The PM 300 APOLLO is an advanced CMP system for polishing 300mm wafer diameters. It features two main polishing tables, pad conditioners, temperature control and can process wafers in one or multiple steps. The system provides automated wafer handling, in-line metrology for process optimization, and a dry-in dry-out process to save time. It offers configurable cleaning and drying modules as well as process control interfaces.

1. Technical Data PM 300 APOLLO
PM 300 APOLLO
Advanced CMP System
for 300 mm Wafer Planarization
Load ports for
FOUP cassettes
Pre-aligner
Metrology
Wet buffer
Secondary
polishing tables
Main polishing table 1
Main polishing table 2
Touch screen monitor
Spindle 1
Polishing head /
wafer cleaner
Spindle 2
Input-output
stations
Wet wafer
robot
Brush
module 2
Spin-rinse
dryer
Dry wafer
robot
Touch screen
monitor
Brush
module 1
Wafer transfer handler
Polishing
head 1
Polishing
head 2 Pad conditioners
Cleaner
module
Polishing head
Wafer diameter
Rotating speed
Backside pressure
Polishing downforce
Designs
Main polishing tables 1 + 2
Diameter
Rotating speed
Temperature control
End Point Detection
Secondary polishing table
Diameter
Rotating speed
Temperature control
300 mm
0 - 125 rpm
0 - 200 kPa
300 - 4000 N
Multizone control, edge influence
900 mm
0 - 125 rpm
20 - 60 °C
Motorcurrent, optical
430 mm
0 - 125 rpm
20 - 60 °C
0 - 350 N
120 mm
0 - 80 rpm
0 - 100 bar
Rotating speed:
0 - 200 rpm brush
0 - 200 rpm wafer
e.g. NH4OH, citric acid, DHF
Rotating speed: 0 - 2000 rpm
11.000 kg
7123 x 1600 x 2200 mm
≈ 11,4 qm
SECS II / GEM, CIM
Pad conditioner
Down force
Disc diameter
Rotating speed
High pressure conditioning
Cleaner
2 brush modules, 4 brushes
On board dilution preparation
Spin-rinse dryer
System
Weight total system
Length x width x height
Floor Space
Interface
version002_3/2005Thisinformationissuppliedwithoutliability,subjecttoalterations
PM 300 APOLLO, advanced CMP System
for the 300 mm Wafer Generation
Peter Wolters Surface Technologies GmbH, a member
of the German Peter Wolters Group, is developing, pro-
ducing and marketing CMP systems for wafers up to
300 mm.
The PM 300 Apollo is a turn-key solution from one
supplier, including the necessary process know how. Its
cluster design already integrates the wafer handling and,
depending on the system configuration, cleaning units.
The PM 300 is one of the first CMP systems on the mar-
ket dedicated to 300 mm wafer processing. Since 1998 it
planarizes 300 mm production wafers with outstanding
reliability. The experience of these installations is the
basis for ongoing and further tool and process develop-
ment. Its state-of-the-art concept enables the PM 300 to
automatically optimize process performance.
The system can be used for various applications, e.g. is
installed at chipmakers for the planarization of structu-
red wafers as well as at prime wafer manufacturers and
wafer reclaiming companies.
The advanced design of the PM 300 Apollo enables the
tool to run up to three subsequent and independent pro-
cess steps. By using the two independently controlled
carriers, one- or multi-step applications can be optimized
to meet high-throughput demands.
The unique solid design of the PM 300, based on a rigid
cast iron frame, delivers the precondition for high tool
reliability, high removal rates and best reproducible poli-
shing results. This property is completed by the paten-
ted Peter Wolters Temperature Control System which
provides accurate controlled temperature conditions for
the polishing process.
Different advanced carrier designs are available to pro-
duce application optimized consistent wafer uniformity
results and the best process performance, e.g. by the
use of multizone control and edge influence. They are an
essential precondition to process design rules < 100 nm.
To achieve capabilities for future processes and noticeable
cost-effective advantages during the polishing process,
the PM 300 can be equipped with End Point Detection
units, e.g. depending on the application based on
motor current measurement or multi wavelength optical
detection.
Automated processing is supported by optional closed
loop control and in-line wafer rework as well as by lea-
ding CIM technology. A self-explaining, graphical user
interface and the possibility of remote control and main-
tenance are a matter of course.
Peter Wolters worldwide
Peter Wolters AG
Büsumer Straße 96
D - 24768 Rendsburg
Phone: (++49)4331/ 458-0
Fax: (++49)4331/ 458-290
e-mail: wolters@peter-wolters.com
Peter Wolters AG
– Niederlassung Süd –
Benzstraße 17
D - 70771 Leinfelden-Echterdingen
Phone: (++49)711/ 903 632-0
Fax: (++49)711/ 903 632-10
e-mail: pwl_sales@peter-wolters.com
Peter Wolters U.K. Ltd.
Brindley Road
Dodwells Bridge Ind. Estate,
Hinckley, Leicestershire
LE 10 3BY, England
Phone: (++44)1455 631 707
Fax: (++44)1455 611 360
e-mail: pwuk_sales@peter-wolters.com
Peter Wolters France
Philippe Lucas
38, Rue du Belvédère
F- 78750 Mareil Marly
Phone: (++33)1 39 58 48 11
Fax: (++33)1 39 58 48 66
e-mail: pwfr@peter-wolters.com
Wolters Ltd.
