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Lecture notes for engineering students for all colleges

The document provides an overview of advanced machining processes (AMPs) and their importance in modern manufacturing, specifically addressing the challenges posed by high workpiece hardness and complex geometries that conventional machining methods struggle to handle. It discusses various techniques such as electrical discharge machining, laser beam machining, and electrochemical machining, highlighting their applications in producing high precision components and miniaturized products across industries like aerospace and electronics. The document emphasizes the need for AMPs to meet evolving product requirements, ensuring better surface integrity, low tolerances, and high production rates.

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1 TA-202:MANUFACTURING PROCESSES
2 * BE KEEN OBSERVER EXAMPLES OF SOME SCIENTISTS
3 KEEN OBSERVATIONS HAD LED TO BIG INVENTIONS WHY IT FELL DOWNWARD? WHY DID IT NOT GO UP? THEORY OF GRAVITATION SIR ISSAC NEWTON
4 OBSERVING THE WAVES IN SEA WHILE GOING ABROAD WHY THE WATER OF SEA LOOKS BLUE IN COLOUR? LED TO THE INVENTION OF “RAMAN EFFECTS” NOBLE PRI ZE WINNER DR. C. V. RAMAN
5 IS IT NECESSARY FOR THE TOOL TO BE HARDER THAN WORKPIECE ? WORN OUT PULLEY BY A ROPE HOW A ROPE CAN WEAR THE PULLEY ?
6 INTRODUCTION
7 ENGINEERING MATERIALS METALS AND ALLOYS PLASTICS AND COMPOSITES CERAMICS • GETTING MORE POPULARITY • DEFINITE ADVANTAGES OVER OTHERS HOW TO MACHINE THEM ? ADVANCED MACHINING PROCESSES SOLUTION Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
8 ENGG. MATERIALS HAVING MUCH SUPERIOR PROPERTIES ULTRA HIGH STRENGTH , HARDNESS VERY HIGH TEMPTURE RESISTANCE DIFFICULT TO MACHINE BY CONVENVENTIONAL MACHINING METHODS WORK PIECE MATERIAL HARDNESS >> TOOL MATERIAL HARDNESS HOW TO SOLVE THE PROBLEM ADVANCED MACHINING PROCESSES WORKPIECE HARDNESS DOES NOT MATTER IN AMPs ? PRESENT DAY DEMAND TRENDS IN INDUSTRIES (AEROSPACE , MISSILES , AUTOMOBILES, NUCLEAR REACTORS, ETC.) Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
9  LIMITATIONS OF CONVENTIONAL MACHINING METHODS (WORKPIECE HARDNESS, SURFACE ROUGHNESS, 3-D PARTS, COMPLEX GEOMETRIES)  INCREASED WORKPIECE HARDNESS  DECREASED ECONOMIC CUTTING SPEED  LOWER PRODUCTIVITY  RAPID IMPROVEMENTS IN THE PROPERTIES OF MATERIALS (WORKPIECEHARDNESS, STRENGTH, ETC.)  METALS & NON – METALS : STAINLESS STEEL , HIGH STRENGTH TEMPERATURE RESISTANT (HSRT) SUPER ALLOYS: STELLITE, ETC.  TOOL MATERIAL HARDNESS >> WORKPIECE HARDNESS  REQUIRES MUCH SUPERIOR QUALITY OF TOOL MATERIALS WHY DO YOU NEED ADVANCED MACHINING PROCESSES (AMPs) ? Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
10 PRODUCT REQUIREMENTS  COMPLEX SHAPES  MACHINING IN INACCESSIBLE AREAS  LOW TOLERANCES (SAY, 10 µm)  BETTER SURFACE INTEGRITY (NO SURFACE DEFECTS, ETC.)  HIGH SURFACE FINISH (NANO LEVEL Ra VALUE =>nm)  MINIATURIZATION OF PRODUCTS (EXAMPLES: LANDLINE PHONE & MOBILE, OLD COMPUTERS & LAP TOP, ETC.)  HIGH MRR WHY DO YOU NEED ADVANCED MACHINING PROCESSES (AMPs) ? Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
11 HIGH PRODUCTION RATE WHILE PROCESSING DIFFICULT –TO- MACHINE MATERIALS LOW COST OF PRODUCTION PRECISION AND ULTRAPRECISION MACHINING (NANO-METER MACHINING) REQUIRES MATERIAL REMOVAL IN THE FORM OF ATOMS AND / OR MOLECULES ADVANCED MACHINING PROCESSES (AMPs) WHY DO YOU NEED ADVANCED MACHINING PROCESSES ? Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur 12 WHY DO YOU NEED ADVANCED MACHINING PROCESSES ? some examples
13 Fabrication Meso / Macro fabrication Micro fabrication Building of machines, structures, or process equipment by cutting, shaping and assembling components made from raw materials. Visible by naked eye Dimensions >= 1mm Process of fabrication of miniature structures / features of µm sizes Need microscopic equipments 999 nm <=Dimensions <= 999 µm Process of fabrication of structures that are measurable and observable. Fabrication IGNORING MESO AND NANO FABRICATION
14 MAGNETIC ABRASIVE FINISHING (MAF) ION BEAM MACHINING(IBM) ABRASIVE FLOW FINISHING (AFM) ELECTRIC DISCHARRGE MACHINING ( EDM) ABRASIVE WATER JET MACHINING (A WJM) BIOCHEMICAL MACHINING (BM) ELECTRON BEAM MACHINING (EBM ) WATER JET MACHINING (WJM) CHEMICAL MACHINING (CHM) LASER BEAM MACHINING (LBM) ULTRASONIC MACHINING (USM) ELECTROCHEMICAL MACHINING (ECM) PLASMA ARC MACHINING (PAM) ABRASIVE JET MACHINING (AJM) MECHANICAL THERMOELECTRIC MAGNETORHEOLOGICAL FINISHING (MRF) MACHINING FINISHING ELECTROCHEMICAL & CHEMICAL  CLASSIFICATION BASED ON THE KIND OF ENERGY USED : MACHANICAL, THERMOELECTRIC, ELECTROCHEMICAL & CHEMICAL, BIOCHEMICAL Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
15 MACHINING OF COMPLEX SHAPED WORKPIECES? ELECTROCHEMICAL MACHINING HOLE NORMAL TO THE WALL Turbine Blade with cooling Holes TAPER 3-D CUTTING USING TRAVELING WIRE- EDM FEMALE MALE PRECISION WIRE EDM Contoured Hole Drilled In Inconel Using ECM Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
16 HOLE=0.09 mmφ HOLES DENSITY = 4000/cm2 WORKPIECE- S.S.; THICK = 0.2 MM; TIME = 10 µS/HOLE HOLE φ =0.006 mm (6 µm); HOLES DENSITY = 200,000 / cm2 ; THICKNESS = 0.12 mm; TIME= 2µs / HOLE PATTERN OF HOLES DRILLED BY EBM PART OF A HELICOPTER TURBINE “ HOLES DRILLED BY EBM” AFF MEDIA ACTS AS A SELF-DEFORMABLE STONE Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
17  PERFORMANCE IS INDEPENDENT OF STRENGTH BARRIER.  PERFORMANCE DEPENDS ON THERMAL, ELECTRICAL, MAGNETIC OR / AND CHEMICAL PROPERTIES OF WORKPIECE MATERIALS.  USE DIFFERENT KINDS OF ENERGY IN DIRECT FORM.  IN GENERAL, LOW MRR BUT BETTER QUALITY PRODUCTS.  COMPARATIVELY HIGH INITIAL INVESTEMENT COST OF MACHINE TOOLS AND HIGH – OPERATING COST . SOME IMPORTANT CHARACTERISTICS OF AMPs & MACHINE TOOLS Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
18 ADVANCED MACHINING PROCESSES Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur CAN WATER CUT THE METALS ? YES. BUT HOW?
