This document summarizes the simulation results of an operational amplifier component model. It tests parameters like output voltage swing, input offset voltage, slew rate, input current, open loop voltage gain, output short circuit current, and common mode rejection ratio. The simulation results show good agreement with the datasheet specifications, with most values matching within 2% error.
SPICE MODEL of BT152-600R in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of BT152-800R in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
This document summarizes the simulation results of an operational amplifier component model. It tests parameters like output voltage swing, input offset voltage, slew rate, input current, open loop voltage gain, output short circuit current, and common mode rejection ratio. The simulation results show good agreement with the datasheet specifications, with most values matching within 2% error.
SPICE MODEL of BT152-600R in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of BT152-800R in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of BT151X-800 in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of BT152B-400R in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
This document summarizes the modeling of a thyristor component. It includes the part number, manufacturer, and descriptions of the diode and thyristor models used in the simulation. Simulation results for various characteristics like IG-VT, ITM-VTM, holding characteristics, and switching times are provided along with comparisons to measurements.
This document summarizes the modeling of a MCR218-4FP thyristor manufactured by Motorola Semiconductor. It includes:
1) A description of the diode model used including key parameters.
2) Simulations and comparisons to measurements of the thyristor's IG-VT, ITM-VTM, and holding characteristics.
3) A simulation and comparison of the thyristor's switching times.
All simulations showed good agreement with measurements within 2.5% error.
SPICE MODEL of BT152B-800R in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
This document provides a device modeling report for a Motorola MCR218-2FP thyristor. It includes:
1) A description of the diode and thyristor SPICE models used including key parameters.
2) Simulation results and comparisons to measurements for the IG-VT, ITM-VTM, and holding characteristics.
3) A switching time evaluation circuit and simulation results compared to measurements.
This document summarizes the Pspice modeling and simulation of a thyristor component. It examines the diode model parameters, the forward IG-VT characteristic, the reverse ITM-VTM characteristic, the holding current IH characteristic, and the switching times Ton and Toff. The simulations show good agreement with measurements, with most error values below 2%.
SPICE MODEL of BT145-600R in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of MCR218-8FP in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of BT151X-650 in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of MCR218-6FP in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of BT151U-500C in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of BT151X-800 in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of BT152B-400R in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
This document summarizes the modeling of a thyristor component. It includes the part number, manufacturer, and descriptions of the diode and thyristor models used in the simulation. Simulation results for various characteristics like IG-VT, ITM-VTM, holding characteristics, and switching times are provided along with comparisons to measurements.
This document summarizes the modeling of a MCR218-4FP thyristor manufactured by Motorola Semiconductor. It includes:
1) A description of the diode model used including key parameters.
2) Simulations and comparisons to measurements of the thyristor's IG-VT, ITM-VTM, and holding characteristics.
3) A simulation and comparison of the thyristor's switching times.
All simulations showed good agreement with measurements within 2.5% error.
SPICE MODEL of BT152B-800R in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
This document provides a device modeling report for a Motorola MCR218-2FP thyristor. It includes:
1) A description of the diode and thyristor SPICE models used including key parameters.
2) Simulation results and comparisons to measurements for the IG-VT, ITM-VTM, and holding characteristics.
3) A switching time evaluation circuit and simulation results compared to measurements.
This document summarizes the Pspice modeling and simulation of a thyristor component. It examines the diode model parameters, the forward IG-VT characteristic, the reverse ITM-VTM characteristic, the holding current IH characteristic, and the switching times Ton and Toff. The simulations show good agreement with measurements, with most error values below 2%.
SPICE MODEL of BT145-600R in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of MCR218-8FP in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of BT151X-650 in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of MCR218-6FP in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of BT151U-500C in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
The document is a device modeling report for an operational amplifier (opamp), the NJM072D manufactured by New Japan Radio. It includes the component specifications, a description of the spice model, and the results of simulations comparing the model values to the datasheet specifications for parameters such as output voltage swing, input offset voltage, slew rate, input current, gain, and common mode rejection ratio. The simulations show good agreement with errors generally less than 1% compared to the datasheet values.
This document summarizes the modeling of a thyristor component. It includes:
1) Details of the thyristor part number and manufacturer.
2) Descriptions of the diode and thyristor models used in the simulation software.
3) Results of simulations matching measurements of the thyristor's gate trigger voltage (VGT), gate trigger current (IGT), maximum current (ITM), holding current (IH), and switching times (Ton and Toff). The simulations were within 1% error of the measurements.
