For SAS / SATA and SSD  SAS Drives • 146GB / 10K / 6Gbps • 300GB / 10K / 6Gbps • 73GB / 15K / 6Gbps • 146GB / 15K / 6Gbps  SATA Drive • 500GB / 7200rpm  SSD Drive • 50GB  Configured with one or two 4-Drive backplanes UEFI BIOS  Next-generation replacement for BIOS-based firmware which provides a richer management experience  Removes limit on number of adapter cards—important in virtualized environments  Ability to remotely configure machines completely via command scripts with Advance Settings Utility IMM  Common IMM Across Rack Portfolio • x3550M2 • x3650M2 • x3750 X5 • x3850 X5 • x3950 X5  300MHz, 32-bit MIPS Processor  Matrox G200 Video Core  128MB Dedicated DDR2 Memory  Avocent Based Digital Video Compression  Dedicated 10/100Mb Ethernet  9-Pin Serial Port  128-bit AES Hardware Encryption Engine  IPMI v2.0  Fan Speed Control  Serial Over LAN  Active Energy Manager/xSEC  LightPath
© 2009 IBM Corporation27 System x® and BladeCenter x3850 X5 configuration flexibility Base System Shipping today Memory Expansion with MAX5 via QPI Shipping today Native Scaling via QPI Shipping today Memory Expansion and Scaling with MAX5 via QPI and EXA Available 2011
© 2009 IBM Corporation28 System x® and BladeCenter Xeon 8-socket interconnect block diagram QPI Cable Links for QPI bus Four QPI cables 1 24 3 3 42 1QPI 3 0 3 02 2 00 2 2 2 2 2002 3 3 3 3 1 3 3 1 Cable cross connects CPUs 2 and 3
© 2009 IBM Corporation29 System x® and BladeCenter x3850 X5 with native QPI scaling Intel Xeon Intel Xeon Intel Xeon Intel Xeon MB1MB 1 MB 1 MB1 MB 1 MB1 MB1MB1 Intel Xeon Intel Xeon MB1MB 1 MB 1 MB1 MB1MB1MB1MB1 Intel Xeon Intel Xeon Intel BoxboroPCI-E Intel Boxboro PCI-E Intel Xeon Intel Xeon Intel Xeon Intel Xeon MB1MB 1 MB 1 MB1 MB 1 MB1 MB1MB1 Intel Xeon Intel Xeon MB1 MB 1 MB 1 MB1 MB1MB1MB1MB1 Intel Xeon Intel Xeon Intel Boxboro PCI-E Intel Boxboro PCI-E Connects directly via QPI bus QPI Cables
© 2009 IBM Corporation30 System x® and BladeCenter x3850 8-socket QPI scaling A DB C REAR VIEW OF CHASSIS QPI 1-2 QPI 3-4 x3850 #1 QPI 1-2 QPI 3-4 x3850 #2
© 2009 IBM Corporation31 System x® and BladeCenter x3850 X5 with MAX5 using QPI Intel Xeon Intel Xeon Intel Xeon Intel Xeon MB1MB 1 MB 1 MB1 MB1MB1 MB1MB1 Intel Xeon Intel Xeon MB1MB 1 MB 1 MB1 MB1MB1MB1MB1 Intel Xeon Intel Xeon Intel BoxboroPCI-E Intel Boxboro PCI-E MAX5 MAX5 MB1MB 1 MB 1 MB1 MB1MB 1 MB 1 MB1 Connects directly to each CPU via QPI bus 6.4 GT/s MB1 MB2 1 3 8 6 2 4 7 5 DDR3 Memory DIMMs Memory Buffer SMI Link to Firehawk EXA port
© 2009 IBM Corporation32 System x® and BladeCenter x3850 X5 to MAX5 QPI cabling eX5 Memory Drawer End x3850 X5 End
© 2009 IBM Corporation33 System x® and BladeCenter 8-socket x3850 X5 with MAX5 using QPI and EXA Connects directly to each CPU via QPI bus 6.4 GT/s Connects via EXA
© 2009 IBM Corporation34 System x® and BladeCenter MAX5 1U Rack Mechanical Chassis Top view Memory Buffers Redundant 650W Power Supplies QPI Link Ports EXA Scalability Ports Firehawk Chipset 32 Memory Dimms Lightpath Diagnostics  QPI attaches to systems  EXA Scalability to other memory drawers Easy front access
© 2009 IBM Corporation35 System x® and BladeCenter MAX5 front and rear views
© 2009 IBM Corporation36 System x® and BladeCenter MAX5 for System x front and rear views Redundant 675W Power Supplies Lightpath Diagnostics QPI PortsEXA Ports Hot swap fans Front Rear System removes from chassis for easy access
© 2009 IBM Corporation37 System x® and BladeCenter MAX5 for System x top view Memory Buffers QPI Ports EXA Ports Firehawk Chipset 32 Memory Dimms  QPI attaches to systems  EXA Scalability to other memory drawers
© 2009 IBM Corporation38 System x® and BladeCenter 38 MAX5 – Hardware; Speeds and Feeds Processors  None! Memory  (32) Total DIMM Slots  DDR3 DIMMs (8) Intel Memory Buffers total • SMI Connected 1066MHz DDR3 Speed • Processor QPI Speed Dependant  1, 2, 4, 8 and 16GB Support • Installed In Matched Pairs  Memory Sparing and Mirroring Support • Installed in Matched Quads Chipset  IBM Firehawk • (8) SMI Lanes • (4) QPI Ports • (3) Scalability Ports Usability  Power sequences from host platform  Memory configuration from host platform  Multi-node configuration from host platform  Lightpath enabled  DSA supported
© 2009 IBM Corporation39 System x® and BladeCenter 39 X6550 2Ghz / 18M / 6.4GT/s E6540 2Ghz / 18M / 6.4GT/s X7560 2.26Ghz / 24M / 6.4GT/s X7550 2Ghz / 18M / 6.4GT/s 8S/Scalable 4S/Scalable L7555 1.86Ghz / 24M / 5.86GT/s E7530 1.86Ghz / 12M / 5.8GT/s E7520 1.86Ghz / 18M / x4.8GT/s X7542 2.66Ghz / 18M / 5.86GT/s EX High Perf. LV L7545 1.86Ghz / 18M / 5.86GT/s E7540 2Ghz / 18M / 6.4GT/s Turbo: 0/1/3/5 Turbo: 1/2/4/5 StandardBasic 6-8 Cores 95W HT / Turbo / S8S 6 Cores 130W Turbo / S8S No Hyper-Threading 8 Cores Hyper-Threading Turbo: 1/2/3/3 130W 6 Cores Hyper-Threading Turbo: 0/1/1/2 105W 4 Cores Hyper-Threading 95W-105W 95W 8C 6C HPC Turbo: 0/1/1/1 E6510 1.73Ghz / 12M / 4.8GT/s 2S Only. Not Scalable2S Only. Not Scalable 105W 2S/Scalable x3850 X5 / x3950 X5 – supported processors Advanced
