This document summarizes the modeling of a MCR218-4FP thyristor manufactured by Motorola Semiconductor. It includes:
1) A description of the diode model used including key parameters.
2) Simulations and comparisons to measurements of the thyristor's IG-VT, ITM-VTM, and holding characteristics.
3) A simulation and comparison of the thyristor's switching times.
All simulations showed good agreement with measurements within 2.5% error.
This document provides a device modeling report for a Motorola MCR225-8FP thyristor. It includes:
1) Details of the thyristor components and manufacturer.
2) Descriptions of the diode, IG-VT, ITM-VTM, holding, and switching time characteristics along with the simulation circuits and comparison of simulated results to measurements.
3) Percent error calculations show good agreement between simulation and measurement across all characteristics within 2.5% error.
SPICE MODEL of BT300S-600R in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
This document provides a device modeling report for a BT300S-500R thyristor manufactured by Philips Semiconductor. It includes the component parameters, SPICE model description, and simulation results comparing the modeled and measured characteristics of the thyristor, including its IG-VT, ITM-VTM, holding, and switching time characteristics. The simulation results show good agreement with measurements, with most error values below 2%.
SPICE MODEL of MCR225-2FP in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of BT300S-800R in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
This document summarizes the modeling of a MCR218-4FP thyristor manufactured by Motorola Semiconductor. It includes:
1) A description of the diode model used including key parameters.
2) Simulations and comparisons to measurements of the thyristor's IG-VT, ITM-VTM, and holding characteristics.
3) A simulation and comparison of the thyristor's switching times.
All simulations showed good agreement with measurements within 2.5% error.
This document provides a device modeling report for a Motorola MCR225-8FP thyristor. It includes:
1) Details of the thyristor components and manufacturer.
2) Descriptions of the diode, IG-VT, ITM-VTM, holding, and switching time characteristics along with the simulation circuits and comparison of simulated results to measurements.
3) Percent error calculations show good agreement between simulation and measurement across all characteristics within 2.5% error.
SPICE MODEL of BT300S-600R in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
This document provides a device modeling report for a BT300S-500R thyristor manufactured by Philips Semiconductor. It includes the component parameters, SPICE model description, and simulation results comparing the modeled and measured characteristics of the thyristor, including its IG-VT, ITM-VTM, holding, and switching time characteristics. The simulation results show good agreement with measurements, with most error values below 2%.
SPICE MODEL of MCR225-2FP in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of BT300S-800R in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of MCR218-6FP in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of BT145-600R in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of BT145-500R in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
This document provides a device modeling report for a Motorola MCR218-2FP thyristor. It includes:
1) A description of the diode and thyristor SPICE models used including key parameters.
2) Simulation results and comparisons to measurements for the IG-VT, ITM-VTM, and holding characteristics.
3) A switching time evaluation circuit and simulation results compared to measurements.
SPICE MODEL of MCR218-10FP in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
This document summarizes the modeling of a thyristor component. It includes:
1) Details of the thyristor part number and manufacturer.
2) Descriptions of the diode and thyristor models used in the simulation software.
3) Results of simulations matching measurements of the thyristor's gate trigger voltage (VGT), gate trigger current (IGT), maximum current (ITM), holding current (IH), and switching times (Ton and Toff). The simulations were within 1% error of the measurements.
SPICE MODEL of BT151X-650 in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
This document summarizes the Pspice modeling and simulation of a thyristor component. It examines the diode model parameters, the forward IG-VT characteristic, the reverse ITM-VTM characteristic, the holding current IH characteristic, and the switching times Ton and Toff. The simulations show good agreement with measurements, with most error values below 2%.
This document summarizes the modeling of a thyristor component. It includes the part number, manufacturer, and descriptions of the diode and thyristor models used in the simulation. Simulation results for various characteristics like IG-VT, ITM-VTM, holding characteristics, and switching times are provided along with comparisons to measurements.
SPICE MODEL of BTH151S-650R in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of RURP15120 , TC=110degree (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of RURP15120 , TC=110degree (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of BT151X-800 in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of MCR225-6FP in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of BT152B-400R in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of MCR218-6FP in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of BT145-600R in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of BT145-500R in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
This document provides a device modeling report for a Motorola MCR218-2FP thyristor. It includes:
1) A description of the diode and thyristor SPICE models used including key parameters.
