This document contains confidential Samsung information regarding the schematic and power diagrams for a laptop reference design. It includes 76 sheets detailing the various components, connections, voltage rails and power consumption estimates. Key components include an Intel Penryn-6M CPU, Intel Cantiga chipset, DDR3 memory, various USB and SATA connections, and discrete graphics. Power is supplied via an AC adapter or battery supplying voltages between 0.75V and 5V to various components as detailed in the power state tables.
Quality defects in TMT Bars, Possible causes and Potential Solutions.
scheme-samsung-np_r560.pdf
1. Samsung
Confidential
SRP Sheet Number: 1 of 76
Sheet 50
Sheet 51.
Sheet 66.
Sheet 52.
Sheet 67.
Sheet 53.
Sheet 68.
Sheet 54.
Sheet 69.
Sheet 55.
Sheet 70.
Sheet 56.
Sheet 71.
Sheet 57.
Sheet 72-73.
Sheet 14-16.
Sheet 74.
Sheet 17-21
Sheet 22.
Sheet 23.
Sheet 24-28
Sheet 29.
Sheet 38-40
Sheet 41-45.
Sheet 46.
GFx_External_NB9X
Sheet 30-34
Graphics_Memory
Sheet 35-37.
LAN_Marvell_8055
Sheet 47-48.
PCIE_Minicard_Slot
Sheet 49.
Express_Card
A
Multi_MV_AU6372
SPI ROM & Debug Connector
HDD_IF_Conn
D
ODD_IF_Conn
SAMSUNG PROPRIETARY
USB_1Port
HDA_Modem
USB_2Port
B
Bluetooth_IF
1
Sheet 12. Clock Generator -CK505
Debug_Port
Sheet 58.
MICOM_Renesas2110
Sheet 59.
KBD_IF
Sheet 60.
Touchpad_IF
Sheet 61.
PWR_Switchbutton
Sheet 62.
MIO_Switch
Sheet 63.
LED_Switch
Sheet 64.
LID_Switch
Sheet 65.
PWR_MV_Charger
ICH,PERIPHERALS BLOCK
PWR_MV_3V_5V
GFX, LAN, AUDIO&MODEM BLOCK
PWR_MV_Switched
POWER DC/DC BLOCK
PWR_CPU_MV_SC452
# Mobile Intel Santa Rosa Platform Design Guide 0.5 (Dec, 2005)
PWR_MV_Cantiga
SAMSUNG
PWR_MV_Memory
B
PWR_GFX_MV_Ext
4
Sheet 13.
3
PBA Name :
D
PCB Code :
X
CHECK
C
SAMSUNG ELECTRONICS CO’S PROPERTY.
4
PROPRIETARY INFORMATION THAT IS
2
1.1
Oslo2_DDR3
Penryn-6M CPU
TH LEE
Signature :
1
# Mobile Intel Crestline Platform Checklist TBD (TBD)
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
Thermal Sensor & FAN
Graphic Interface
Camera_IF
MAIN
DDR3 SODIMM B
Cantiga-GMCH
Sheet 8.
Diagram (Block/Power) & Annotations
BA41-00866A
ICH9-M
DRAW
C
3
Chip Set :
Model Name :
Montevina Platform
A
OSLO2
CPU,MCH/DDR3, CLK, THERMAL BLOCK
Sheet 9.
Sheet 11.
Sheet 10.
Cover
THIS DOCUMENT CONTAINS CONFIDENTIAL
DDR3 SODIMM A
High Definition Audio (ALC262 REV-C)
EXCEPT AS AUTHORIZED BY SAMSUNG.
Dev. Step :
SEC Mobile R & D
Remarks :
TH LEE
PWR_MV_DisCharger
BA41-00867A
CPU :
ELECTRONICS
MP
Intel Penryn-6M (1067/800) MHz
Intel Cantiga & ICH9M
T.R. Date :
MS YANG
2
Sheet 1.
Owner :
2008. 05.15
APPROVAL
Revision :
MK KIM
Sheet 2-7.