© 2009 IBM Corporation40 System x® and BladeCenter System Population Guidelines Processors  Base Systems contain 2 CPU  8-socket QPI scaling is supported with 4+4 CPU, all matching Memory  Each CPU needs at least one memory card  Each memory card needs at least 2 DIMMs  DIMMs must be installed in matching pairs  Optimal memory performance requires 2 memory cards per CPU, with 4 DIMMs on each memory card, equal amounts of memory per card.  If memory mirrored, then DIMM’s must match in sets of 4  MAX5 memory expansion works best with DIMMs in sets of 4  MAX5 memory expansion works best with a ratio of 2/1 memory in host/expander Drives  Base systems contain backplane for 4 drives  Maximum of 8 SFF SAS drives I/O Adapters  Alternate adapter population between IOH chipset devices; alternate between slots (1-4) and (5-7)
© 2009 IBM Corporation41 System x® and BladeCenter 4141 Trademarks Trademarks The following are trademarks of the International Business Machines Corporation in the United States and/or other countries. For a complete list of IBM Trademarks, see www.ibm.com/legal/copytrade.shtml: AS/400, DBE, e-business logo, ESCO, eServer, FICON, IBM, IBM Logo, iSeries, MVS, OS/390, pSeries, RS/6000, S/30, VM/ESA, VSE/ESA, WebSphere, xSeries, z/OS, zSeries, z/VM The following are trademarks or registered trademarks of other companies Lotus, Notes, and Domino are trademarks or registered trademarks of Lotus Development Corporation Java and all Java-related trademarks and logos are trademarks of Sun Microsystems, Inc., in the United States and other countries LINUX is a registered trademark of Linux Torvalds UNIX is a registered trademark of The Open Group in the United States and other countries. Microsoft, Windows and Windows NT are registered trademarks of Microsoft Corporation. SET and Secure Electronic Transaction are trademarks owned by SET Secure Electronic Transaction LLC. Intel is a registered trademark of Intel Corporation * All other products may be trademarks or registered trademarks of their respective companies. NOTES: Performance is in Internal Throughput Rate (ITR) ratio based on measurements and projections using standard IBM benchmarks in a controlled environment. The actual throughput that any user will experience will vary depending upon considerations such as the amount of multiprogramming in the user's job stream, the I/O configuration, the storage configuration, and the workload processed. Therefore, no assurance can be given that an individual user will achieve throughput improvements equivalent to the performance ratios stated here. IBM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply. All customer examples cited or described in this presentation are presented as illustrations of the manner in which some customers have used IBM products and the results they may have achieved. Actual environmental costs and performance characteristics will vary depending on individual customer configurations and conditions. This publication was produced in the United States. IBM may not offer the products, services or features discussed in this document in other countries, and the information may be subject to change without notice. Consult your local IBM business contact for information on the product or services available in your area. All statements regarding IBM's future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only. Information about non-IBM products is obtained from the manufacturers of those products or their published announcements. IBM has not tested those products and cannot confirm the performance, compatibility, or any other claims related to non-IBM products. Questions on the capabilities of non-IBM products should be addressed to the suppliers of those products. Prices subject to change without notice. Contact your IBM representative or Business Partner for the most current pricing in your geography. References in this document to IBM products or services do not imply that IBM intends to make them available in every country. Any proposed use of claims in this presentation outside of the United States must be reviewed by local IBM country counsel prior to such use. The information could include technical inaccuracies or typographical errors. Changes are periodically made to the information herein; these changes will be incorporated in new editions of the publication. IBM may make improvements and/or changes in the product(s) and/or the program(s) described in this publication at any time without notice. Any references in this information to non-IBM Web sites are provided for convenience only and do not in any manner serve as an endorsement of those Web sites. The materials at those Web sites are not part of the materials for this IBM product and use of those Web sites is at your own risk.

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X3850x5techpresentation09 29-2010-101118124714-phpapp01

  • 1.
    © 2009 IBMCorporation IBM Confidential x3850 X5 Technical Presentation March 30, 2009 Ralph M. Begun System Development Lead begun@us.ibm.com Michelle Gottschalk WW Product Manager mgottsc@us.ibm.com
  • 2.
    © 2009 IBMCorporation System x and BladeCenter 2 IBM Confidential NDA DISCLOSURE ONLY x3850 X5 overview
  • 3.