SPICE MODEL of BT145-500R in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of MUSES8820 , LTspice Model in SPICE PARKTsuyoshi Horigome
This document summarizes the simulation and measurement results of various parameters for the MUSES8820 operational amplifier SPICE model from New Japan Radio. Key parameters tested include output voltage swing, output short circuit current, input offset voltage, input current, slew rate, open loop voltage gain, common mode rejection ratio, supply current, power supply rejection ratio, input common mode voltage range, and gain bandwidth product. For each parameter, a simulation schematic, simulation results, evaluation circuit, and comparison table of measured and simulated values are provided.
SPICE MODEL of BT151X-500 in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of MCR225-2FP in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
This document provides a device modeling report for a BT300S-500R thyristor manufactured by Philips Semiconductor. It includes the component parameters, SPICE model description, and simulation results comparing the modeled and measured characteristics of the thyristor, including its IG-VT, ITM-VTM, holding, and switching time characteristics. The simulation results show good agreement with measurements, with most error values below 2%.
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)Tsuyoshi Horigome
This document provides an inventory update of 6,747 parts at Spice Park as of April 2024. It lists the part numbers, manufacturers, and quantities of various semiconductor components, including 1,697 Schottky rectifier diodes from 29 different manufacturers. It also includes details on passive components, batteries, mechanical parts, motors, and lamps in the inventory.
The document provides an inventory update from April 2024 of the Spice Park collection which contains 6,747 electronic components. It includes tables listing the types of semiconductor components, passive parts, batteries, mechanical parts, motors, and lamps in the collection along with their manufacturer and quantities. One of the semiconductor components, the general purpose rectifier diode, is broken down into a more detailed table with 116 entries providing part numbers, manufacturers, thermal ratings, and remarks.
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)Tsuyoshi Horigome
The document provides an inventory update from March 2024 of parts in the Spice Park warehouse. It lists 6,725 total parts across various categories including semiconductors, passive parts, batteries, mechanical parts, motors, and lamps. The semiconductor section lists 652 general purpose rectifier diodes from 18 different manufacturers with quantities ranging from 2 to 145 pieces.
This document provides an inventory list of parts at Spice Park as of March 2024. It contains 3 sections - Semiconductor parts (diodes, transistors, ICs etc.), Passive parts (capacitors, resistors etc.), and Battery parts. For Semiconductor parts, it lists 36 different part types and provides the quantity of each part. It then provides further details of Diode/General Purpose Rectifiers, listing the manufacturer and quantity of 652 individual part numbers.
Update 29 models(Solar cell) in SPICE PARK(FEB2024)Tsuyoshi Horigome
The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 total pieces of electronic components and parts. It lists 36 categories of semiconductor devices, 11 categories of passive parts, 10 types of batteries, 5 mechanical parts, DC motors, lamps, and power supplies. It provides the most detailed listing for solar cells, with 1,003 total pieces from 51 manufacturers listed with part numbers.
The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 electronic components. It lists the components by type (e.g. semiconductor), part number, manufacturer, thermal rating, and quantity on hand. For example, it shows that there are 621 general purpose rectifier diodes from manufacturers such as Fairchild, Fuji, Intersil, Rohm, Shindengen, and Toshiba. The detailed four-page section provides further information on the first item, general purpose rectifier diodes, including 152 individual part numbers and specifications.
This document discusses circuit simulations using LTspice. It describes driving a circuit simulation by inserting a 250 ohm resistor between the output terminals. It also describes simulating a 1 channel bridge circuit where the DUT1 and DUT2 resistors are both set to 100 ohms and the input voltage is set to either 1V or 5V.
This document discusses parametric sweeps of external and internal resistance values Rg for circuit simulation in LTspice. It also references outputting a waveform similar to a report on fall time characteristics for a device modeling report with customer Samsung.
Threats to mobile devices are more prevalent and increasing in scope and complexity. Users of mobile devices desire to take full advantage of the features
available on those devices, but many of the features provide convenience and capability but sacrifice security. This best practices guide outlines steps the users can take to better protect personal devices and information.
Building RAG with self-deployed Milvus vector database and Snowpark Container...Zilliz
This talk will give hands-on advice on building RAG applications with an open-source Milvus database deployed as a docker container. We will also introduce the integration of Milvus with Snowpark Container Services.
Dr. Sean Tan, Head of Data Science, Changi Airport Group
Discover how Changi Airport Group (CAG) leverages graph technologies and generative AI to revolutionize their search capabilities. This session delves into the unique search needs of CAG’s diverse passengers and customers, showcasing how graph data structures enhance the accuracy and relevance of AI-generated search results, mitigating the risk of “hallucinations” and improving the overall customer journey.