2. Samsung
Confidential
Samsung
Confidential
Samsung
Confidential
SRP Sheet Number: 2 of 76
PG 41
Lane 2
ELECTRONICS
D
PG 71
A
LPC
2
Modem
DDR III
C
DDR III
Lane X
SATA
PROPRIETARY INFORMATION THAT IS
MICOM
USB 4
88E8055
PG 52
CK-505
Lane 3
1299 FCBGA
PG 44
NB9X
PG 48
FAN
HDA0
SODIMM 0
PG 17 - 21
Express Card
PG 13
SATA
PG 22
KBD
PCIE x1
4 Pin
USB 10
PG 66
Module
3
Bluetooth
PG 46
D
HDMI
SAMSUNG ELECTRONICS CO’S PROPERTY.
CRT
DDR III Power
3
L2 Cache : 6/3MB
4
Circuit
PG 64
Battery
CLINK
USB 8
PCIE x1
LED
MCH-M
PG 46
ICH9-M
Dual channel
Clocking DC/DC
USB 0,6,2
ON BOARD
676 BGA
Channel A (Reverse)
VCCP / DC-DC
PM45
SPKR R
AU6371
OPTION
PG 50
PG 49
PG 51
PG 56
80
Port
478pin
Penryn-6M
MIC-IN
MDC
Cantiga-PM PG 23
TMKBC (TBD)
Aud.
SPDIF.
PG 53
PG 61
PEG x16
PG 29
Camera
FSB
SPKR L
AMP
ANT
667/800 MT/S
A
Mobile Processor
PCIE x1
RJ11
PG 47
DDR III 1067/800
RJ45
SAMSUNG
12P
PG 51
USB 5
PAD
B
DDR III 1067/800
Lane 1
PG 69
OPTION
PG 59
External Graphics
IMVP-6
(TBD)
1
PG 39
2
PG 57
CPU
PG 49
PCIE x1
SATA 1
PG 56
ODD
52P
Thermistor
Mini Card 2
Mini Card 1
HDA1
PG 54,55
1
USB 3
PG 70
SODIMM 1
LCD
SATA 0
Smart
DC/DC
Direct Media Interface
7 IN 1
Ext. PEG
HDAUDIO
CPU
LCD
ANT
4
HP
PG 39
CRT
FSB 1067
SAMSUNG PROPRIETARY
Channel B (Reverse)
EXCEPT AS AUTHORIZED BY SAMSUNG.
PG 60
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
PG 30 - 34
PG 40
HDA2
PG 42
ALC262
THIS DOCUMENT CONTAINS CONFIDENTIAL
PG 42,43
PG 66
RESERVED FOR
PG 24 - 28
x4, 1.5V
PG 14,15,16
SPI ROM
PG 38
M/S(SD...)
H8S-2110B
PG 13
Audio
PG
58
USB 0,6,2
52P
Touch
C
High Definition Audio
3.3V LPC, 33MHz
B
HDD
PG 12
Charging
SPI
3. Samsung
Confidential
Samsung
Confidential
Samsung
Confidential
SRP Sheet Number: 3 of 76
A
P1.5V_AUX
P3.3V_MICOM
P0.75V
VTT for CPU, Crestline & ICH9-M
1.5V switched power rail (off in S3-S5)
P1.5V
5.0V switched on power rail (off in S4-S5)
P5.0V_AUX
GFX_CORE Core Voltage for GPU
3.3V always power rail (for Micom)
0.75V power rail for DDR (off in S3-S5)
P5.0V_ALW 5.0V always power rail
SYSTEM PORT 1
C
4
ELECTRONICS
BOARD INFORMATION
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
SAMSUNG ELECTRONICS CO’S PROPERTY.
SAMSUNG
-
-
E
-
-
-
I C / SMB Address
Devices Address
ICH9-m
CPU Thermal Sensor
SODIMM0
SODIMM1
Master
0111 101x
1
A
4
B
PROPRIETARY INFORMATION THAT IS
SAMSUNG PROPRIETARY
C
P3.3V
P5.0V
USB PORT Assign
PORT # ASSIGNED TO
Express Card
4
Bluetooth
0
1
2
3
See rev notes for more information.
PCI Devices
Devices IDSEL#
Cardbus
F
REVISION HISTORY
SCHEMATIC ANNOTATIONS AND BOARD INFORMATION
D
2 1
B
EXCEPT AS AUTHORIZED BY SAMSUNG.