    © 2009 IBMCorporation System x and BladeCenter 3 IBM Confidential NDA DISCLOSURE ONLY IBM System x3850 X5 Flagship System x platform for leadership scalable performance and capacity Versatile 4-socket, 4U rack-optimized scalable enterprise server provides a flexible platform for maximum utilization, reliability and performance of compute- and memory-intensive workloads. System Specifications  4x Intel Xeon 7500-series CPUs  64 DDR3 DIMMs, up to 96 with MAX5  6 open PCIe slots (+ 2 additional)  Up to 8x 2.5” HDDs or 16x 1.8” SSDs  RAID 0/1 Std, Optional RAID 5/6  2x 1GB Ethernet LOM  2x 10GB Ethernet SFP+ Virtual Fabric / FCoEE  Scalable to 8S, 128 DIMM  Internal USB for embedded hypervisor  IMM, uEFI & IBM Systems Director Maximize Memory – 64 threads and 1TB capacity for 3.3x database and 3.6x the virtualization performance over industry 2-socket x86 (Intel Xeon 5500 Series) systems – MAX5 memory expansion for 50% more virtual machines and leadership database performance Minimize Cost – Lower cost, high performance configurations reaching desired memory capacity using less expensive DIMMs – eXFlash 480k internal IOPs for 40x local database performance and $1.3M savings in equal IOPs storage Simplify Deployment – Pre-defined database and virtualization workload optimized systems for faster deployment and faster time to value
  • 4.
    © 2009 IBMCorporation4 System x® and BladeCenter MAX5 x3850 X5 and x3950 X5 Models x3850 X5 – Four Socket Scalable Server IBM System x high end four-socket server with Intel 7500 Series processors, IMM, RAID 0,1, dualGigE, Emulex 10GigE, 2x1975W power supplies x3850 X5 x3850 X5 – Memory Expanded Four Socket Scalable Server IBM System x high end four-socket scalable server with MAX5, IMM, RAID 0,1, dualGigE, Emulex 10GigE, 1x4QPI cable kit, 2x1975W power supplies . Workload Optimized Models Richly-configured models optimized for virtualization environments or database workloads x3850 X5 7145-1RY 2x E7520 4 Core 1.86GHz18MB x4.8 95W (S4S), 4x4GB 7145-2RY 2x E7530 6 Core 1.86GHzT,12MB x5.86 105W (S4S), 4x4GB 7145-3RY 2x E7540 6 Core 2.0GHzT,18MB x6.4 105W (S8S), 4x4GB 7145-4RY 2x X7550 8 Core 2.0GHzT,18MB x6.4 130W (S8S), 4x4GB 7145-5RY 2x X7560 8 Core 2.27GHzT,24MB x6.4 130W (S8S), 4x4GB 7145-E4Y 2x X7550 8 Core 2.0GHzT,18MB x6.4 130W (S8S), 4x4GB x3850 X5 7145-2SY 4x E7530 6 Core 1.86GHzT,12MB x5.86 105W (S4S), 8x4GB + eX5 MAX5, 2x2GB 7145-4SY 4x X7550 8 Core 2.0GHzT,18MB x6.4 130W (S8S) 8x4GB + eX5 MAX5, 2x2GB 7145-5SY 4x X7560 8 Core 2.27GHzT,24MB x6.4 130W (S8S) 8x4GB + eX5 MAX5, 2x2GB x3950 X5 Virtualization Optimized Models 7145-4DX 4x X7550 Turbo 2.0GHz/6.4GTS-18MB 8C 130W. 64x4GB, +eX5 MAX5, 32x4GB, VMWare ESXi Hypervisor USB key x3850 X5 Database Optimized Models 7145-5DY 2x X7560 Turbo 2.26GHz/6.4GTS-24MB 8C 4QPI, 8x4GB, 2x1975W, IMM, 1 x Intruder backplane, dual GigE, Emulex 10GigE 7145-4FY 4 x X7550 Turbo 2.0GHz/6.4GTS-18MB 8C 130W, 32x4GB, 16x1.8” 200GB SSD,RAID 5,6 7145-5GY 4 x X7560 Turbo 2.26GHz/6.4GTS-24MB 8C 130W, 32x4GB, 16x1.8”200GB SSD,RAID 5,6 x3850 X5 w/ MAX5
  • 5.
    © 2009 IBMCorporation5 System x® and BladeCenter Intel Xeon chipset
  • 6.
    © 2009 IBMCorporation6 System x® and BladeCenter Intel Boxboro-EX 4S design • Connectivity – Fully-connected (4 Intel® QuickPath interconnects per socket) – 6.4, 5.86, or 4.8 GT/s on all links – Socket-LS – With 2 IOHs: 82 PCIe lanes (72 Gen2 Boxboro lanes + 4 Gen1 lanes on unused ESI port + 6 Gen1 ICH10 lanes) • Memory – CPU-integrated memory controller – Registered DDR3-1066 DIMMs running at speeds of 800, 978 or 1066 MHz via on- board memory buffer – 64 DIMM support (4:1 DIMM to buffer ratio) • Technologies & Enabling – Intel® Intelligent Power Node Manager – Virtualization: VT-x, VT-d, & VT-c – Security: TPM 1.2, Measured Boot, UEFI – RAS features MB MBMB MBMB MBMB MB MB MBMB MBMB MBMB MB Intel® QuickPath interconnects BoxboroBoxboro X4 ESI BoxboroBoxboro ICH 10* XeonXeon XeonXeon x8x8 2x4 x8 x4x8 x8x8 x16 x8 x4x8 x16 2x4 2x4 2x4 X4PCIeGen1 XeonXeon XeonXeon 6
  • 7.
    © 2009 IBMCorporation7 System x® and BladeCenter • Modified Boxboro-EX ingredients to offer a new high-memory 2S platform • Xeon 2S will only be validated with up to 2 IOHs • Xeon 2S SKUs cannot scale natively (w/ QPI) beyond 2skts • Xeon 2S SKUs can scale beyond 2skts with a node controller • Comparison w/ Boxboro-EX & Tylersburg-EP: Boxboro-EX 2S (2 IOH) Tylersburg-EP (2 IOH) # of cores per CPU Up to 8 Up to 4 QuickPath Interconnect 4^ 2 # of DIMMs 32 18 PCIe lanes 72+10 72+6 BoxboroBoxboro X4 ESI BoxboroBoxboro ICH 10* XeonXeon XeonXeon x8x8 2x4 x8 2x2 x4x8 x8x8 x16 x8 2x2 x4x8 x16 2x4 2x4 2x4 X4PCIeGen1 Intel® QuickPath interconnects Intel Boxboro-EX 2S Platform Validated Configuration 7
  • 8.
