This document provides details on latest rigid printed circuit boards (PCBs) from Dongguan HuiXinPu Circuit Co. Ltd. including rigid-flex, multilayer, and specialized PCBs. Key details include board dimensions, layer counts, material types, copper weights, and finishing processes. Board applications include general purpose, high frequency, and carbon printing. Production capabilities include rigid, flex, and rigid-flex circuits up to 4 layers in a variety of sizes.

1. Latest fabricated rigid PCBs
JF - Overseas Sales
Dongguan HuiXinPu Circuit Co. Ltd(HXP Circuit)
Tel: 0086-755-32813032
Email: emily@hxpcircuit.com
UL number E352848.
ISO certificate number Q191203132.
Rigid-Flex PCB
3 layer
26.1*16.94 mm
0.4 mm rigid /0.1mm flex
Polyimide + FR4 material
2.5/0.5/2.5 oz copper
Hard gold plating 5u"
Polyimide cover layer
on bottom only
No silkscreen
Different soldermask color
2 layer
311.6*210 mm
48pcs/array
1.0 mm thick
FR4 material
1/1 oz copper
Hard gold plating 2u"
White soldermask on top
Green mask on bottom
No silkscreen
PCB with gold fingers
4 layer
174.7*83.9 mm
1.6 mm thick
FR4 material
2.5/2/2/2.5 oz copper
HAL + Hard gold plated
fingers 20u"
Green soldermask
White silkscreen

2. Carbon print PCB
2 layer
378.46*288.54 mm
2pcs/array
1.6 mm thick
FR-4
1.5/1.5 oz copper
HAL + carbon print
Green soldermask
White silkscreen
PCB with large gold area
4 layer
102*99 mm
1.0mm thick
FR-4 TG170
1/1/1/1 oz copper
ENIG
Green soldermask
on top only
No silkscreen
High frequency PCB
2 layer
25.82*56.19 mm
0.3mm thick
RO4350 10mil
1/1 oz copper
ENIG
Green soldermask
on top only
White silkscreen
on top only