THIS DOCUMENT CONTAINS CONFIDENTIAL
D
2
3
3
USB2.0 #1 (USB1) : D
USB2.0 #2 (USB4) : C
25MHz
Crystal LAN Marvell LAN (88E8850)
14.318MHz
Crystal CLOCK-Generator CK-505
USB2.0 #4 (EHCI) : H
6
7
USB2.0 #3 (USB5) : E
Hex
-
7Ah
1010 000x
1010 010x
Thermal Sensor on SODIMM1
Primary DC system power supply (7 to 21V)
1.8V switched power rail (off in S3-S5)
VDC
VCC_CORE
P1.8V
P1.05V (VCCP)
Core Voltage for CPU
3.3V switched on power rail (off in S4-S5)
3.3V switched power rail (off in S3-S5)
5.0V switched power rail (off in S3-S5)
1.5V power rail for DDR (off in S4-S5)
P3.3V_AUX
B
-
LOM
NC
GLAN - -
8
9 NC
34h -
-
30h
Thermal Sensor on SODIMM0
5
LCD Pannel Detect
USB
Hub to PCI
LPC bridge/IDE/AC97/SMBUS
Internal MAC
AD25
AD29(internal)
AD30(internal)
AD31(internal)
AD24(internal)
REQ/GNT#
3
Interrupts
A,B,C
USB2.0 #0 (USB0) : A
B
HD64F2169/2160
11 NC
NC
6
12MHz
Crystal Multi Card Reader Alkor AU6371
MICOM
Battery
Master
0001011x
-
16h
A0h
Bus
SMBUS Master
Thermal Sensor (EMC2012)
-
-
Clock, Unused Clock Output Disable
A4h
D2h
2
CK-505M (Clock Generator) 1101 001x
Voltage Rails
AC Link -
0011 010x
Express Card
0011 000x
1
2
3
Mini Card 2 (ROBSON or DVB-T)
4
5
Mini Card 1 (WLAN)
NC
SYSTEM PORT 2
SYSTEM PORT 2
Mini Card
NC
10 Multi Card Reader (7-in-1)
Devices Resolution PANNEL_DETECT_0
Crystal / Oscillator
32.768KHz
Crystal
TYPE FREQUENCY DEVICE
ICH9-M
USAGE
Real Time Clock
10MHz
Crystal MICOM
SMBUS Master
Battery
Camera
(EDID)
PCI Express Assign
PORT # ASSIGNED TO
4. Samsung
Confidential
Samsung
Confidential
Samsung
Confidential
SRP Sheet Number: 4 of 76
MICOM
TOUCHPAD
AUDIO AMP
MDC
HDD
C
ICH8-M
Thermal Sensor
LCD
(CHP3_S4_STATE*)
S3
ON
MDC
CK505
P1.05V
+V*LAN
P3.3V_AUX
3
P5V_AUX
AUDIO
PENRYN
D
ON
LAN
P5.0V
ICH9-M
+V*A(LWS)
+0.9V
P1.1V
GCORE3_PWRGD
S0
Cantiga
Cantiga
ICH9-M
AUX DISPLAY
SAMSUNG PROPRIETARY
GFX PEG
(CHP3_SLPS3*)
GDDR-3 for PEG
Rev 0.1
P0.75V
PEG
USB
S0
B
LEDs
P3.3V_ALW
Cantiga
+V* (CORE)
SODIMM
ON ON
ON
ODD
+1.8V_AUX
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
+V
A
State
CK505
VCCP3_PWRGD
LAN
Power On/Off Table by S-state
THIS DOCUMENT CONTAINS CONFIDENTIAL
Mini Card
KBC3_SUSPWR
B
1
P2.5V_LAN
LAN
P12.0V_ALW
4
EGFX_CORE
D
PROPRIETARY INFORMATION THAT IS
ICH9-M
P1.5V_AUX
S5-S4
P3.3V_MICOM
P1.8V_LAN
P5.0V_ALW
nVidia GFX
MICOM
ELECTRONICS
2
S5
3
EXCEPT AS AUTHORIZED BY SAMSUNG.
ON
P1.5V
CPU_CORE
SAMSUNG
PENRYN
C
AC Adapter
(VCCP)
ON
POWER DIAGRAM
S3
ON
KBC3_PWRON
S4
1
P1.2V_LAN
VDC
P1.8V
SODIMM (DDR III)
Cantiga
SODIMM (DDR III)
ICH9-M
USB
Express Card
SODIMM (DDR III)
Battery DC
2
4
MICOM
P3.3V
ON
+V*AUX
ON
Rail
SPI
SAMSUNG ELECTRONICS CO’S PROPERTY.