    © 2009 IBMCorporation8 System x® and BladeCenter Xeon® 7500/6500 Platform Memory  4 Socket platform capability (64 DIMMs): – Up to 16 DDR3 DIMMs per socket via up to four Scalable Memory Buffers – Support for up to 16GB DDR3 DIMMs – 1TB with 16GB DIMMS  Memory types supported: – 1066MHz DDR3 – Registered (RDIMM) – Single-rank (SR), dual-rank (DR), quad-rank (QR)  Actual system memory speed depends on specific processor capabilities. (see NHM-EX SKU stack for max SMI link speeds per SKU): – 6.4GT/s SMI link speed capable of running memory speeds up to 1066Mhz – 5.86GT/s SMI link speed capable of running memory speeds up to 978Mhz** – 4.8GT/s SMI link speed capable of running memory speeds up to 800Mhz RDI MM RDI MM RDI MM RDI MM SMB XeonXeon 7500/65007500/6500 4 SMI 2 DDR3 Up to 16 DIIMS ^SMI^SMI/SMB = Intel Scalable Memory Interconnect / Scalable Memory Buffer ^SMI^SMI/SMB = Intel Scalable Memory Interconnect / Scalable Memory Buffer ** Memory speed sett by UEFI ; All channels in a system will run at the fastest common frequency 8
  • 9.
    © 2009 IBMCorporation9 System x® and BladeCenter x3850 X5 system specifics
  • 10.
    © 2009 IBMCorporation10 System x® and BladeCenter x3850 X5 – Chipset Basics Intel Xeon Intel Xeon Intel Xeon Intel Xeon MB1MB 1 MB 1 MB1 MB1MB1 MB1MB1 Intel Xeon Intel Xeon MB1MB 1 MB 1 MB1 MB1MB1MB1MB1 Intel Xeon Intel Xeon Intel BoxboroPCI-E Intel Boxboro PCI-E DDR3 Memory DIMMs Memory Buffer SMI Link to CPU Memory Card MB1 MB2 1 3 8 6 2 4 7 5 Memory Controller (1 of 2 per CPU) CPU’s connect via QPI bus 6.4 GT/s max Quick Path Interconnect
  • 11.
    © 2009 IBMCorporation11 System x® and BladeCenter x3850 X5 – Block Diagram Intel Xeon Rack , Westmere EX drop in design, 4 CPUs, 64 DDR3, 7 PCIE, 8 HDD, QPI Cable to 8-socket 6.4GT/s SMI (FBD2) 16 buses Each @ 6.4GT/s (2B Rd/1B Wr) Cable or Wrap Xeon CPU4 QPI 64 DDR3 DIMMs 32 buses @ 1066M 2 DIMMs per bus QPI Xeon CPU1 Xeon CPU2 x8 x8 x8 Slot 6 QPI QPI Xeon CPU3 QPIQPI Slot 1x16 x4 x8 x8 Slot 2 SAS Slot 3 PC3-10600R LP DIMMs 1GB, x8, 1R, 1Gb 2GB, x8, 2R, 1Gb 4GB, x8, 4R, 1Gb 8GB, x8, 4R, 2Gb 16GB, x4, 4R, 2Gb Xeon 8-core 2.27 GHz IBM CONFIDENTIAL Boxboro1 ESI x4 ICH10 Southbridge USB LPC DVD 5709 EN ESI x4 x8 Slot 7 Slot 5 x4 + x4 Dual Gb 0 2 0 3 3 1 3 0 3 2 2 2 0 1 x4 Slot 4 1 0 1 0 1 1 Boxboro2 Memory Card 1 PROWL I/O and Power card PCIe SAS connector on CPU card MB1 MB2 1 3 2 4 8 6 7 50 01 1 1 2 Memory Card 3 MB1 MB2 1 3 2 4 8 6 7 50 01 1 2 1 Memory Card 4 MB1 MB2 2 4 1 3 7 5 8 6 0 01 1 3 4 Memory Card 7 MB1 MB2 1 3 2 4 8 6 7 50 01 1 2 1 Memory Card 8 MB1 MB2 2 4 1 3 7 5 8 6 0 01 1 3 4 Memory Card 2 MB1 MB2 2 4 1 3 7 5 8 6 0 01 1 4 3 Memory Card 5 MB1 MB2 1 3 2 4 8 6 7 50 01 1 1 2 Memory Card 6 MB1 MB2 2 4 1 3 7 5 8 6 0 01 1 4 3 STARSCREAM CPU Card iBMC, TPM 4 Back, 2 Front 8 Memory Cards Cable or Wrap 2 Int, 2 iBMC SATA PCIe Slots 1-4 Full Length Slot 2 has x8 connector PCIe Slots 5-7 Half Length Dual 10Gb
  • 12.
    © 2009 IBMCorporation12 System x® and BladeCenter x3850/x3950 X5 - 4 Socket 4U EX platform 6 Fans 2x – 1975 W P/S 4U Rack Mechanical Chassis Front view (2x) 1975W Rear Access Hot Swap, Redundant P/S (4x) Intel Xeon EX CPU’s (8x) Memory Cards – 8 1066MHxDDR3 DIMMs per card 7x - PCIe Gen2 Slots 2x 60mm Hot Swap Fans (8x) Gen2 2.5” Drives (2x) 120mm Hot Swap Fans Dual USB DVD Drive Light Path Diagnostics RAID Card
  • 13.
