Writing a Comprehensive Technical Paper

Writing a comprehensive
technical paper
RESEARCH BASED
TEACHING & LEARNING
APPROACH: WRITE MODEL
Copyright number: CRLY00013349

2
Manuscript Structure
Manuscript 1. Title
2. Abstract
3. Keywords
4. Introduction
5. Materials/ Methodology
6. Results and Discussion
7. Conclusion
8. References

3
Manuscript 1. Title
2. Abstract
3. Keywords
4. Introduction
7. Conclusion
8. References
Concise
Avoid abbreviations

4
Manuscript 1. Title
2. Abstract
3. Keywords
4. Introduction
7. Conclusion
8. References
Example:
Investigation of Hole Making Process on
Carbon Fibre Reinforced Polymer (CFRP):
Effect of Cutting Parameter on Helical Milling
Technique
Lab Apparatus for Cascade Learning

5
Manuscript 1. Title
2. Abstract
3. Keywords
4. Introduction
7. Conclusion
8. References
Author
Affiliation
Email address

6
Manuscript 1. Title
2. Abstract
3. Keywords
4. Introduction
7. Conclusion
8. References
Example:
The Effects of Nickel Underlayer and Solder Dipping as
Tin Whisker Mitigations in Tin Surface Finishes
HOOI PENG LIM1,a*, ALI OURDJINI2,b and TUTY ASMA ABU BAKAR3,c
1Politeknik Ibrahim Sultan, KM10, Jalan Kong Kong, 81700 Pasir
Gudang, Johor, Malaysia
2-3Faculty of Mechanical Engineering, Universiti Teknologi Malaysia,
81310 Johor Bahru, Malaysia
alimhooipeng@pis.edu.my, bourdjini@fkm.utm.my,
ctuty@mail.fkm.utm.my

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Manuscript 1. Title
2. Abstract
3. Keywords
4. Introduction
7. Conclusion
8. References
Summary of the paper
background of the study,
objective, methodology,
results and conclusion

8
Abstract. Driven by environmental concerns and the enforcement of
Restriction of Hazardous Substances Directive (RoHS) to ban the use
of lead in electronics, the global electronics industry has migrated
toward lead-free electronics. However, the adoption of lead-free tin
(Sn) surface finish is known to form whiskers. These whiskers grow
spontaneously from the Sn finish layer as a stress-relief over time
causing device failures. In the present research, whisker growth is
investigated via immersion Sn finishes on Cu substrate. The effects of
Sn layer thickness, addition of Ni under-layer and solder dipping on
whisker growth are investigated by storing the samples under ambient
temperature for up to 24 weeks. The effects of external stresses were
also studied using bending test. The results showed that whisker
length on immersion Sn increases with time for all the samples either
with or without Ni under-layer. Thicker Sn coating showed more
whisker growth compared with thinner Sn coating. The longest
whisker length of 23m was observed for Sn coating with 2m
thickness. The addition of Ni as under-layer was found to be more
effective in mitigating the whisker growth by extending the incubation
time for whisker formation. Compared to immersion Sn, solder dipping
in pure Sn showed no whisker growth. However, alloying Sn with
0.4%wtCu resulted in whisker growth indicating the role of Cu in
promoting whiskers formation.
Introduction
Problem statement
Objective 1
Objective 2
Objective 3
Result 1
Result 2
Result 3
Result 4
Conclusion

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Manuscript 1. Title
2. Abstract
3. Keywords
4. Introduction
7. Conclusion
8. References
To facilitate online searching
Keywords:
Tin whisker, nickel under-layer, solder
dipping, immersion tin

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Manuscript 1. Title
2. Abstract
3. Keywords
4. Introduction
7. Conclusion
8. References
Why is this study important?
What alternatives have been
done by other researcher to
solve the problem?

11
Manuscript 1. Title
2. Abstract
3. Keywords
4. Introduction
7. Conclusion
8. References
Presentation of study
background, identification of
gap(s) in existing research &
statement of research
purpose