2) Simulation results and comparisons to measurements for the IG-VT, ITM-VTM, and holding characteristics.
3) A switching time evaluation circuit and simulation results compared to measurements.
SPICE MODEL of MCR218-10FP in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
This document summarizes the modeling of a thyristor component. It includes:
1) Details of the thyristor part number and manufacturer.
2) Descriptions of the diode and thyristor models used in the simulation software.
3) Results of simulations matching measurements of the thyristor's gate trigger voltage (VGT), gate trigger current (IGT), maximum current (ITM), holding current (IH), and switching times (Ton and Toff). The simulations were within 1% error of the measurements.
SPICE MODEL of BT151X-650 in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
This document summarizes the Pspice modeling and simulation of a thyristor component. It examines the diode model parameters, the forward IG-VT characteristic, the reverse ITM-VTM characteristic, the holding current IH characteristic, and the switching times Ton and Toff. The simulations show good agreement with measurements, with most error values below 2%.
This document summarizes the modeling of a thyristor component. It includes the part number, manufacturer, and descriptions of the diode and thyristor models used in the simulation. Simulation results for various characteristics like IG-VT, ITM-VTM, holding characteristics, and switching times are provided along with comparisons to measurements.
SPICE MODEL of BTH151S-650R in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of RURP15120 , TC=110degree (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of RURP15120 , TC=110degree (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of BT151X-800 in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of MCR225-6FP in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of BT152B-400R in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of MCR225-10FP in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of BT151X-500 in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of MCR218-8FP in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of BT151U-500C in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of BT152-800R in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)Tsuyoshi Horigome
This document provides an inventory update of 6,747 parts at Spice Park as of April 2024. It lists the part numbers, manufacturers, and quantities of various semiconductor components, including 1,697 Schottky rectifier diodes from 29 different manufacturers. It also includes details on passive components, batteries, mechanical parts, motors, and lamps in the inventory.
The document provides an inventory update from April 2024 of the Spice Park collection which contains 6,747 electronic components. It includes tables listing the types of semiconductor components, passive parts, batteries, mechanical parts, motors, and lamps in the collection along with their manufacturer and quantities. One of the semiconductor components, the general purpose rectifier diode, is broken down into a more detailed table with 116 entries providing part numbers, manufacturers, thermal ratings, and remarks.
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)Tsuyoshi Horigome
The document provides an inventory update from March 2024 of parts in the Spice Park warehouse. It lists 6,725 total parts across various categories including semiconductors, passive parts, batteries, mechanical parts, motors, and lamps. The semiconductor section lists 652 general purpose rectifier diodes from 18 different manufacturers with quantities ranging from 2 to 145 pieces.
This document provides an inventory list of parts at Spice Park as of March 2024. It contains 3 sections - Semiconductor parts (diodes, transistors, ICs etc.), Passive parts (capacitors, resistors etc.), and Battery parts. For Semiconductor parts, it lists 36 different part types and provides the quantity of each part. It then provides further details of Diode/General Purpose Rectifiers, listing the manufacturer and quantity of 652 individual part numbers.
Update 29 models(Solar cell) in SPICE PARK(FEB2024)Tsuyoshi Horigome
The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 total pieces of electronic components and parts. It lists 36 categories of semiconductor devices, 11 categories of passive parts, 10 types of batteries, 5 mechanical parts, DC motors, lamps, and power supplies. It provides the most detailed listing for solar cells, with 1,003 total pieces from 51 manufacturers listed with part numbers.
The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 electronic components. It lists the components by type (e.g. semiconductor), part number, manufacturer, thermal rating, and quantity on hand. For example, it shows that there are 621 general purpose rectifier diodes from manufacturers such as Fairchild, Fuji, Intersil, Rohm, Shindengen, and Toshiba. The detailed four-page section provides further information on the first item, general purpose rectifier diodes, including 152 individual part numbers and specifications.
This document discusses circuit simulations using LTspice. It describes driving a circuit simulation by inserting a 250 ohm resistor between the output terminals. It also describes simulating a 1 channel bridge circuit where the DUT1 and DUT2 resistors are both set to 100 ohms and the input voltage is set to either 1V or 5V.