19 WATER JET MACHINING (WJM), ABRASIVE WATER JET MACHINING (AWJM) , ABRASIVE JET MACHINING (AJM) Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur HOW DOES IT WORK? K.E. of WATER AND / OR ABRASIVE PARTICLES MAKES IT TO HAPPEN. VELOCITY OF THE ABRASIVE WATER JET  AS HIGH AS 900 m/s. +
20 ELETRIC DISCHARGE MACHINING Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur WORN OUT MARKS LAZERANKO
21 LASER BEAM MACHINING (LBM) Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
22 LASER BEAM MACHINING (LBM) Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
23 ULTRASONIC MACHINING Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
24 PLASMA ARC MACHINING (PAM) Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
25 OVERVIEW OF ADVANCED MACHINING PROCESSES
26 ELECTROCHEMICAL MACHINING (ECM)
27 ELECTRICHEMICAL MACHINING (ECM) ECM PROCESS IS ALSO KNOWN AS A CONTACTLESS ELECTROCHEMICAL FORMING PROCESS ELECTROCHEMICAL ENERGY DETACHES METAL FROM ANODE ATOM BY ATOM
28 TYPES OF ELECTROLYTES USED IN ECM ACIDIC ALKALINE NEUTRAL 2 H2 O + 2eˉ → H2 ↑ + 2OHˉˉ 2Fe – 2eˉ → 2Fe++ Fe++ + 2OHˉˉ → Fe(OH)2 2Fe + 4 H2 O → Fe(OH)3 + H2 ↑ + ½O2 ↑ Fe(OH)2 , Fe(OH)3 → INSOLUBLE IN WATER POSITIVE IONS CONVERT AS HYDROXIDES (FERROUS OR FERRIC HYDROXIDE IN CASE OF IRON AS ANODE/ WORK MATERIAL) IEG < 1 mm, VOLTAGE  8-20 ELECTROCHEMICAL REACTIONS NO ELECTROLYTE IS BEING CONSUMED IN THE PROCESS
FARADAY’ S LAWS OF ELECTROLYSIS m α itE MASS OF DISSOLVED METAL GRAM CHEMICAL EQUIVALENT = A / Z CURENT TIME AATOMIC MASS OF ANODE, Z  VALENCY OF DISSOLUTION OF ANODE 29 WORKING PRINCIPLE OF ECM
MATERIAL REMOVAL (m) IN ECM FOLLOWS FARADAY’S LAWS OF ELECTROLYSIS: MATERIAL RAMOVAL RATE (MRR) CAN BE OBTAINED AS F ItE m = . m IE m t F • = = MATERIAL REMOVAL IN ECM 30 Where, ‘m’ is amount of material removed in grams, ‘I’ is current flowing through the IEG in Amperes, ‘t’ Is time of current flow (or ECM), ‘E’ Is gram chemical equivalent of anode material, ‘F’ is Faraday’s constant (Coulombs or A.s) or constant of proportionality . and is material removal rate in g/s. . m • …….(1) …….(1a)
WHERE, = DENSITY OF ANODE, = VOLUME OF MATERIAL REMOVED FROM THE ANODE IN TIME ‘t’, = X- SECTIONAL AREA ON THE ANODE FROM WHICH MATERIAL IS BEING REMOVED IN TIME ‘t’, IS THE THICKNNESS OF MATERIAL REMOVED IN TIME ‘t’. ∆V IS OVER POTENTIAL, k= ELECTROLYTE’S ELECTRICAL CONDUCTIVITY a ρ a V a A a y MATERIAL REMOVAL IN ECM 31 ( ) ( ) a a a a a A y v IE t t F ρ ρ = = Prof. V.K.Jain, Mech. Engg. Deptt., I.I.T. Kanpur MRR CAN BE OBTAINED AS
32 ( ) ( ) a l a a y IE MRR t F A ρ ∴ = = l a JE MRR F ρ = a l a a kA V V E MRR A y Fρ    − ∆ =         MATERIAL REMOVAL IN ECM FROM ABOVE EQUATION, WE CAN WRITE ABOVE EQUATION CAN BE WRITTEN AS …….(2) Prof. V.K.Jain, Mech. Engg. Deptt., I.I.T. Kanpur (J = CURRENT DENSITY = I/Aa) J=I/Aa=V/R=V/(ρl/A) ρ =(1/k) J=((V- ∆V)/A) (kA/y) ρ=Resistance Anode density
33 THERMAL MICROMACHINING PROCESSES ELECTRIC DISCHARGE MICROMACHINIG BEAM MICROMACHINING 1. LASER BEAM MICROMACHINING 2. ELECTRON BEAM MICROMACHINING 3.ION BEAM MICROMACHINING (NOT A THERMAL PROCESS)
34 EBM IBM LBM 34 SHORT PULSE LASER MACHINING BEAM TECHNOLOGY CRATER CRATER 100 M ICRONS IEG = A FEW HUNDRED µm Dr. V.K.Jain, I.I.T. Kanpur;vkjain@iitk.ac.in
35 ELECTRIC DISCHARGE MACHINING (EDM)
36 ELECTRIC DISCHARGE MACHINING •SPARKS CREATED DELIBERATELY • HEAT IN A LOCALIZED AREA MELTING AND / OR VAPORIZATION (EDM) CRATER CRATER 100 M ICRONS IEG = A FEW HUNDRED µm
37 ELECTRIC DISCHARGE MACHINING : HOW SPARKING TAKES PLACE? PULSED D.C. SOURCE Asperity Ion Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur PULSED D.C. SOURCE
 BREAK DOWN OF DIELECTRIC (AT PRE DETERMINED ELECTRIC FIELD) OF DIELECTRIC (USUALLY KEROSENE OR WATER) TAKES PLACE BETWEEN TWO ELECTRODES (TOOL & WORKPIECE).  DIELECTRIC IONIZATION  MOLECULES (ELECTRONS FROM CATHODE COLLIDE THE MOLECULES ) SPLIT INTO IONS, AND ELECTRONS.  IONS  MOVE TOWARDS CATHODE AND ELECTRONS MOVE TOWARDS  ANODE • ELECTRONS HIT THE CATHODE AND IONS HIT ANODE • DUE TO THEIR K.E., THEY PRODUCE HEAT ON CATHODE (LESS) AND ANODE (MORE) • THIS HEAT MELTS AND EVEN VAPORIZES A SMALL PART OF CATHODE AND ANODE. 38 EDM: WORKING PRINCIPLE Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
39 ELECTRIC DISCHARGE MACHINING (EDM) : MACHINE ELEMENTS DC Pulse Generator IEG Ionized fluid Servo system Control gap Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur REPLICA OF THE TOOL  WORKPIECE
40 ELECTRIC DISCHARGE MACHINING (EDM) Ignition delay 1 µs POLARITY IN EDM VOLTAGE / CURRENT PULSES IN EDM (SOURCE: Advanced Machining Processes by V.K.Jain, Allied Publishers, New Delhi)
41 ELECTRON BEAM MACHINING (EBM) Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
42 FOCUSSED ION BEAM MACHNING (IBM)  SPUTTERING OFF: KNOCKING OUT ATOMS FROM THE WORK-PIECE SURFACE BY THE KINETIC MOMENTUM TRANSFER FROM INCIDENT ION TO THE TARGET ATOMS  REMOVAL OF ATOMS WILL OCCUR WHEN THE ACTUAL ENERGY TRANSFERRED EXCEEDS THE USUAL BINDING ENERGY.  AT SUFFICIENTLY HIGH ENERGY, THE CASCADING EVENTS WILL PENETRATE MORE DEEPLY INTO THE SOLID, SEVERAL ATOMS OR MOLECULES WILL BE EJECTED OUT AND THE BOMBARDING ION WILL BECOME IMPLANTED DEEP WITHIN THE MATERIAL. Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur FIG. SCHEMATIC ILLUSTRATION
43 MECHANICAL MICROMACHINING PROCESSES ULTRASONIC MICROMACHINIG ABRASIVE JET MICROMACHINING 1. WATERJET MICROMACHINING 2. ABRASIVE WATER JET MICROMACHINING
44 PRINCIPLE OF MECHANICAL MICROMACHINING MECHANISM Mechanism of material removal in brittle material Mechanism of material removal in ductile material AWJM, AJM, USM FORCES ACTING ON EACH PARTICLE AND PARTICLE SIZE WILL DEC IDE THE SCALE OF MATERIAL REMOVED : MACRO, MICRO, NANO ABRASIVE JET MACHINING ABRASIVE WATR JET MACHINING ULTRASONIC MACHINING Dr. V.K.Jain, I.I.T. Kanpur;vkjain@iitk.ac.in
45 ABRASIVE WATER JET MICRO-MACHINING (AWJM) 1. Low feed rate 2. Medium feed rate 3. High feed rate
46 APPLICATIONS OF ABRASIVE WATER JET CUTTING (AWJC) Granite cutting (COURTESY : IITM CHENNAI)
47 Material Removal Processes Micro/nano machining Micro/nano finishing Traditional machining processes Advanced machining processes Traditional finishing processes Advanced finishing processes
48 Micro-manufacturing A set of processes used to fabricate features, components, or systems with dimensions most conveniently described in micrometers
49 MICROMACHINING : AN OVERVIEW
50 Why miniaturization? Minimizing energy and materials use in manufacturing Reduction of power budget Faster devices Increased selectivity and sensitivity Improved accuracy and reliability Cost / performance advantages Integration with electronics, simplifying systems
51
Electro chemical spark deposition Material deposition Material Removal Forming / shaping Joining Casting Electro discharge deposition LIGA Chemical vapor deposition Rapid prototype / rapid tooling Physical vapor deposition Rolling Forging Extrusion & drawing Sheet metal Welding Brazing Soldering Advanced material removal processes Traditional material removal processes Methods of Micro-manufacturing MICROFABRICATION IS GOING TO WITNESS AN EXCELLENCE IN R & D AT A REMARKABLE RATE