A
5. Samsung
Confidential
Samsung
Confidential
Samsung
Confidential
SRP Sheet Number: 5 of 76
EXCEPT AS AUTHORIZED BY SAMSUNG.
0.9V( TBD A )
0.1 A (TBD)
VDC
INV
(
TBD
A
)
D
3.3V
3.3V
3.3V
3.3V
LAN (88E8055)
SAMSUNG ELECTRONICS CO’S PROPERTY.
5V
ELECTRONICS
( ~ 2.0 W )
B
1.5 A (TBD)
5V
19V (VDC INV)
0.08 A (TBD)
Value by Datasheet/Application notes
0.01 A (TBD)
4
P1.2V_LAN
HD Audio
4
0.08 A (TBD)
CPU CORE ( TBD A )
A
( 35 W )
3.3V (LCD 3V)
5.0V_AUX
(
TBD
A
)
3.3V
0.2 A (TBD)
PROPRIETARY INFORMATION THAT IS
1 A (TBD)
C
0.9V
ITP
5V
Battery
3.3V
SAMSUNG PROPRIETARY
MICOM 3V
3.3V
2
3.3V
0.15 A (TBD)
1.5V
VGA
CORE
(TBD
A)
1.05V ( TBD A )
3.3V ( TBD A )
SAMSUNG
3.3V_AUX
A
SD Card
SATA
2 A (TBD)
0.5 A (TBD)
1.5 A (TBD)
3
0.5 A (TBD)
(Dual slots)
1.8V
1.05V
1.13 A (TBD)
3
MICOM 3V
D
5V
5V
( ~ 5.0 W )
3.1 A (TBD)
0.29 A (TBD)
5V_AUX
1
FAN
THIS DOCUMENT CONTAINS CONFIDENTIAL
1.5 A (TBD) Audio AMP
P1.8V/2.5V_LAN
0.015 A (TBD)
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
3.3V
C
Penryn-6M
5.0V ( TBD A )
0.13 A (TBD)
2
1.05V (VCCP)
B
3.3V
Touch Pad
1.25V
0.2 A (TBD)
ICH9-M
KeyBoard
GDDR
3.3V_AUX
(
TBD
A
)
RTC_Battery
1.05V (VCCP)
PWR LED
3.3V
0.5 A (TBD)
3.3V
0.67 A (TBD)
LAN
Adapter
0.75 A (TBD)
1
0.001 A (TBD)
1.8V_AUX ( TBD A )
1.0V-1.1V (EGFX CORE)
MICOM 3V ( TBD A )
3.3V_AUX
1.25V ( TBD A )
0.125 A (TBD)
RTC_Battery
0.33 A (TBD)
1.8V ( TBD A )
6.53 A (TBD)
(Value by measurement)
1.5V
0.06 A (TBD)
DDR-3
3.3V_AUX
1.5V
0.08 A (TBD)
0.374 A (TBD)
220V
7.7 A (TBD)
(8 - 8.5 W )
0.006 A (TBD)
CLOCK
SPI
ODD
0.67 A (TBD)
0.16 A (TBD)
PEG
PEX
IO
(TBD
A)
1.05V (MCH CORE)
P3.3V_AUX
Thermal
0.1 A (TBD)
0.1 A (TBD)
0.07 A (TBD)
GMCH
5V
POWER RAILS ANALYSIS
USB (x 3)
1.05V
0.25 A (TBD)
3.79 A (TBD)
1.5V ( TBD A )
Mini Card X 2
1.8V
0.001 A (TBD)
3.3V
1.8V_AUX
3.1 A (TBD)
1.75 A (TBD)
KBD LED
0.209 A (TBD)
3.3V_AUX
0.22 A (TBD)
3.3V_AUX
41 A (TBD)
0.75A (TBD)
5V
0.6 A (TBD)
Cantiga
LCD
17.75 A (TBD)
KBC
5V
2.43A (TBD)
1.8V_AUX
SATA HDD
1.2V (PEX IO)
Sensor
1.5V
MDC
Rev. 0.6 (060920)
5V
CPU CORE
2.4A (TBD)
1.8V
4.48 A (TBD)
4.5 A (TBD)