12
Introduction. The Restriction of Hazardous Substances Directive
(RoHS), which took effect on 1 July 2006, restricts the use of six
hazardous materials including Pb in the manufacturing of electronics
devices. Thus, the drive to eliminate lead (Pb) from electronics has
resulted in the replacement of Pb-free alloys for both surface finish
and soldering materials in electronic devices. As a result of the global
ban of Pb in electronics industry and transition to Pb-free electronics,
mainly driven by environmental concerns and legislations, pure tin
(Sn) or tin-based Pb-free alloys are being used extensively for lead
finishes to protect conductors, reduce oxidation and enhance
solderability. However, a major drawback of using Pb-free tin finishes
is their tendency to spontaneously grow electrically conductive Sn
whisker during storage. Sn whiskers are usually pure single crystals
or grains of Sn with filament or hair-like structures that grow
spontaneously from electroplated polycrystalline Sn surfaces. These
Sn whiskers which can grow up to several mm in length are highly
conductive, and can cause short circuits in electronic components.
Thus, Sn whisker growth has become a serious reliability concern in
electronic packaging.
Background of the problem
Motivation of the study
Drawbacks of the existing
alternatives

13
Among those surface finishes applications in printed circuit board
(PCB), electroless tin deposits and hot dipping have demonstrated
significant advantages such as low operating temperature without
electrolysis equipment, good solderability, Pb-free surface which is
harmless to environment, good dispersibility and levelling power in
comparison with electroplating tin [1]. Immersion tin plating and Sn
solder dipping are currently preferable in the electronics industry due
to its excellent solderability protection and the ability to retard the
growth of tin whisker. During the first 10 years of research on Sn
whiskers, Arnold, for the first time, discussed mitigation strategies for
Sn whisker in 1956 [2]. His further study on mitigation strategies
reported that except from fusing and hot-dipping, alloying Sn film with
Pb was the predominant whisker mitigation strategy [3]. However, as
the electronics industry migrated toward Pb-free assembly and
system, the surface finish materials have been replaced with pure Sn
or Sn-based alloys. In recent years, the Center for Advanced Life
Cycle Engineering (CALCE-EPSC) published recommended
mitigation strategies for Sn whiskers in July 2002 [4]. The various
mitigation techniques include solder dip the plated surface finish with
Sn-rich Pb-free solder; select a matte or low stress Sn surface finish;
perform barrier layer or under-layer to reduce intermetallic formation;
vary the thickness of Sn plating; reflow of pure Sn plated surface;
annealing and apply a conformal coat. Thus, the main purpose of this
study is to investigate the effects of applying Ni under-layer and solder
dip on Sn surface finishes.
Merits of the methodology
Important of the present study
Literature of the present study
Emphasis on the main objective

14
Manuscript 1. Title
2. Abstract
3. Keywords
4. Introduction
7. Conclusion
8. References
Proposed materials and
methodology
Proposed Model

15
Experimental methodology. In this study, the Cu based
substrates were subjected to a series of pre-treatment
procedures followed by deposition of Sn layer using immersion
plating and solder dipping. For mitigation purposes, electroless Ni
under-layer were deposited between the Cu based substrates
and immersion Sn/ Sn solder dip plating. The primary source of
internal stress is exposure of samples to ambient conditions
which is around 30oC, with uncontrolled relative humidity (RH).
For external stress condition, the samples were first subjected to
bending test at 45o followed by exposure to the same conditions
as above. Examination of Sn whisker formation and growth is
made using Field Emission Scanning Electron Microscope
(FESEM) at different time intervals for up to 24 weeks. Due to
the large number of whiskers, the average of five longest
whiskers per sample will be recorded. The length of a whisker is
defined in accordance to JEDEC standard No. 22-A121A with a
single measurement of the effective shorting distance [5]. The
whisker length is measured as the straight line distance from the
termination surface to the most distant point on the whisker
where the radius of sphere containing the whisker with its centre
located at the point of emergence.
Method 1
Method 2
Method 3
Characterization 1
Characterization 2

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Manuscript 1. Title
2. Abstract
3. Keywords
4. Introduction
7. Conclusion
8. References
Results should be presented
to facilitate reader’
understanding

17
Statement
Aid of figures
Description of the figures
Further discussion
Effects of External Stress on Immersion Sn Plating and Sn Alloys
Solder Dipping.
Compressive stress has been proposed as a necessary factor for Sn
whiskers growth. Mechanical bending during or after deposition are
categorized as externally applied stresses. The lengths of whisker
growth as a function of storage time for all of the Sn coatings are
plotted in Fig. 2a and Fig. 2b for unbent and bent substrates
respectively. It is obvious from that for both unbent and bent
substrates the whisker length increased with increasing storage time
at ambient conditions for the immersion Sn coatings regardless of Sn
coating thickness. The results also indicate that for the 0.8µm and
1.3µm Sn coatings there is not much difference in whisker length. By
contrast for the 2µm thick immersion Sn coating, whiskers were longer
as compared with the thin Sn coatings for all storage durations. For
the 2µm thick immersion Sn coating, whiskers longer than 20µm were
observed after being stored for 24 weeks for both with and with no
bending condition samples whereas whiskers with a length less than
15µm were observed after 24 weeks storage for the plating
thicknesses at 0.8m and 1.3m samples.
The grain size of thin films is proportional to its thickness [6] so thicker
Sn layer is expected to have larger grain size. Previous works
reported that thicker coatings (larger grain sizes) tend to grow fewer
whiskers [7]. The present results, however, showed that with
increasing Sn layer thickness more whiskers had grown compared
with thinner layers. It should be noted, however, that most of the
research data on whiskers concerns electroplated Sn which is
normally thicker than Sn deposited by immersion processes.
Citation of previous work
Point out the different view of
current study

