The document discusses various point geometry defects in drill bits and their functional impact. It provides maximum allowable measurements for defects like layback, hook, offcenter, and overlap across different drill bit diameter ranges. Less impactful defects with wider tolerances like gap and negative angle are also outlined. The tables seek to define optimum point geometry and tolerances for drill bit cutting effectiveness.
Company presentation for Saturn Electronics Corporation, bare printed circuit board manufacturer. Presentation focuses on the companys PCB Manufacturing Equipment, Capabilities, and Expertise.
Updated Company Presentation from ITAR Registered / AS9100 Certified Saturn Electronics Corporation includes newly developed advanced technologies to include Metal Core / Aluminum Circuit Boards--featured in free LED MCPCB keychain available on web site.
Lead Free Pcb RoHs Compliant Design, Fabrication, and Assembly Cost ReductionDomestic PCB Fabrication
Lead Free Cost Reduction webinar dealing with RoHS compliant laminates and final finishes pertaining to PCB manufacturing to included design, fabrication, and assembly.
Company presentation for Saturn Electronics Corporation, bare printed circuit board manufacturer. Presentation focuses on the companys PCB Manufacturing Equipment, Capabilities, and Expertise.
Updated Company Presentation from ITAR Registered / AS9100 Certified Saturn Electronics Corporation includes newly developed advanced technologies to include Metal Core / Aluminum Circuit Boards--featured in free LED MCPCB keychain available on web site.
Lead Free Pcb RoHs Compliant Design, Fabrication, and Assembly Cost ReductionDomestic PCB Fabrication
Lead Free Cost Reduction webinar dealing with RoHS compliant laminates and final finishes pertaining to PCB manufacturing to included design, fabrication, and assembly.
SPICE MODEL of 2SK4002 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4002 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of ZR6_RL=4.7(Ohm) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
FREE SPICE MODEL of 1SS272 in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of ZR6_RL=2.2(Ohm) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 1SS370 (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 1SS370 (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
Results of a recent survey of the top 40 domestic bare printed circuit board manufacturers. The survey evaluated the PCB fabricators on the following quality system certifications: UL, ITAR, C 7000, AS9100 and TS16949.
PCBs are electronic real estate. Establishing the foundation for assembly, there is a direct correlation between the reliability of a final electronic product and the bare printed circuit board. There is much to knowing what it takes as both a buyer and a producer of of PCBs to ensure high-reliability PCB performance.
FR-4 PCBs for LED Applications: Testing Performance of PTH and Copper Pour In...Domestic PCB Fabrication
FR-4 Circuit Boards: Testing the performance of PTH and Copper Pour instead of Metal Core PCBs in LED Applications. From the June issue of SMT Magazine.
SEC uses PTFE for our customer's Radio Frequency Microwave High Bandwidth applications. PTFE hybrids utilize Teflon in the dielectric material of the printed circuit board. Often synthesized with other high speed materials, our PTFE hybrid boards for RFMW incorporate the use of ceramic and other high-speed resin systems.
SPICE MODEL of 2SK4002 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4002 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of ZR6_RL=4.7(Ohm) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
FREE SPICE MODEL of 1SS272 in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of ZR6_RL=2.2(Ohm) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 1SS370 (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 1SS370 (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
Results of a recent survey of the top 40 domestic bare printed circuit board manufacturers. The survey evaluated the PCB fabricators on the following quality system certifications: UL, ITAR, C 7000, AS9100 and TS16949.
PCBs are electronic real estate. Establishing the foundation for assembly, there is a direct correlation between the reliability of a final electronic product and the bare printed circuit board. There is much to knowing what it takes as both a buyer and a producer of of PCBs to ensure high-reliability PCB performance.
FR-4 PCBs for LED Applications: Testing Performance of PTH and Copper Pour In...Domestic PCB Fabrication
FR-4 Circuit Boards: Testing the performance of PTH and Copper Pour instead of Metal Core PCBs in LED Applications. From the June issue of SMT Magazine.
SEC uses PTFE for our customer's Radio Frequency Microwave High Bandwidth applications. PTFE hybrids utilize Teflon in the dielectric material of the printed circuit board. Often synthesized with other high speed materials, our PTFE hybrid boards for RFMW incorporate the use of ceramic and other high-speed resin systems.
LED Thermal Management: Free Consultation with Clemens Lasance at IPC APEX Ex...Domestic PCB Fabrication
Clemens Lasance is a recognized LED thermal management in the electronics cooling community.
A former Principal Scientist at Philips Research Clemens' main focus was the thermal management of Light Emitting Diodes for electronic systems.
Thermal Management for LED Printed Circuit Boards
In December 2009, he participated in the Thermal Management webinar, "MCPCBs for
LED Applications".
He currently serves on the Editorial Board for Electronics Cooling magazine.
Automotive PCB Fabrication Manufacturing presentation from TS16949 certified Saturn Electronics Corporation featuring special section automotive heat transfer and the latest company updates to include
Saturn Electronics Corporation is a Top 10 U.S. domestic bare printed circuit board manufacturer providing low-to-high volume production as well as complex prototypes and advanced technologies such as blind and buried vias, heavy copper, PTFE hybrids for RFMW and metal core for LED thermal management.
