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- 1. Company Public – NXP, the NXP logo, and NXP secure connections for a smarter world are trademarks of NXP B.V. All other product or service names are the property of their respective owners. © 2019 NXP B.V. Marketing Manager EMEA - Radio Power BL Pascal Massot 5G mMIMO Modules with Enhanced Power and Efficiency November 2019 | EUF-IND-T3931
- 2. COMPANY PUBLIC 1 Focus of this presentation
- 3. COMPANY PUBLIC 2 COMPANY PUBLIC 2 Agenda • Introduction to cellular network market • 5G network RF technology dynamics • 5G RF Amplifier portfolio • RF Circuit collection
- 4. COMPANY PUBLIC 3 Introduction to cellular network market
- 5. COMPANY PUBLIC 4 Wireless Connectivity Landscape Ultra-short Range Short Range Wide Range CAT-M1 NB-IoT 5G
- 7. COMPANY PUBLIC 6 COMPANY PUBLIC 6 History of Communication Standards 1G-AMPS 1980 – 1990 Voice Only 64 kb/s 2G-GSM 1990 – 2000 Digitized Voice 2 Mb/s 3G-WCDMA 2000 – 2010 Mobile Internet 1 Gb/s 4G-LTE 2010 – 2020 Mobile Broadband 5 Gb/s 5G-NR 2020 – Man-to-Man Communication Man-to-Internet Communication Everything Connected
- 8. COMPANY PUBLIC 7 Explosive Growth in Connected Devices 2015 2018 2016 25 22 20 19 17 15 28 2017 2019 2020 2021 Customers Facing… • Skyrocketing data rates • Multiple wireless standards • Increasing network complexity • Stringent power requirements • Worldwide rise in IP traffic Mobile Broadband for Evolving Cellular Market • Reduced energy consumption • Shrinking equipment footprint • Reduced time-to-market Connected Devices vs. Global Mobile Traffic # Connected Devices (Billions) Global Mobile Traffic (Monthly Exabytes) Source: Ericsson, June 2016 11 20 29 35 53 75 95
- 9. COMPANY PUBLIC 8 COMPANY PUBLIC 8 Everything Connected Requires a New Communication Protocol: 5G New Radio (5G-NR) Ultra-high reliability: 99.9999999% Ultra-low latency: Less than 1millisecond Ultra-high density 1M nodes / km2 Ultra low complexity: 10s of kbps 5G Mobile Broadband Smart Transport Realtime Virtual Reality Internet of Things Massive Machine Communication Data rate: 10s Gbps Capacity: 10 Tbps / km2
- 10. COMPANY PUBLIC 9 5G: Cell Phones and Much More Low Power Wireless 2G/3G 4G Pre 5G 5G Critical MTC: Latency & reliability Connected Cars Beyond LOS Ultra low latency Conventional freq. Low Power & BW Mobile Broad Band (MBB): Capacity & Coverage LTE Advanced High BW / CA Higher diversity Conventional freq. Low & high power eMBB: Ultra High Capacity mmWave RAN GBps Data Last mile connectivity Ultra high bandwidth mMIMO New frequencies TIME Massive Machine Type Communication (MTC): Low Power & Small signaling overhead Internet of Things Low power & BW NB-LTE / WiFi / 2G Conventional freq. 2017-2019 2020-2025
- 11. COMPANY PUBLIC 10 5G Network RF Technology Dynamics
- 12. COMPANY PUBLIC 11 COMPANY PUBLIC 11 Evolution of the Cellular Base Station
- 13. COMPANY PUBLIC 12 Massive MIMO • Active Antenna Solutions enable a leap in capacity by utilizing between 16 and 64 transmit and receive paths in a single active system. • TDD-mMIMO systems are leading the way at 2.6 GHz and 3.5 GHz bands but will expand to FDD and other frequencies as well. • Although system costs are currently higher than traditional RRH, significant throughput improvements justify the investment.
- 14. COMPANY PUBLIC 13 mmWave Solutions • To improve capacity even further, the industry is looking to mmWave frequencies ranging from 24 GHz to 39 GHz, enabling over 1 GHz of bandwidth. • Beamforming will enable spatial multiplexing for increased spectrum reuse. • Solutions include Fixed Wireless Access as well as Radio Access Networks.
