We are a leading micro manufacturing solution and micro metal components facility in Suzhou SND whose focus is on customer demand and customer feeling to create more value in our customer's supply chain.
Registered capital: RMB60mln
Headcount: 130 employees
Spaces: 20,000M2(Used 7,500M2)
2. Index
Brief introduction
Vision & Mission
Core Value and Operation Philosophy
Organization chart & HR structure
Certificates of High tech and quality system
Products application market
Typical sample photos
Business road map
Technical development road map
Main equipment list and glimpse of production
3. Brief Introduction
UIG SND plant locates in Suzhou National New & Hi-tech Industrial
Development Zone, west of Suzhou city, about 1.5 hour to Shanghai by car.
Basic Information;
• Registered capital: RMB60mln
• Location: Suzhou SND
• Headcount: 130 employees
• Spaces: 20,000M2(Used 7,500M2)
4. Vision & Mission
Mission
To provide one stop micro
manufacturing solution and micro
metal components to create
customer value, focusing on
customer demand and customer
feeling.
Vision
To be world class in micro
manufacturing.
5. Core Value and Philosophy
Core Value
Benefit Others/利他
Grow/成长
Gratitude/感恩
Create Social Value/创造社会价值
Operation Philosophy
Customer Oriented/客户导向
Innovation/创新
Equality/平等
Empowerment/授权
Green Environment/绿色环保
6. Organization Chart
HR Structure:
80% of Chinese staff with university/college degree or above
American and Japanese experts with over 30 years’ professional experiences
8. Quality System
ISO9001 achieved
in May’08
ISO14000&OHSAS18001
achieved in April,09
ISO13485 achieved
in Oct, 12
TS16949 achieved
in Apr,13
9. Products Application& Customer Distribution
Products application fields:
MEMS microphone & Sensors;
VCM & Lens Module;
Hearing aids, injection in medical fields;
Deep draw parts for auto industry;
Probe pin and socket for semiconductor, MEMS and PCB board
Global Customer Location
Notes: UIG is now delivering to customers in 16 countries worldwide.
10. Material: Brass C2680 (T=0.1 mm)
Type: Drawn
Used on: MEMS microphone
Material: SUS 304 (T=0.08 mm)
Type: Drawn
Used on: Mobile Pressure sensor
Material: Brass C2680 (T=0.1 mm)
Type: Drawn+24 holes Laser Drilling
Used on: Waterproof microphone
Typical Products Photos, MEMS & Sensors
Material: SUS 304 (T=0.08mm)
Type: Drawn
Used on: Automobile pressure sensor
11. Typical Products Photos, MEMS & Sensors
Material: SUS316L (T=0.15mm)
Type: Deep Draw + Flanging
Used on: Waterproof pressure sensor
Material: SUS316L (T=0.15mm)
Type: Draw + Bend + Shimmy trim
Used on: MEMS Speaker
Material: SUS304 (T=0.08mm)
Type: Lid with Membrane
Used on: IP67 Waterproof pressure sensor
Material: SUS304 (T=0.10mm)
Type: Draw + Pierce
Used on: Pressure sensor
12. Typical Products Photos, Medical Field
Material: FeNi Alloy (T=0.15mm)
Type: Blanking + Welding
Used on: Hearing aids
Material: SUS 316 (Multi-T)
Type: Deep drawn
Used on: Medical injection
Material: FeNi Alloy (T=0.178mm)
Type: Drawn + Shimmy Trim
Used on: Hearing aids
Material: BeCu Alloy (T=0.05mm)
Type: Bending+ Circling
Used on: Hearing aids
13. Typical Products Photos-Medical Field
Material: FeNi Alloy (T=0.178mm)
Type: Deep drawn
Used on: Hearing aids
Material: SUS 305 ( T=0.15mm)
Type: Deep drawn
Used on: Hearing aids
Material: SUS 316L ( T=0.127mm)
Type: Deep drawn
Used on: Hearing aids
Material: SUS 304 ( T=0.15mm)
Type: Deep drawn
Used on: Hearing aids
14. Typical Products Photos-VCM & Lens Module
Material: SPCE (T=0.20mm)
Type: Deep drawn
Used on: VCM motor
Material : Steel 1008 (T=0.2mm)
Type: Bending + Gluing
Used on: Mobile Camera module
Material: SUS 304 (T=0.25mm)
Type: Blanking + Welding
Used on: Mobile contactor
Material: SUS316 + SUS304
Type: Deep Draw + Laser welding
Used on: Dual lens for smart phone
15. Typical Products Photos-Automobile Field
Material: SUS 305 (T=0.5mm)
Type: Deep drawn + Side Punch
Used on: Automobile
Material: SPCE (T=1.2mm)
Type: Deep drawn
Used on: Automobile
Material: Brass C2680 (T=0.8mm)
