For micro and nano manufacturing

1. Micro and Nano Mechanical Testing of Materials
and Devices

2. Fuqian Yang · James C.M. Li
Editors
Micro and Nano Mechanical
Testing of Materials
and Devices
123

3. Editors
Fuqian Yang
Department of Chemical and Materials
Engineering
University of Kentucky
Lexington, KY 40506
fyang0@engr.uky.edu
James C.M. Li
Department of Mechanical Engineering
University of Rochester
Rochester, NY 14627
li@me.rochester.edu
ISBN: 978-0-387-78700-8 e-ISBN: 978-0-387-78701-5
Library of Congress Control Number: 2008923469
c
2008 Springer Science+Business Media, LLC
All rights reserved. This work may not be translated or copied in whole or in part without the written
permission of the publisher (Springer Science+Business Media, LLC, 233 Spring Street, New York,
NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in
connection with any form of information storage and retrieval, electronic adaptation, computer software,
or by similar or dissimilar methodology now known or hereafter developed is forbidden.
The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are
not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject
to proprietary rights.
Printed on acid-free paper
9 8 7 6 5 4 3 2 1
springer.com

4. Foreword
Micro- and nano- mechanical devices are certain to play an ever more important
role in future technologies. Already, sensors and actuators based on MEMS tech-
nologies are common, and new devices based on NEMS are just around the corner.
These developments are part of a decade-long trend to build useful engineering de-
vices and structures on a smaller and smaller scale. Since the invention of the in-
tegrated circuit 50 years ago we have been building microelectronic devices on a
smaller and smaller scale, with some of the critical dimensions now reaching just
a few nanometers. Similar developments have occurred in thin film magnetic stor-
age technologies and related optical devices. The creation of such small structures
and devices calls for an understanding of the mechanical properties of materials at
these small length scales, not only because these functional devices are primarily
load bearing structures, but also because mechanical durability and reliability are
required for their successful operation. In the macroscale (bulk), the mechanical
properties of materials are commonly described by single-valued parameters (e.g.,
yield stress, hardness, etc.), which are largely independent of the size of the speci-
men. However, the dimensions of micro- and nanoscale devices are comparable to
the microstructural features that control mechanical properties, and so the mechani-
cal behavior of these devices cannot be predicted using the known properties of bulk
materials. Thus, micro- and nanoscale mechanical testing techniques, as described
in this book, are required to characterize the mechanical properties of the materi-
als used for these functional devices. In addition, the materials that comprise these
devices and structures may not even exist in bulk form, thus making small-scale
mechanical testing the only way to determine their mechanical properties. Beyond
functional devices, MEMS and NEMS structures comprise micro- and nanoscale
devices that have important mechanical functions well, with mechanical actuation
and mechanical resonance being critical features of these devices.
The study of mechanical properties of materials in small dimensions is impor-
tant for another, very different, reason. The ability to study experimentally the basic
mechanical properties of materials with sample dimensions in the range of tens to
hundreds of nanometers opens up the possibility of conducting mechanical deforma-
tion experiments on length scales that can be accessed by atomistic and multiscale
v

5. vi Foreword
modeling, even if there still exists a huge discrepancy in the timescale of the ex-
periments compared to the atomistic modeling. Thus, the mechanical testing tech-
niques described in this book are expected to provide not only new knowledge on
the mechanical properties of materials for micro- and nanoscale devices but also
experimental validation for computational modeling of length-scale-dependent me-
chanical properties.
In the last two decades we have seen an explosion of research on the mechanical
properties of thin films and materials in small dimensions. Much of this work was
necessarily devoted to the development of new techniques for studying the mechani-
cal properties at the micro- and nanoscales, as testing instruments and methods were
not previously available. The present book brings many of these new developments
together for the first time and allows new workers to enter this field quickly and ex-
tend it to new, emerging, nanoscale materials and devices. With the very rapid devel-
opment of completely new materials in the form of nanowires, nanotubes, nanobelts,
and other nanoscale objects, it is likely that the readers of this book will be the ones
to bring about the next transformation of this exciting field.
It is fitting that this book be organized and edited by professors J.C.M. Li and
F. Yang, as they were among the first to recognize the importance of studying
mechanical properties of materials in small dimensions. Their seminal work on im-
pression creep inspired a new generation to focus on the mechanical properties of
materials at smallscales.
Many important new developments in the mechanical testing of materials for
micro- and nanoscale devices are described in this book. The development of com-
mercial instruments for nanoindentation was accompanied by seminal papers de-
scribing the techniques and methodologies through which these new instruments
could be used to determine the fundamental mechanical properties in small vol-
umes. Therefore, it is fitting that the basic principles and applications of indentation
are described in the first chapter by M. Sakai. Other chapters dealing with the prop-
erties and effects revealed by nanoindentation include Chap. 2 on size effects in
nanoindentation by X. Feng et al., and Chap. 7 on the determination of residual
stresses by nanoindentation by Z.-H. Xu and X. Li. In Chap. 3, Y.-T. Cheng and
D.S. Grummon make good use of indentation in their study of shape memory and
superelastic effects.
Chapter 10 by T.-Y. Zhang shows how fundamental mechanical properties of
thin film materials can be found by deflecting microbridge structures, geometries
that arise naturally in MEMS and NEMS devices. Other MEMS and NEMS devices
frequently involve contacting surfaces wherein adhesion becomes very important.
This topic is covered by F.Q. Yang in Chap. 4. These micro- and nanomechanical
devices are often electrostatically actuated, and this too has led to new techniques for
mechanical testing of materials at the chip level, as described by A. Corigliano et al.
in Chap. 13. Still other kinds of loading can occur in thin film devices; they produce
important mechanical deformation effects that play a central role in understanding
device reliability. Some of these developments are described by R.R. Keller et al. in
Chap. 12.