µ-EBM µ-LBM µ-AJM ECMM µ-EDM µ-turning µ-milling µ-drilling Traditional µ-MACHINING METHODS Mechanical Thermal Chemical Advanced µ-USM AFM, MAF, M- RAFF, MPF µ-AWJM µ-grinding µ-PAM PCMM HYBRID µ-ECSM µ-ECG µ-EDG ELID, etc
54 MICRO MACHINING 54 Micro Machining Removal of material at micro level 1.Macro components but material removal is at micro/nano level 2.Micro/nano components and material removal is at micro/nano level (Ex. MEMS, NEMS) Unfortunately , the present day notion is Machining of highly miniature components with miniature features. Literally it should NOT be so LEG OF A HOUSE FLY SIZE : 2mm x 2mm MORE CORRECT DEFINITION IS material removal is at micro/nano level WITH NO CONSTRAINT ON THE SIZE OF THE COMPONENT
55 55 LASER-CUT STENTLIKE PATTERN IN MINIATURE STAINLESS- STEEL TUBE WITH 1.25-mm OD. LASER-DRILLED HOLE (DIA. 15 µm) PATTERN IN POLYURETHANE TUBE SOME MICROMACHINED PARTS
56 ELECTRO DISCHARGE MICROMACHINING (EDMM)
57 Holes as small as 6.5 microns in diameter and an aspect ratio of 7.5 30-micron shafts and 50-micron holes produced by micro-EDM. EXAMPLES OF EDMM
58 58 MICROFLUIDICS MIXER MICRO GEARS(DIA 0.52 mm) 0.52 mm DIA EXTRUSION DIE LADDER WITH 100 µm GAP BETWEEN TEETH PIN OVER MOULDING JIG (655 µ HOLES) EXAMPLES OF EDMM
59 LASER BEAM MICROMACHINING (LBMM)
60 60 • LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION. • LIGHT ENERGY OF A PARTICULAR FREQUENCY CAN BE USED TO STIMULATE THE ELECTRONS IN AN ATOM TO EMIT ADDITIONAL LIGHT WITH EXACTLY THE SAME CHARACTERISTICS AS THE ORIGINAL STIMULATING LIGHT SOURCE. • PHOTON ENERGY IS PROPORTIONAL TO FREQUENCY BUT INVERSELY PROPORTIONAL TO WAVELENGTH. • THE PHOTON STIMULATES THE ATOM, CAUSING IT TO EMIT AN ADDITIONAL PHOTON WITH IDENTICAL CHARACTERISTICS TO THE STIMULATING PHOTON. BASIC PRINCIPLES OF LASER
61 61 • MONOCHROMATIC – SINGLE WAVELENGTH. • COHERENT – SAME PHASE RELATIONSHIP. • DIRECTIONAL – LOW DIVERGENCE, BEAM SPREADS VERY LITTLE. • INTENSE – HIGH DENSITY OF USABLE PHOTONS. PROPERTIES OF LASER BEAM TWO TYPES OF LASERS: CONTINUOUS WAVE AND PULSED LASERS LONG PULSED LASES AND SHORT PULSED LASERS
TIME SCALES: 1*10-15 second Femto second 1*10-12 second Pico second 1*10-9 second Nano second 1*10-6 second Micro second 1*10-3 second Millisecond TYPES OF LASERS 62
63 63 LONG PULSE LASER MACHINING DEMERITS OF LONG PULSE LASER ANIMATION
64 64 SHORT PULSE LASER MACHINING MERITS OF SHORT PULSE LASER
65 65 MICRO CUTTING IN A TUNGSTEN PIN USING 511nm ND LASER MICRO FLUIDIC DEVICE IN SILICON SHOWING LASER DRILLED VIA HOLE AND CONNECTING CHANNEL APPLICATIONS OF LBM
66 LASERS AND THEIR CONFIGURATION MICRO MACHINED LETTERS ON A SINGLE HUMAN HAIR NOTE THE CLARITY OF THE LETTERS IN THE CLOSE-UP VIEW
67 ELECTRON BEAM MICROMACHINING (EBMM)
68 68 • IT WORKS IN MUCH THE SAME WAY AS A CATHODE RAY TUBE IN A TELEVISION. CATHODE SECTION(GENERATES BEAM) ANODE SECTION(ACCELERATES THE BEAM) LENS SYSTEM CONVERGES AND DEFLECTS THE BEAM TO THE DESIRED POSITION ELECTRON-BEAM MACHINING PROCESS BASICS OF EBM
69 69 ELECTRON-BEAM IN A VACUUM ELECTRON BEAM IN AMBIENT AIR WHY VACCUM IS REQUIRED?
70 70 HOLE=0.09 mmφ HOLES DENSITY = 4000/cm2 WORKPIECE- S.S. THICK = 0.2 mm TIME = 10 µS/HOLE HOLE φ =0.006 mm (6 µm) HOLES DENSITY = 200,000 / cm2 THICKNESS = 0.12 mm TIME= 2µs / HOLE PATTERN OF HOLES DRILLED BY EBM
71 ELECTRO CHEMICAL MICROMACHINING (ECMM)
72 ELECTRO CHEMICAL MACHINING (ECM) Fe + 2H2O Fe(OH)2 + H2 4Fe(OH)2 + 2H2O + O2 4Fe(OH)3
73 73 PRODUCTION OF HIGH ACCURACY HOLES MICRO-HOLES PRODUCED ON A Ti6Al4V CYLINDER USING JET-EMM APPLICATIONS OF ECMM CU STRUCTURE (SMALL PRISM, 5 µm BY 10 µm BY 12 µm) MACHINED INTO THE CU SHEET OF AN ELECTRONIC CIRCUIT BOARD 3D MICRO-MACHINING
74 74 LONG-RANGE ACCURACY AND REPRODUCIBILITY OF 30 µm CAVITIES SMOOTH SURFACE AND SHARP BORDERS THAT ARE ACHIEVED UNDER OPTIMIZED DISSOLUTION CONDITIONS Titanium surface microstructure by through-mask EMM APPLICATIONS OF ECMM
75 ELECTRO CHEMICAL DEBURRING (ECD) • Adaptation of ECM to remove burrs or round sharp corners on holes in metal parts produced by conventional through-hole drilling.
76 ION BEAM MICROMACHINING (IBMM)
77 MECHANISM OF ION BEAM MACHINING  SPUTTERING OFF: KNOCKING OUT ATOMS FROM THE WORK-PIECE SURFACE BY THE KINETIC MOMENTUM TRANSFER FROM INCIDENT ION TO THE TARGET ATOMS  REMOVAL OF ATOMS WILL OCCUR WHEN THE ACTUAL ENERGY TRANSFERRED EXCEEDS THE USUAL BINDING ENERGY. FIG.SCHEMATIC ILLUSTRATION OF THE MECHANISM OF MATERIAL REMOVAL IN IBM  AT SUFFICIENTLY HIGH ENERGY, THE CASCADING EVENTS WILL PENETRATE MORE DEEPLY INTO THE SOLID, SEVERAL ATOMS OR MOLECULES WILL BE EJECTED OUT AND THE BOMBARDING ION WILL BECOME IMPLANTED DEEP WITHIN THE MATERIAL.
Coil 700 nm pitch, 80 nm line width, diamond like amorphous carbon, Fabricated by FIB induced deposition Shinji Matsui et al, J. Vac. Sci. Technol. B 18(2000) 3181 Micro wine glass with 2.75 µm external diameter and 12 µm height. (a) Radial DLC free-space-wiring grown into eight directions from the center. (b) Radial DLC free- space-wiring grown into 16 directions from the center. T. Morita et al, J. Vac. Sci. Technol. B 21 (2003) 78
79 TYPICAL MATERIAL REMOVAL RATE IN ION BEAM MACHINING TABLE1: REMOVAL RATES BY IBM (SPENCER AND SCHMIDIT,1972 [1]) DATA : ARGON ION BEAM 60 TO 700 FROM NORMAL PRESSURE = 3X10-4 TORR VOLTAGE = 6 KV CURRENT = 100 µA CURRENT DENSITY = 1 MACM-2 OVER 1 CM DIAMETER AREA MATERIAL REMOVAL (MILLING) RATE, (µM HR-1) QUARTZ 2 GARNET 1 CERAMIC 1 GLASS 1 GOLD 2 SILVER 3 PHOTO RESIST MATERIAL (KTFR) 1 PERMALLOY 1 DIAMOND 1
80 NANOFINISHING PROCESSES: AN OVERVIEW
81 Micro / nano finishing Traditional Advanced Grinding Lapping Honing ELID MRAFF CMP MRF MAF AFM MFP SHAPE AND SIZE CONSTRAINTS WITH EACH OF THESE TRADITIONAL FINISHING PROCESSES CMMRF
82 MAF AFM MRAFF MRF CMP MFP Workpiece Ft Fn Media Abrasive S N Spindle Ceramic balls Drive Shaft Al Base Steel yoke Magnetic Fluid & Abrasives Float Magnets S N S N N S N S N S Electromagnet pole Motion N S Workpiece surface Workpiece fixture CIP Chain Ft Fn N S Magnetic lines of force FLEXIBLE MAGNETIC ABRASIVE BRUSH Workpiece Fmn Fc Abrasive Workpiece Chip
83 OVERVIEW OF ADVANCED ABRASIVE FINISHING PROCESSES
84 WHY ADVANCED ABRASIVE FINISHING PROCESSES? Complex Geometrical Shapes. Labor Intensive Nature of Traditional Finishing Operations. Difficulties in Controlling Abrading Forces. Nano-meter (10-9 m) Surface Finish Requirements. 84
85 ADVANCED ABRASIVE FINISHING PROCESSES MAF Magnetic Abrasive Finishing AFF Abrasive Flow Finishing MRAFF Magnetorheological Abrasive Flow Finishing MRF Magneto Rheological Finishing CMP Chemo Mechanical Polishing MFP Magnetic Float Polishing 85 IN ALL THESE PROCESSES NORMAL FORCE IS RESPONSIBLE FOR PENETRATION OF ABRASIVE INTO WORKPIECE AND SHEAR FORCE TO REMOVE THE MATERIAL IN THE FORM OF MICROCHIP
86
87 WORKING GAP  FILLED WITH MAPs  FORMS FMAB MULTIPOINT CUTTING TOOL Feed Magnetic equipotential lines Magnetic lines of force N S MAPs formed FMAB Workpiece Finished Surface Workpiece S S N N Rotating magnetic pole Flexible Magnetic Abrasive Brush Fmn Fc Abrasive Workpiece Micro Chip SCHEMATIC VIEW OF MAF WORKING PRINCIPLE SALIENT FEATURES Ra = AS GOOD AS 8 nm
88 EXPERIMENTAL SET-UP DESIGNED AND FABRICATED AT IITK MAGNETIC ABRASIVE FINISHING (MAF) (DST SPONSORED PROJECT) FERROMAGNETIC WORKPIECE ROUND ELECTROMAGNET FMAB DIGITAL PHOTOGRAPH OF FLEXIBLE MAGNETIC ABRASIVE BRUSH (FMAB)
