The document summarizes improvements and future plans for the Fusion system. It discusses improved handler and system reliability through new kits and patches. It also details improved cooling capacity through heat exchanger replacements. Future plans include testing new revisions to address high failure rates and hang up problems. Bottlenecks mentioned are weak parts reliability, limited space for improved cooling, and weak software supports.

1. Fusion
Major Improvements:
• Improved handler down - New kits for PCF87X52.
• Improved system down - New patches released to improve PCF87X52
hang up.
• Improved cooling capacity & efficiency - Finished the replacement of
two heat-exchangers . Improved Fusion cooling capacity & efficiency.
1

2. Future Plan:
• Improvement pin card high failure rates - It will have a new revision trial
on Fusion.
• Improvement SMS board high failure rates - SMS rev 02 change to rev 03.
• OM6357 “Stuck-at ” problem caused by register during production.
(Under monitoring, no more troubles found recently).
• Improve PCF87X52 hang up problem - New patches & OS will be trial.
Bottleneck:
• Weak reliability of parts.
• Old building (W2) do not have enough space to improve ext-cooling
capacity.
• Weak supports of software.
2

3. WTF Fusion
Major Improvement
• Improved type down - New test program of PC8814 was released to
solved Bin 21 issue
• Improved type down - PC87xxx hang-up issue had been solved due to
new driver updated.
• Improved production - PC50874V6 with dual site have been released to
Fusion-DH.
Action / Future Plan
• OM6116 yield improvement
• Gap between utilization and output from utilization analysis and reduction
(To prevent the unnecessary operation time)
Bottle Neck
• New and immature types cause the high utilization loss
3