This document discusses parametric sweeps of external and internal resistance values Rg for circuit simulation in LTspice. It also references outputting a waveform similar to a report on fall time characteristics for a device modeling report with customer Samsung.
Main news related to the CCS TSI 2023 (2023/1695)Jakub Marek
An English 🇬🇧 translation of a presentation to the speech I gave about the main changes brought by CCS TSI 2023 at the biggest Czech conference on Communications and signalling systems on Railways, which was held in Clarion Hotel Olomouc from 7th to 9th November 2023 (konferenceszt.cz). Attended by around 500 participants and 200 on-line followers.
The original Czech 🇨🇿 version of the presentation can be found here: https://www.slideshare.net/slideshow/hlavni-novinky-souvisejici-s-ccs-tsi-2023-2023-1695/269688092 .
The videorecording (in Czech) from the presentation is available here: https://youtu.be/WzjJWm4IyPk?si=SImb06tuXGb30BEH .
[OReilly Superstream] Occupy the Space: A grassroots guide to engineering (an...Jason Yip
The typical problem in product engineering is not bad strategy, so much as “no strategy”. This leads to confusion, lack of motivation, and incoherent action. The next time you look for a strategy and find an empty space, instead of waiting for it to be filled, I will show you how to fill it in yourself. If you’re wrong, it forces a correction. If you’re right, it helps create focus. I’ll share how I’ve approached this in the past, both what works and lessons for what didn’t work so well.
For the full video of this presentation, please visit: https://www.edge-ai-vision.com/2024/06/temporal-event-neural-networks-a-more-efficient-alternative-to-the-transformer-a-presentation-from-brainchip/
Chris Jones, Director of Product Management at BrainChip , presents the “Temporal Event Neural Networks: A More Efficient Alternative to the Transformer” tutorial at the May 2024 Embedded Vision Summit.
The expansion of AI services necessitates enhanced computational capabilities on edge devices. Temporal Event Neural Networks (TENNs), developed by BrainChip, represent a novel and highly efficient state-space network. TENNs demonstrate exceptional proficiency in handling multi-dimensional streaming data, facilitating advancements in object detection, action recognition, speech enhancement and language model/sequence generation. Through the utilization of polynomial-based continuous convolutions, TENNs streamline models, expedite training processes and significantly diminish memory requirements, achieving notable reductions of up to 50x in parameters and 5,000x in energy consumption compared to prevailing methodologies like transformers.
Integration with BrainChip’s Akida neuromorphic hardware IP further enhances TENNs’ capabilities, enabling the realization of highly capable, portable and passively cooled edge devices. This presentation delves into the technical innovations underlying TENNs, presents real-world benchmarks, and elucidates how this cutting-edge approach is positioned to revolutionize edge AI across diverse applications.
5th LF Energy Power Grid Model Meet-up SlidesDanBrown980551
5th Power Grid Model Meet-up
It is with great pleasure that we extend to you an invitation to the 5th Power Grid Model Meet-up, scheduled for 6th June 2024. This event will adopt a hybrid format, allowing participants to join us either through an online Mircosoft Teams session or in person at TU/e located at Den Dolech 2, Eindhoven, Netherlands. The meet-up will be hosted by Eindhoven University of Technology (TU/e), a research university specializing in engineering science & technology.
Power Grid Model
The global energy transition is placing new and unprecedented demands on Distribution System Operators (DSOs). Alongside upgrades to grid capacity, processes such as digitization, capacity optimization, and congestion management are becoming vital for delivering reliable services.
Power Grid Model is an open source project from Linux Foundation Energy and provides a calculation engine that is increasingly essential for DSOs. It offers a standards-based foundation enabling real-time power systems analysis, simulations of electrical power grids, and sophisticated what-if analysis. In addition, it enables in-depth studies and analysis of the electrical power grid’s behavior and performance. This comprehensive model incorporates essential factors such as power generation capacity, electrical losses, voltage levels, power flows, and system stability.