PCB Multilayer Lamination, Multilam Process Tour for Circuit Board ProductionDomestic PCB Fabrication
Multilayer Lamination Installation.
In 2010, installed a three hot press plus one cold press system, each press with ten openings.
5,000 SF building expansion to house these 3 10-opening Burkle PC-controlled lamination system, which is the most Automated System in North American (N.A.).
In addition, hot oil is used to heat the platens, thereby ensuring heat is applied uniformly to panels.
GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using Deplo...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
Elevating Tactical DDD Patterns Through Object CalisthenicsDorra BARTAGUIZ
After immersing yourself in the blue book and its red counterpart, attending DDD-focused conferences, and applying tactical patterns, you're left with a crucial question: How do I ensure my design is effective? Tactical patterns within Domain-Driven Design (DDD) serve as guiding principles for creating clear and manageable domain models. However, achieving success with these patterns requires additional guidance. Interestingly, we've observed that a set of constraints initially designed for training purposes remarkably aligns with effective pattern implementation, offering a more ‘mechanical’ approach. Let's explore together how Object Calisthenics can elevate the design of your tactical DDD patterns, offering concrete help for those venturing into DDD for the first time!
GridMate - End to end testing is a critical piece to ensure quality and avoid...ThomasParaiso2
End to end testing is a critical piece to ensure quality and avoid regressions. In this session, we share our journey building an E2E testing pipeline for GridMate components (LWC and Aura) using Cypress, JSForce, FakerJS…
Communications Mining Series - Zero to Hero - Session 1DianaGray10
This session provides introduction to UiPath Communication Mining, importance and platform overview. You will acquire a good understand of the phases in Communication Mining as we go over the platform with you. Topics covered:
• Communication Mining Overview
• Why is it important?
• How can it help today’s business and the benefits
• Phases in Communication Mining
• Demo on Platform overview
• Q/A
DevOps and Testing slides at DASA ConnectKari Kakkonen
My and Rik Marselis slides at 30.5.2024 DASA Connect conference. We discuss about what is testing, then what is agile testing and finally what is Testing in DevOps. Finally we had lovely workshop with the participants trying to find out different ways to think about quality and testing in different parts of the DevOps infinity loop.
Pushing the limits of ePRTC: 100ns holdover for 100 daysAdtran
At WSTS 2024, Alon Stern explored the topic of parametric holdover and explained how recent research findings can be implemented in real-world PNT networks to achieve 100 nanoseconds of accuracy for up to 100 days.
Observability Concepts EVERY Developer Should Know -- DeveloperWeek Europe.pdfPaige Cruz
Monitoring and observability aren’t traditionally found in software curriculums and many of us cobble this knowledge together from whatever vendor or ecosystem we were first introduced to and whatever is a part of your current company’s observability stack.
While the dev and ops silo continues to crumble….many organizations still relegate monitoring & observability as the purview of ops, infra and SRE teams. This is a mistake - achieving a highly observable system requires collaboration up and down the stack.
I, a former op, would like to extend an invitation to all application developers to join the observability party will share these foundational concepts to build on:
UiPath Test Automation using UiPath Test Suite series, part 4DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 4. In this session, we will cover Test Manager overview along with SAP heatmap.
The UiPath Test Manager overview with SAP heatmap webinar offers a concise yet comprehensive exploration of the role of a Test Manager within SAP environments, coupled with the utilization of heatmaps for effective testing strategies.
Participants will gain insights into the responsibilities, challenges, and best practices associated with test management in SAP projects. Additionally, the webinar delves into the significance of heatmaps as a visual aid for identifying testing priorities, areas of risk, and resource allocation within SAP landscapes. Through this session, attendees can expect to enhance their understanding of test management principles while learning practical approaches to optimize testing processes in SAP environments using heatmap visualization techniques
What will you get from this session?
1. Insights into SAP testing best practices
2. Heatmap utilization for testing
3. Optimization of testing processes
4. Demo
Topics covered:
Execution from the test manager
Orchestrator execution result
Defect reporting
SAP heatmap example with demo
Speaker:
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
The Art of the Pitch: WordPress Relationships and SalesLaura Byrne
Clients don’t know what they don’t know. What web solutions are right for them? How does WordPress come into the picture? How do you make sure you understand scope and timeline? What do you do if sometime changes?
All these questions and more will be explored as we talk about matching clients’ needs with what your agency offers without pulling teeth or pulling your hair out. Practical tips, and strategies for successful relationship building that leads to closing the deal.
SAP Sapphire 2024 - ASUG301 building better apps with SAP Fiori.pdfPeter Spielvogel
Building better applications for business users with SAP Fiori.