18
Manuscript 1. Title
2. Abstract
3. Keywords
4. Introduction
7. Conclusion
8. References
Summarize what have been
done
Conclude based on the
results

19
Conclusion
On the basis of the analysis presented the following conclusion
can be drawn:
1. The Sn whisker length increases with increased immersion Sn
plating thickness. The longest whisker length has been observed
in the 2µm thick immersion Sn layer.
2. No whiskers were observed on pure Sn solder dip indicating
that solder dip may be used as a method for whisker mitigation.
3. Use of a Ni under-layer appears to extend the incubation time
for whiskers to grow and assist in resisting excessive whisker
growth during storage under ambient.
Conclude the obj. 1
Conclude the obj. 2
Conclude the obj. 3

20
Manuscript 1. Title
2. Abstract
3. Keywords
4. Introduction
7. Conclusion
8. References
Contain a list of papers
which have been referred to

21
References
[1] T. Liu, Y. Wang, D. Ding and K.-P. Galuschki, "Tin Whisker Formation on
Electroless Tin Film Deposited on Lead-frame Alloys," in International
Conference on Electronic Packaging Technology & High Density Packaging,
2011.
[2] S. M. Arnold, "The Growth and Properties of Metal Whiskers," in
Proceedings 43rd Annual Convention of the American Electroplater's Soc.,
1956.
[3] S. M. Arnold, "The Growth of Metal Whiskers on Electrical Components,"
in Proceedings of the IEEE Electronics Component Conference, 1959.
Arnold, S. M. (1959). The Growth of Metal Whiskers on Electrical
Components. Proceedings of the IEEE Electronics Component Conference,
(pp. 75-82).
Asrar, N. (2008). Lead-free Solder Metallization Interdiffusion in Electronic
Interconnect. Proceedings of the 34th International Symposium for Testing
and Failure Analysis, (p. 53).
Baker, G. S. (1957, July). Angular Bends in Whiskers. Acta Metallurgica,
5(7), 353-357.
IEEE
APA

22
Manuscript Grammar
Utilization of Pineapple Leaf Waste for Polypropylene Matrix
Reinforced Fibre (PALF-PP):
The Effect of Fibre Length on the Mechanical Properties
Lim Hooi Peng1,a*, Abd Razak Bin Senan1,b
1Mechanical Engineering Department
Politeknik Ibrahim Sultan
alimhooipeng@pis.edu.my
barastrd@ymail.com

23
Manuscript Grammar
Abstract
Pineapple leaf fibre (PALF) is one of the natural fibres found
ideally as reinforcement in thermoplastics due to its nature of rich
cellulose and abundantly available. The objectives of the present
study are to investigate the potential of using PALF as
reinforcement in polypropylene matrix by melt-mixing method and
the effect of fibre length on mechanical properties including water
absorption, hardness, impact and tensile strength. It was
observed that the fibre length greatly influences the mechanical
properties where long fibre PALF reinforced composites were
indicated to be stronger than other type of fibre loadings as
determined by lower water absorption, greater energy strength,
higher hardness value and tensile strength.
Language focus
Present tense
To describe the background
and objective of the study
Past tense
To report results
To state conclusion