Unlocking Productivity: Leveraging the Potential of Copilot in Microsoft 365, a presentation by Christoforos Vlachos, Senior Solutions Manager – Modern Workplace, Uni Systems
In the rapidly evolving landscape of technologies, XML continues to play a vital role in structuring, storing, and transporting data across diverse systems. The recent advancements in artificial intelligence (AI) present new methodologies for enhancing XML development workflows, introducing efficiency, automation, and intelligent capabilities. This presentation will outline the scope and perspective of utilizing AI in XML development. The potential benefits and the possible pitfalls will be highlighted, providing a balanced view of the subject.
We will explore the capabilities of AI in understanding XML markup languages and autonomously creating structured XML content. Additionally, we will examine the capacity of AI to enrich plain text with appropriate XML markup. Practical examples and methodological guidelines will be provided to elucidate how AI can be effectively prompted to interpret and generate accurate XML markup.
Further emphasis will be placed on the role of AI in developing XSLT, or schemas such as XSD and Schematron. We will address the techniques and strategies adopted to create prompts for generating code, explaining code, or refactoring the code, and the results achieved.
The discussion will extend to how AI can be used to transform XML content. In particular, the focus will be on the use of AI XPath extension functions in XSLT, Schematron, Schematron Quick Fixes, or for XML content refactoring.
The presentation aims to deliver a comprehensive overview of AI usage in XML development, providing attendees with the necessary knowledge to make informed decisions. Whether you’re at the early stages of adopting AI or considering integrating it in advanced XML development, this presentation will cover all levels of expertise.
By highlighting the potential advantages and challenges of integrating AI with XML development tools and languages, the presentation seeks to inspire thoughtful conversation around the future of XML development. We’ll not only delve into the technical aspects of AI-powered XML development but also discuss practical implications and possible future directions.
Let's Integrate MuleSoft RPA, COMPOSER, APM with AWS IDP along with Slackshyamraj55
Discover the seamless integration of RPA (Robotic Process Automation), COMPOSER, and APM with AWS IDP enhanced with Slack notifications. Explore how these technologies converge to streamline workflows, optimize performance, and ensure secure access, all while leveraging the power of AWS IDP and real-time communication via Slack notifications.
“An Outlook of the Ongoing and Future Relationship between Blockchain Technologies and Process-aware Information Systems.” Invited talk at the joint workshop on Blockchain for Information Systems (BC4IS) and Blockchain for Trusted Data Sharing (B4TDS), co-located with with the 36th International Conference on Advanced Information Systems Engineering (CAiSE), 3 June 2024, Limassol, Cyprus.
20 Comprehensive Checklist of Designing and Developing a WebsitePixlogix Infotech
Dive into the world of Website Designing and Developing with Pixlogix! Looking to create a stunning online presence? Look no further! Our comprehensive checklist covers everything you need to know to craft a website that stands out. From user-friendly design to seamless functionality, we've got you covered. Don't miss out on this invaluable resource! Check out our checklist now at Pixlogix and start your journey towards a captivating online presence today.
Pushing the limits of ePRTC: 100ns holdover for 100 daysAdtran
At WSTS 2024, Alon Stern explored the topic of parametric holdover and explained how recent research findings can be implemented in real-world PNT networks to achieve 100 nanoseconds of accuracy for up to 100 days.
Generative AI Deep Dive: Advancing from Proof of Concept to ProductionAggregage
Join Maher Hanafi, VP of Engineering at Betterworks, in this new session where he'll share a practical framework to transform Gen AI prototypes into impactful products! He'll delve into the complexities of data collection and management, model selection and optimization, and ensuring security, scalability, and responsible use.
Alt. GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using ...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
UiPath Test Automation using UiPath Test Suite series, part 6DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 6. In this session, we will cover Test Automation with generative AI and Open AI.
UiPath Test Automation with generative AI and Open AI webinar offers an in-depth exploration of leveraging cutting-edge technologies for test automation within the UiPath platform. Attendees will delve into the integration of generative AI, a test automation solution, with Open AI advanced natural language processing capabilities.
Throughout the session, participants will discover how this synergy empowers testers to automate repetitive tasks, enhance testing accuracy, and expedite the software testing life cycle. Topics covered include the seamless integration process, practical use cases, and the benefits of harnessing AI-driven automation for UiPath testing initiatives. By attending this webinar, testers, and automation professionals can gain valuable insights into harnessing the power of AI to optimize their test automation workflows within the UiPath ecosystem, ultimately driving efficiency and quality in software development processes.
What will you get from this session?
1. Insights into integrating generative AI.
2. Understanding how this integration enhances test automation within the UiPath platform
3. Practical demonstrations
4. Exploration of real-world use cases illustrating the benefits of AI-driven test automation for UiPath
Topics covered:
What is generative AI
Test Automation with generative AI and Open AI.
