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Bulletin of Electrical Engineering and Informatics
Vol. 8, No. 1, March 2019, pp. 172~179
ISSN: 2302-9285, DOI: 10.11591/eei.v8i1.1410  172
Journal homepage: http://beei.org/index.php/EEI
Design of Ku-band power divider using Substrate Integrated
Waveguide technique
Tan Gan Siang1
, David Paul David Dass2
, Siti Zuraidah Ibrahim3
, Mohd Nazri A. Karim4
, Aliya
A. Dewani5
1,2,3
School of Computer & Communication Engineering, Universiti Malaysia Perlis, Malaysia
4
Department of Electronic Engineering Technology, Faculty of Engineering Technology, Universiti Malaysia
Perlis, Malaysia
5
Center for Wireless Monitoring and Applications, School of Electrical Engineering, Griffith University,
Brisbane, Australia
Article Info ABSTRACT
Article history:
Received Oct 19, 2018
Revised Nov 23, 2018
Accepted Jan 8, 2019
A Ku-band Substrate Integrated Waveguide power divider is proposed. In
this work, the SIW power divider is designed with T-junction configuration.
The SIW technique enables the power divider to have low insertion loss, low
cost and features uniplanar circuit. An additional of metallic via hole is added
in the center of the junction to improve the return loss performance of the T-
junction SIW power divider. The simulated input return losses at port 1 are
better than 27 dB, and features equal power division of about -3.1 dB ±0.4
dB at both output ports across frequency range of 13.5-18 GHz. The SIW
power divider is fabricated, and the measurement results show acceptable
performances. Since there are some losses contributed by the SMA connector
of the fabricated SIW power divider prototype, an additional SIW
transmission line is simulated and fabricated to analyze the connector loss.
Keywords:
Metallic via hole
Power divider
Substrate Integrated Waveguide
T-junction
Copyright © 2019 Institute of Advanced Engineering and Science.
All rights reserved.
Corresponding Author:
Siti Zuraidah Ibrahim,
School of Computer and Communication Engineering (SCCE),
Universiti Malaysia Perlis,
First Floor, Pauh Putra Campus, 02600 Arau, Perlis, Malaysia.
Email: sitizuraidah@unimap.edu.my
1. INTRODUCTION
In microwave systems, one of the crucial components used to divide signal power is power divider.
This component is mostly used in the transmission line for the communication and antenna system which
needs around the laboratory for the help of developing, maintenance, configuration, calibration, and for the
help of designing new microwave equipment or devices. The power divider is one of the passive electronic
devices. This type of power divider is used in many microwave application, such as the distribution of low
power signal for two or multiple antennas and intermodulation distortion measurement where the power
divider is used to combine two power signal and produce one signal outputs [1].
From the microwave research trend, the substrate integration innovation of SIW is an appropriate
design for the improvement of microwaves signal propagation. SIW is the simplest method to use in
microwave component because of the immaterial radiation losses, particularly for wide frequency
applications, and give the likelihood to be fabricated in planar innovations. An SIW design is similar to the
standard rectangular waveguide. It is worked by applying a dielectric substrate inside two metal layers, then
transmitting the signal in the form of the electromagnetic field with the arrangement of two columns of
metalised vias on both sides. Also, the rising methods coordinate the propagation of microwave in the active
and passive devices such as the power divider [2]. The SIW technique also has been used in the design of
coupler [3], antenna [4] and filter [5].
Bulletin of Electr Eng and Inf ISSN: 2302-9285 
Design of Ku-band power divider using Substrate Integrated Waveguide technique (Tan Gan Siang)
173
A few SIW power dividers designs were demonstrated in the past few years [6-12]. Those designing
methods have been proposed to develop the SIW power divider with different materials and different
operating band. The SIW power divider with T-Junction configuration is done on Ku-Band [6], Ka-band [7]
and 10-15 GHz frequency band [8]. Others configuration such as Half-mode SIW [9, 10] and DGS
technology [11] is also proposed. There is also an SIW power divider for Antenna Feed systems [12]. The T-
junction configuration SIW power divider has been used in the design of the SIW six-port [13].
An SIW power divider working on Ku-Band is presented in this paper. As compared to the
previously published works on SIW power divider, this SIW power divider is easier to design with the T-
junction configuration and can further optimize the insertion loss performance with the additional via hole.
The presented SIW power divider is using a T-junction configuration and has a low insertion loss and can
function as a power splitter.
2. CONFIGURATION AND DESIGN
The structure of the SIW power divider is formed by T-junction configuration. The design layout
had been presented in Figure 1. As depicted in Figure 1, the parameters Weq and Wtp represent the equivalent
width of the SIW structure and the tapper width respectively. The parameter d represents the diameter of the
via while the separation of via is represented by parameter p. Xp is the length to be optimised to achieve the
required operating frequency of the SIW power divider.
Figure 1. SIW power divider configuration
For SIW method, the mode that will be appeared is the TE10 modes as the dominant mode. The
dimension for designing the Ku-band power divider can be obtained from the mathematical expression
written as (1) and (2) [14]:
1
2
)
10
(
95
.
0
2
−









−

=
p
d
W
c
f
r
TE
c

(1)
p
d
W
Weff

−
=
95
.
0
2
(2)
where c, εr, W, d and p are the speed of light, dielectric permittivity of the substrate, the width of the SIW,
diameter and the separation between the via holes respectively.
In order to minimize the signal leakage between vias holes, the via holes design must follow the
following parametric conditions written as expression (3), (4), and (5) [15-16]:
25
.
0
/ 
c
p  (3)
 ISSN: 2302-9285
Bulletin of Electr Eng and Inf, Vol. 8, No. 1, March 2019 : 172 – 179
174
5
/
g
d 
 (4)
d
p
d 2