89 Before MAF After MAF After MAF I=0.75 A, G=600 N=9 I=0.75 A, G =800 N= 9 Surface Profilometer Results DC-MAF After MAF Before MAF I=0.88 A, G= 500 N=11 (No. of cycles) BEST SURFACE ROUGHNESS ACHIEVED WAS 40nm EXPERIMENTAL RESULTS OF MAF
90 Drilled hole edge (a) before, (b) after deburring (a) (b) MICRO DEBURRING APPLICATION OF MAF
91 ABRASIVE FLOW FINISHING (AFF)
92 ABRASIVE FLOW MACHINING (AFM) • Two vertically opposed cylinders extrude abrasive laden medium back & forth through passage formed by the workpiece & tooling • Medium : Visco-elastic Polymer with special rheological properties Fine Abrasive Particles 92 Deburring of turbine impeller Abrasive Flow Machining (AFM) at IIT – K (DST SPONSORED PROJECT)
Silly Putty (viscoelastic) + SiC (abrasive) Workpiece held in fixture Thermostat for temp control Piston Fig: Abrasive flow finishing setup for knee joint finishing
94 VERSATILITY – FINISH COMPLEX SURFACES OF VARIOUS SIZES.  SURFACE FINISH - 0.1 µm to 0.05 µm Ra. LIMITATIONS:  VISCOELASTIC POLYMERIC MEDIUM – COSTLY AND LACK OF AVAILABILITY.  MEDIUM RHEOLOGICAL PROPERTIES – VARY IN UNCONTROLLED MANNER DURING PROCESS.  LACK OF DETERMINISM. FORCE : 0.0009N -- 0.002N Per Particle DEPTH OF PENETRATION : 5nm -- 30nm KEY FEATURES OF AFM
95 AFM MEDIAACTS AS A SELF-DEFORMABLE STONE
96 MAGNETORHEOLOGICAL FINISHING (MRF)
 CI particles form a chain-like columnar structure, with the application of magnetic field and they are aligned along the lines of magnetic force.  The magnetic force between iron particles provides bonding strength to it. MRF- Mechanism of material removal  When these chains have relative motion with respect to the workpiece surface the asperities on the surface are abraded due to shearing / plastic deformation at the tips. Source: www. qedmrf.com
98 98 • Fluid is extruded onto a rotating wheel in a thin ribbon that contacts the optical / WORKPIECE surface. • Electromagnet below the polishing wheel exerts a strong local Magnetic field gradient. • Precisely controlled zone of magnetized fluid becomes the Polishing tool. MAGNETORHEOLOGICAL FINISHING (MRF) MR-fluids are suspension of ferromagnetic particles in water/oil that reversibly stiffens under the influence of magnetic field. Stiffness of the fluid α Magnetic Field Strength.
(1- CNC milling M/c head, 2- MR finishing tool, 3- MR polishing fluid, 4- fixture for knee joint implant (Ti6Al4V), 5- knee joint implant) Apparatus and tooling for freeform surface 99
100 Finishing of freeform surface Components of knee joint implants (Courtesy: Aesculap Implant Systems, LLC, www.soactivesofast.com).  Knee joint implants consist of metal femoral and tibial components with a plastic polyethylene insert sandwiched between to restore joint function.  Surface roughness of knee joint implant has a significant effect on the force at the connection and reaction of tissues in the joint area and behaviour of germs in bone tissue (Mathia et al., 2011).  Wear by abrasion is one of the main causes for failures of knee joints because over time, the continuous movement between the metal and plastic can cause the polyethylene to crack, pit and delaminate.  It may also cause microscopic particles to break off which in turn attack the body’s immune system.
101 (BY B. TECH. STUDENTS PROJECT) MRF EXPERIEMTNAL SETUP AT IIT - K WORKPIECE / LENS MR FLUID
102 40 mins 50 mins 30 mins 20 mins Before finishing 53 nm (RMS) 11 nm (RMS) EXPERIMENTAL RESULTS OF MRF
103 THANK YOU
EBM IBM LBM Ref.: Cmxr lasers industry, www.cmxr.com/industrial/handbook/ SHORT PULSE LASER MACHINING
105 MECHANISM OF MATERIAL REMOVAL IN MECHANICAL MICROMACHINING Mechanism of material removal in brittle material Mechanism of material removal in ductile material AWJM, AJM, USM FORCES ACTING ON EACH PARTICLE AND PARTICLE SIZE WILL DEC IDE THE SCALE OF MATERIAL REMOVED : MACRO, MICRO, NANO ABRASIVE JET MACHINING ABRASIVE WATR JET MACHINING ULTRASONIC MACHINING
106 MAF AFM MRAFF MRF CMP MFP Workpiece Ft Fn Media Abrasive S N Spindle Ceramic balls Drive Shaft Al Base Steel yoke Magnetic Fluid & Abrasives Float Magnets S N S N N S N S N S N S Magnetic lines of force FLEXIBLE MAGNETIC ABRASIVE BRUSH Workpiece Fmn Fc Abrasive Workpiece Chip ABRASIVE Dr. V.K.Jain, I.I.T. Kanpur;vkjain@iitk.ac.in
107 ADVANCED MACHINING PROCESSES Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
108 Questions bank for “introduction to AMPs” Q.1 Name the important factors that should be considered during the selection of an Advanced Machining Process for a given job. Q.2 Classify the different types of Advanced Machining Processes based on different criteria. Q.3 What do you understand by the term “Micromachining”? Classify the different types of micromachining methods. Also write down the ranges of macro, meso, micro, and Nano machining. Q.4 What do you understand by “hybrid process”? List out the names of hybrid processes and the advantages of a hybrid process over its constituent processes. Q.5 Classify the advanced machining processes based on electrical properties of materials. Q.6 what is the mechanism of material removal in Laser beam machining? Q.7 Differentiate between chemical and electrochemical machining processes. Q.8 Write the element of EBM. Q.9 what do you understand by a finishing process? Q.10 what are the constraints that limit the performance of different kinds of AMPs Q.11 what do you understand by the word “unconventional“ in unconventional machining processes ? Is it justified to use this word in the context of the present day medium and large scale engineering industries? Q.12 Classify the advanced machining processes on the basis of type of the energy employed. Q.13 What are the advanced machining processes which can be used for magnetic material? QUESTIONS BANK Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
109 109 • IN EDM MATERIAL IS REMOVED BY THE THERMAL EROSIVE ACTION OF ELECTRICAL DISCHARGES (SPARKS) PROVIDED BY THE OF A PULSE GENERATOR. THE SAME PRINCIPLE OF EDM IS APPLIED TO REMOVE MTERIAL AT MICRON LEVEL FOR MICROMACHINING. IN MICRO-EDM, THE KEY IS TO LIMIT THE ENERGY IN THE DISCHARGE (SPARK) BASICS OF EDMM
110 110 PROPERTY VALUE MECHANISM OF MATERIAL REMOVAL MELTING, VAPORIZATION MEDIUM VACUUM TOOL BEAM OF ELECTRON MOVING AT VERY HIGH SPEED MAX. MRR 10 mm3/min (MAY BE IN SPECIAL CONDITIONS) SPECIFIC POWER CONSUMPTION 450 W/mm3-min CRITICAL PARAMETERS ACCELERATING VOLTAGE, BEAM CURRENT, BEAM DIA., WORK SPEED, MELTING TEMPERATURE MATERIALS APPLICATION ALL MATERIALS (CONDUCTIN & NON-CONDUCTING BOTH) SHAPE APPLICATION DRILLING FINE HOLES, CUTTING CONTOURS IN SHEETS, CUTTING NARROW SLOTS LIMITATIONS VERY HIGH SPECIFIC ENERGY CONSUMPTION, NECESSITY OF VACUUM, EXPENSIVE MACHINE PROCESS CHARACTERSTICS
111 111 E-BEAM WELDING SUS –>> SULPHUR STEEL
112 Micro / nano finishing traditional Advanced Grinding Lapping Honing ELID MRAFF CMP MRF MAF AFM MFP

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Lecture notes for engineering students for all colleges

  • 1.
  • 2.
    2 * BE KEENOBSERVER EXAMPLES OF SOME SCIENTISTS
  • 3.
    3 KEEN OBSERVATIONS HADLED TO BIG INVENTIONS WHY IT FELL DOWNWARD? WHY DID IT NOT GO UP? THEORY OF GRAVITATION SIR ISSAC NEWTON
  • 4.