    © 2009 IBMCorporation13 System x® and BladeCenter x3850 X5 rear view QPI cables (2x) 1975W Rear Access Hot Swap, Redundant P/S w/120mm fan (4x) PCIe full length (3x) PCIe half length x8 Emulex 10Gb Ethernet Dual Backplane – SAS & SSD
  • 14.
    © 2009 IBMCorporation14 System x® and BladeCenter x3850 X5 front view (2x) 1975W Rear Access Hot Swap, Redundant P/S (4x) Intel Xeon EX CPU’s (8x) Memory Cards – 8 1066MHxDDR3 DIMMs per card 7x - PCIe Gen2 Slots 2x 60mm Hot Swap Fans (8x) Gen2 2.5” Drives (2x) 120mm Hot Swap Fans Dual USB Light Path Diagnostics RAID Card DVD Drive 10Gb Ethernet Adapter
  • 15.
    © 2009 IBMCorporation15 System x® and BladeCenter System Images - Interior PS1 PS2 Boxborro 2 Boxborro1 M5015 RAID HS Fan Pack PCIe x16 PCIe x4 PCIe x8 PCIe x8 PCIe x8 PCIe x8 PCIe x8 USB System Recovery Jumpers CPU1 CPU2 CPU3 CPU4Slot 7 Slot 6 Slot 5 Slot 4 Slot 3 Slot 2 Slot 1 Mem Card 1 Mem Card 2 Mem Card 3 Mem Card 4 Mem Card 5 Mem Card 6 Mem Card 7 Mem Card 8 SAS Backplanes + HDD Cage
  • 16.
    © 2009 IBMCorporation16 System x® and BladeCenter New x3850 X5 memory card Specifications : 64 DDR3 DIMMs 32 buses @ 1066M 2 DIMMs per bus SMI - 16 buses Each @ 6.4GT/s (2B Rd/1B Wr) PC3-10600R LP DIMMs 1GB, x8, 1R, 1Gb 2GB, x8, 2R, 1Gb 4GB, x8, 4R, 1Gb 8GB, x8, 4R, 2Gb 16GB, x4, 4R, 2Gb
  • 17.
    © 2009 IBMCorporation System x and BladeCenter 17 IBM Confidential NDA DISCLOSURE ONLY System Images – Chassis View Front Access 120mm fans Rear I/O Shutttle Rear Access HS PSUs - lift up on handle then pull out QPI Scalability Ports / Cables
  • 18.
    © 2009 IBMCorporation System x and BladeCenter 18 IBM Confidential NDA DISCLOSURE ONLY System Images – CPU and Memory Memory Cards CPU and Heatsink installation
  • 19.
    © 2009 IBMCorporation System x and BladeCenter 19 IBM Confidential NDA DISCLOSURE ONLY System Images - Options M1015 RAID card and Installation bracket 8 HDD SAS Backplane
  • 20.
    © 2009 IBMCorporation System x and BladeCenter 20 IBM Confidential NDA DISCLOSURE ONLY 20 CPU MC2 MC1 Memory Buffer 2 Memory Buffer 2 Memory Buffer 1 Memory Buffer 1 DIMM 2 DIMM 1 DIMM 4 DIMM 3 DIMM 7 DIMM 5 DIMM 8 DIMM 6 DIMM 6DIMM 8 DIMM 7 DIMM 1 DIMM 3 DIMM 2 DIMM 4 DIMM 5 Memory Card 1 Memory Card 2 SMI Lane 1 SMI Lane 4 SMI Lane 2 SMI Lane 3 Channel 0 Channel 0 Channel 0 Channel 0 Channel 1 Channel 1 Channel 1 Channel 1 x3850 X5 DIMM Population Rules General Memory Population Rules • DIMM’s must be installed in matching pairs • Each memory card requires at least 2 DIMM’s Memory Population Best Practices • Populate 1 DIMM / Memory Buffer on each SMI lane 1st • Populate 1 DIMM / Memory Buffer across all cards before moving to populate the next channel on the Memory Buffer • Populate DIMMs furthest away from Memory Buffer 1st (ie – 1, 8, 3, 6) before populating 2nd DIMM in channel • Memory DIMMs should be plugged in order of DIMM size • Plug largest DIMMs first, followed by next largest size • Each CPU & memory card should have identical amounts of RAM Optimally expandable memory config is 2 memory cards / CPU, 4 DIMMs / memory card, equal amounts of memory / card 20
  • 21.
    © 2009 IBMCorporation System x and BladeCenter 21 IBM Confidential NDA DISCLOSURE ONLY 21 Card # PCIe Slot # 1 1 2 5 3 3 4 6 5 4 6 7 7 2 x3850 X5 PCIe Slot Population Plug one PCIe card / Boxboro before moving to next set of slots 21
  • 22.
    © 2009 IBMCorporation System x and BladeCenter 22 IBM Confidential NDA DISCLOSURE ONLY x3850X5 Supported Internal ServRAID adapters 22 ServRAID M1015 Features and Functions • Two x4 internal SAS / SATA ports • RAID Levels 0, 1, 10 • LSI SAS2008 RAID on Chip (ROC) • Low-profile PCIe ½ Length card • X8 PCIe Gen 2 host interface ServRAID M5015 Features and Functions • Two x4 internal SAS / SATA ports • X8 PCI e Gen 2 host interface • RAID Levels 0, 1, 5, 10, 50 (6, 60 Optional) • 800MHz 72-bit ECC DDR2 SDRAM Memory (512 MB) • LSI SAS2108 6Gb/s RAID on Chip • Low-profile PCIe ½ Length card • Encryption Services • Instant Secure Erase • Local Key Management • MegaRAID Management Suite • MegaRAID Storage Manager • MegaCLI (command-line interface) • WebBIOS • Intelligent Battery Backup Unit Multiple RAID Adapters to meet Multiple Performance Requirements 22 Bertram: optional for x3850 X5, std on x3690
  • 23.
