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RoHS is the commonly known term referring to both the original RoHS Directive and the RoHS Recast 
Directive , which replaced the original RoHS as of January 1 2013. You will also see RoHS II referred to as 
the RoHS Recast. The RoHS recast contains the same principal restrictions as the previous RoHS Directive 
but has an increase in requirements compared to the previous RoHS directive. 
ROHS EXEMPTION LIST WITH EXPIRATIONS
/2 
NUMBER DESCRIPTION EXPIRY DATE 
1a 
Mercury in single capped (compact) fluorescent lamps not exceeding (per 
burner): For general lighting purposes < 30 W: 2,5mg shall be used per burner 
after 31 December 2012 
21-Jul-16 
1b 
Mercury in single capped (compact) fluorescent lamps not exceeding (per 
burner): For general lighting purposes ≥ 30 W and < 50 W: 3,5mg may be used 
per burner after 31 December 2011 
21-Jul-16 
1c 
Mercury in single capped (compact) fluorescent lamps not exceeding (per 
burner): For general lighting purposes with circular or square structural shape 
and tube diameter ≤ 17 mm: 7 mg may be used per burner after 31 December 
2011 
21-Jul-16 
1d 
Mercury in single capped (compact) fluorescent lamps not exceeding (per 
burner): For general lighting purposes ≥ 150 W: 15 mg 
21-Jul-16 
1e 
Mercury in single capped (compact) fluorescent lamps not exceeding (per 
burner): For general lighting purposes with circular or square structural shape 
and tube diameter ≤ 17 mm 
21-Jul-16 
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ANNEX III - APPLICATIONS EXEMPTED FROM THE 
RESTRICTION IN ARTICLE 4(1)
/3 
NUMBER DESCRIPTION EXPIRY DATE 
1f 
Mercury in single capped (compact) fluorescent lamps not exceeding (per 
burner): For special purposes: 5 mg 
21-Jul-16 
2a1 
Mercury in double-capped linear fluorescent lamps for general lighting purposes 
not exceeding (per lamp): Tri-band phosphor with normal lifetime and a tube 
diameter < 9 mm (e.g. T2):4 mg may be used per lamp after 31 December 2011 
21-Jul-16 
2a2 
Mercury in double-capped linear fluorescent lamps for general lighting purposes 
not exceeding (per lamp): Tri-band phosphor with normal lifetime and a tube 
diameter ≥ 9 mm and ≤ 17 mm (e.g. T5): 3 mg may be used per lamp after 31 
December 2011 
21-Jul-16 
2a3 
Mercury in double-capped linear fluorescent lamps for general lighting purposes 
not exceeding (per lamp): Tri-band phosphor with normal lifetime and a tube 
diameter > 17 mm and ≤ 28 mm (e.g. T8): 3,5 mg may be used per lamp after 31 
December 2011 
21-Jul-16 
2a4 
Mercury in double-capped linear fluorescent lamps for general lighting purposes not 
exceeding (per lamp): Tri-band phosphor with normal lifetime and a tube diameter 
> 28 mm (e.g. T12):3,5 mg may be used per lamp after 31 December 2012 
21-Jul-16 
2a5 
Mercury in double-capped linear fluorescent lamps for general lighting purposes 
not exceeding (per lamp): Tri-band phosphor with long lifetime (≥ 25 000h): 5 mg 
may be used per lamp after 31 December 2011 
21-Jul-16 
2b1 "Linear halophosphate lamps with tube > 28 mm (T10 and T12): 13-Apr-12 
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/4 
NUMBER DESCRIPTION EXPIRY DATE 
2b2 10 mg per lamp" 13-Apr-16 
2b3 
Mercury in other fluorescent lamps not exceeding (per lamp): Non-linear 
halophosphate lamps (all diameters): 15 mg 
21-Jul-16 
2b4 
Mercury in other fluorescent lamps not exceeding (per lamp): Non-linear tri-band 
phosphor lamps with tube diameter > 17 mm (e.g. T9): 15 mg may be used 
per lamp after 31 December 2011 
21-Jul-16 
3a 
Mercury in other fluorescent lamps not exceeding (per lamp): Lamps for other 
general lighting and special purposes (e.g. induction lamps): 15 mg may be used 
per lamp after 31 December 2011 
21-Jul-16 
3b 
Mercury in cold cathode fluorescent lamps and external electrode fluorescent 
lamps (CCFL and EEFL) for special purposes not exceeding (per lamp): Short 