6. Foreword vii
Size effects in plasticity are important for low-dimensional materials such as
nanoparticles, nanowires, and thin films, and can also control the mechanical prop-
erties of macroscopic 3D materials with unusual microstructures such as nanoporous
metals. The mechanical behavior of these nanoscale materials can now be studied
using the new testing methodologies described in this book. In particular, size ef-
fects in plasticity of nanoporous metals are described in Chap. 6 by J. Biener et al.
Also, micro- and nanoscale contacts can produce important nonmechanical effects
such as the piezoelectric effects described by F.Q. Yang in Chap. 8.
As noted above, the development of nanowires and related nanoscale objects rep-
resents one of the most exciting developments in this field. This has naturally led to
the exploration of the mechanical properties of these new nanomaterials. Chapters
5 and 11 by Y.S. Zhang et al. and B. Peng et al., respectively, focus on the mechan-
ical testing and characterization of these new materials. L.C. Zhang also discusses
the mechanics of carbon nanotubes in Chap. 9 and considers their use in composite
materials.
Readers of this book will greatly benefit from the experience of these authors and
will be well prepared to read the original literature and make their own contributions
to this important field.
Stanford University William D. Nix
January 17, 2008

7. Contents
Foreword . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v
1 Principles and Applications of Indentation . . . . . . . . . . . . . . . . . . . . . . 1
Mototsugu Sakai
2 Size Effects in Nanoindentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Xue Feng, Yonggang Huang, and Keh-chih Hwang
3 Indentation in Shape Memory Alloys . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Yang-Tse Cheng and David S. Grummon
4 Adhesive Contact of Solid Surfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Fuqian Yang
5 Nanomechanical Characterization of One-Dimensional
Nanostructures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
Yousheng Zhang, Eunice Phay Shing Tan, Chorng Haur Sow,
and Chwee Teck Lim
6 Deformation Behavior of Nanoporous Metals . . . . . . . . . . . . . . . . . . . . 121
Juergen Biener, Andrea M. Hodge, and Alex V. Hamza
7 Residual Stress Determination Using Nanoindentation Technique . . . 139
Zhi-Hui Xu and Xiaodong Li
8 Piezoelectric Response in the Contact Deformation of Piezoelectric
Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155
Fuqian Yang
9 Mechanics of Carbon Nanotubes and Their Composites . . . . . . . . . . . 179
Liang Chi Zhang
10 Microbridge Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215
Tong-Yi Zhang
ix

8. x Contents
11 Nanoscale Testing of One-Dimensional Nanostructures . . . . . . . . . . . . 287
Bei Peng, Yugang Sun,Yong Zhu, Hsien-Hau Wang,
and Horacio Dante Espinosa
12 Metrologies for Mechanical Response of Micro- and Nanoscale
Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 313
Robert R. Keller, Donna C. Hurley, David T. Read, and Paul Rice
13 Mechanical Characterization of Low-Dimensional Structures
Through On-Chip Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 349
Alberto Corigliano, Fabrizio Cacchione, and Sarah Zerbini
Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 385