    © 2009 IBMCorporation System x and BladeCenter 23 IBM Confidential NDA DISCLOSURE ONLY Emulex 10Gb Ethernet adapters for eX5  Superior 10Gb/s performance – Dual-channel, 10Gb/s Ethernet Link speed – 3.6m packets per second (pps), full line rate – TCIP/IP stateless offloads – TCP Chimney Offload  Energy efficient design – Industry-leading performance per watt – Complements data center “green” initiatives  One platform for network and storage connection – Future-proof option to purchase an entitlement to enable storage support (i.e. change personality)* – Simplifies I/O hardware choices for IT managers •Lower Capital Expense (CapEx) •Lower Operational Expense (OpEx)  Two Options – Integrated for low cost, ordering ease – Option for expandability, flexibility Extended Edge Connector Integrated Option
  • 24.
    © 2009 IBMCorporation System x and BladeCenter 24 IBM Confidential NDA DISCLOSURE ONLY  Rebranded Emulex CNA keyed for Slot 7 only  Initial support for 10Gb Ethernet  Shipped with Copper Connectors, SFP+ Optics are Optional  Interoperability with mutliple vendors switches – Upcoming BNT 10Gb ToR VFA Switch for vNIC/NIC and FCoE functions – Cisco N5K, Brocade 10GbE switches for NIC/FCoE  Integration into IBM UEFI menus IBM x3850X5 Integrated 10Gb NIC Extended Edge Connector 24
  • 25.
    © 2009 IBMCorporation25 System x® and BladeCenter 25 x3850 X5 – Hardware; Speeds and Feeds Processors  4 Socket Intel Xeon 7500 series  (4) QPI Ports/Processor  (4) SMI Ports/Processor Memory  (8) Memory Cards, 2 per CPU  (16) Intel Memory Buffers total • SMI Connected  DDR3 DIMMs  (64) Total DIMM Slots  1066 MHz DDR3 speed • Processor QPI Speed Dependant  2, 4, 8 and 16GB Support • Installed In Matched Pairs  Memory Sparing and Mirroring Support • Installed in Matched Quads Chipset  (2) Intel Boxboro IOH (QPI-to-PCIe Bridge) • (36) PCIe Gen2 Lanes • (2) QPI Ports • (4) ESI Lanes To ICH10  Intel ICH10 Southbridge • (8) USB 2.0 Ports • 3Gb/s SATA DVD Connection Networking  Broadcom BCM5709C • Dual 1Gb connection • x4 PCIe Gen2 Connection  Emulex 10Gb dual port custom • IBM Specific Adapter Option • Installs in PCIe Slot 7, x8 PCIe Gen2 • V-NIC Capable PCIe Slots  Slot 1 PCIE Gen2 x16 Full Length  Slot 2 PCIE Gen2 x4 Full Length (x8 mech)  Slot 3 PCIE Gen2 x8 Full Length  Slot 4 PCIE Gen2 x8 Full Length  Slot 5 PCIE Gen2 x8 Half Length  Slot 6 PCIE Gen2 x8 Half Length  Slot 7 PCIE Gen2 x8 Half Length (10GbE) All slots 5Gb/s, full height
  • 26.
    © 2009 IBMCorporation26 System x® and BladeCenter 26 x3850 X5 – Hardware; Speeds and Feeds Cont. 2.5” Storage Up To (8) 2.5” HDD Bays • Support For SAS / SATA and SSD  SAS Drives • 146GB / 10K / 6Gbps • 300GB / 10K / 6Gbps • 73GB / 15K / 6Gbps • 146GB / 15K / 6Gbps  SATA Drive • 500GB / 7200rpm  SSD Drive • 50GB  Configured with one or two 4-Drive backplanes UEFI BIOS  Next-generation replacement for BIOS-based firmware which provides a richer management experience  Removes limit on number of adapter cards—important in virtualized environments  Ability to remotely configure machines completely via command scripts with Advance Settings Utility IMM  Common IMM Across Rack Portfolio • x3550M2 • x3650M2 • x3750 X5 • x3850 X5 • x3950 X5  300MHz, 32-bit MIPS Processor  Matrox G200 Video Core  128MB Dedicated DDR2 Memory  Avocent Based Digital Video Compression  Dedicated 10/100Mb Ethernet  9-Pin Serial Port  128-bit AES Hardware Encryption Engine  IPMI v2.0  Fan Speed Control  Serial Over LAN  Active Energy Manager/xSEC  LightPath
  • 27.
    © 2009 IBMCorporation27 System x® and BladeCenter x3850 X5 configuration flexibility Base System Shipping today Memory Expansion with MAX5 via QPI Shipping today Native Scaling via QPI Shipping today Memory Expansion and Scaling with MAX5 via QPI and EXA Available 2011
  • 28.
    © 2009 IBMCorporation28 System x® and BladeCenter Xeon 8-socket interconnect block diagram QPI Cable Links for QPI bus Four QPI cables 1 24 3 3 42 1QPI 3 0 3 02 2 00 2 2 2 2 2002 3 3 3 3 1 3 3 1 Cable cross connects CPUs 2 and 3
  • 29.
    © 2009 IBMCorporation29 System x® and BladeCenter x3850 X5 with native QPI scaling Intel Xeon Intel Xeon Intel Xeon Intel Xeon MB1MB 1 MB 1 MB1 MB 1 MB1 MB1MB1 Intel Xeon Intel Xeon MB1MB 1 MB 1 MB1 MB1MB1MB1MB1 Intel Xeon Intel Xeon Intel BoxboroPCI-E Intel Boxboro PCI-E Intel Xeon Intel Xeon Intel Xeon Intel Xeon MB1MB 1 MB 1 MB1 MB 1 MB1 MB1MB1 Intel Xeon Intel Xeon MB1 MB 1 MB 1 MB1 MB1MB1MB1MB1 Intel Xeon Intel Xeon Intel Boxboro PCI-E Intel Boxboro PCI-E Connects directly via QPI bus QPI Cables
  • 30.