length (≤ 500 mm). 3,5 mg may be used per lamp after 31 December 2011 
21-Jul-16 
3c 
Mercury in cold cathode fluorescent lamps and external electrode fluorescent 
lamps (CCFL and EEFL) for special purposes not exceeding (per lamp): Medium 
length (> 500 mm and ≤ 1 500 mm). 5 mg may be used per lamp after 31 
December 2011 
21-Jul-16 
4a 
Mercury in cold cathode fluorescent lamps and external electrode fluorescent 
lamps (CCFL and EEFL) for special purposes not exceeding (per lamp): Long 
length (> 1 500 mm). 13 mg may be used per lamp after 31 December 2011 
21-Jul-16 
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/5 
NUMBER DESCRIPTION EXPIRY DATE 
4bI 
Mercury in other low pressure discharge lamps (per lamp). 15 mg may be used 
per lamp after 31 December 2011 
21-Jul-16 
4bII 
Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes 
not exceeding (per burner) in lamps with improved colour rendering index Ra > 
60: P ≤ 155 W. 30 mg may be used per lamp after 31 December 2011 
21-Jul-16 
4bIII 
Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes 
not exceeding (per burner) in lamps with improved colour rendering index Ra > 
60: 155 W < P ≤ 405 W. 40 mg may be used per lamp after 31 December 2011 
21-Jul-16 
4cI 
Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes 
not exceeding (per burner) in lamps with improved colour rendering index Ra > 
60: P > 405 W. 40 mg may be used per lamp after 31 December 2011 
21-Jul-16 
4cII 
Mercury in other High Pressure Sodium (vapour) lamps for general lighting 
purposes not exceeding (per burner): P ≤ 155 W. 25 mg may be used per lamp 
after 31 December 2011 
21-Jul-16 
4cIII 
Mercury in other High Pressure Sodium (vapour) lamps for general lighting 
purposes not exceeding (per burner): 155 W < P ≤ 405 W. 30 mg may be used per 
lamp after 31 December 2011 
21-Jul-16 
4d 
Mercury in other High Pressure Sodium (vapour) lamps for general lighting 
purposes not exceeding (per burner): P > 405 W. 40 mg may be used per lamp 
after 31 December 2011 
13-Apr-15 
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/6 
NUMBER DESCRIPTION EXPIRY DATE 
4e Mercury in High Pressure Mercury (vapour) lamps (HPMV) 21-Jul-16 
4f Mercury in metal halide lamps (MH) 21-Jul-16 
5a 
Mercury in other discharge lamps for special purposes not specifically mentioned 
in this Annex 
21-Jul-16 
5b Lead in glass of cathode ray tube 21-Jul-16 
6a Lead in glass of fluorescent tubes not exceeding 0,2 % by weight 21-Jul-16 
6b 
Lead as an alloying element in steel for machining purposes and in galvanised 
steel containing up to 0,35 % lead by weight 
21-Jul-16 
6c Lead as an alloying element in aluminium containing up to 0,4 % lead by weight 21-Jul-16 
7a Copper alloy containing up to 4 % lead by weight 21-Jul-16 
7b 
Lead in high melting temperature type solders (i.e. lead-based alloys containing 
85 % by weight or more lead) 
21-Jul-16 
7cI 
Lead in solders for servers, storage and storage array systems, network 
infrastructure equipment for switching, signalling, transmission, and network 
management for telecommunications 
21-Jul-16 
7cII 
Electrical and electronic components containing lead in a glass or ceramic other 
than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass 
or ceramic matrix compound 
21-Jul-16 
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/7 
NUMBER DESCRIPTION EXPIRY DATE 
7cIII 
Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC 
or 250 V DC. 
[May only be used in spare parts for EEE placed on the market before 1 January 
2013.] 
01-Jan-13 
7cIV 
Lead in PZT based dielectric ceramic materials for capacitors which are part of 
integrated circuits or discrete semiconductors. 
21-Jul-16 
8a 
Cadmium and its compounds in one shot pellet type thermal cut-off. 
[May only be used in spare parts for EEE placed on the market before 1 January 
2012.] 
