Although it requires a considerably greater degree of manufacturing process control and accuracy as well as uses the same processes as for single layer boards, the manufacture of multi-layer printed circuit boards. The PCB fabrication must be efficient.

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2. High Thermal Conductive PCB
Part No.: M0125060189A
Layer count: 1 layer metal core PCB
Material: Aluminum core, 1.5mm, 1 OZ, 2.0 W/M*K
Minimum tack: 25 mil
Minimum space(gap): 25 mil
Minimum hole: 3.0mm
Surface finished: ENIEPIG
Panel size: 28*258mm/1up

3. Electronics Boards Assembly | Electric Charging Boards
Layer count: 4 layer
Material: FR4, TG170, 1.6mm, 2 OZ for all layer
Minimum tack: 10 mil
Minimum space(gap): 12 mil
Minimum hole: 0.30mm
Surface finished: LF HASL
Panel size: 358*118mm/1up

4. High frequency PCB | Rogers4350 + FR4
PCB
Part No.: E0415060179A
Layer count: 4 layer
Material: FR4, 1.6mm, high TG+RO4350B, 1
Minimum tack: 8 mil
Minimum space(gap): 8 mil
Minimum hole: 0.30mm
Surface finished: ENIG
Panel size: 58*38mm/1up

5. Copper Core Printed Circuits
Part No.: M0155360169C
Layer count: Single Layer Copper Core PCB
Material: Copper core, 1.6 mm, 3 OZ, 10.0 W/M*K
Minimum tack: 20 mil
Minimum space(gap): 20 mil
Minimum hole: 3.2mm
Surface finished: ENIG
Panel size: 208*118mm/1up

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