Power Grid Model is currently being applied in a wide variety of use cases, including grid planning, expansion, reliability, and congestion studies. It can also help in analyzing the impact of renewable energy integration, assessing the effects of disturbances or faults, and developing strategies for grid control and optimization.
What to expect
For the upcoming meetup we are organizing, we have an exciting lineup of activities planned:
-Insightful presentations covering two practical applications of the Power Grid Model.
-An update on the latest advancements in Power Grid -Model technology during the first and second quarters of 2024.
-An interactive brainstorming session to discuss and propose new feature requests.
-An opportunity to connect with fellow Power Grid Model enthusiasts and users.
Your One-Stop Shop for Python Success: Top 10 US Python Development Providersakankshawande
Simplify your search for a reliable Python development partner! This list presents the top 10 trusted US providers offering comprehensive Python development services, ensuring your project's success from conception to completion.
HCL Notes und Domino Lizenzkostenreduzierung in der Welt von DLAUpanagenda
Webinar Recording: https://www.panagenda.com/webinars/hcl-notes-und-domino-lizenzkostenreduzierung-in-der-welt-von-dlau/
DLAU und die Lizenzen nach dem CCB- und CCX-Modell sind für viele in der HCL-Community seit letztem Jahr ein heißes Thema. Als Notes- oder Domino-Kunde haben Sie vielleicht mit unerwartet hohen Benutzerzahlen und Lizenzgebühren zu kämpfen. Sie fragen sich vielleicht, wie diese neue Art der Lizenzierung funktioniert und welchen Nutzen sie Ihnen bringt. Vor allem wollen Sie sicherlich Ihr Budget einhalten und Kosten sparen, wo immer möglich. Das verstehen wir und wir möchten Ihnen dabei helfen!
Wir erklären Ihnen, wie Sie häufige Konfigurationsprobleme lösen können, die dazu führen können, dass mehr Benutzer gezählt werden als nötig, und wie Sie überflüssige oder ungenutzte Konten identifizieren und entfernen können, um Geld zu sparen. Es gibt auch einige Ansätze, die zu unnötigen Ausgaben führen können, z. B. wenn ein Personendokument anstelle eines Mail-Ins für geteilte Mailboxen verwendet wird. Wir zeigen Ihnen solche Fälle und deren Lösungen. Und natürlich erklären wir Ihnen das neue Lizenzmodell.
Nehmen Sie an diesem Webinar teil, bei dem HCL-Ambassador Marc Thomas und Gastredner Franz Walder Ihnen diese neue Welt näherbringen. Es vermittelt Ihnen die Tools und das Know-how, um den Überblick zu bewahren. Sie werden in der Lage sein, Ihre Kosten durch eine optimierte Domino-Konfiguration zu reduzieren und auch in Zukunft gering zu halten.
Diese Themen werden behandelt
- Reduzierung der Lizenzkosten durch Auffinden und Beheben von Fehlkonfigurationen und überflüssigen Konten
- Wie funktionieren CCB- und CCX-Lizenzen wirklich?
- Verstehen des DLAU-Tools und wie man es am besten nutzt
- Tipps für häufige Problembereiche, wie z. B. Team-Postfächer, Funktions-/Testbenutzer usw.
- Praxisbeispiele und Best Practices zum sofortigen Umsetzen
Fueling AI with Great Data with Airbyte WebinarZilliz
This talk will focus on how to collect data from a variety of sources, leveraging this data for RAG and other GenAI use cases, and finally charting your course to productionalization.
AppSec PNW: Android and iOS Application Security with MobSFAjin Abraham
Mobile Security Framework - MobSF is a free and open source automated mobile application security testing environment designed to help security engineers, researchers, developers, and penetration testers to identify security vulnerabilities, malicious behaviours and privacy concerns in mobile applications using static and dynamic analysis. It supports all the popular mobile application binaries and source code formats built for Android and iOS devices. In addition to automated security assessment, it also offers an interactive testing environment to build and execute scenario based test/fuzz cases against the application.
This talk covers:
Using MobSF for static analysis of mobile applications.
Interactive dynamic security assessment of Android and iOS applications.
Solving Mobile app CTF challenges.
Reverse engineering and runtime analysis of Mobile malware.
How to shift left and integrate MobSF/mobsfscan SAST and DAST in your build pipeline.