01-Jan-12 
8b Cadmium and its compounds in electrical contact 21-Jul-16 
9 
Hexavalent chromium as an anticorrosion agent of the carbon steel cooling 
system in absorption refrigerators up to 0,75 % by weight in the cooling solution 
21-Jul-16 
9b 
Lead in bearing shells and bushes for refrigerant-containing compressors for 
heating, ventilation, air conditioning and refrigeration (HVACR) applications 
21-Jul-16 
11a 
“Lead used in C-press compliant pin connector systems. 
[May only be used in spare parts for EEE placed on the market before 24 
September 2010.]” 
24-Sep-10 
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/8 
NUMBER DESCRIPTION EXPIRY DATE 
11b 
“Lead used in other than C-press compliant pin connector systems. 
[May only be used in spare parts for EEE placed on the market before 1 January 
2013.]” 
01-Jan-13 
12 
“Lead as a coating material for the thermal conduction module C-ring. 
[May only be used in spare parts for EEE placed on the market before 24 
September 2010.]” 
24-Sep-10 
13a Lead in white glasses used for optical applications 21-Jul-16 
13b Cadmium and lead in filter glasses and glasses used for reflectance standards 21-Jul-16 
14 
“Lead in solders consisting of more than two elements for the connection 
between the pins and the package of microprocessors 
with a lead content of 
more than 80 % and less than 85 % by weight. 
[May only be used in spare parts for EEE placed on the market before 1 Jan 
2011.]” 
01-Jan-11 
15 
Lead in solders to complete a viable electrical connection between semiconductor 
die and carrier within integrated circuit flip chip packages 
21-Jul-16 
16 Lead in linear incandescent lamps with silicate coated tubes. 01-Sep-13 
17 
Lead halide as radiant agent in high intensity discharge (HID) lamps used for 
professional reprography applications 
21-Jul-16 
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/9 
NUMBER DESCRIPTION EXPIRY DATE 
18a 
LEAD as activator in the fluorescent powder (1 % lead by weight or less) of 
discharge lamps when used as specialty lamps for diazoprinting reprography, 
lithography, insect traps, photochemical and curing processes containing 
phosphors such as SMS. 
01-Jan-11 
18b 
Lead as activator in the fluorescent powder (1 % lead by weight or less) of 
discharge lamps when used as sun tanning lamps containing phosphors such 
as BSP (BaSi2O5:Pb) 
21-Jul-16 
19 
LEAD with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam 
and with PbSn-Hg as auxiliary amalgam in very compact energy saving lamps 
(ESL). 
01-Jun-11 
20 
LEAD oxide in glass used for bonding front & rear substrates of flat fluorescent 
lamps used for liquid crystal displays (LCD). 
01-Jun-11 
21 
Lead and cadmium in printing inks for the application of enamels on glasses, 
such as borosilicate and soda lime glasses 
21-Jul-16 
23 
“Lead in finishes of fine pitch components other than connectors with a pitch of 
0,65 mm and less. 
[May only be used in spare parts for EEE placed on the market before 24 
September 2010.]” 
24-Sep-10 
24 
Lead in solders for the soldering to machined through hole discoidal and planar 
array ceramic multilayer capacitors 
21-Jul-16 
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/10 
NUMBER DESCRIPTION EXPIRY DATE 
25 
Lead oxide in surface conduction electron emitter displays (SED) used in 
structural elements, notably in the seal frit and frit ring 
21-Jul-16 
26 Lead oxide in the glass envelope of black light blue lamps 01-Jun-11 
27 
Lead alloys as solder for transducers used in high-powered loudspeakers 
designated to operate for several hours at acoustic power levels of 125 dB SPL 
and above. 
24-Sep-10 
29 
Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of 
Council Directive 69/493/EEC (1) 
21-Jul-16 
30 
Cadmium alloys as electrical/mechanical solder joints to electrical conductors 
located directly on the voice coil intransducers used in high-powered 
loudspeakers with sound pressure levels of 100 dB (A) and more 
21-Jul-16 
31 
Lead in soldering materials in mercury free flat fluorescent lamps (which, e.g. 
are used for liquid crystal displays, design or industrial lighting) 
21-Jul-16 
32 
Lead oxide in seal frit used for making window assemblies for Argon and Krypton 
laser tubes 
21-Jul-16 
33 
Lead in solders for the soldering of thin copper wires of 100 μm diameter and 
less in power transformer 
21-Jul-16 
34 Lead in cermet-based trimmer potentiometer elements 21-Jul-16 
36 
Mercury used as a cathode sputtering inhibitor in DC plasma displays with a 
content up to 30 mg per display. 