- 15. COMPANY PUBLIC 14 Throughput Evolution Massive MIMO • Used in Macro BTS • Existing spectrum + new bands below 6 GHz • More data with LTE and existing handsets • Possible now • Least expensive option to increase throughput, even at increased equipment cost Microwave & Millimeterwave Frequencies • > 6 GHz on WRC-2019 agenda • GHz bandwidth has potential to carry a lot of data • Propagation and building penetration issues force “small cell” deployments – many of them needed • Significant increase of throughput – will see use starting 2020 Today: LTE Tomorrow: mMIMO + LTE After 2020: mMIMO + 5G
- 16. COMPANY PUBLIC 15 TRX RFFE RFFE RFFE RFFE RFFE RFFE RFFE RFFE Solutions for mmWave beamforming Required RF building blocks for a mmWave TDD beamforming system: − Splitter / combiner network − TX front end (PA) − RX front end (LNA) − TX / RX switch − Phase shifter VM VM B A TR TR LNA PA VM VM B A TR TR LNA PA VM VM B A TR TR LNA PA VM VM B A TR TR LNA PA BUS Example of an integrated 4 channel solution:
- 17. COMPANY PUBLIC 16 COMPANY PUBLIC 16 Wireless Infrastructure MIMO Evolution Antenna Diversity Increasing in All Market Sub-segments 2 x 80W 4 x 40W 8 x 15W 32/64 x 2.5W 256 x 200mW 2T 120 Mb/s 4T 230 Mb/s 8T 440 Mb/s mMIMO 2-5 Gb/s MMW >10 Gb/s 4 x 40W 32x 5W 32/64 x 2.5W 256 x 200mW 4T 230 Mb/s 16T 1 Gb/s 32T 1-2 Gb/s 64T 2-5 Gb/s MMW >10 Gb/s 16x 10W 4G 4G 5G 4G LTE Wide Area Coverage LDMOS & GaN LTE Adv. / 5G Suburban Coverage LDMOS, GaN & SiGe LTE Adv. / 5G Urban Coverage LDMOS, GaN & SiGe LTE Adv. / 5G Dense Urban Areas LDMOS, GaN & SiGe 5G – Highest Capacity Dense Urban Areas SiGe & GaN 5G
- 18. COMPANY PUBLIC 17 5G RF Module Portfolio
- 19. COMPANY PUBLIC 18 COMPANY PUBLIC 18 NXP’s RF Technology Toolbox 80W 40-60W 10-20W 1-5W <1 W LNA SW LDMOS 48V GaN GaN LDMOS 28V GaN and LDMOS 28V LDMOS 28 V IC SiGe and RFCMOS GaAs (HBT, pHEMT) < 1000MHz 2,0 GHz 2.6 GHz 3.5 GHz 4-10 GHz 10-60 GHz Existing Spectrum GaN and LDMOS 28V New Spectrum AVG PA Power From sub-1GHz to mm-wave; from mW’s to 10’s of W
- 20. COMPANY PUBLIC 19 COMPANY PUBLIC 19 Leveraging the Benefits of GaN and LDMOS GaN Benefits • Differentiating performance exceeding LDMOS above 2.5 GHz • Enables 5G at higher frequencies • Broadband design • High efficiency at high frequencies • Comparable thermal package as LDMOS • Compact PA design (more power in smaller package, smaller matching circuitry) • Wideband CW and Pulse PA applications: • 200-2600 MHz at 100 W • S-band 2.7-3.5 GHz at 700 W LDMOS Benefits • Competitive performance to 2.7 GHz • Cost effective PA solutions • Mature process technology • High ruggedness up to 65:1 VSWR • Consistent thermal behavior • Broadband VHF/UHF below 1 GHz • Highest power up to 1.5 GHz • Narrow-band PA applications: • Cellular bands up to 2.7 GHz • Avionics/L-band 1.2-1.4 GHz up to 1.5 kW • S-band 2.7-3.1 GHz at 300 W