24
Manuscript Grammar
Language focus
Introduction
Global warming and resources exhaustion have driven
tremendous growth in the study and utilization of natural fibres.
The preference to use naturally abundant fibres are mainly due to
the promising biodegradability, cost effective, low density, high
specific strength and toughness, low energy consumption, non
abrasive nature and good thermal characteristics (Reddy & Yang,
2005) (Li, Tabil, & Panigrahi, 2007). In recent years, natural fibres
have been widely recommended to substitute partially the
expensive oil-derived plastic materials and synthetic fibres. As an
agricultural country, Malaysia endow with an abundant availability
of natural fibres. Pineapple leaf fibre (PALF) is the one left
underutilized and the use is limited to textile and handcrafted
paper. PALF possess potential value-added applications such as
polymer reinforcement, construction materials, sound and
thermal insulations. The utilization of PALF reinforced
thermoplastics such as low density polyethylene (LDPE) and
polyester have been demonstrated in many research works
(Devi, Bhagawan, & Thomas, 1997) (George, Bhagawan,
Prabhakaran, & Thomas, 1995) (Mishra, Misra, Tripathy, Nayak,
& Mohanty, 2001) (Sreekumar, Albert, Joseph, & Thomas, 2008).
Present tense
Present perfect tense
To talk about generally
established knowledge
Information prominent
citations- to highlight the
information rather than the
author(s)

25
Manuscript Grammar
Language focus
In contrast, the application of polypropylene (PP) is still not widely
practiced (Vinod & Sudev, 2013) (Chollakup, Tantatherdtam,
Ujjin, & Sriroth, 2011). Therefore, Malaysian Pineapple Industry
Board (MPIB) has urged both industry and university to be
actively collaborated in the research of developing innovative
PALF reinforced plastic products and expanding their potential
commercialization avenue. This study presents the utilization of
PALF as potential reinforcement in polypropylene matrix and the
effect of fibre length on mechanical properties of the PALF
reinforced polypropylene composite.
Present tense
Present perfect tense
To explain the research activity
of the present study

26
Manuscript Grammar
Language focus
Methodology
PALFs were extracted from the spiky leaves of pineapple by
retting. The waste pineapple leaves were collected from
pineapple farm located at Ayer Baloi, Pontian Johor during the
harvest process. Retting began with pressing the pineapple
leaves using two-roll miller to remove circa 90% of the water
content to obtain the PALFs. These PALFs were then chopped
into different length of 2 mm, 10mm and loose powder. Fibre size
ranges from 2-10mm was indicated to be the most favourable
processing size for melt-mixing process which gives effective
reinforcement property for polypropylene matrix (Chollakup,
Tantatherdtam, Ujjin, & Sriroth, 2011). The chopped PALFs were
cleaned with distilled water to remove the contaminants and
followed by drying process in furnace at 70C for 24 hours before
being mixed with polypropylene (George, Bhagawan,
Prabhakaran, & Thomas, 1995). Polypropylene is the
thermoplastic that possess a high degree of recyclability and
versatility. It was identified to provide the best possible protection
against water absorption (Chattopadhyay, Khandal, Uppaluri, &
Ghoshal, 2009).
Past tense + passive voice
(was/were + past participle)
– to place the emphasis on the
procedure

27
Manuscript Grammar
Language focus
Results and Discussion
Water absorption
Water absorption behaviour of PALF-PP composite has a
significant effect on the physical and mechanical properties due
to the nano-sized holes in the fibres that form hydrogen bonds
with the polypropylene and retard the pores to absorb moisture.
Water absorption of PALF-PP composite was calculated using
following equation:
WA (mol%) = WAt - WAo x 100 (1)
WAo
where WAt is the mass of water at equilibrium and WAo is the
initial mass of the specimen. Sorption curves in mol percent for
PALF-PP composites by 100g of the polypropylene was plotted
against the different fibre loadings at 100C to activate the
diffusivity of the composites and therefore enhance the water
uptake.
Past tense
To present the findings
Information prominent
Present tense
General description of the
theory applied

28
Manuscript Grammar
Language focus
Water absorption
Figure 2 clearly shows that as the immersion time increased, the
water absorption also increased. Pure polypropylene was
indicated to have the lowest water absorption at 4.23 mol%
because of the availability of free nano-pores which sufficiently
reduced the water uptake. The swelled polypropylene chains
induced increasing elasticity of structure after immersion in
distilled water for up to 150 minutes and thus increased the
chemical potential that retard further absorption of water
(Sreekumar, Albert, Joseph, & Thomas, 2008).
Present tense
To locate your data in a figure
Past tense
To comment on the results

29
Manuscript Grammar
Language focus
Izod Impact Test
It is seen from Figure 4 that comparatively higher impact energy
was observed for composite of short and long fibre at 1.8460J
and 1.8830J respectively. However, there is a decrease in impact
energy for loose powder fibre reinforced composite of 0.0740J as
compared to pure polypropylene matrix resin of 1.4862J. The
greater energy absorption for long and short fibre during impact is
because of the effective load and stress transmission of PALFs to
the polypropylene matrix. Moreover, higher energy is required to
break the bond in PALFs and extract them completely out of the
matrix. In the case of loose powder fibre, it is difficult to control
the orientation degree of loose powder fibre compared with that
of long and short fibre. Therefore, addition of longer fibres creates
potential of stress concentrations that require more energy to
initiate a crack.
Present tense
To compare the findings
other verbs of report:
(propose, hypothesize,
report, show, imply,
demonstrate)