01-Jul-10 
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/11 
NUMBER DESCRIPTION EXPIRY DATE 
37 
Lead in the plating layer of high voltage diodes on the basis of a zinc borate 
glass body 
21-Jul-16 
38 
Cadmium and cadmium oxide in thick film pastes used on aluminium bonded 
beryllium oxide 
21-Jul-16 
39 
Cadmium in colour converting II-VI LEDs (< 10 μg Cd per mm2 of light-emitting 
area) for use in solid state illumination 
or display systems. Expires on 1 July 
2014 
21-Jul-16 
40 
Cadmium in photoresistors for analogue optocouplers applied in professional 
audio equipment. 
31-Dec-13 
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/12 
NUMBER DESCRIPTION EXPIRY DATE 
1 Lead, cadmium and mercury in detectors for ionising radiation 21-Jul-18 
1a Lead and cadmium in ion selective electrodes including glass of pH electrodes. 21-Jul-18 
1b Lead anodes in electrochemical oxygen sensors. 21-Jul-18 
1c Lead, cadmium and mercury in infra-red light detectors. 21-Jul-18 
1d 
Mercury in reference electrodes: low chloride mercury chloride, mercury sulphate 
and mercury oxide. 
21-Jul-18 
2 Lead bearings in X-ray tubes. 21-Jul-18 
3 
Lead in electromagnetic radiation amplification devices: micro-channel plate 
and capillary plate. 
21-Jul-18 
4 
Lead in glass frit of X-ray tubes and image intensifiers and lead in glass frit binder 
for assembly of gas lasers and for vacuum tubes that convert electromagnetic 
radiation into electrons. 
21-Jul-18 
5 Lead in shielding for ionising radiation. 21-Jul-18 
ANNEX IV - APPLICATIONS EXEMPTED FROM THE RESTRICTION IN 
ARTICLE 4(1) SPECIFIC TO MEDICAL DEVICES AND MONITORING 
AND CONTROL INSTRUMENTS 
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/13 
NUMBER DESCRIPTION EXPIRY DATE 
6 Lead in X-ray test objects. 21-Jul-18 
7 Lead stearate X-ray diffraction crystals. 21-Jul-18 
8 
Radioactive cadmium isotope source for portable X-ray fluorescence 
spectrometers. 
21-Jul-18 
9 Cadmium in helium-cadmium lasers. 21-Jul-18 
10 Lead and cadmium in atomic absorption spectroscopy lamps. 21-Jul-18 
11 Lead in alloys as a superconductor and thermal conductor in MRI. 21-Jul-18 
12 
Lead and cadmium in metallic bonds to superconducting materials in MRI and 
SQUID detectors. 
21-Jul-18 
13 Lead in counterweights. 21-Jul-18 
14 Lead in single crystal piezoelectric materials for ultrasonic transducers. 21-Jul-18 
15 Lead in solders for bonding to ultrasonic transducers. 21-Jul-18 
16 
Mercury in very high accuracy capacitance and loss measurement bridges and 
in high frequency RF switches and relays in monitoring and control instruments 
not exceeding 20 mg of mercury per switch or relay. 
21-Jul-18 
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/14 
NUMBER DESCRIPTION EXPIRY DATE 
17 Lead in solders in portable emergency defibrillators. 21-Jul-18 
18 
Lead in solders of high performance infrared imaging modules to detect in the 
range 8-14 micrometer. 
