This document summarizes a Six Sigma project to reduce die set location issues on Press Line #1. The problem was that dies were not clamping properly during die set due to location errors, breaking locating pins and causing downtime. The team revised the die location bolster pin system by extending the pin engagement and adding hardened inserts to bolster holes. This solved the problem, eliminating die location failures and associated downtime since implementation in January 2021. The goal of reducing die set location issues by 50% was achieved.

1. KCISP
SIX-SIGMA COST PANEL
Location: Press Line #1
Project: Die Set Die Location

2. 6-PANEL DEFINE VOICE OF THE CUSTOMER
D M A I C R
Team Members:
 Todd Beck, Team Leader Press
 Tim Lemka, Team Leader Press
 Andy Gray, Team Leader Press
 James Whaley, Process Coach
 William Spicer, Process Coach
 Roderick Howard, Process Coach
 Ivy Poole and Warren Decker, Die Setters
 Scott Boylan and Randy Gorham, Die Setters
 Dylan Jones and Robert Oates, Die Setters
 Matthew Hunt & Bill Hodges, Project Leader
 Todd Zellak, Project Owner
 Bill Hodges and Todd Zellak, Project Champions
Project Location: Press Line 1 KCISP
Project Completion Date: 1/28/2021
SIX-SIGMA PANEL

3. 6-PANEL
PROBLEM STATEMENT
During the Die Set process dies do not
clamp properly as a result of die
location errors resulting in locating
pins breaking resulting in excessive
DEFINE VOICE OF THE CUSTOMER
D M A I C R
VOICE OF THE CUSTOMER:
Die Sets not clamping properly result in excessive downtime.
CTQ/CTC STATEMENT (Critical To Quality/Cost - Customer Requirement):
Die Set process must be completed in 6 minutes or less to maintain schedule.
COST OF POOR QUALITY/COST:
Extended die set time, process inefficiencies. 3 major occurrences in 2020 resulted in 140 minutes of
downtime and potential to require an extra shift to catch up.
SCOPE AND GOAL:
Reduced die set location issues by 50%.
Plant: KCISP
Line: Stamping Press #1
Area: Stamping Press
Part/Process Name: Die Set Process

4. 6-PANEL DEFINE VOICE OF THE CUSTOMER
D M A I C R
 Process

5. 6-PANEL
Method (Process)
Environment
Reduce die
location related
downtime 50%
Manpower
Material Machine
- Gripper Crane
- Level
OIS Crane
Operator
D M A I C R
MEASURE
 KPOV and KPIVs – Cause & Effect Diagram
- Bolsters
Gripper
Crane
Operators
WDX Locator
Pin System
Standards
X1
Key Process Input Variables: In Y = f(X)
X1 = Revise WDX Standards Die Locating Pin System

6. 6-PANEL DEFINE VOICE OF THE CUSTOMER
D M A I C R
New Design Old Design
 Key Process Input Variable #X1: Die Location Bolster Pin System
Bolster pin
engagement
to 50mm
from 25 mm
increases
robustness
of process

7. 6-PANEL DEFINE VOICE OF THE CUSTOMER
D M A I C R
B1 14 holes
B2 14 Holes
B3 16 holes
B4 14 holes
Bolster holes drilled out and hardened inserts Installed C and D sides
 Key Process Input Variable #X1: Die Location Bolster Pin System

8. 6-PANEL D M A I C R
ANALYZE & IMPROVE
 Key Process Input Variable #X1: Die Location Bolster Pin System
YTD (10/22) 140 minutes
0 die location failures since shutdown work as of 1/21/21.
BEFORE:
AFTER:
17 HEADS $40.50 8 HOURS = $5,508 Per Shift
3 occurrences resulted in Stamping having to run Production on 3 Saturdays to make
up lost time.
TOTAL $16,524

9. 6-PANEL
 Replication: Where else in the Area or Plant can this be
replicated?
D M A I R
REPLICATE
C
 This is a replication project that was developed jointly with Stamping
Engineering, DSP and KSP.
 DSP and KSP have partially implemented.
 KCISP will move forward with P2 as required.

10. 6-PANEL
Appendix

11. 6-PANEL DEFINE VOICE OF THE CUSTOMER
D M A I C R
 Process

12. 6-PANEL DEFINE VOICE OF THE CUSTOMER
D M A I C R

13. 6-PANEL DEFINE VOICE OF THE CUSTOMER
D M A I C R
New Design Old Design
 Key Process Input Variable #X1: Die Location Bolster Pin System

14. 6-PANEL DEFINE VOICE OF THE CUSTOMER
D M A I C R
Bolster Pin New Style Bolster Sleeve Hardened Inserts
Revised Die Location Bolster Pin System
 Key Process Input Variable #X1: Die Location Bolster Pin System
Hardened inserts allow tighter tolerances
and reduce location errors.