9. Contributors
Juergen Biener
Nanoscale Synthesis and Characterization Laboratory, Lawrence Livermore
National Laboratory, Livermore, CA 94550, USA, biener2@llnl.gov
Fabrizio Cacchione
Department of Structural Engineering, Politecnico di Milano, piazza Leonardo da
Vinci 32, 20133 Milano, Italy
Yang-Tse Cheng
Materials and Processes Laboratory, General Motors RD Center, Warren, MI
48090, USA, Yangtcheng@aol.com
Alberto Corigliano
Department of Structural Engineering, Politecnico di Milano, piazza Leonardo da
Vinci 32, 20133 Milano, Italy, alberto.corigliano@polimi.it
Horacio D. Espinosa
Department of Mechanical Engineering, Northwestern University, 2145 Sheridan
Rd., Evanston, IL 60208-3111, USA, espinosa@northwestern.edu
Xue Feng
Department of Engineering Mechanics, Tsinghua University, Beijing 100084,
China, fengxue@mail.tsinghua.edu.cn
David S. Grummon
Department of Chemical Engineering and Materials Science, Michigan State
University, East Lansing, Michigan 48823, USA, grummon@egr.msu.edu
Alex V. Hamza
Aerospace and Mechanical Engineering Department, University of Southern
California, Los Angeles, CA 90089, USA
Andrea M. Hodge
Nanoscale Synthesis and Characterization Laboratory, Lawrence Livermore
National Laboratory, Livermore, CA 94550, USA
xi

10. xii Contributors
Yonggang Huang
Department of Civil and Environmental Engineering, Department of
Mechanical Engineering, Northwestern University, Evanston, IL 60208,
USA, y-huang@northwestern.edu
Donna C. Hurley
Materials Reliability Division, National Institute of Standards and Technology,
Boulder, CO 80305, USA
Keh-chih Hwang
Department of Engineering Mechanics, Tsinghua University, Beijing 100084,
China
Robert R. Keller
Materials Reliability Division, National Institute of Standards and Technology,
Boulder, CO 80305, USA, keller@boulder.nist.gov
Xiaodong Li
Department of Mechanical Engineering, University of South Carolina, 300 Main
Street, Columbia, SC 29208, USA, LIXIAO@engr.sc.edu
Chwee Teck Lim
Nanoscience and Nanotechnology Initiative, Division of Bioengineering,
Department of Mechanical Engineering, National University of Singapore, 9
Engineering Dr. 1, Singapore 117576, ctlim@nus.edu.sg
Bei Peng
Department of Mechanical Engineering, Northwestern University, 2145 Sheridan
Rd., Evanston, IL 60208-3111, USA, bpeng@northwestern.edu
David T. Read
Materials Reliability Division, National Institute of Standards and Technology,
Boulder, CO 80305, USA
Paul Rice
Materials Reliability Division, National Institute of Standards and Technology,
Boulder, CO 80305, USA
Mototsugu Sakai
Department of Materials Science, Toyohashi University of Technology,
Tempakucho, Toyohashi 441-8580, Japan, msakai@tutms.tut.ac.jp
Chorng Haur Sow
Nanoscience and Nanotechnology Initiative, Department of Physics, Blk S12,
Faculty of Science, National University of Singapore, 2 Science Drive 3, Singapore
117542, physowch@nus.edu.sg
Yugang Sun
Argonne National Laboratory, Argonne, IL 60439, USA

11. Contributors xiii
Eunice Phay Shing Tan
Division of Bioengineering, National University of Singapore, 9 Engineering Dr. 1,
Singapore 117576, tanphayshing@yahoo.com
Hsien-Hau Wang
Argonne National Laboratory, Argonne, IL 60439, USA
Zhi-Hui Xu
Department of Mechanical Engineering, University of South Carolina, 300 Main
Street, Columbia, SC 29208, USA
Fuqian Yang
Department of Chemical and Materials Engineering, University of Kentucky,
Lexington, KY 40506, USA, fyang0@engr.uky.edu
Sarah Zerbini
MEMS Product Division, STMicroelectronics, via Tolomeo 1. 20010 Cornaredo,
Milano, Italy
Liangchi Zhang
School of Aerospace, Mechanical and Mechatronic Engineering, The University of
Sydney, Sydney, NSW 2006, Australia, zhang@aeromech.usyd.edu.au
Tong-Yi Zhang
Department of Mechanical Engineering, Hong Kong University of Science and
Technology, Clear Water Bay, Kowloon, Hong Kong, China, mezhangt@ust.hk
Yousheng Zhang
Nanoscience and Nanotechnology Initiative, National University of Singapore,
2 Science Dr. 3, Singapore 117542, nnizys@nus.edu.sg
Yong Zhu
Department of Mechanical Engineering, Northwestern University, 2145 Sheridan
Rd., Evanston, IL 60208-3111, USA