21-Jul-18 
19 Lead in Liquid crystal on silicon (LCoS) displays. 21-Jul-18 
20 Cadmium in X-ray measurement filters. 21-Jul-18 
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RoHS Exemption List - Review By: Assent Compliance

  • 1. [ I N F O@A S S E N T C OMP L I A N C E . C OM WWW. A S S E N T C OMP L I A N C E . C OM T E L : 1 ( 8 6 6 ) 9 6 4 - 6 9 3 1 ] /1 RoHS is the commonly known term referring to both the original RoHS Directive and the RoHS Recast Directive , which replaced the original RoHS as of January 1 2013. You will also see RoHS II referred to as the RoHS Recast. The RoHS recast contains the same principal restrictions as the previous RoHS Directive but has an increase in requirements compared to the previous RoHS directive. ROHS EXEMPTION LIST WITH EXPIRATIONS
  • 2. /2 NUMBER DESCRIPTION EXPIRY DATE 1a Mercury in single capped (compact) fluorescent lamps not exceeding (per burner): For general lighting purposes < 30 W: 2,5mg shall be used per burner after 31 December 2012 21-Jul-16 1b Mercury in single capped (compact) fluorescent lamps not exceeding (per burner): For general lighting purposes ≥ 30 W and < 50 W: 3,5mg may be used per burner after 31 December 2011 21-Jul-16 1c Mercury in single capped (compact) fluorescent lamps not exceeding (per burner): For general lighting purposes with circular or square structural shape and tube diameter ≤ 17 mm: 7 mg may be used per burner after 31 December 2011 21-Jul-16 1d Mercury in single capped (compact) fluorescent lamps not exceeding (per burner): For general lighting purposes ≥ 150 W: 15 mg 21-Jul-16 1e Mercury in single capped (compact) fluorescent lamps not exceeding (per burner): For general lighting purposes with circular or square structural shape and tube diameter ≤ 17 mm 21-Jul-16 [ I N F O@A S S E N T C OMP L I A N C E . C OM WWW. A S S E N T C OMP L I A N C E . C OM T E L : 1 ( 8 6 6 ) 9 6 4 - 6 9 3 1 ] ANNEX III - APPLICATIONS EXEMPTED FROM THE RESTRICTION IN ARTICLE 4(1)
  • 3. /3 NUMBER DESCRIPTION EXPIRY DATE 1f Mercury in single capped (compact) fluorescent lamps not exceeding (per burner): For special purposes: 5 mg 21-Jul-16 2a1 Mercury in double-capped linear fluorescent lamps for general lighting purposes not exceeding (per lamp): Tri-band phosphor with normal lifetime and a tube diameter < 9 mm (e.g. T2):4 mg may be used per lamp after 31 December 2011 21-Jul-16 2a2 Mercury in double-capped linear fluorescent lamps for general lighting purposes not exceeding (per lamp): Tri-band phosphor with normal lifetime and a tube diameter ≥ 9 mm and ≤ 17 mm (e.g. T5): 3 mg may be used per lamp after 31 December 2011 21-Jul-16 2a3 Mercury in double-capped linear fluorescent lamps for general lighting purposes not exceeding (per lamp): Tri-band phosphor with normal lifetime and a tube diameter > 17 mm and ≤ 28 mm (e.g. T8): 3,5 mg may be used per lamp after 31 December 2011 21-Jul-16 2a4 Mercury in double-capped linear fluorescent lamps for general lighting purposes not exceeding (per lamp): Tri-band phosphor with normal lifetime and a tube diameter > 28 mm (e.g. T12):3,5 mg may be used per lamp after 31 December 2012 21-Jul-16 2a5 Mercury in double-capped linear fluorescent lamps for general lighting purposes not exceeding (per lamp): Tri-band phosphor with long lifetime (≥ 25 000h): 5 mg may be used per lamp after 31 December 2011 21-Jul-16 2b1 "Linear halophosphate lamps with tube > 28 mm (T10 and T12): 13-Apr-12 [ I N F O@A S S E N T C OMP L I A N C E . C OM WWW. A S S E N T C OMP L I A N C E . C OM T E L : 1 ( 8 6 6 ) 9 6 4 - 6 9 3 1 ]
