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OUTLIER DETECTION FOR
QUALITY IMPROVEMENT IN
SEMICONDUCTOR TESTING
Semiconductor Testing
OUTLIER DETECTION
OUTLIER DETECTION
• In the highly competitive semiconductor industry, ensuring high-
quality products is crucial to maintaining customer satisfaction and
gaining a competitive edge. Outlier detection is a powerful tool that
can be used to identify and address issues with product quality.
yieldWerx yield management system provides advanced outlier
detection capabilities using wafer maps, stacked wafer map analysis,
and die genealogy data.
OUTLIER DETECTION USING WAFER MAPS
• Wafer maps provide a visual representation of the location of
failures on a wafer. yieldWerx uses advanced analytics algorithms to
analyze wafer maps and identify outliers that may indicate
systematic errors in the manufacturing process. By identifying the
root cause of failures, manufacturers can take targeted actions to
improve product quality and yield.
STACKED WAFER MAP ANALYSIS
• Stacked wafer map analysis is a technique used to identify hotspots
and patterns of failing die across multiple wafers. This method
involves aligning multiple wafer maps and stacking them on top of
each other to identify common patterns or clusters of failing die.
yieldWerx uses advanced algorithms to identify the causes of
hotspots and patterns of failures and provides valuable insights into
the semiconductor manufacturing process.
DIE GENEALOGY DATA
• Die genealogy data includes information about pass and fail outcomes,
parametric data, and wafer and lot identification. yieldWerx uses die
genealogy data to trace the genealogy of each die and identify any
patterns or trends that may indicate issues with the manufacturing
process. By analyzing die genealogy data, manufacturers can gain
valuable insights into the causes of failures and take appropriate
actions to address them.
CONCLUSION
• In conclusion, outlier detection using wafer maps, stacked wafer map
analysis, and die genealogy data is an essential tool for semiconductor
manufacturers to improve quality and yield. yieldWerx provides advanced
analytics and visualization tools to help manufacturers identify and
address issues with product quality. By using yieldWerx, manufacturers
can gain valuable insights into the manufacturing process and take precise
actions to improve product quality and yield.
ADD ONS
• Automated Assemble Map Generation
• Quality Assurance & Risk Elimination
• Cross Work Center Correlation
• External Data Source Integration
• Real time Lot Control and Disposition
• Executive Dashboard
• Part Average Testing
CONT’D
• Smart Wafer Merge
• SPC/SBL/SYL
• Automated Data Loading
• Production Yield Reporting
• Raw Data Monitoring
• Standard Data Access
• Yield Calculation Flexibility
• Lot Genealogy

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Outlier Detection for Quality Improvement in Semiconductor Testing.pptx

  • 1. OUTLIER DETECTION FOR QUALITY IMPROVEMENT IN SEMICONDUCTOR TESTING Semiconductor Testing
  • 3. OUTLIER DETECTION • In the highly competitive semiconductor industry, ensuring high- quality products is crucial to maintaining customer satisfaction and gaining a competitive edge. Outlier detection is a powerful tool that can be used to identify and address issues with product quality. yieldWerx yield management system provides advanced outlier detection capabilities using wafer maps, stacked wafer map analysis, and die genealogy data.
  • 4. OUTLIER DETECTION USING WAFER MAPS • Wafer maps provide a visual representation of the location of failures on a wafer. yieldWerx uses advanced analytics algorithms to analyze wafer maps and identify outliers that may indicate systematic errors in the manufacturing process. By identifying the root cause of failures, manufacturers can take targeted actions to improve product quality and yield.
  • 5. STACKED WAFER MAP ANALYSIS • Stacked wafer map analysis is a technique used to identify hotspots and patterns of failing die across multiple wafers. This method involves aligning multiple wafer maps and stacking them on top of each other to identify common patterns or clusters of failing die. yieldWerx uses advanced algorithms to identify the causes of hotspots and patterns of failures and provides valuable insights into the semiconductor manufacturing process.
  • 6. DIE GENEALOGY DATA • Die genealogy data includes information about pass and fail outcomes, parametric data, and wafer and lot identification. yieldWerx uses die genealogy data to trace the genealogy of each die and identify any patterns or trends that may indicate issues with the manufacturing process. By analyzing die genealogy data, manufacturers can gain valuable insights into the causes of failures and take appropriate actions to address them.
  • 7. CONCLUSION • In conclusion, outlier detection using wafer maps, stacked wafer map analysis, and die genealogy data is an essential tool for semiconductor manufacturers to improve quality and yield. yieldWerx provides advanced analytics and visualization tools to help manufacturers identify and address issues with product quality. By using yieldWerx, manufacturers can gain valuable insights into the manufacturing process and take precise actions to improve product quality and yield.
  • 8. ADD ONS • Automated Assemble Map Generation • Quality Assurance & Risk Elimination • Cross Work Center Correlation • External Data Source Integration • Real time Lot Control and Disposition • Executive Dashboard • Part Average Testing
  • 9. CONT’D • Smart Wafer Merge • SPC/SBL/SYL • Automated Data Loading • Production Yield Reporting • Raw Data Monitoring • Standard Data Access • Yield Calculation Flexibility • Lot Genealogy