    © 2009 IBMCorporation30 System x® and BladeCenter x3850 8-socket QPI scaling A DB C REAR VIEW OF CHASSIS QPI 1-2 QPI 3-4 x3850 #1 QPI 1-2 QPI 3-4 x3850 #2
  • 31.
    © 2009 IBMCorporation31 System x® and BladeCenter x3850 X5 with MAX5 using QPI Intel Xeon Intel Xeon Intel Xeon Intel Xeon MB1MB 1 MB 1 MB1 MB1MB1 MB1MB1 Intel Xeon Intel Xeon MB1MB 1 MB 1 MB1 MB1MB1MB1MB1 Intel Xeon Intel Xeon Intel BoxboroPCI-E Intel Boxboro PCI-E MAX5 MAX5 MB1MB 1 MB 1 MB1 MB1MB 1 MB 1 MB1 Connects directly to each CPU via QPI bus 6.4 GT/s MB1 MB2 1 3 8 6 2 4 7 5 DDR3 Memory DIMMs Memory Buffer SMI Link to Firehawk EXA port
  • 32.
    © 2009 IBMCorporation32 System x® and BladeCenter x3850 X5 to MAX5 QPI cabling eX5 Memory Drawer End x3850 X5 End
  • 33.
    © 2009 IBMCorporation33 System x® and BladeCenter 8-socket x3850 X5 with MAX5 using QPI and EXA Connects directly to each CPU via QPI bus 6.4 GT/s Connects via EXA
  • 34.
    © 2009 IBMCorporation34 System x® and BladeCenter MAX5 1U Rack Mechanical Chassis Top view Memory Buffers Redundant 650W Power Supplies QPI Link Ports EXA Scalability Ports Firehawk Chipset 32 Memory Dimms Lightpath Diagnostics  QPI attaches to systems  EXA Scalability to other memory drawers Easy front access
  • 35.
    © 2009 IBMCorporation35 System x® and BladeCenter MAX5 front and rear views
  • 36.
    © 2009 IBMCorporation36 System x® and BladeCenter MAX5 for System x front and rear views Redundant 675W Power Supplies Lightpath Diagnostics QPI PortsEXA Ports Hot swap fans Front Rear System removes from chassis for easy access
  • 37.
    © 2009 IBMCorporation37 System x® and BladeCenter MAX5 for System x top view Memory Buffers QPI Ports EXA Ports Firehawk Chipset 32 Memory Dimms  QPI attaches to systems  EXA Scalability to other memory drawers
  • 38.
    © 2009 IBMCorporation38 System x® and BladeCenter 38 MAX5 – Hardware; Speeds and Feeds Processors  None! Memory  (32) Total DIMM Slots  DDR3 DIMMs (8) Intel Memory Buffers total • SMI Connected 1066MHz DDR3 Speed • Processor QPI Speed Dependant  1, 2, 4, 8 and 16GB Support • Installed In Matched Pairs  Memory Sparing and Mirroring Support • Installed in Matched Quads Chipset  IBM Firehawk • (8) SMI Lanes • (4) QPI Ports • (3) Scalability Ports Usability  Power sequences from host platform  Memory configuration from host platform  Multi-node configuration from host platform  Lightpath enabled  DSA supported
  • 39.
    © 2009 IBMCorporation39 System x® and BladeCenter 39 X6550 2Ghz / 18M / 6.4GT/s E6540 2Ghz / 18M / 6.4GT/s X7560 2.26Ghz / 24M / 6.4GT/s X7550 2Ghz / 18M / 6.4GT/s 8S/Scalable 4S/Scalable L7555 1.86Ghz / 24M / 5.86GT/s E7530 1.86Ghz / 12M / 5.8GT/s E7520 1.86Ghz / 18M / x4.8GT/s X7542 2.66Ghz / 18M / 5.86GT/s EX High Perf. LV L7545 1.86Ghz / 18M / 5.86GT/s E7540 2Ghz / 18M / 6.4GT/s Turbo: 0/1/3/5 Turbo: 1/2/4/5 StandardBasic 6-8 Cores 95W HT / Turbo / S8S 6 Cores 130W Turbo / S8S No Hyper-Threading 8 Cores Hyper-Threading Turbo: 1/2/3/3 130W 6 Cores Hyper-Threading Turbo: 0/1/1/2 105W 4 Cores Hyper-Threading 95W-105W 95W 8C 6C HPC Turbo: 0/1/1/1 E6510 1.73Ghz / 12M / 4.8GT/s 2S Only. Not Scalable2S Only. Not Scalable 105W 2S/Scalable x3850 X5 / x3950 X5 – supported processors Advanced
  • 40.
    © 2009 IBMCorporation40 System x® and BladeCenter System Population Guidelines Processors  Base Systems contain 2 CPU  8-socket QPI scaling is supported with 4+4 CPU, all matching Memory  Each CPU needs at least one memory card  Each memory card needs at least 2 DIMMs  DIMMs must be installed in matching pairs  Optimal memory performance requires 2 memory cards per CPU, with 4 DIMMs on each memory card, equal amounts of memory per card.  If memory mirrored, then DIMM’s must match in sets of 4  MAX5 memory expansion works best with DIMMs in sets of 4  MAX5 memory expansion works best with a ratio of 2/1 memory in host/expander Drives  Base systems contain backplane for 4 drives  Maximum of 8 SFF SAS drives I/O Adapters  Alternate adapter population between IOH chipset devices; alternate between slots (1-4) and (5-7)
  • 41.