- 21. COMPANY PUBLIC 20 COMPANY PUBLIC 20 NXP Family of Fully-Integrated High Efficiency Power Amplifiers • Power levels 2.5 – 5 Watt devices • Roadmap covering bands 2.3 GHz to 5 GHz • Easy implementation – 50 Ω input & output • Pin-compatibility between all frequency bands and power levels • LDMOS – low cost solution Rx Front-End Module 4x4 mm2 package PA Module 6x10 mm2 package Pre-Driver Amplifier 3x4 mm2 package Low Cost Small Size 21x35 mm2 solution
- 22. COMPANY PUBLIC 21 COMPANY PUBLIC 21 Block diagram Tx In I2C ENABLE RX OUT RF PA CONTROL BYPASS AFRX5G132 AFLP5G35647 BIAS CONTROLLER AFSC5G35D37 T/R SWITCH TO ANTENNA FEEDBACK OUT BYPASS TX OUT / RX IN CONTROL DAC0 DAC1 Final stage: AFSC5G35D37 Driver: AFLP5G25641 RX Module: AFRX5G372
- 23. COMPANY PUBLIC 22 COMPANY PUBLIC 22 Airfast 5G MCM Benefits Device 10x6 mm2 Solution 15x11 mm2 Time To Market The ease of use of a 50-ohm, high gain dual-stage PA with integrated Doherty shortens design cycle time • Eliminates multiple prototype passes • No compromise on performance • 50-ohm, pin-compatibility from a MCM PA to another enables reuse for other frequencies / power levels Manufacturing A surface mount device, compatible with standard pick and place + reflow, facilitates manufacturing • Reduces assembly time increasing ROI for manufacturing equipment and reduced need for capital investment • Eliminates testing redundancies while improving yields Smaller, lighter active antenna systems The high integration enables lighter 64T active antenna systems. • Small size enabled by a 10 x 6 mm package • 50-ohm in/out with integrated Doherty reduces external component out
- 24. COMPANY PUBLIC 23 COMPANY PUBLIC 23 Devices Dual-stage PA • AFSC5G23D37 • AFSC5G26D37 • AFSC5G35D37 • AFSC5G37D37 • AFSC5G35D35 10x6 mm2 LNA + switch • AFRX5G272 • AFRX5G372 6.2x6.2 mm2 Pre-driver • AFLP5G25641 • AFLP5G35645 4x3 mm2 Airfast 5G MCM Enablement – Reference Circuits & Reference Designs Reference Design Reference Circuits Documentation (data pack, dxf drawings) available from nxp.com Orderable P/N: “device#”-EVB (ex: AFSC5G37D37-EVB) $250 MSRP Reference Designs Reference Design: AFDEV5G-26D37 Reference Design: AFDEV5G-35D37 More details on AFDEV5G-26D37 More details on AFDEV5G-35D37 Orderable Q4 2019 Available now Orderable Sep 2019 Pre-driver, PA and LNA together
- 25. COMPANY PUBLIC 24 COMPANY PUBLIC 24 Part Number Decoder AFSC5G35D37T2 5G Family 2000 pcs reel size (MPQ) NXP’s RF Signature for Cellular Infrastructure: Airfast System-in-compact package Frequency band dBm Avg Power Doherty Series PA Modules: AFLP5G35645T5 Linear Pre-driver Frequency band 5000 pcs reel size (MPQ) Pre-Drivers: AFRX5G372T4 Receiver Frequency band Generation 2500 pcs reel size (MPQ) Rx Modules: Back to portfolio selection Back to 5G portfolio Introduction
- 26. COMPANY PUBLIC 25 COMPANY PUBLIC 25 Introducing Airfast 5G MCM Solutions – 28 V LDMOS Average Output Power 2300 MHz 2400 MHz 2500 MHz 2600 MHz 2700 MHz ~ 3400 MHz 3500 MHz 3600 MHz 3700 MHz 3800 MHz AFSC5G23D37 AFSC5G26D37 AFSC5G35D35 AFSC5G35D37 AFSC5G37D37 5 W 37 dBm 27 dB gain, 38% PAE 2300-2400 MHz 27 dB gain, 38% PAE 2545-2655 MHz 27 dB gain, 36% PAE 3400-3600 MHz 29 dB gain, 38% PAE 3600-3800 MHz 29 dB gain, 38% PAE 3400-3600 MHz PA MCMs: Rx Front-end Modules (LNA + switch): Pre-Driver Amplifiers: 29 dBm AFLP5G25641 2300-2700 MHz AFLP5G35645 3400-3800 MHz AFRX5G272 2300-2700 MHz AFRX5G372 3300-4200 MHz 3 W 35 dBm Test conditions: PAE @ 8-8.5 dB OBO ✓ Simple DPD ✓ ACPR < -50 dBc w/ 2x20MHz LTE 7.5dB PAR