Generating privacy-protected synthetic data using Secludy and MilvusZilliz
During this demo, the founders of Secludy will demonstrate how their system utilizes Milvus to store and manipulate embeddings for generating privacy-protected synthetic data. Their approach not only maintains the confidentiality of the original data but also enhances the utility and scalability of LLMs under privacy constraints. Attendees, including machine learning engineers, data scientists, and data managers, will witness first-hand how Secludy's integration with Milvus empowers organizations to harness the power of LLMs securely and efficiently.
Essentials of Automations: Exploring Attributes & Automation ParametersSafe Software
Building automations in FME Flow can save time, money, and help businesses scale by eliminating data silos and providing data to stakeholders in real-time. One essential component to orchestrating complex automations is the use of attributes & automation parameters (both formerly known as “keys”). In fact, it’s unlikely you’ll ever build an Automation without using these components, but what exactly are they?
Attributes & automation parameters enable the automation author to pass data values from one automation component to the next. During this webinar, our FME Flow Specialists will cover leveraging the three types of these output attributes & parameters in FME Flow: Event, Custom, and Automation. As a bonus, they’ll also be making use of the Split-Merge Block functionality.
You’ll leave this webinar with a better understanding of how to maximize the potential of automations by making use of attributes & automation parameters, with the ultimate goal of setting your enterprise integration workflows up on autopilot.
For the full video of this presentation, please visit: https://www.edge-ai-vision.com/2024/06/how-axelera-ai-uses-digital-compute-in-memory-to-deliver-fast-and-energy-efficient-computer-vision-a-presentation-from-axelera-ai/
Bram Verhoef, Head of Machine Learning at Axelera AI, presents the “How Axelera AI Uses Digital Compute-in-memory to Deliver Fast and Energy-efficient Computer Vision” tutorial at the May 2024 Embedded Vision Summit.
As artificial intelligence inference transitions from cloud environments to edge locations, computer vision applications achieve heightened responsiveness, reliability and privacy. This migration, however, introduces the challenge of operating within the stringent confines of resource constraints typical at the edge, including small form factors, low energy budgets and diminished memory and computational capacities. Axelera AI addresses these challenges through an innovative approach of performing digital computations within memory itself. This technique facilitates the realization of high-performance, energy-efficient and cost-effective computer vision capabilities at the thin and thick edge, extending the frontier of what is achievable with current technologies.
In this presentation, Verhoef unveils his company’s pioneering chip technology and demonstrates its capacity to deliver exceptional frames-per-second performance across a range of standard computer vision networks typical of applications in security, surveillance and the industrial sector. This shows that advanced computer vision can be accessible and efficient, even at the very edge of our technological ecosystem.
Skybuffer SAM4U tool for SAP license adoptionTatiana Kojar
Manage and optimize your license adoption and consumption with SAM4U, an SAP free customer software asset management tool.
SAM4U, an SAP complimentary software asset management tool for customers, delivers a detailed and well-structured overview of license inventory and usage with a user-friendly interface. We offer a hosted, cost-effective, and performance-optimized SAM4U setup in the Skybuffer Cloud environment. You retain ownership of the system and data, while we manage the ABAP 7.58 infrastructure, ensuring fixed Total Cost of Ownership (TCO) and exceptional services through the SAP Fiori interface.
How information systems are built or acquired puts information, which is what they should be about, in a secondary place. Our language adapted accordingly, and we no longer talk about information systems but applications. Applications evolved in a way to break data into diverse fragments, tightly coupled with applications and expensive to integrate. The result is technical debt, which is re-paid by taking even bigger "loans", resulting in an ever-increasing technical debt. Software engineering and procurement practices work in sync with market forces to maintain this trend. This talk demonstrates how natural this situation is. The question is: can something be done to reverse the trend?
Northern Engraving | Nameplate Manufacturing Process - 2024Northern Engraving
Manufacturing custom quality metal nameplates and badges involves several standard operations. Processes include sheet prep, lithography, screening, coating, punch press and inspection. All decoration is completed in the flat sheet with adhesive and tooling operations following. The possibilities for creating unique durable nameplates are endless. How will you create your brand identity? We can help!