• What is SAP Fiori and why it matters to you
• How a better user experience drives measurable business benefits
• How to get started with SAP Fiori today
• How SAP Fiori elements accelerates application development
• How SAP Build Code includes SAP Fiori tools and other generative artificial intelligence capabilities
• How SAP Fiori paves the way for using AI in SAP apps
State of ICS and IoT Cyber Threat Landscape Report 2024 previewPrayukth K V
The IoT and OT threat landscape report has been prepared by the Threat Research Team at Sectrio using data from Sectrio, cyber threat intelligence farming facilities spread across over 85 cities around the world. In addition, Sectrio also runs AI-based advanced threat and payload engagement facilities that serve as sinks to attract and engage sophisticated threat actors, and newer malware including new variants and latent threats that are at an earlier stage of development.
The latest edition of the OT/ICS and IoT security Threat Landscape Report 2024 also covers:
State of global ICS asset and network exposure
Sectoral targets and attacks as well as the cost of ransom
Global APT activity, AI usage, actor and tactic profiles, and implications
Rise in volumes of AI-powered cyberattacks
Major cyber events in 2024
Malware and malicious payload trends
Cyberattack types and targets
Vulnerability exploit attempts on CVEs
Attacks on counties – USA
Expansion of bot farms – how, where, and why
In-depth analysis of the cyber threat landscape across North America, South America, Europe, APAC, and the Middle East
Why are attacks on smart factories rising?
Cyber risk predictions
Axis of attacks – Europe
Systemic attacks in the Middle East
Download the full report from here:
https://sectrio.com/resources/ot-threat-landscape-reports/sectrio-releases-ot-ics-and-iot-security-threat-landscape-report-2024/
2. Chips TYC O M INTERNATIONAL
Functional Defect
Prevents the drill from
cutting cleanly and efficiently
Diameter Magnification
0.0020"-0.0130" 50X
0.0131"-0.0260" 40X
0.0261"-0.0465" 30X
0.0466"-0.1250" 20X
0.1251"-0.1800" 15X
0.1801"-0.2639" 10X
3. Layback TYC O M INTERNATIONAL
Functional Defect
Results in the Center of the
Primary Face Being the Leading
Cutting Edge (Negative Rake).
Diameter Maximum
0.0020"-0.0130" 0.0001"
0.0131"-0.0260" 0.0001"
0.0261"-0.0465" 0.0002"
0.0466"-0.1250" 0.0002"
0.1251"-0.1800" 0.0003"
0.1801"-0.2639" 0.0004"
4. Hook TYC O M INTERNATIONAL
Minor Functional Defect
Extreme Hook Can
Result in Premature Wear
Diameter Maximum
0.0020"-0.0130" 0.0002"
0.0131"-0.0260" 0.0003"
0.0261"-0.0465" 0.0004"
0.0466"-0.1250" 0.0005"
0.1251"-0.1800" 0.0008"
0.1801"-0.2639" 0.0012"
5. Offcenter TYC O M INTERNATIONAL
a
Functional Defect
Can Result in
Non-Concentric Drilling.
Diameter Maximum
0.0020"-0.0130" 0.0002"
b 0.0131"-0.0260" 0.0003"
0.0261"-0.0465" 0.0004"
0.0466"-0.1250" 0.0005"
0.1251"-0.1800" 0.0008"
0.1801"-0.2639" 0.0012"
(a-b)
Offcenter =
2
6. Offset TYC O M INTERNATIONAL
a
Functional Defect
Can Result in
Non-Concentric Drilling.
Diameter Maximum
0.0020"-0.0130" 0.0002"
0.0131"-0.0260" 0.0003"
b 0.0261"-0.0465" 0.0004"
0.0466"-0.1250" 0.0005"
0.1251"-0.1800" 0.0008"
0.1801"-0.2639" 0.0012"
(a-b)
Offset =
2
7. Overlap TYC O M INTERNATIONAL
Moderately Functional Defect
Can Impede the Drill
from Centering Properly
Diameter Maximum
0.0020"-0.0130" 0.0002"
0.0131"-0.0260" 0.0003"
0.0261"-0.0465" 0.0004"
0.0466"-0.1250" 0.0005"
0.1251"-0.1800" 0.0008"
0.1801"-0.2639" 0.0012"
8. Gap TYC O M INTERNATIONAL
Non-Functional Condition
Diameter Maximum
0.0020"-0.0130" 0.0002"
0.0131"-0.0260" 0.0003"
0.0261"-0.0465" 0.0004"
0.0466"-0.1250" 0.0005"
0.1251"-0.1800" 0.0008"
0.1801"-0.2639" 0.0012"
9. Negative TYC O M INTERNATIONAL
Non-Functional Condition
Diameter Maximum
0.0020"-0.0130" 1deg
0.0131"-0.0260" 1deg
0.0261"-0.0465" 1deg
0.0466"-0.1250" 2deg
0.1251"-0.1800" 2deg
0.1801"-0.2639" 2deg
10. Flare TYC O M INTERNATIONAL
Non-Functional Condition
Diameter Maximum
0.0020"-0.0130" 2deg
0.0131"-0.0260" 3deg
0.0261"-0.0465" 4deg
0.0466"-0.1250" 4deg
0.1251"-0.1800" 5deg
0.1801"-0.2639" 6deg