Mems Exchange Benard

The document discusses the fabrication of high aspect ratio microelectromechanical systems (MEMS) devices for Department of Defense applications using hot embossing technology. It describes using the LIGA process to fabricate nickel micro-parts with high aspect ratios that are then micro-assembled into frames on 10mm by 10mm substrate dies. These assembled MEMS devices could have applications as safing and arming devices.