    4 OBSERVING THE WAVESIN SEA WHILE GOING ABROAD WHY THE WATER OF SEA LOOKS BLUE IN COLOUR? LED TO THE INVENTION OF “RAMAN EFFECTS” NOBLE PRI ZE WINNER DR. C. V. RAMAN
  • 5.
    5 IS IT NECESSARYFOR THE TOOL TO BE HARDER THAN WORKPIECE ? WORN OUT PULLEY BY A ROPE HOW A ROPE CAN WEAR THE PULLEY ?
  • 6.
  • 7.
    7 ENGINEERING MATERIALS METALS ANDALLOYS PLASTICS AND COMPOSITES CERAMICS • GETTING MORE POPULARITY • DEFINITE ADVANTAGES OVER OTHERS HOW TO MACHINE THEM ? ADVANCED MACHINING PROCESSES SOLUTION Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
  • 8.
    8 ENGG. MATERIALS HAVINGMUCH SUPERIOR PROPERTIES ULTRA HIGH STRENGTH , HARDNESS VERY HIGH TEMPTURE RESISTANCE DIFFICULT TO MACHINE BY CONVENVENTIONAL MACHINING METHODS WORK PIECE MATERIAL HARDNESS >> TOOL MATERIAL HARDNESS HOW TO SOLVE THE PROBLEM ADVANCED MACHINING PROCESSES WORKPIECE HARDNESS DOES NOT MATTER IN AMPs ? PRESENT DAY DEMAND TRENDS IN INDUSTRIES (AEROSPACE , MISSILES , AUTOMOBILES, NUCLEAR REACTORS, ETC.) Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
  • 9.
    9  LIMITATIONS OFCONVENTIONAL MACHINING METHODS (WORKPIECE HARDNESS, SURFACE ROUGHNESS, 3-D PARTS, COMPLEX GEOMETRIES)  INCREASED WORKPIECE HARDNESS  DECREASED ECONOMIC CUTTING SPEED  LOWER PRODUCTIVITY  RAPID IMPROVEMENTS IN THE PROPERTIES OF MATERIALS (WORKPIECEHARDNESS, STRENGTH, ETC.)  METALS & NON – METALS : STAINLESS STEEL , HIGH STRENGTH TEMPERATURE RESISTANT (HSRT) SUPER ALLOYS: STELLITE, ETC.  TOOL MATERIAL HARDNESS >> WORKPIECE HARDNESS  REQUIRES MUCH SUPERIOR QUALITY OF TOOL MATERIALS WHY DO YOU NEED ADVANCED MACHINING PROCESSES (AMPs) ? Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
  • 10.
    10 PRODUCT REQUIREMENTS  COMPLEXSHAPES  MACHINING IN INACCESSIBLE AREAS  LOW TOLERANCES (SAY, 10 µm)  BETTER SURFACE INTEGRITY (NO SURFACE DEFECTS, ETC.)  HIGH SURFACE FINISH (NANO LEVEL Ra VALUE =>nm)  MINIATURIZATION OF PRODUCTS (EXAMPLES: LANDLINE PHONE & MOBILE, OLD COMPUTERS & LAP TOP, ETC.)  HIGH MRR WHY DO YOU NEED ADVANCED MACHINING PROCESSES (AMPs) ? Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
  • 11.
    11 HIGH PRODUCTION RATEWHILE PROCESSING DIFFICULT –TO- MACHINE MATERIALS LOW COST OF PRODUCTION PRECISION AND ULTRAPRECISION MACHINING (NANO-METER MACHINING) REQUIRES MATERIAL REMOVAL IN THE FORM OF ATOMS AND / OR MOLECULES ADVANCED MACHINING PROCESSES (AMPs) WHY DO YOU NEED ADVANCED MACHINING PROCESSES ? Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
  • 12.
    Prof. V.K.Jain, MechanicalEngineering Department, I.I.T. Kanpur 12 WHY DO YOU NEED ADVANCED MACHINING PROCESSES ? some examples
  • 13.
    13 Fabrication Meso / Macro fabricationMicro fabrication Building of machines, structures, or process equipment by cutting, shaping and assembling components made from raw materials. Visible by naked eye Dimensions >= 1mm Process of fabrication of miniature structures / features of µm sizes Need microscopic equipments 999 nm <=Dimensions <= 999 µm Process of fabrication of structures that are measurable and observable. Fabrication IGNORING MESO AND NANO FABRICATION
  • 14.
    14 MAGNETIC ABRASIVE FINISHING (MAF) IONBEAM MACHINING(IBM) ABRASIVE FLOW FINISHING (AFM) ELECTRIC DISCHARRGE MACHINING ( EDM) ABRASIVE WATER JET MACHINING (A WJM) BIOCHEMICAL MACHINING (BM) ELECTRON BEAM MACHINING (EBM ) WATER JET MACHINING (WJM) CHEMICAL MACHINING (CHM) LASER BEAM MACHINING (LBM) ULTRASONIC MACHINING (USM) ELECTROCHEMICAL MACHINING (ECM) PLASMA ARC MACHINING (PAM) ABRASIVE JET MACHINING (AJM) MECHANICAL THERMOELECTRIC MAGNETORHEOLOGICAL FINISHING (MRF) MACHINING FINISHING ELECTROCHEMICAL & CHEMICAL  CLASSIFICATION BASED ON THE KIND OF ENERGY USED : MACHANICAL, THERMOELECTRIC, ELECTROCHEMICAL & CHEMICAL, BIOCHEMICAL Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
  • 15.
    15 MACHINING OF COMPLEXSHAPED WORKPIECES? ELECTROCHEMICAL MACHINING HOLE NORMAL TO THE WALL Turbine Blade with cooling Holes TAPER 3-D CUTTING USING TRAVELING WIRE- EDM FEMALE MALE PRECISION WIRE EDM Contoured Hole Drilled In Inconel Using ECM Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
  • 16.
    16 HOLE=0.09 mmφ HOLESDENSITY = 4000/cm2 WORKPIECE- S.S.; THICK = 0.2 MM; TIME = 10 µS/HOLE HOLE φ =0.006 mm (6 µm); HOLES DENSITY = 200,000 / cm2 ; THICKNESS = 0.12 mm; TIME= 2µs / HOLE PATTERN OF HOLES DRILLED BY EBM PART OF A HELICOPTER TURBINE “ HOLES DRILLED BY EBM” AFF MEDIA ACTS AS A SELF-DEFORMABLE STONE Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
  • 17.
    17  PERFORMANCE ISINDEPENDENT OF STRENGTH BARRIER.  PERFORMANCE DEPENDS ON THERMAL, ELECTRICAL, MAGNETIC OR / AND CHEMICAL PROPERTIES OF WORKPIECE MATERIALS.  USE DIFFERENT KINDS OF ENERGY IN DIRECT FORM.  IN GENERAL, LOW MRR BUT BETTER QUALITY PRODUCTS.  COMPARATIVELY HIGH INITIAL INVESTEMENT COST OF MACHINE TOOLS AND HIGH – OPERATING COST . SOME IMPORTANT CHARACTERISTICS OF AMPs & MACHINE TOOLS Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
  • 18.
    18 ADVANCED MACHINING PROCESSES Prof.V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur CAN WATER CUT THE METALS ? YES. BUT HOW?
  • 19.
    19 WATER JET MACHINING(WJM), ABRASIVE WATER JET MACHINING (AWJM) , ABRASIVE JET MACHINING (AJM) Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur HOW DOES IT WORK? K.E. of WATER AND / OR ABRASIVE PARTICLES MAKES IT TO HAPPEN. VELOCITY OF THE ABRASIVE WATER JET  AS HIGH AS 900 m/s. +
  • 20.
    20 ELETRIC DISCHARGE MACHINING Prof.V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur WORN OUT MARKS LAZERANKO
  • 21.
    21 LASER BEAM MACHINING(LBM) Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
  • 22.
    22 LASER BEAM MACHINING(LBM) Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
  • 23.
    23 ULTRASONIC MACHINING Prof. V.K.Jain,Mechanical Engineering Department, I.I.T. Kanpur
  • 24.
    24 PLASMA ARC MACHINING(PAM) Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
  • 25.
  • 26.
  • 27.
    27 ELECTRICHEMICAL MACHINING (ECM) ECMPROCESS IS ALSO KNOWN AS A CONTACTLESS ELECTROCHEMICAL FORMING PROCESS ELECTROCHEMICAL ENERGY DETACHES METAL FROM ANODE ATOM BY ATOM
  • 28.
    28 TYPES OF ELECTROLYTESUSED IN ECM ACIDIC ALKALINE NEUTRAL 2 H2 O + 2eˉ → H2 ↑ + 2OHˉˉ 2Fe – 2eˉ → 2Fe++ Fe++ + 2OHˉˉ → Fe(OH)2 2Fe + 4 H2 O → Fe(OH)3 + H2 ↑ + ½O2 ↑ Fe(OH)2 , Fe(OH)3 → INSOLUBLE IN WATER POSITIVE IONS CONVERT AS HYDROXIDES (FERROUS OR FERRIC HYDROXIDE IN CASE OF IRON AS ANODE/ WORK MATERIAL) IEG < 1 mm, VOLTAGE  8-20 ELECTROCHEMICAL REACTIONS NO ELECTROLYTE IS BEING CONSUMED IN THE PROCESS
  • 29.