Freshworks Rethinks NoSQL for Rapid Scaling & Cost-EfficiencyScyllaDB
Freshworks creates AI-boosted business software that helps employees work more efficiently and effectively. Managing data across multiple RDBMS and NoSQL databases was already a challenge at their current scale. To prepare for 10X growth, they knew it was time to rethink their database strategy. Learn how they architected a solution that would simplify scaling while keeping costs under control.
Freshworks Rethinks NoSQL for Rapid Scaling & Cost-Efficiency
LTspice Model of MUSES8820
1. Device Modeling Report
COMPONENTS: OPERATIONAL AMPLIFIER
PART NUMBER: MUSES8820 (LTspice Model)
MANUFACTURER: New Japan Radio
REMARK TYPE: (OPAMP)
Bee Technologies Inc.
All Rights Reserved Copyright (c) Bee Technologies Inc. 2010
1
2. SPICE MODEL
All Rights Reserved Copyright (c) Bee Technologies Inc. 2010
2
3. Output Voltage Swing
Simulation result
VOH
VOL
Evaluation circuit
Comparison table
Parameter Measurement Simulation %Error
VOH (V) 13.500 13.497 -0.02
VOL (V) -13.500 -13.497 -0.02
All Rights Reserved Copyright (c) Bee Technologies Inc. 2010
3
4. Output Short Circuit Current
Simulation result
Evaluation circuit
Comparison table
Parameter Measurement Simulation %Error
IOH (mA) 50.000 51.108 2.22
IOL (mA) 50.000 51.108 2.22
All Rights Reserved Copyright (c) Bee Technologies Inc. 2010
4
5. Input Offset Voltage
Simulation result
Evaluation circuit
Comparison table
Parameter Measurement Simulation %Error
Vio (mV) 0.300 0.300 -0.01
All Rights Reserved Copyright (c) Bee Technologies Inc. 2010
5
6. Input Current Ib, Ibos
Simulation result
Evaluation circuit
Comparison table
Parameter Measurement Simulation %Error
Iio (nA) 5.000 5.003 0.05
Ib (nA) 100.000 100.012 0.01
All Rights Reserved Copyright (c) Bee Technologies Inc. 2010
6
7. Slew Rate
Simulation result
Evaluation circuit
Comparison table
Parameter Measurement Simulation %Error
Slew Rate (V/us) 5.000 4.925 -1.50
All Rights Reserved Copyright (c) Bee Technologies Inc. 2010
7
8. Open loop voltage gain
Simulation result
Evaluation circuit
Comparison table
Parameter Measurement Simulation %Error
AV (db) 110.000 109.914 -0.08
All Rights Reserved Copyright (c) Bee Technologies Inc. 2010
8
9. Common-mode rejection voltage gain
Simulation result
Evaluation circuit
Comparison table
Common mode gain = 0.961 V/V
CMRR = 20*log10(316627/0.961) = 110.356
Parameter Measurement Simulation %Error
CMRR(dB) 110.000 110.356 0.32
All Rights Reserved Copyright (c) Bee Technologies Inc. 2010
9
10. Supply Current
Simulation result
Evaluation circuit
Comparison table
Parameter Measurement Simulation %Error
ICC (mA) 7.600 7.641 0.54
All Rights Reserved Copyright (c) Bee Technologies Inc. 2010
10
11. Power supply rejection ration
Simulation result
Evaluation circuit
Comparison table
Parameter Measurement Simulation %Error
PSRR (dB) 110.000 109.992 -0.01
All Rights Reserved Copyright (c) Bee Technologies Inc. 2010
11
12. Input common-mode voltage range
Simulation result
Evaluation circuit
Comparison table
Parameter Measurement Simulation %Error
Vicm (V) 27.000 27.153 0.57
All Rights Reserved Copyright (c) Bee Technologies Inc. 2010
12
13. Gain Bandwidth Product
Simulation result
Evaluation circuit
Comparison table
VCC=15[V], VEE=-15[V], Av=40[dB]
Parameter Measurement Simulation %Error
Ft (MHz) 5.800 5.711 -1.54
Phase margin () 48.000 46.969 -2.15
All Rights Reserved Copyright (c) Bee Technologies Inc. 2010
13