UiPath integration with generative AI
Speaker:
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
Essentials of Automations: The Art of Triggers and Actions in FMESafe Software
In this second installment of our Essentials of Automations webinar series, we’ll explore the landscape of triggers and actions, guiding you through the nuances of authoring and adapting workspaces for seamless automations. Gain an understanding of the full spectrum of triggers and actions available in FME, empowering you to enhance your workspaces for efficient automation.
We’ll kick things off by showcasing the most commonly used event-based triggers, introducing you to various automation workflows like manual triggers, schedules, directory watchers, and more. Plus, see how these elements play out in real scenarios.
Whether you’re tweaking your current setup or building from the ground up, this session will arm you with the tools and insights needed to transform your FME usage into a powerhouse of productivity. Join us to discover effective strategies that simplify complex processes, enhancing your productivity and transforming your data management practices with FME. Let’s turn complexity into clarity and make your workspaces work wonders!
Introducing Milvus Lite: Easy-to-Install, Easy-to-Use vector database for you...Zilliz
Join us to introduce Milvus Lite, a vector database that can run on notebooks and laptops, share the same API with Milvus, and integrate with every popular GenAI framework. This webinar is perfect for developers seeking easy-to-use, well-integrated vector databases for their GenAI apps.
A tale of scale & speed: How the US Navy is enabling software delivery from l...sonjaschweigert1
Rapid and secure feature delivery is a goal across every application team and every branch of the DoD. The Navy’s DevSecOps platform, Party Barge, has achieved:
- Reduction in onboarding time from 5 weeks to 1 day
- Improved developer experience and productivity through actionable findings and reduction of false positives
- Maintenance of superior security standards and inherent policy enforcement with Authorization to Operate (ATO)
Development teams can ship efficiently and ensure applications are cyber ready for Navy Authorizing Officials (AOs). In this webinar, Sigma Defense and Anchore will give attendees a look behind the scenes and demo secure pipeline automation and security artifacts that speed up application ATO and time to production.
We will cover:
- How to remove silos in DevSecOps
- How to build efficient development pipeline roles and component templates
- How to deliver security artifacts that matter for ATO’s (SBOMs, vulnerability reports, and policy evidence)
- How to streamline operations with automated policy checks on container images
A tale of scale & speed: How the US Navy is enabling software delivery from l...
SPICE MODEL of NJM072L in SPICE PARK
1. Device Modeling Report
COMPONENTS: OPERATIONAL AMPLIFIER
PART NUMBER: NJM072L
MANUFACTURER: NEW JAPAN RADIO
REMARK TYPE: (OPAMP)
Bee Technologies Inc.
All Rights Reserved Copyright (c) Bee Technologies Inc. 2004
2. Spice Model
OUT1 VCC
-IN1 OUT2
+IN1 +IN2
VEE -IN2
NJM072L_SUB
All Rights Reserved Copyright (c) Bee Technologies Inc. 2004
3. Output Voltage Swing, +Vout and –Vout
Simulation result
These simulation results are compared with +Vout
Evaluation circuit
Output Voltage Swing Data sheet Simulation %Error
+Vout(V) +13.5 +13.438 0.459
-Vout(V) -13.5 -13.438 0.459
All Rights Reserved Copyright (c) Bee Technologies Inc. 2004
4. Input Offset Voltage
Simulation result
Evaluation circuit
Measurement Simulation Error
Vos
15 mV 14.948 mV 0.34 %
All Rights Reserved Copyright (c) Bee Technologies Inc. 2004
5. Slew Rate, +SR, -SR
Simulation result
Evaluation circuit
Data sheet Simulation %Error
Slew Rate(v/us)
20V/us 20.023V/us 0.115
All Rights Reserved Copyright (c) Bee Technologies Inc. 2004
6. Input current Ib, Ibos
Simulation result
Evaluation circuit
Data sheet Simulation %Error
Ib(nA) 30 30.05 0.166
Ibos(nA) 5 5.06 1.2
All Rights Reserved Copyright (c) Bee Technologies Inc. 2004
7. Open Loop Voltage Gain vs. Frequency , Av-dc, f-0dB
Simulation result
Evaluation circuit
Data sheet Simulation %Error
f-0dB(MHz) 5 4.87 2.6
Av-dc 106 106.1 0.094
All Rights Reserved Copyright (c) Bee Technologies Inc. 2004
8. Output Short Circuit Current - Ios
Simulation result
Evaluation circuit
Data sheet Simulation %Error
Short Circuit Current
3mA 3.05mA 1.66
All Rights Reserved Copyright (c) Bee Technologies Inc. 2004
9. Common-Mode Rejection Voltage gain
Simulation result
Evaluation circuit
Common mode gain=31.625/1=31.625
Common Mode Reject Ratio=201836/31.625=6382
Data sheet Simulation %Error
CMRR
6309 6382 1.157
All Rights Reserved Copyright (c) Bee Technologies Inc. 2004