- 27. COMPANY PUBLIC 26 COMPANY PUBLIC 26 mMIMO Power budget BTS Total Pout (W) BTS Total Pout (dBm) MIMO (#) Antenna Pout (W) Antenna Pout (dBm) PA avg Pout (W) PA avg Pout (dBm) Losses (dB) 320 55 16 20.0 43 32 45 2 240 54 16 15.0 42 24 44 2 200 53 16 12.5 41 20 43 2 320 55 32 10.0 40 16 42 2 240 54 32 7.5 39 12 41 2 200 53 32 6.3 38 10 40 2 160 52 16 10.0 40 16 42 2 100 50 16 6.3 38 10 40 2 320 55 64 5.0 37 8 39 2 240 54 64 3.8 36 6 38 2 200 53 64 3.1 35 5 37 2 160 52 32 5.0 37 8 39 2 100 50 32 3.1 35 5 37 2 3 35 4 0.8 29 1.27 31 2
- 28. COMPANY PUBLIC 27 COMPANY PUBLIC 27 AFSC5G37D37 Typical line-up: • 3600-3800 MHz • 37 dBm / 5 W avg (45.6 dBm / 36 W peak) • 28 V LDMOS • 50-ohm in/out, dual-stage MCM with Doherty combiner • 38% efficiency @ 8 dB OBO • 29 dB gain • 10x6 mm2 over-molded plastic package Comments: • Designed for 240 W, 64T mMIMO active antennas for the B48 • In production • Reference circuit: AFSC5G37D37-EVB available Reference Circuit: Pout = 5 W avg., VDD = 29 V, 1x 20 MHz LTE, Input PAR 8 dB Carrier Center Frequency Gain (dB) ACPR (dBc) PAE (%) 3600 MHz 29.5 -32.4 39% 3700 MHz 29.7 -33.6 38% 3800 MHz 29.9 -34.4 38% Final stage: AFSC5G37D37 Driver: AFLP5G35645 RX Module: AFRX5G372
- 29. COMPANY PUBLIC 28 COMPANY PUBLIC 28 AFSC5G35D37 Typical line-up: • 3400-3600 MHz • 37 dBm / 5 W avg (45.6 dBm / 36 W peak) • 28 V LDMOS • 50-ohm in/out, dual-stage MCM with Doherty combiner • 39% efficiency @ 8 dB OBO • 29 dB gain • 10x6 mm2 over-molded plastic package Comments: • Designed for 240 W, 64T mMIMO active antennas for the B42 • In production • Reference circuit: AFSC5G35D37-EVB available Reference Circuit: Pout = 5 W avg., VDD = 29 V, 1x 20 MHz LTE, Input PAR 8 dB Final stage: AFSC5G35D37 Driver: AFLP5G35645 RX Module: AFRX5G372 Carrier Center Frequency Gain (dB) ACPR (dBc) PAE (%) 3400 MHz 29.2 -31.4 39% 3500 MHz 29.3 -32.8 39% 3600 MHz 29.4 -31.0 39%
- 30. COMPANY PUBLIC 29 COMPANY PUBLIC 29 AFSC5G35D35 Typical line-up: • 3400-3600 MHz • 35 dBm / 3 W avg (43 dBm / 20 W peak) • 28 V LDMOS • 50-ohm in/out, dual-stage MCM with Doherty combiner • 37% efficiency @ 8 dB OBO • 25 dB gain • 10x6 mm2 over-molded plastic package Comments: • Designed for 240 W, 64T mMIMO active antennas for the B42 • In production • Reference circuit: AFSC5G35D35-EVB available Reference Circuit: Pout = 3 W avg., VDD = 24 V, 1x 20 MHz LTE, Input PAR 8 dB Final stage: AFSC5G35D35 Driver: AFLP5G35645 RX Module: AFRX5G372 Carrier Center Frequency Gain (dB) ACPR (dBc) PAE (%) 3400 MHz 25.3 -27.6 37% 3500 MHz 24.9 -30.8 37% 3600 MHz 24.8 -32.9 35%