Shanghai Representative Office
Rm. 10B North Gate Plaza
99 Tianmu Xi Lu
Shanghai 200070 / P.R. China
Phone: (++86)21 5101 3975
Fax: (++86)21 5101 3977
e-mail: sales-china@peter-wolters.com
Peter Wolters
Japan Co., Ltd.
Daisho Bldg., 6th floor, Rm. 601
12-28, Esaka-cho 1-chome
Suita-shi, Osaka 564-0063, Japan
Phone: (++81)6 6821 7024
Fax: (++81)6 6821 7031
e-mail: pwj_sales@peter-wolters.com
Peter Wolters
of America Inc.
P.O. Box 1585 / 14 High Street
USA - Plainville, Massachusetts 02762
Phone: (++1)508/ 695/ 71 51
Fax: (++1)508/ 695/ 71 54
e-mail: pwa_sales@peter-wolters.com
Peter Wolters
of America Inc.
509 N. Third Avenue
USA - Des Plaines (Chicago)
IL 60016 - 1196
Phone: (++1)847/ 803/ 32 00
Fax: (++1)847/ 803/ 98 75
e-mail: pwa_sales@peter-wolters.com
www.peter-wolters.com
Peter Wolters
of America Inc.
Service Center West
Peter Wolters
of America Inc.
Plainville, Massachusetts
Peter Wolters AG
Rendsburg
Peter Wolters U.K. Ltd.
Birmingham
Peter Wolters France
Paris
Peter Wolters AG
– Niederlassung Süd –
Leinfelden-Echterdingen
Headquarters Rendsburg
Peter Wolters AG
Peter Wolters China
Shanghai
Peter Wolters Japan Co., Ltd.
Osaka
Peter Wolters
of America Inc.
Chicago, Illinois
Peter Wolters Subsidiaries
Novellus Subsidiaries

2. PM 300 APOLLO Features and Benefits for the Customer
Main polishing table with polishing
head and conditioning tool
Spin-rinse dryer for final rinsing and
high-performance drying
Pre-aligner for wafer identification
Easy-to-learn software concept
with high flexibility
High-speed six-axes robot
with edge gripper
In-line metrology system
for in-line wafer rework and
closed loop control
Wafer I/O station for
safe wafer transfer
High-speed robot for
wet-wafer handling
Wafer wet buffer for metro-
logy and wafer rework
Secondary polishing table
for final polishing or DI-water buff
2 brush modules for
multi-step cleaning
Load ports for
FOUP cassettes
Polishing head /
wafer cleaner
Handler for wafer transfer
from cassettes to polisher
Main polishing table 1
with pad conditioner
PM 300 APOLLO Advanced CMP System
Features
Various applications
Planarization of structured
wafers
Polishing of prime wafers
For 300 mm wafers
Sophisticated system
Turn-key solution
Dry-in/dry-out
Automated wafer handling
Closed loop control based on
in-line metrology system
In-line wafer rework
implementation
Advanced design
Small tool width
Wafer handling concept for
minimized mechanical stress
Mini-environment with air-flow-
optimised filter-fan units
(class.1000-0.1 )
Separate recipes for each
single wafer
Remote control
Remote maintenance
Self-explaining, graphical user
interface
SECSII / GEM Interface
Advanced fab automation for
300 mm equipment
Benefit for the customer
Can be adapted to the specific
application of the customer
Hardware, software and process
know-how from one supplier
No separate post-CMP cleaner
step saves operator / cycle time
High reliability, reproducible
process results
Automatic process optimization,
enables in-line wafer rework
Maximizes yield
Easy maintenance
Maximizes yield
Reduces CoO
Saves cleanroom investment
Enables efficient process deve-
lopment, high flexibility
Operation access from outside
the cleanroom
Software upgrade and tool
diagnostics via modem
High operator acceptance
For standard fab integrati-
on and computer integrated
manufacturing (CIM)
For additional fab integration
and CIM
Features
Polisher
Two independent linear chuck
spindles
Four independent polishing
tables
Two in-situ / ex-situ pad
conditioners
Temperature control system
Flat panel touch-screen display
Advanced polishing head
design with multi zone
control and edge influence
Rigid cast iron frame
CMP cleaner
Advanced edge-gripper design
Dual vertical brush-box design,
suitable for NH4OH / DHF
Spin-rinse dryer
Options
Automated wafer and cassette
tracking systems
Process know-how
Solutions for various oxide and
metal processes
High removal rates and good
uniformity results
High brush lifetime, high
polishing pad lifetime, low
DI-water consumption
Benefit for the customer
High throughput
Multi-step processing
For longer pad life, better
uniformity and higher removal
rates
Provides controlled temperature
for slurry, polishing tables and
DI-water
Cleanroom adapted ergonomic
operator interface
Consistent wafer uniformity
results and process perfor-
mance
High precision and reliability,
reproducibility, best uniformity
Avoids contact contamination
Two-stage, high-performance-
cleaning process for residual
slurry-clean and particle
removal
High-speed drying,
low gripper wear
New STR-Spin technology
available
100% control of each single
wafer process history
Turn-key solutions
High throughput, maximizes
yield
Reduces CoO, lowers
maintenance cycles