  • 4. /4 NUMBER DESCRIPTION EXPIRY DATE 2b2 10 mg per lamp" 13-Apr-16 2b3 Mercury in other fluorescent lamps not exceeding (per lamp): Non-linear halophosphate lamps (all diameters): 15 mg 21-Jul-16 2b4 Mercury in other fluorescent lamps not exceeding (per lamp): Non-linear tri-band phosphor lamps with tube diameter > 17 mm (e.g. T9): 15 mg may be used per lamp after 31 December 2011 21-Jul-16 3a Mercury in other fluorescent lamps not exceeding (per lamp): Lamps for other general lighting and special purposes (e.g. induction lamps): 15 mg may be used per lamp after 31 December 2011 21-Jul-16 3b Mercury in cold cathode fluorescent lamps and external electrode fluorescent lamps (CCFL and EEFL) for special purposes not exceeding (per lamp): Short length (≤ 500 mm). 3,5 mg may be used per lamp after 31 December 2011 21-Jul-16 3c Mercury in cold cathode fluorescent lamps and external electrode fluorescent lamps (CCFL and EEFL) for special purposes not exceeding (per lamp): Medium length (> 500 mm and ≤ 1 500 mm). 5 mg may be used per lamp after 31 December 2011 21-Jul-16 4a Mercury in cold cathode fluorescent lamps and external electrode fluorescent lamps (CCFL and EEFL) for special purposes not exceeding (per lamp): Long length (> 1 500 mm). 13 mg may be used per lamp after 31 December 2011 21-Jul-16 [ I N F O@A S S E N T C OMP L I A N C E . C OM WWW. A S S E N T C OMP L I A N C E . C OM T E L : 1 ( 8 6 6 ) 9 6 4 - 6 9 3 1 ]
  • 5. /5 NUMBER DESCRIPTION EXPIRY DATE 4bI Mercury in other low pressure discharge lamps (per lamp). 15 mg may be used per lamp after 31 December 2011 21-Jul-16 4bII Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner) in lamps with improved colour rendering index Ra > 60: P ≤ 155 W. 30 mg may be used per lamp after 31 December 2011 21-Jul-16 4bIII Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner) in lamps with improved colour rendering index Ra > 60: 155 W < P ≤ 405 W. 40 mg may be used per lamp after 31 December 2011 21-Jul-16 4cI Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner) in lamps with improved colour rendering index Ra > 60: P > 405 W. 40 mg may be used per lamp after 31 December 2011 21-Jul-16 4cII Mercury in other High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner): P ≤ 155 W. 25 mg may be used per lamp after 31 December 2011 21-Jul-16 4cIII Mercury in other High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner): 155 W < P ≤ 405 W. 30 mg may be used per lamp after 31 December 2011 21-Jul-16 4d Mercury in other High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner): P > 405 W. 40 mg may be used per lamp after 31 December 2011 13-Apr-15 [ I N F O@A S S E N T C OMP L I A N C E . C OM WWW. A S S E N T C OMP L I A N C E . C OM T E L : 1 ( 8 6 6 ) 9 6 4 - 6 9 3 1 ]
  • 6. /6 NUMBER DESCRIPTION EXPIRY DATE 4e Mercury in High Pressure Mercury (vapour) lamps (HPMV) 21-Jul-16 4f Mercury in metal halide lamps (MH) 21-Jul-16 5a Mercury in other discharge lamps for special purposes not specifically mentioned in this Annex 21-Jul-16 5b Lead in glass of cathode ray tube 21-Jul-16 6a Lead in glass of fluorescent tubes not exceeding 0,2 % by weight 21-Jul-16 6b Lead as an alloying element in steel for machining purposes and in galvanised steel containing up to 0,35 % lead by weight 21-Jul-16 6c Lead as an alloying element in aluminium containing up to 0,4 % lead by weight 21-Jul-16 7a Copper alloy containing up to 4 % lead by weight 21-Jul-16 7b Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) 21-Jul-16 7cI Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission, and network management for telecommunications 21-Jul-16 7cII Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 21-Jul-16 [ I N F O@A S S E N T C OMP L I A N C E . C OM WWW. A S S E N T C OMP L I A N C E . C OM T E L : 1 ( 8 6 6 ) 9 6 4 - 6 9 3 1 ]