- 31. COMPANY PUBLIC 30 COMPANY PUBLIC 30 AFSC5G26D37 Typical line-up: • 2496-2690 MHz • 37 dBm / 5 W avg (45.7 dBm / 37 W peak) • 28 V LDMOS • 50-ohm in/out, dual-stage MCM with Doherty combiner • 40% efficiency @ 8 dB OBO • 27 dB gain • 10x6 mm2 over-molded plastic package Comments: • Designed for 200 W, 64T mMIMO active antennas for the B41 • In production • Reference circuit: AFSC5G26D37-EVB available Reference Circuit: Pout = 5 W avg., VDD = 28 V, 1x 20 MHz LTE, Input PAR 8 dB Final stage: AFSC5G26D37 Driver: AFLP5G25641 RX Module: AFRX5G272 Carrier Center Frequency Gain (dB) ACPR (dBc) PAE (%) 2575 MHz 27.4 –27.8 40% 2600 MHz 27.2 –27.9 40% 2625 MHz 27.1 –27.7 40%
- 32. COMPANY PUBLIC 31 COMPANY PUBLIC 31 AFSC5G23D37 Typical line-up: • 2300-2400 MHz • 37 dBm / 5 W avg (45.7 dBm / 37 W peak) • 28 V LDMOS • 50-ohm in/out, dual-stage MCM with Doherty combiner • 38% efficiency @ 8 dB OBO • 27 dB gain • 10x6 mm2 over-molded plastic package Comments: • Designed for 240 W, 64T mMIMO active antennas for the B40 • In production • Reference circuit: AFSC5G23D37-EVB available Reference Circuit: Pout = 5 W avg., VDD = 26 V, 1x 20 MHz LTE, Input PAR 8 dB Final stage: AFSC5G23D37 Driver: AFLP5G25641 RX Module: AFRX5G272 Carrier Center Frequency Gain (dB) ACPR (dBc) PAE (%) 2575 MHz 27.4 –27.8 40% 2600 MHz 27.2 –27.9 40% 2625 MHz 27.1 –27.7 40%
- 33. COMPANY PUBLIC 32 COMPANY PUBLIC 32 AFLP5G35645 Functional Block Diagram: Typical line-up: • 3400-3800 MHz pre-driver • 29 dBm avg (25 dBm @ 3.3 V) • 5 V GaAs • 50-ohm in/out, 3-stage MCM with 1.8 V logic control pin for bias enable/disable TDD operation. • Very low power consumption: 158 mW @ 5 V (114 mW @ 3.3 V) • 4x3 mm2 plastic package Comments: • Pre-driver for AFSC5G37D37, 35D37, 35D35 • In development, qualification planned end Q4 2019 MATCH CONTROLLER GND GND GND GND GND GND VCC2 GND EN VCC1 GND LLS RFIN GND GND RFOUT Final stage: AFSC5G35D37 Driver: AFLP5G35645 RX Module: AFRX5G372
- 34. COMPANY PUBLIC 33 COMPANY PUBLIC 33 AFLP5G25641 Functional Block Diagram: Typical line-up: • 2300-2700 MHz pre-driver • 29 dBm avg (25 dBm @ 3.3 V) • 5 V GaAs • 50-ohm in/out, 3-stage MCM with 1.8 V logic control pin for bias enable/disable TDD operation. • Very low power consumption: 158 mW @ 5 V (114 mW @ 3.3 V) • 4x3 mm2 plastic package Comments: • Pre-driver for AFSC5G23D37, 26D37 • In development, qualification planned end Q4 2019 MATCH CONTROLLER GND GND GND GND GND GND VCC2 GND EN VCC1 GND LLS RFIN GND GND RFOUT Final stage: AFSC5G26D37 Driver: AFLP5G25641 RX Module: AFRX5G272
- 35. COMPANY PUBLIC 34 COMPANY PUBLIC 34 AFRX5G372 Functional Block Diagram: Typical line-up: Comments: • Rx for AFSC5G37D37, 35D37, 35D35 • In development, qualification planned in Q1 2020 • Support circuitry to work from a 5 V supply and a 1.8 logic-level T/R control • Support Tx and Rx modes, which are controlled by T/R logic signaling • 3300-5000 MHz • 5 V GaAs LNA + switch • Noise Figure: 1.3 dB • Gain 33dB • 50-ohm in/out • 6.2x6.2 mm2 plastic package PA Controller LNA LNA Rx Tx Tx / Rx Digital control (1.8 V JEDEC) VDD (5 V) 6.2 x 6.2 LGA P in switch Final stage: AFSC5G35D37 Driver: AFLP5G35645 RX Module: AFRX5G372