Type: Flanging
Used on: Automobile
Material: SUS 305 (T=0.35mm)
Type: Deep drawn
Used on: Automobile
16. Typical Products Photos-Electronics Field
Material: 34pins +LCP
Type: Stamping + IM+ OM
Used on: Electronics connector
Material: Copper C194 (T=0.127mm)
Type: Coning + Blanking
Used on: Semiconductor
Material: Copper C11000(T=1mm)
Type: Stamping + Etching
Used on: 5G Base Station
Material: Copper CuZn30 (T=0.15mm)
Type: Fine blanking
Used on: Semiconductor
17. Business Road Map
• Set up Micro testing
assembly line for
semiconductor
• One piece clip frame
semiconductor
• Mass Production of
automation shimmy
trim
2015
2016
2017
• Draw + automation
drilling for pressure
sensor industry
• Micro
manufacturing lab
• Shimmy trim for
hearing aids
• Continue to
develop in micro-
manufacturing fields
2018~
• Mass production
probe pin
• Automation line for
case of dual lens
module
• IP67 membrane
water proof lids
• Big tons deep draw
for ABS components
18. Technical Road Map
Capability
Year 2014
2015
2016
2017
2018
No. Capability
A Material thickness
B Blanking tolerance
C Bend tolerance
D Drawn tolerance
E Position tolerance
F Drawn ratio
G
SPM (Stroke Per
Minute)
H
Tooling part making
precision
I Tooling fit clearance
J
Riveting in primary
tooling
K Ink printing
L Resistance welding
M Laser welding
N Laser marking
O Laser drilling
P Micro injection
Q
Automatic check on
line (V&D)
R
Automatic assembly
and packing
No. (In mm)
A >=0.05
B <=0.01
C <=0.015
D <=0.03
E <=0.05
F >=5
G <=1000
H <=0.0015
I >=0.003
J no
K no
L yes
M yes
N no
O no
P no
Q yes
R yes
No. (In mm)
A >=0.04
B <=0.008
C <=0.015
D <=0.025
E <=0.04
F >=6
G <=1000
H <=0.001
I >=0.002
J no
K no
L yes
M yes
N no
O yes
P no
Q yes
R yes
No. (In mm)
A >=0.03
B <=0.007
C <=0.015
D <=0.02
E <=0.04
F >=8
G <=1200
H <=0.001
I >=0.002
J no
K no
L yes
M yes
N no
O yes
P yes
Q yes
R yes
No. (In mm)
A >=0.03
B <=0.005
C <=0.01
D <=0.015
E <=0.03
F >=10
G <=1200
H <=0.0007
I >=0.002
J yes
K no
L yes
M yes
N no
O yes
P yes
Q yes
R yes
No. (In mm)
A >=0.025
B <=0.005
C <=0.01
D <=0.01
E <=0.03
F >=12
G <=1500
H <=0.0007
I >=0.002
J yes
K yes
L yes
M yes
N yes
O yes
P yes
Q yes
R yes
19. Main Equipment List
■ Stamping machine
Machine name Brand Made in Qty
Auto High-speed Stamping Machine BRUDERER Switzerland ×10
Auto High-speed Stamping Machine KYORI/Dobby Japan ×5
Transfer Stamping Machine Asahi Seiki Japan ×2
Single Stamping Machine Yuandu/Xieyi China ×4
20. ■ Main inspection machine
Machine name Brand Made in Qty
OGP 3D inspection machine SMARTSCOPE ZIP250 USA ×1
2D projector&2D inspection machine Nikon/Wan Hao/EV2515 Japan ×5
X-Ray Scope FISHER XDV-SDD German ×1
Digital automatic hardness tester HVS-1000 Local ×1
Plating thickness spectrometer Thick800A EDXRF Local ×1
Roughness Tester Mitsutoyo Japan ×1
Main Equipment List
21. ■ Main accessorial machine
Machine name Type Made in Qty
EDM machine Sodick A3R Japan ×2
Grinder machine Flatness grinder Taiwan ×3
Grinding machine Stone/Magnetic China ×5
Polishing machine Sand blasting China ×7
Drying machine Tumbling China ×3
Cleaning machine Ultrasonic China ×3
Main Equipment List
22. Production line of high speed stamping and auto welding for micro precision parts
Glimpse of production line
23. Glimpse of production line
■ Instant information system controlled production line
Machine Application Qty
Auto high speed stamping line Deep draw, bending and blanking process ×15
Auto welding line & laser drilling Micro welding & laser drill process ×7
Auto packing line Packing and flatness inspection ×6
24. Summarizing
UIG is a high tech company focusing on delivering micro manufacturing service
to customers in industries of MEMS, Sensor, Medical, Lens Module,
Semiconductor and auto by following technologies:
Micro stamping
Deep drawing
Micro plating
Laser welding and laser drilling
Resistance welding
Tape & reel packing
Micro testing components(probe pin & socket)
We are dedicated to create customer value to our valuable customers!