    © 2009 IBMCorporation41 System x® and BladeCenter 4141 Trademarks Trademarks The following are trademarks of the International Business Machines Corporation in the United States and/or other countries. For a complete list of IBM Trademarks, see www.ibm.com/legal/copytrade.shtml: AS/400, DBE, e-business logo, ESCO, eServer, FICON, IBM, IBM Logo, iSeries, MVS, OS/390, pSeries, RS/6000, S/30, VM/ESA, VSE/ESA, WebSphere, xSeries, z/OS, zSeries, z/VM The following are trademarks or registered trademarks of other companies Lotus, Notes, and Domino are trademarks or registered trademarks of Lotus Development Corporation Java and all Java-related trademarks and logos are trademarks of Sun Microsystems, Inc., in the United States and other countries LINUX is a registered trademark of Linux Torvalds UNIX is a registered trademark of The Open Group in the United States and other countries. Microsoft, Windows and Windows NT are registered trademarks of Microsoft Corporation. SET and Secure Electronic Transaction are trademarks owned by SET Secure Electronic Transaction LLC. Intel is a registered trademark of Intel Corporation * All other products may be trademarks or registered trademarks of their respective companies. NOTES: Performance is in Internal Throughput Rate (ITR) ratio based on measurements and projections using standard IBM benchmarks in a controlled environment. The actual throughput that any user will experience will vary depending upon considerations such as the amount of multiprogramming in the user's job stream, the I/O configuration, the storage configuration, and the workload processed. Therefore, no assurance can be given that an individual user will achieve throughput improvements equivalent to the performance ratios stated here. IBM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply. All customer examples cited or described in this presentation are presented as illustrations of the manner in which some customers have used IBM products and the results they may have achieved. Actual environmental costs and performance characteristics will vary depending on individual customer configurations and conditions. This publication was produced in the United States. IBM may not offer the products, services or features discussed in this document in other countries, and the information may be subject to change without notice. Consult your local IBM business contact for information on the product or services available in your area. All statements regarding IBM's future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only. Information about non-IBM products is obtained from the manufacturers of those products or their published announcements. IBM has not tested those products and cannot confirm the performance, compatibility, or any other claims related to non-IBM products. Questions on the capabilities of non-IBM products should be addressed to the suppliers of those products. Prices subject to change without notice. Contact your IBM representative or Business Partner for the most current pricing in your geography. References in this document to IBM products or services do not imply that IBM intends to make them available in every country. Any proposed use of claims in this presentation outside of the United States must be reviewed by local IBM country counsel prior to such use. The information could include technical inaccuracies or typographical errors. Changes are periodically made to the information herein; these changes will be incorporated in new editions of the publication. IBM may make improvements and/or changes in the product(s) and/or the program(s) described in this publication at any time without notice. Any references in this information to non-IBM Web sites are provided for convenience only and do not in any manner serve as an endorsement of those Web sites. The materials at those Web sites are not part of the materials for this IBM product and use of those Web sites is at your own risk.

Editor's Notes

  • #21 Each CPU needs at least one memory card Each memory card needs at least 2 DIMM’s DIMM’s must be installed in matching pairs Optimal memory performance requires 2 memory cards per CPU, with 4 DIMMs on each memory card, equal amounts of memory per card. If memory mirrored, then DIMM’s must match in sets of 4 eX5 Memory expansion works best with DIMM’s in sets of 4 eX5 Memory expansion works best with a ratio of 2/1 memory in host/expander Memory Size DIMMFRUOption (contains only 1 DIMM) 1GB DIMM (1Gb, x8, SR) 43X5044 44T149044T1480 2GB DIMM (1Gb, x8, DR) 43X504544T149144T1481 4GB DIMM (1Gb, x8, QR) 43X505546C745246C7448 8GB DIMM (2Gb, x8, QR) 43X507046C748846C7482 16GB DIMM (2Gb, x4, QR) 43X507146C748946C7483 Best not to mix ranks in a channel Memory Installation Card numberDIMM Numbers 1 1 & 8 7 1 & 8 3 1 & 8 5 1 & 8 2 1 & 8 8 1 & 8 4 1 & 8 6 1 & 8 1 3 & 6 7 3 & 6 3 3 & 6 5 3 & 6 2 3 & 6 8 3 & 6 4 3 & 6 6 3 & 6 1 2 & 7 7 2 & 7 3 2 & 7 5 2 & 7 2 2 & 7 8 2 & 7 4 2 & 7 6 2 & 7 14 & 5 7 4 & 5 3 4 & 5 5 4 & 5 2 4 & 5 8 4 & 5 4 4 & 5 6 4 & 5
  • #22 A PCIe Gen 2 lane is 500MB/s X16 PCIe slot is ~~ 8GB/s X8 PCIe slot is ~~5GB/s X4 PCIe slot is ~~2GB/s
  • #24 The OCe10102-N is a dual-port 10GbeE network adapter. It supports basic TCP/IP stateless offloads plus TCP Chimney Offload for Windows Server 2003 and 2008. One of the key benefits of this product is the option to enable support for FCoE or iSCSI in-the-field, when and were needed. There is no requirement to upgrade to a new adapter! FCoE or iSCSI support will be enabled with a license key that can be downloaded from emulex.com. With this pay-as-you-go model, you can standardize on OneConnect for 10GbE networking connectivity and then enable storage support at your own pace. Another key benefit is the OneCommand Manager application, which supports all of the networking and storage protocols (TCP/IP, TOE or TCP Chimney, FCoE and iSCSI). OneCommand Manager is based on Emulex’s market proven HBAnyware application that is managing over 7 million Emulex HBA ports.
  • #25 OCe10102-NX-XI PCIe CNA – with extended edge connector Solder mask is BLUE to denote integrated card that will not function in std PCIe slot NIC protocol only (FCOE upgrade 2Q10) Shipped as Copper Connectors, SFP+ Optics are Optional Interoperates with upcoming BNT 10Gb ToR VFA Switch for vNIC/NIC and FCoE functions Interoperates with Cisco N5K, Brocade 10GbE switches for NIC/FCoE GA date 1Q10
  • #28 after this “switch gears”