1. TECHNICAL CAPABILITY

3. General capability

4. Technical investments

5. Technical investments Laser vias filling line Router with CCD camera and Z axis control Drilling (OIR & 300KT/MN) LDI (Paragon 8W) Laser plotter (LP5008) DES line AOI & AOR (Automatic Optical Repair) Electroless nickel-gold line 2009 2008 2007

6. Reliability

9. Industrial designs & examples for high reliable boards

10. or Base materials : high Tg (175°C°) epoxy with fillers and phenolic hardener

11. BGA from 0.8 to 1 mm pitch

13. Blind holes Thru holes BGA at 1 mm pitch (1500 boules)

14. Main technology in the case of “large” BGA’s (number of balls from 800 to 1800) Main markets : Avionics, Military, Industriel, “big” computers Evolutions : high number of layers (+ 40% in 4 years) Base copper thickness of 35µ (Low voltage ; “differential” signals) Controlled impedances “ Sequential” boards

15. High Density PCB’s Designs & examples for HDI boards (Advanced technology)

16. High Density PCB’s The packaging “orientation” is mainly due to : - the market segment (”consumer” vs “professional”...) - the BGA pitch - the “matrix” size (number of balls) - the electrical constraints (impedance, signal quality ...) - the assembly constraints (thermal shocks, finishes ...)

17. High Density PCB’s BGA at 0.5 to 0.3 mm pitch

18. High Density PCB’s BGA at 0.5 mm pitch without lines between pads

19. High Density PCB’s Example Thru holes drilled at 0.25 mm Laser holes drilled at 0.1 mm 100 µ lines Thickness : 1 mm BGA pitch 0.5 mm External Layer Internal Layer

20. High Density PCB’s BGA at 0.5 mm pitch with one line between 2 pads

21. High Density PCB’s BGA at 0.4 mm pitch with one line between 2 pads

22. High Density PCB’s BGA at 0.3 mm pitch without lines between pads

23. High Density PCB’s Main packaging when BGA pitch =< 0.5 mm Main markets : communication and/or handled Electronic devices (mobile phones, Bluetooth, PDA ...) Future : high packages matrix (more balls) stacked vias Less total plated thru holes thinner lines & spacing

24. High Density PCB’s Advanced technology for Specific Needs (close to silicon devices)

25. High Density PCB’s

26. High Density PCB’s BGA at 0.5 mm pitch : one line between 2 pads sequential board Drilled holes at 150µ 60 µ lines

27. High Density PCB’s Double sided board : - Flip-chip at 250 µ pitch - 165 µ pad - Drilling at 100 µ - Base material : Hitachi 679F 100µ 200µ Cuivre Nickel-Or chimique

28. High Density PCB’s

29. High Density PCB’s 58 µ 55 µ 30 µ 35 µ 45 µ 90 µ 110 µ External line with Nickel & Gold Inner line Inner line 100 µ drilled hole

30. High Density PCB’s