  • 7. /7 NUMBER DESCRIPTION EXPIRY DATE 7cIII Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC. [May only be used in spare parts for EEE placed on the market before 1 January 2013.] 01-Jan-13 7cIV Lead in PZT based dielectric ceramic materials for capacitors which are part of integrated circuits or discrete semiconductors. 21-Jul-16 8a Cadmium and its compounds in one shot pellet type thermal cut-off. [May only be used in spare parts for EEE placed on the market before 1 January 2012.] 01-Jan-12 8b Cadmium and its compounds in electrical contact 21-Jul-16 9 Hexavalent chromium as an anticorrosion agent of the carbon steel cooling system in absorption refrigerators up to 0,75 % by weight in the cooling solution 21-Jul-16 9b Lead in bearing shells and bushes for refrigerant-containing compressors for heating, ventilation, air conditioning and refrigeration (HVACR) applications 21-Jul-16 11a “Lead used in C-press compliant pin connector systems. [May only be used in spare parts for EEE placed on the market before 24 September 2010.]” 24-Sep-10 [ I N F O@A S S E N T C OMP L I A N C E . C OM WWW. A S S E N T C OMP L I A N C E . C OM T E L : 1 ( 8 6 6 ) 9 6 4 - 6 9 3 1 ]
  • 8. /8 NUMBER DESCRIPTION EXPIRY DATE 11b “Lead used in other than C-press compliant pin connector systems. [May only be used in spare parts for EEE placed on the market before 1 January 2013.]” 01-Jan-13 12 “Lead as a coating material for the thermal conduction module C-ring. [May only be used in spare parts for EEE placed on the market before 24 September 2010.]” 24-Sep-10 13a Lead in white glasses used for optical applications 21-Jul-16 13b Cadmium and lead in filter glasses and glasses used for reflectance standards 21-Jul-16 14 “Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight. [May only be used in spare parts for EEE placed on the market before 1 Jan 2011.]” 01-Jan-11 15 Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages 21-Jul-16 16 Lead in linear incandescent lamps with silicate coated tubes. 01-Sep-13 17 Lead halide as radiant agent in high intensity discharge (HID) lamps used for professional reprography applications 21-Jul-16 [ I N F O@A S S E N T C OMP L I A N C E . C OM WWW. A S S E N T C OMP L I A N C E . C OM T E L : 1 ( 8 6 6 ) 9 6 4 - 6 9 3 1 ]
  • 9. /9 NUMBER DESCRIPTION EXPIRY DATE 18a LEAD as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as specialty lamps for diazoprinting reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS. 01-Jan-11 18b Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi2O5:Pb) 21-Jul-16 19 LEAD with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact energy saving lamps (ESL). 01-Jun-11 20 LEAD oxide in glass used for bonding front & rear substrates of flat fluorescent lamps used for liquid crystal displays (LCD). 01-Jun-11 21 Lead and cadmium in printing inks for the application of enamels on glasses, such as borosilicate and soda lime glasses 21-Jul-16 23 “Lead in finishes of fine pitch components other than connectors with a pitch of 0,65 mm and less. [May only be used in spare parts for EEE placed on the market before 24 September 2010.]” 24-Sep-10 24 Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors 21-Jul-16 [ I N F O@A S S E N T C OMP L I A N C E . C OM WWW. A S S E N T C OMP L I A N C E . C OM T E L : 1 ( 8 6 6 ) 9 6 4 - 6 9 3 1 ]
  • 10. /10 NUMBER DESCRIPTION EXPIRY DATE 25 Lead oxide in surface conduction electron emitter displays (SED) used in structural elements, notably in the seal frit and frit ring 21-Jul-16 26 Lead oxide in the glass envelope of black light blue lamps 01-Jun-11 27 Lead alloys as solder for transducers used in high-powered loudspeakers designated to operate for several hours at acoustic power levels of 125 dB SPL and above. 