    FARADAY’ S LAWSOF ELECTROLYSIS m α itE MASS OF DISSOLVED METAL GRAM CHEMICAL EQUIVALENT = A / Z CURENT TIME AATOMIC MASS OF ANODE, Z  VALENCY OF DISSOLUTION OF ANODE 29 WORKING PRINCIPLE OF ECM
  • 30.
    MATERIAL REMOVAL (m)IN ECM FOLLOWS FARADAY’S LAWS OF ELECTROLYSIS: MATERIAL RAMOVAL RATE (MRR) CAN BE OBTAINED AS F ItE m = . m IE m t F • = = MATERIAL REMOVAL IN ECM 30 Where, ‘m’ is amount of material removed in grams, ‘I’ is current flowing through the IEG in Amperes, ‘t’ Is time of current flow (or ECM), ‘E’ Is gram chemical equivalent of anode material, ‘F’ is Faraday’s constant (Coulombs or A.s) or constant of proportionality . and is material removal rate in g/s. . m • …….(1) …….(1a)
  • 31.
    WHERE, = DENSITYOF ANODE, = VOLUME OF MATERIAL REMOVED FROM THE ANODE IN TIME ‘t’, = X- SECTIONAL AREA ON THE ANODE FROM WHICH MATERIAL IS BEING REMOVED IN TIME ‘t’, IS THE THICKNNESS OF MATERIAL REMOVED IN TIME ‘t’. ∆V IS OVER POTENTIAL, k= ELECTROLYTE’S ELECTRICAL CONDUCTIVITY a ρ a V a A a y MATERIAL REMOVAL IN ECM 31 ( ) ( ) a a a a a A y v IE t t F ρ ρ = = Prof. V.K.Jain, Mech. Engg. Deptt., I.I.T. Kanpur MRR CAN BE OBTAINED AS
  • 32.
    32 ( ) ( ) a l aa y IE MRR t F A ρ ∴ = = l a JE MRR F ρ = a l a a kA V V E MRR A y Fρ    − ∆ =         MATERIAL REMOVAL IN ECM FROM ABOVE EQUATION, WE CAN WRITE ABOVE EQUATION CAN BE WRITTEN AS …….(2) Prof. V.K.Jain, Mech. Engg. Deptt., I.I.T. Kanpur (J = CURRENT DENSITY = I/Aa) J=I/Aa=V/R=V/(ρl/A) ρ =(1/k) J=((V- ∆V)/A) (kA/y) ρ=Resistance Anode density
  • 33.
    33 THERMAL MICROMACHINING PROCESSES ELECTRICDISCHARGE MICROMACHINIG BEAM MICROMACHINING 1. LASER BEAM MICROMACHINING 2. ELECTRON BEAM MICROMACHINING 3.ION BEAM MICROMACHINING (NOT A THERMAL PROCESS)
  • 34.
    34 EBM IBM LBM 34 SHORT PULSELASER MACHINING BEAM TECHNOLOGY CRATER CRATER 100 M ICRONS IEG = A FEW HUNDRED µm Dr. V.K.Jain, I.I.T. Kanpur;vkjain@iitk.ac.in
  • 35.
  • 36.
    36 ELECTRIC DISCHARGE MACHINING •SPARKSCREATED DELIBERATELY • HEAT IN A LOCALIZED AREA MELTING AND / OR VAPORIZATION (EDM) CRATER CRATER 100 M ICRONS IEG = A FEW HUNDRED µm
  • 37.
    37 ELECTRIC DISCHARGE MACHINING: HOW SPARKING TAKES PLACE? PULSED D.C. SOURCE Asperity Ion Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur PULSED D.C. SOURCE
  • 38.
     BREAK DOWNOF DIELECTRIC (AT PRE DETERMINED ELECTRIC FIELD) OF DIELECTRIC (USUALLY KEROSENE OR WATER) TAKES PLACE BETWEEN TWO ELECTRODES (TOOL & WORKPIECE).  DIELECTRIC IONIZATION  MOLECULES (ELECTRONS FROM CATHODE COLLIDE THE MOLECULES ) SPLIT INTO IONS, AND ELECTRONS.  IONS  MOVE TOWARDS CATHODE AND ELECTRONS MOVE TOWARDS  ANODE • ELECTRONS HIT THE CATHODE AND IONS HIT ANODE • DUE TO THEIR K.E., THEY PRODUCE HEAT ON CATHODE (LESS) AND ANODE (MORE) • THIS HEAT MELTS AND EVEN VAPORIZES A SMALL PART OF CATHODE AND ANODE. 38 EDM: WORKING PRINCIPLE Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
  • 39.
    39 ELECTRIC DISCHARGE MACHINING(EDM) : MACHINE ELEMENTS DC Pulse Generator IEG Ionized fluid Servo system Control gap Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur REPLICA OF THE TOOL  WORKPIECE
  • 40.
    40 ELECTRIC DISCHARGE MACHINING(EDM) Ignition delay 1 µs POLARITY IN EDM VOLTAGE / CURRENT PULSES IN EDM (SOURCE: Advanced Machining Processes by V.K.Jain, Allied Publishers, New Delhi)
  • 41.
    41 ELECTRON BEAM MACHINING(EBM) Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
  • 42.
    42 FOCUSSED ION BEAMMACHNING (IBM)  SPUTTERING OFF: KNOCKING OUT ATOMS FROM THE WORK-PIECE SURFACE BY THE KINETIC MOMENTUM TRANSFER FROM INCIDENT ION TO THE TARGET ATOMS  REMOVAL OF ATOMS WILL OCCUR WHEN THE ACTUAL ENERGY TRANSFERRED EXCEEDS THE USUAL BINDING ENERGY.  AT SUFFICIENTLY HIGH ENERGY, THE CASCADING EVENTS WILL PENETRATE MORE DEEPLY INTO THE SOLID, SEVERAL ATOMS OR MOLECULES WILL BE EJECTED OUT AND THE BOMBARDING ION WILL BECOME IMPLANTED DEEP WITHIN THE MATERIAL. Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur FIG. SCHEMATIC ILLUSTRATION
  • 43.
    43 MECHANICAL MICROMACHINING PROCESSES ULTRASONICMICROMACHINIG ABRASIVE JET MICROMACHINING 1. WATERJET MICROMACHINING 2. ABRASIVE WATER JET MICROMACHINING
  • 44.
    44 PRINCIPLE OF MECHANICALMICROMACHINING MECHANISM Mechanism of material removal in brittle material Mechanism of material removal in ductile material AWJM, AJM, USM FORCES ACTING ON EACH PARTICLE AND PARTICLE SIZE WILL DEC IDE THE SCALE OF MATERIAL REMOVED : MACRO, MICRO, NANO ABRASIVE JET MACHINING ABRASIVE WATR JET MACHINING ULTRASONIC MACHINING Dr. V.K.Jain, I.I.T. Kanpur;vkjain@iitk.ac.in
  • 45.
    45 ABRASIVE WATER JETMICRO-MACHINING (AWJM) 1. Low feed rate 2. Medium feed rate 3. High feed rate
  • 46.
    46 APPLICATIONS OF ABRASIVEWATER JET CUTTING (AWJC) Granite cutting (COURTESY : IITM CHENNAI)
  • 47.
    47 Material Removal Processes Micro/nanomachining Micro/nano finishing Traditional machining processes Advanced machining processes Traditional finishing processes Advanced finishing processes
  • 48.
    48 Micro-manufacturing A set ofprocesses used to fabricate features, components, or systems with dimensions most conveniently described in micrometers
  • 49.
  • 50.
    50 Why miniaturization? Minimizing energyand materials use in manufacturing Reduction of power budget Faster devices Increased selectivity and sensitivity Improved accuracy and reliability Cost / performance advantages Integration with electronics, simplifying systems
  • 51.
  • 52.
    Electro chemical spark deposition Material deposition Material Removal Forming/ shaping Joining Casting Electro discharge deposition LIGA Chemical vapor deposition Rapid prototype / rapid tooling Physical vapor deposition Rolling Forging Extrusion & drawing Sheet metal Welding Brazing Soldering Advanced material removal processes Traditional material removal processes Methods of Micro-manufacturing MICROFABRICATION IS GOING TO WITNESS AN EXCELLENCE IN R & D AT A REMARKABLE RATE
  • 53.
    µ-EBM µ-LBM µ-AJM ECMM µ-EDM µ-turning µ-milling µ-drilling Traditional µ-MACHINING METHODS MechanicalThermal Chemical Advanced µ-USM AFM, MAF, M- RAFF, MPF µ-AWJM µ-grinding µ-PAM PCMM HYBRID µ-ECSM µ-ECG µ-EDG ELID, etc
  • 54.
    54 MICRO MACHINING 54 Micro Machining Removalof material at micro level 1.Macro components but material removal is at micro/nano level 2.Micro/nano components and material removal is at micro/nano level (Ex. MEMS, NEMS) Unfortunately , the present day notion is Machining of highly miniature components with miniature features. Literally it should NOT be so LEG OF A HOUSE FLY SIZE : 2mm x 2mm MORE CORRECT DEFINITION IS material removal is at micro/nano level WITH NO CONSTRAINT ON THE SIZE OF THE COMPONENT
  • 55.
