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LEDs Lighting the Way towards Smart Cities
Plessey is a technology design and manufacturing company pioneering Gan-on-silicon LED technology aimed at the solid-state lighting market, which has significant advantages over traditional methods. The company has made notable advancements in LED efficacy, integration solutions for smart lighting, and innovative packaging over the years. Plessey's global presence and strategic acquisitions support its focus on providing cutting-edge LED solutions that enhance performance and reduce costs.
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LEDs Lighting the Way towards Smart Cities
- 1. Memoori Webinar –LED’s Lighting the Way towards smart Cities Semiconductor approach to integrated lighting solutions MICHAEL LEGOFF (CEO) DR KEITH STRICKLAND (CTO) 11TH MAY 2016
- 2. 2COMPANY CONFIDENTIAL Plessey isan innovative technology design and manufacturing company • Globally recognised British brand • Innovation and technology centres in Swindon and Plymouth • Significant manufacturing facilities in Plymouth • Strong management team and experienced advisory board World class GaN-on-Silicon light emitting diode (“LED”) manufacturing technology for the growing solid state lighting (“SSL”) market • In March 2013 Plessey launched world’s first available GaN on 6-inch silicon LED products • GaN on Silicon USPs in conjunction with silicon / IC industry advanced packaging • Differentiated SSL solutions – Integrated Inteligent (i2LED) approach • Provides integration solution for smart LED lighting • Cost advantage over traditional LED manufacturing technologies • Demonstrating LED performance at >60% WPE Executive Summary
- 3. 3COMPANY CONFIDENTIAL Global Presence HQR&D centre Sales office Plymouth Swindon Philadelphia Florianópolis Shenzhen Delhi Shanghai Munich Milan
- 4. 4COMPANY CONFIDENTIAL 2016 ANDONWARDS Acquisition of CamGaN provides access to ground-breaking LED technology Market-leading sensor technology developed alongside legacy product sales Plessey doubles efficacy within the year, from 32 to 64lm/W Plessey produces world’s first commercial LEDs manufactured on 6” (150mm) diameter silicon substrates Transfer of experimental recipe onto production tool completed Plessey re-launched from the Swindon and Plymouth facilities Mainstream GaN-on-Si production Expanded product range – Power LEDs Efficacy at 130lm/W, and higher in lab 2013201220112010 2014 Advanced packaging solutions i2LED technology 14 reactors installation plans Plessey: An innovative technology company 2015
- 5. 5COMPANY CONFIDENTIAL Si HEAT GaN onSilicon – Inherent Unique Selling Points • Better Thermal Performance that provides 3 degrees of leverage • Lower LED operating temp Higher reliability • Simpler heat sink Lower system cost • Higher drive current cost down through more lumens per die area • Improved Hot-Cold factor • Focussed light emitting surface (smaller etendue) • Surface emitter V.S. volume emitter: How “spread out” the light is • Simpler and lower cost optical system • Better lm/W maintenance when scaling up die size • Better uniformity • Better process control for target wavelength • Higher wavelength binning yield Lower cost for LEDs with tight binning requests • Sharper wavelength peak for big die • Better colour control for a high power LED Si 149 W/m·K Sapphire 27 W/m·K LIGHT Si Light absorption → Efficiency loss~20% efficiency drop ~2% efficiency drop Our GaN-on-Si Typical GaN-on-Sapphire Wavelength Std Dev Consistent PL wavelength standard deviation of < 3nm, typical 2.5nm. Wafer bow is within a tight range of 0 um 10um Si Si Si mirror Simple mesa Vertical Thin Film
- 6. 6COMPANY CONFIDENTIAL n-up VLEDChip on Si Chip Scale Packaging Wafer Level Packaging GEN 1: Vertical LED GEN 2: Segmentation/ Chip Scale Optics and Advanced Packaging GEN 3: Wafer Scale Packaging &TSV Intelligent LED Monolithic Si-Integration GEN 4: Active Sub-mount • Double bottom contacts • Active bonded wafer • Addressable arrays • Zener Diode • Low Power regulation • Photodiodes• Mount on Silicon • n-Up VLED with wire bond • Two bottom contact • Wafer level phosphor dispense • TSV-Through Silicon Vias • Wafer scale LED to sub- mountHV Segmentation • VHA process • Segmented LED on chip On-Chip Diagnostics & Controls for • Temperature • Intensity • Spectrum • ESD Connectivity & Communications Micro displays Hi-Voltage (>48V) DC / AC LEDs for system level benefits in • Retrofits (space constraint) • Driver efficiency • Automotive High Density LED Arrays for • Automotive Headlamps • Intelligent LED Displays • Power Projection Sources • Cost Reduction by Scaling to 8” Si • Large Area LEDs • Surface Emission • Superior Thermal Performance • Competitive performance • No Wire Bonds (Hi Reliability) • Flat Top for Direct Optical Attach • Optimized Active Area Usage • No Far Field Wire Bond Shadow • Low Contact Resistance, • Good thermal resistance Technology Roadmap Chip Scale Optics and Reflectors • White light beam shaping • Reduced secondary optics • Size and format • System cost advantages • Greater design freedom • Spots • Hi Bays • Stadiums • On Chip white light • Collimation potential down to 10 degrees
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