30
Manuscript Grammar
Language focus
Tensile Test
Tensile strength of fibre reinforced composites relies on the degree to
which an applied load is transmitted to fibres. A critical fibre length is
required for the fibre to develop its entirely stressed level in the matrix.
Tensile properties of longitudinal oriented PALF-PP composites at
length of 2mm, 10mm and loose powder are shown in Figure 5 and
Table 3.The highest tensile stress was indicated in long fibre (10mm)
reinforced composite at 15.14MPa. As the length of fibre increased,
the value increased by 6.17% for short fibre (2mm) reinforced
composite with respect to that of polypropylene matrix. However,
loose powder fibre reinforced composite was indicated to have the
lowest tensile stress of 8.85MPa. The ductile and stiffness nature of
PALF is justified where the elongation of polypropylene matrix could
be enhanced by PALF reinforcement when the tensile stress of pure
polypropylene has been extensively increased from 10.29MPa by
47.13% for long fibre and 35.77% for short fibre. It is due to the
effective transmission of stresses between the PALF and
polypropylene matrix. However, observation of the composite samples
has shown that tensile stress for loose powder reinforced composites
tends to decrease. Thus, the theory of critical fibre length required for
the fibre to completely transfer the stresses to the matrix is proven
(Devi, Bhagawan, & Thomas, 1997). PALF in loose powder orientation
is not sufficient to be the stress transmitter.
1. State the theory of the
property
2. Present the findings
3. Enhance the findings
description with conjunction
4. Justify the findings in line
with the proposed theory
5. Conclude the entire
discussion and provide the
findings as the proof to your
claim

31
Manuscript Grammar
Language focus
Conclusion
Considering the overall experimental results of the present study,
a fibre length of 10mm was found to sufficiently enhance the
hardness value, energy absorption and tensile strength. An
increase in the energy absorption with short and long PALF
content made polypropylene based composites were found to be
stiffer and stronger than pure polypropylene. Hardness increase
was observed in both short and long fibre due to the decrease of
crystallites cross section when the polypropylene was reinforced
by PALF. Additionally, the promising improvement in tensile
strength was observed in long PALF reinforced composites
whereas loose powder PALF exhibited poor flexural and impact
strength. The effect of reinforcement by long fibre has more
distinctive evidence than short fibre because of the high degree
of stress mobility in long fibre to matrix, and thus resulting in
greater mechanical properties. 10mm long PALF-PP composite is
therefore the recommended length, where the hardness, impact
and tensile value are found to be the maximum and the water
absorption uptake is lower than short fibre. Future work will focus
to improve the PALF-PP composite by chemical modification and
fibre orientation in the thermosetting plastics.
Past tense
To restate the findings
Present tense
To explain implications
Future tense
To suggest future work

32
Where to submit? Checklist.
• Scope of Journal
• ISI/Scopus Indexed
• IMPACT Factor
• Journal Format
• Publication frequency
• Publication history
• Culture of the journal

33
Indexed Journal
https://www.elsevier.com

34
Indexed Journal
https://www.elsevier.com

35
Conference
http://www.conferencealerts.com/index

36

37
Conclusion

38
Tip 1
Start writing paper from Methodology.
You may use the methods written in student’s
proposal BUT;
Remember to change it from future tense to
past tense.

39
Tip 2
The same thing applies to Results/ Discussion.
Most of the text should be written in past tense
unless you’re commenting on the results, then
it is fine to use present tense.
For example:
The results showed that …
The significant of these results is that …

40
Tip 3
In general, Conclusion is written in past tense.
For example:
This study concluded that …
There were limitations to the present study …

41
Tip 4
Start writing Introduction after you have
indicated the main focus of the study.
For example:
Review the previous works and research gaps for
flexural strength of polymer if your study was
carried to determine the effect of certain parameters
on flexural strength for a polymer …

42
Tip 5
Save the best for last.
Write the Abstract which describes the whole idea
of your study.
It must precise and include the background of the
study, objective, brief methodology, simple results
and discussion as well as conclusion.
250-300 words would be nice.

Writing a Comprehensive Technical Paper

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