24-Sep-10 29 Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EEC (1) 21-Jul-16 30 Cadmium alloys as electrical/mechanical solder joints to electrical conductors located directly on the voice coil intransducers used in high-powered loudspeakers with sound pressure levels of 100 dB (A) and more 21-Jul-16 31 Lead in soldering materials in mercury free flat fluorescent lamps (which, e.g. are used for liquid crystal displays, design or industrial lighting) 21-Jul-16 32 Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes 21-Jul-16 33 Lead in solders for the soldering of thin copper wires of 100 μm diameter and less in power transformer 21-Jul-16 34 Lead in cermet-based trimmer potentiometer elements 21-Jul-16 36 Mercury used as a cathode sputtering inhibitor in DC plasma displays with a content up to 30 mg per display. 01-Jul-10 [ I N F O@A S S E N T C OMP L I A N C E . C OM WWW. A S S E N T C OMP L I A N C E . C OM T E L : 1 ( 8 6 6 ) 9 6 4 - 6 9 3 1 ]
  • 11. /11 NUMBER DESCRIPTION EXPIRY DATE 37 Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body 21-Jul-16 38 Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide 21-Jul-16 39 Cadmium in colour converting II-VI LEDs (< 10 μg Cd per mm2 of light-emitting area) for use in solid state illumination or display systems. Expires on 1 July 2014 21-Jul-16 40 Cadmium in photoresistors for analogue optocouplers applied in professional audio equipment. 31-Dec-13 [ I N F O@A S S E N T C OMP L I A N C E . C OM WWW. A S S E N T C OMP L I A N C E . C OM T E L : 1 ( 8 6 6 ) 9 6 4 - 6 9 3 1 ]
  • 12. /12 NUMBER DESCRIPTION EXPIRY DATE 1 Lead, cadmium and mercury in detectors for ionising radiation 21-Jul-18 1a Lead and cadmium in ion selective electrodes including glass of pH electrodes. 21-Jul-18 1b Lead anodes in electrochemical oxygen sensors. 21-Jul-18 1c Lead, cadmium and mercury in infra-red light detectors. 21-Jul-18 1d Mercury in reference electrodes: low chloride mercury chloride, mercury sulphate and mercury oxide. 21-Jul-18 2 Lead bearings in X-ray tubes. 21-Jul-18 3 Lead in electromagnetic radiation amplification devices: micro-channel plate and capillary plate. 21-Jul-18 4 Lead in glass frit of X-ray tubes and image intensifiers and lead in glass frit binder for assembly of gas lasers and for vacuum tubes that convert electromagnetic radiation into electrons. 21-Jul-18 5 Lead in shielding for ionising radiation. 21-Jul-18 ANNEX IV - APPLICATIONS EXEMPTED FROM THE RESTRICTION IN ARTICLE 4(1) SPECIFIC TO MEDICAL DEVICES AND MONITORING AND CONTROL INSTRUMENTS [ I N F O@A S S E N T C OMP L I A N C E . C OM WWW. A S S E N T C OMP L I A N C E . C OM T E L : 1 ( 8 6 6 ) 9 6 4 - 6 9 3 1 ]
  • 13. /13 NUMBER DESCRIPTION EXPIRY DATE 6 Lead in X-ray test objects. 21-Jul-18 7 Lead stearate X-ray diffraction crystals. 21-Jul-18 8 Radioactive cadmium isotope source for portable X-ray fluorescence spectrometers. 21-Jul-18 9 Cadmium in helium-cadmium lasers. 21-Jul-18 10 Lead and cadmium in atomic absorption spectroscopy lamps. 21-Jul-18 11 Lead in alloys as a superconductor and thermal conductor in MRI. 21-Jul-18 12 Lead and cadmium in metallic bonds to superconducting materials in MRI and SQUID detectors. 21-Jul-18 13 Lead in counterweights. 21-Jul-18 14 Lead in single crystal piezoelectric materials for ultrasonic transducers. 21-Jul-18 15 Lead in solders for bonding to ultrasonic transducers. 21-Jul-18 16 Mercury in very high accuracy capacitance and loss measurement bridges and in high frequency RF switches and relays in monitoring and control instruments not exceeding 20 mg of mercury per switch or relay. 21-Jul-18 [ I N F O@A S S E N T C OMP L I A N C E . C OM WWW. A S S E N T C OMP L I A N C E . C OM T E L : 1 ( 8 6 6 ) 9 6 4 - 6 9 3 1 ]
  • 14. /14 NUMBER DESCRIPTION EXPIRY DATE 17 Lead in solders in portable emergency defibrillators. 21-Jul-18 18 Lead in solders of high performance infrared imaging modules to detect in the range 8-14 micrometer. 21-Jul-18 19 Lead in Liquid crystal on silicon (LCoS) displays. 21-Jul-18 20 Cadmium in X-ray measurement filters. 21-Jul-18 [ I N F O@A S S E N T C OMP L I A N C E . C OM WWW. A S S E N T C OMP L I A N C E . C OM T E L : 1 ( 8 6 6 ) 9 6 4 - 6 9 3 1 ]