    55 55 LASER-CUT STENTLIKE PATTERNIN MINIATURE STAINLESS- STEEL TUBE WITH 1.25-mm OD. LASER-DRILLED HOLE (DIA. 15 µm) PATTERN IN POLYURETHANE TUBE SOME MICROMACHINED PARTS
  • 56.
  • 57.
    57 Holes as smallas 6.5 microns in diameter and an aspect ratio of 7.5 30-micron shafts and 50-micron holes produced by micro-EDM. EXAMPLES OF EDMM
  • 58.
    58 58 MICROFLUIDICS MIXER MICRO GEARS(DIA 0.52 mm) 0.52mm DIA EXTRUSION DIE LADDER WITH 100 µm GAP BETWEEN TEETH PIN OVER MOULDING JIG (655 µ HOLES) EXAMPLES OF EDMM
  • 59.
  • 60.
    60 60 • LIGHT AMPLIFICATIONBY STIMULATED EMISSION OF RADIATION. • LIGHT ENERGY OF A PARTICULAR FREQUENCY CAN BE USED TO STIMULATE THE ELECTRONS IN AN ATOM TO EMIT ADDITIONAL LIGHT WITH EXACTLY THE SAME CHARACTERISTICS AS THE ORIGINAL STIMULATING LIGHT SOURCE. • PHOTON ENERGY IS PROPORTIONAL TO FREQUENCY BUT INVERSELY PROPORTIONAL TO WAVELENGTH. • THE PHOTON STIMULATES THE ATOM, CAUSING IT TO EMIT AN ADDITIONAL PHOTON WITH IDENTICAL CHARACTERISTICS TO THE STIMULATING PHOTON. BASIC PRINCIPLES OF LASER
  • 61.
    61 61 • MONOCHROMATIC –SINGLE WAVELENGTH. • COHERENT – SAME PHASE RELATIONSHIP. • DIRECTIONAL – LOW DIVERGENCE, BEAM SPREADS VERY LITTLE. • INTENSE – HIGH DENSITY OF USABLE PHOTONS. PROPERTIES OF LASER BEAM TWO TYPES OF LASERS: CONTINUOUS WAVE AND PULSED LASERS LONG PULSED LASES AND SHORT PULSED LASERS
  • 62.
    TIME SCALES: 1*10-15 second Femtosecond 1*10-12 second Pico second 1*10-9 second Nano second 1*10-6 second Micro second 1*10-3 second Millisecond TYPES OF LASERS 62
  • 63.
    63 63 LONG PULSE LASERMACHINING DEMERITS OF LONG PULSE LASER ANIMATION
  • 64.
    64 64 SHORT PULSE LASERMACHINING MERITS OF SHORT PULSE LASER
  • 65.
    65 65 MICRO CUTTING INA TUNGSTEN PIN USING 511nm ND LASER MICRO FLUIDIC DEVICE IN SILICON SHOWING LASER DRILLED VIA HOLE AND CONNECTING CHANNEL APPLICATIONS OF LBM
  • 66.
    66 LASERS AND THEIRCONFIGURATION MICRO MACHINED LETTERS ON A SINGLE HUMAN HAIR NOTE THE CLARITY OF THE LETTERS IN THE CLOSE-UP VIEW
  • 67.
  • 68.
    68 68 • IT WORKSIN MUCH THE SAME WAY AS A CATHODE RAY TUBE IN A TELEVISION. CATHODE SECTION(GENERATES BEAM) ANODE SECTION(ACCELERATES THE BEAM) LENS SYSTEM CONVERGES AND DEFLECTS THE BEAM TO THE DESIRED POSITION ELECTRON-BEAM MACHINING PROCESS BASICS OF EBM
  • 69.
    69 69 ELECTRON-BEAM IN A VACUUM ELECTRONBEAM IN AMBIENT AIR WHY VACCUM IS REQUIRED?
  • 70.
    70 70 HOLE=0.09 mmφ HOLES DENSITY= 4000/cm2 WORKPIECE- S.S. THICK = 0.2 mm TIME = 10 µS/HOLE HOLE φ =0.006 mm (6 µm) HOLES DENSITY = 200,000 / cm2 THICKNESS = 0.12 mm TIME= 2µs / HOLE PATTERN OF HOLES DRILLED BY EBM
  • 71.
  • 72.
    72 ELECTRO CHEMICAL MACHINING(ECM) Fe + 2H2O Fe(OH)2 + H2 4Fe(OH)2 + 2H2O + O2 4Fe(OH)3
  • 73.
    73 73 PRODUCTION OF HIGHACCURACY HOLES MICRO-HOLES PRODUCED ON A Ti6Al4V CYLINDER USING JET-EMM APPLICATIONS OF ECMM CU STRUCTURE (SMALL PRISM, 5 µm BY 10 µm BY 12 µm) MACHINED INTO THE CU SHEET OF AN ELECTRONIC CIRCUIT BOARD 3D MICRO-MACHINING
  • 74.
    74 74 LONG-RANGE ACCURACY AND REPRODUCIBILITYOF 30 µm CAVITIES SMOOTH SURFACE AND SHARP BORDERS THAT ARE ACHIEVED UNDER OPTIMIZED DISSOLUTION CONDITIONS Titanium surface microstructure by through-mask EMM APPLICATIONS OF ECMM
  • 75.
    75 ELECTRO CHEMICAL DEBURRING(ECD) • Adaptation of ECM to remove burrs or round sharp corners on holes in metal parts produced by conventional through-hole drilling.
  • 76.
  • 77.
    77 MECHANISM OF IONBEAM MACHINING  SPUTTERING OFF: KNOCKING OUT ATOMS FROM THE WORK-PIECE SURFACE BY THE KINETIC MOMENTUM TRANSFER FROM INCIDENT ION TO THE TARGET ATOMS  REMOVAL OF ATOMS WILL OCCUR WHEN THE ACTUAL ENERGY TRANSFERRED EXCEEDS THE USUAL BINDING ENERGY. FIG.SCHEMATIC ILLUSTRATION OF THE MECHANISM OF MATERIAL REMOVAL IN IBM  AT SUFFICIENTLY HIGH ENERGY, THE CASCADING EVENTS WILL PENETRATE MORE DEEPLY INTO THE SOLID, SEVERAL ATOMS OR MOLECULES WILL BE EJECTED OUT AND THE BOMBARDING ION WILL BECOME IMPLANTED DEEP WITHIN THE MATERIAL.
  • 78.
    Coil 700 nmpitch, 80 nm line width, diamond like amorphous carbon, Fabricated by FIB induced deposition Shinji Matsui et al, J. Vac. Sci. Technol. B 18(2000) 3181 Micro wine glass with 2.75 µm external diameter and 12 µm height. (a) Radial DLC free-space-wiring grown into eight directions from the center. (b) Radial DLC free- space-wiring grown into 16 directions from the center. T. Morita et al, J. Vac. Sci. Technol. B 21 (2003) 78
  • 79.
    79 TYPICAL MATERIAL REMOVALRATE IN ION BEAM MACHINING TABLE1: REMOVAL RATES BY IBM (SPENCER AND SCHMIDIT,1972 [1]) DATA : ARGON ION BEAM 60 TO 700 FROM NORMAL PRESSURE = 3X10-4 TORR VOLTAGE = 6 KV CURRENT = 100 µA CURRENT DENSITY = 1 MACM-2 OVER 1 CM DIAMETER AREA MATERIAL REMOVAL (MILLING) RATE, (µM HR-1) QUARTZ 2 GARNET 1 CERAMIC 1 GLASS 1 GOLD 2 SILVER 3 PHOTO RESIST MATERIAL (KTFR) 1 PERMALLOY 1 DIAMOND 1
  • 80.
  • 81.
    81 Micro / nanofinishing Traditional Advanced Grinding Lapping Honing ELID MRAFF CMP MRF MAF AFM MFP SHAPE AND SIZE CONSTRAINTS WITH EACH OF THESE TRADITIONAL FINISHING PROCESSES CMMRF
  • 82.
    82 MAF AFM MRAFF MRFCMP MFP Workpiece Ft Fn Media Abrasive S N Spindle Ceramic balls Drive Shaft Al Base Steel yoke Magnetic Fluid & Abrasives Float Magnets S N S N N S N S N S Electromagnet pole Motion N S Workpiece surface Workpiece fixture CIP Chain Ft Fn N S Magnetic lines of force FLEXIBLE MAGNETIC ABRASIVE BRUSH Workpiece Fmn Fc Abrasive Workpiece Chip
  • 83.
  • 84.
    84 WHY ADVANCED ABRASIVEFINISHING PROCESSES? Complex Geometrical Shapes. Labor Intensive Nature of Traditional Finishing Operations. Difficulties in Controlling Abrading Forces. Nano-meter (10-9 m) Surface Finish Requirements. 84
  • 85.
    85 ADVANCED ABRASIVE FINISHINGPROCESSES MAF Magnetic Abrasive Finishing AFF Abrasive Flow Finishing MRAFF Magnetorheological Abrasive Flow Finishing MRF Magneto Rheological Finishing CMP Chemo Mechanical Polishing MFP Magnetic Float Polishing 85 IN ALL THESE PROCESSES NORMAL FORCE IS RESPONSIBLE FOR PENETRATION OF ABRASIVE INTO WORKPIECE AND SHEAR FORCE TO REMOVE THE MATERIAL IN THE FORM OF MICROCHIP
  • 86.