- 36. COMPANY PUBLIC 35 COMPANY PUBLIC 35 AFRX5G272 Functional Block Diagram: Typical line-up: • 2300-2700 MHz LNA + switch • Noise Figure: 1.3 dB • 5 V GaAs • Gain 33dB • 50-ohm in/out • 6.2x6.2 mm2 plastic package Comments: • Rx for AFSC5G23D37, 26D37 • In development, qualification planned in Q1 2020 • Support circuitry to work from a 5 V supply and a 1.8 logic-level T/R control • Support Tx and Rx modes, which are controlled by T/R logic signaling PA Controller LNA LNA Rx Tx Tx / Rx Digital control (1.8 V JEDEC) VDD (5 V) 6.2 x 6.2 LGA P in switch Final stage: AFSC5G26D37 Driver: AFLP5G25641 RX Module: AFRX5G272
- 37. COMPANY PUBLIC 36 COMPANY PUBLIC 36 AFDEV5G-35D37 Reference Design Functional Block Diagram: Typical line-up: • 3400-3600 MHz • 30 V LDMOS • 5 W AVG, 37 dBm • Integrated RF design • 50 ohm input/output • In development, orderable Q1 2020 Design Size: 20.95 mm 38.35 mm 57.15 mm 34.52 mm Total height including cover 9.7 mm Tx In I2C ENABLE RX OUT RF PA CONTROL BYPASS AFRX5G372 AFLP5G35647 BIAS CONTROLLER AFSC5G35D37 T/R SWITCH TO ANTENNA FEEDBACK OUT BYPASS TX OUT / RX IN CONTROL DAC0 DAC1 Final stage: AFSC5G35D37 Driver: AFLP5G35645 RX Module: AFRX5G372
- 38. COMPANY PUBLIC 37 COMPANY PUBLIC 37 AFDEV5G-26D37 Reference Design Functional Block Diagram: Typical line-up: • 2496-2690 MHz • 30 V LDMOS • 5 W AVG, 37 dBm • Integrated RF design • 50 ohm input/output • In development, orderable Q1 2020 Design Size: 20.95 mm 38.35 mm 57.15 mm 34.52 mm Total height including cover 9.7 mm Tx In I2C ENABLE RX OUT RF PA CONTROL BYPASS AFRX5G272 AFLP5G25641 BIAS CONTROLLER AFSC5G26D37 T/R SWITCH TO ANTENNA FEEDBACK OUT BYPASS TX OUT / RX IN CONTROL DAC0 DAC1 Final stage: AFSC5G26D37 Driver: AFLP5G25641 RX Module: AFRX5G272
- 39. COMPANY PUBLIC 38 RF Circuit Collection
- 40. COMPANY PUBLIC 39 Full Set of Design Support Tools On-Demand Accessibility Proven RF Designs
- 41. COMPANY PUBLIC 40 Announced in October
- 42. COMPANY PUBLIC 41 COMPANY PUBLIC 41 What is it? • The RF Circuit Collection is a unique tool to quickly search for the right board, order a fully assembled board, and obtain reference circuit design files • It resides on NXP.com and available to the general public with no special log-in required • It provides access to over 400 reference circuits − 60 orderable board part#s with distributor inventory − 80 downloadable design files − Quick access to request hundreds of other assembled specialty boards
- 43. COMPANY PUBLIC 42 Request Specialty Boards Go to www.nxp.com/RFCollection Search Frequency Power Gain Voltage Download Design Files Order Fully Assembled Boards RF Circuit Collection
- 44. COMPANY PUBLIC 43 What’s inside the zip file?
- 45. COMPANY PUBLIC 44 Orderable Part# Design File Not Rec For New Design Specialty Board Buy Direct X X X X X X X RF Circuit Collection Remember: All boards with the button have orderable NXP part numbers. Examples: • MRF101AN-27MHZ • AFIC901N-135MHZ • AFV10700H-1090 All others can be special ordered directly from NXP
- 46. COMPANY PUBLIC 45 Let’s Try It! www.nxp.com/RFCollection
- 47. NXP and the NXP logo are trademarks of NXP B.V. All other product or service names are the property of their respective owners. © 2019 NXP B.V.