  • 87.
    87 WORKING GAP FILLED WITH MAPs  FORMS FMAB MULTIPOINT CUTTING TOOL Feed Magnetic equipotential lines Magnetic lines of force N S MAPs formed FMAB Workpiece Finished Surface Workpiece S S N N Rotating magnetic pole Flexible Magnetic Abrasive Brush Fmn Fc Abrasive Workpiece Micro Chip SCHEMATIC VIEW OF MAF WORKING PRINCIPLE SALIENT FEATURES Ra = AS GOOD AS 8 nm
  • 88.
    88 EXPERIMENTAL SET-UP DESIGNED ANDFABRICATED AT IITK MAGNETIC ABRASIVE FINISHING (MAF) (DST SPONSORED PROJECT) FERROMAGNETIC WORKPIECE ROUND ELECTROMAGNET FMAB DIGITAL PHOTOGRAPH OF FLEXIBLE MAGNETIC ABRASIVE BRUSH (FMAB)
  • 89.
    89 Before MAF After MAF AfterMAF I=0.75 A, G=600 N=9 I=0.75 A, G =800 N= 9 Surface Profilometer Results DC-MAF After MAF Before MAF I=0.88 A, G= 500 N=11 (No. of cycles) BEST SURFACE ROUGHNESS ACHIEVED WAS 40nm EXPERIMENTAL RESULTS OF MAF
  • 90.
    90 Drilled hole edge(a) before, (b) after deburring (a) (b) MICRO DEBURRING APPLICATION OF MAF
  • 91.
  • 92.
    92 ABRASIVE FLOW MACHINING(AFM) • Two vertically opposed cylinders extrude abrasive laden medium back & forth through passage formed by the workpiece & tooling • Medium : Visco-elastic Polymer with special rheological properties Fine Abrasive Particles 92 Deburring of turbine impeller Abrasive Flow Machining (AFM) at IIT – K (DST SPONSORED PROJECT)
  • 93.
    Silly Putty (viscoelastic)+ SiC (abrasive) Workpiece held in fixture Thermostat for temp control Piston Fig: Abrasive flow finishing setup for knee joint finishing
  • 94.
    94 VERSATILITY – FINISHCOMPLEX SURFACES OF VARIOUS SIZES.  SURFACE FINISH - 0.1 µm to 0.05 µm Ra. LIMITATIONS:  VISCOELASTIC POLYMERIC MEDIUM – COSTLY AND LACK OF AVAILABILITY.  MEDIUM RHEOLOGICAL PROPERTIES – VARY IN UNCONTROLLED MANNER DURING PROCESS.  LACK OF DETERMINISM. FORCE : 0.0009N -- 0.002N Per Particle DEPTH OF PENETRATION : 5nm -- 30nm KEY FEATURES OF AFM
  • 95.
    95 AFM MEDIAACTS ASA SELF-DEFORMABLE STONE
  • 96.
  • 97.
     CI particlesform a chain-like columnar structure, with the application of magnetic field and they are aligned along the lines of magnetic force.  The magnetic force between iron particles provides bonding strength to it. MRF- Mechanism of material removal  When these chains have relative motion with respect to the workpiece surface the asperities on the surface are abraded due to shearing / plastic deformation at the tips. Source: www. qedmrf.com
  • 98.
    98 98 • Fluid isextruded onto a rotating wheel in a thin ribbon that contacts the optical / WORKPIECE surface. • Electromagnet below the polishing wheel exerts a strong local Magnetic field gradient. • Precisely controlled zone of magnetized fluid becomes the Polishing tool. MAGNETORHEOLOGICAL FINISHING (MRF) MR-fluids are suspension of ferromagnetic particles in water/oil that reversibly stiffens under the influence of magnetic field. Stiffness of the fluid α Magnetic Field Strength.
  • 99.
    (1- CNC millingM/c head, 2- MR finishing tool, 3- MR polishing fluid, 4- fixture for knee joint implant (Ti6Al4V), 5- knee joint implant) Apparatus and tooling for freeform surface 99
  • 100.
    100 Finishing of freeformsurface Components of knee joint implants (Courtesy: Aesculap Implant Systems, LLC, www.soactivesofast.com).  Knee joint implants consist of metal femoral and tibial components with a plastic polyethylene insert sandwiched between to restore joint function.  Surface roughness of knee joint implant has a significant effect on the force at the connection and reaction of tissues in the joint area and behaviour of germs in bone tissue (Mathia et al., 2011).  Wear by abrasion is one of the main causes for failures of knee joints because over time, the continuous movement between the metal and plastic can cause the polyethylene to crack, pit and delaminate.  It may also cause microscopic particles to break off which in turn attack the body’s immune system.
  • 101.
    101 (BY B. TECH.STUDENTS PROJECT) MRF EXPERIEMTNAL SETUP AT IIT - K WORKPIECE / LENS MR FLUID
  • 102.
    102 40 mins 50 mins 30mins 20 mins Before finishing 53 nm (RMS) 11 nm (RMS) EXPERIMENTAL RESULTS OF MRF
  • 103.
  • 104.
    EBM IBM LBM Ref.: Cmxrlasers industry, www.cmxr.com/industrial/handbook/ SHORT PULSE LASER MACHINING
  • 105.
    105 MECHANISM OF MATERIALREMOVAL IN MECHANICAL MICROMACHINING Mechanism of material removal in brittle material Mechanism of material removal in ductile material AWJM, AJM, USM FORCES ACTING ON EACH PARTICLE AND PARTICLE SIZE WILL DEC IDE THE SCALE OF MATERIAL REMOVED : MACRO, MICRO, NANO ABRASIVE JET MACHINING ABRASIVE WATR JET MACHINING ULTRASONIC MACHINING
  • 106.
    106 MAF AFM MRAFF MRFCMP MFP Workpiece Ft Fn Media Abrasive S N Spindle Ceramic balls Drive Shaft Al Base Steel yoke Magnetic Fluid & Abrasives Float Magnets S N S N N S N S N S N S Magnetic lines of force FLEXIBLE MAGNETIC ABRASIVE BRUSH Workpiece Fmn Fc Abrasive Workpiece Chip ABRASIVE Dr. V.K.Jain, I.I.T. Kanpur;vkjain@iitk.ac.in
  • 107.
    107 ADVANCED MACHINING PROCESSES Prof.V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
  • 108.
    108 Questions bank for“introduction to AMPs” Q.1 Name the important factors that should be considered during the selection of an Advanced Machining Process for a given job. Q.2 Classify the different types of Advanced Machining Processes based on different criteria. Q.3 What do you understand by the term “Micromachining”? Classify the different types of micromachining methods. Also write down the ranges of macro, meso, micro, and Nano machining. Q.4 What do you understand by “hybrid process”? List out the names of hybrid processes and the advantages of a hybrid process over its constituent processes. Q.5 Classify the advanced machining processes based on electrical properties of materials. Q.6 what is the mechanism of material removal in Laser beam machining? Q.7 Differentiate between chemical and electrochemical machining processes. Q.8 Write the element of EBM. Q.9 what do you understand by a finishing process? Q.10 what are the constraints that limit the performance of different kinds of AMPs Q.11 what do you understand by the word “unconventional“ in unconventional machining processes ? Is it justified to use this word in the context of the present day medium and large scale engineering industries? Q.12 Classify the advanced machining processes on the basis of type of the energy employed. Q.13 What are the advanced machining processes which can be used for magnetic material? QUESTIONS BANK Prof. V.K.Jain, Mechanical Engineering Department, I.I.T. Kanpur
  • 109.
    109 109 • IN EDMMATERIAL IS REMOVED BY THE THERMAL EROSIVE ACTION OF ELECTRICAL DISCHARGES (SPARKS) PROVIDED BY THE OF A PULSE GENERATOR. THE SAME PRINCIPLE OF EDM IS APPLIED TO REMOVE MTERIAL AT MICRON LEVEL FOR MICROMACHINING. IN MICRO-EDM, THE KEY IS TO LIMIT THE ENERGY IN THE DISCHARGE (SPARK) BASICS OF EDMM
  • 110.
    110 110 PROPERTY VALUE MECHANISM OFMATERIAL REMOVAL MELTING, VAPORIZATION MEDIUM VACUUM TOOL BEAM OF ELECTRON MOVING AT VERY HIGH SPEED MAX. MRR 10 mm3/min (MAY BE IN SPECIAL CONDITIONS) SPECIFIC POWER CONSUMPTION 450 W/mm3-min CRITICAL PARAMETERS ACCELERATING VOLTAGE, BEAM CURRENT, BEAM DIA., WORK SPEED, MELTING TEMPERATURE MATERIALS APPLICATION ALL MATERIALS (CONDUCTIN & NON-CONDUCTING BOTH) SHAPE APPLICATION DRILLING FINE HOLES, CUTTING CONTOURS IN SHEETS, CUTTING NARROW SLOTS LIMITATIONS VERY HIGH SPECIFIC ENERGY CONSUMPTION, NECESSITY OF VACUUM, EXPENSIVE MACHINE PROCESS CHARACTERSTICS
  • 111.
  • 112.
    112 Micro / nanofinishing traditional Advanced Grinding Lapping Honing ELID MRAFF CMP MRF MAF AFM MFP