 (5)
where λc and λg is the cutoff wavelength and the guided wavelength respectively.
The metallic via hole is placed at the centre between port 2 and port 3. According to fundamental of
the waveguide transmission theory, the metallic via hole is equivalent to a susceptance. The changing of the
position of Xp can change the reflecting and scattering signal of the input signal. Three tapered lines are
chosen as the transition between the microstrip line and SIW for each of the input and output port to provide
the matching to the 50 Ω microstrip line.
3. SIMULATED AND MEASURED RESULTS
The SIW power divider is constructed using a RO4003C substrate having εr=3.38 and the
thickness=0.508 mm. The centre via, Xp has been added to achieve better return losses performance. Some
parametric studies are performed on Xp to obtain the overall optimized performance on the proposed SIW
power divider.
The distance of the metallic via hole to the bottom vias, Xp has been adjusted to 2.78 mm and 4.83
mm and the simulated results are shown in Figure 2. When Xp is at 2.78 mm which is below the centre of the
output ports, the bandwidth of reflection coefficient, S11 is increase over a wide band while the performance
is degraded when the Xp at 4.83 mm. With this value, the operational bandwidth is limited to the frequency
range of 13.15 GHz to 15.32 GHz. Therefore the value of Xp should not be more than ½ of the Weq value
from bottom vias.
(a)
(b)
Figure 2. Simulation results of S11 (a) After Xp adjusted to 4.83 mm and (b) After Xp adjusted to 2.78 mm
Bulletin of Electr Eng and Inf ISSN: 2302-9285 
Design of Ku-band power divider using Substrate Integrated Waveguide technique (Tan Gan Siang)
175
(a)
(b)
Figure 3. Simulation results of S12 and S13 (a) After Xp adjusted to 4.83 mm, (b) Xp adjusted to 2.78 mm
The results for insertion loss S12 and S13 are shown on Figure 3. When Xp is at 4.83 mm, the signal
achieved is -4 dB ±0.7 dB across frequency range of 13.15 GHz to 18 GHz. After Xp is adjusted to 2.78 mm,
the insertion loss is improved to -3.3 dB ±0.2 dB accross 13.2 GHz to 18 GHz. The signal level achieved is
better by which the signal is more constant which is have a flat coupling response.
After the parametric study, the dimensions of the SIW T-junction power divider are determined.
Table 1 shows the optimised dimensions of SIW power divider. After that, the SIW power divider is
fabricated to verify the results. The fabricated SIW power divider is shown in Figure 4. Comparison between
the simulation and measurement results is shown in Figure 5.
Table 1. Parameter values of SIW T-junction power divider
Parameter Weq Wstep d p Xp
Dimension (mm) 8.159 4.024 0.6 0.7 2.78
Figure 4. Fabricated SIW power divider
 ISSN: 2302-9285
Bulletin of Electr Eng and Inf, Vol. 8, No. 1, March 2019 : 172 – 179
176
(a)
(b)
(c)
Figure 5. Comparison of SIW power divider simulation and measurement results (a) Return loss at Port 1
(S11) (b) Insertion loss at Port 2 (S21) (c) Insertion loss at Port 3 (S31)
The simulated results of S21 and S31 are about -3.1 ±0.4 dB across the frequency range of
13.5 GHz-18 GHz, which shows an equal power division between port 2 and 3. The simulated return loss at
port 1 is better than is 10 dB across 13 GHz to 18 GHz while the measured result of S11 indicates an
operational frequency range of 15.4 GHz to 18 GHz. The measured results of the fabricated SIW power
divider are slightly degraded about 2 dB loss for both S21 and S31.
The main losses occurred in the measured results is due to the connector loss. The imperfect
fabrication also contributed to the loss and imbalance amplitude of power division of the SIW power divider
measurement results. An SIW transmission line is fabricated to investigate the loss caused by the connector.
The fabrication of the SIW line is shown in Figure 6. The results of the simulation and measurement are
shown in Figure 7.
Bulletin of Electr Eng and Inf ISSN: 2302-9285 
Design of Ku-band power divider using Substrate Integrated Waveguide technique (Tan Gan Siang)
177
Figure 6. Fabricated SIW transmission line
(a)
(b)
Figure 7. Comparison of simulated and measured results (a) S11 (b) S21of SIW transmission line
As depicted in Figure 7, the measured S21 result of the connector is degraded about 2 dB insertion
losses and more significant at high frequency. The measured result of S11 result also indicates degraded
reflection coefficient performance of the fabricated connector.
Comparison of the SIW power divider to the previously researched SIW power divider is made to
show the advantage of the design. The comparison between the simulation insertion losses of the SIW power
dividers is shown in Table 2. The comparisons show that the proposed SIW power divider has lower
insertion loss.
 ISSN: 2302-9285
Bulletin of Electr Eng and Inf, Vol. 8, No. 1, March 2019 : 172 – 179
178
Table 2. Comparison of SIW power dividers performance in simulation
References Operating Frequency (GHz) Substrate Topology Insertion loss (dB)
[3] 18-26.5 Not available T-junction 3.45 ±0.5
[5] 8.5-16 RO4350 Y-junction 3.9 ±0.2
[6] 8.25-12.25 RT5880
Half-mode
with slots and
resistor
4.0 ±0.5
[7] 8-9.4 RT5880
T-junction
with slots
4.0 ±0.3
This work 13.5-18 RO4003 T-junction 3.1 ±0.4
4. CONCLUSION
A Ku-band T-junction SIW power divider has been presented. The additional via successfully
enhanced the insertion loss performance. As a result, the simulated input return losses at port 1 are better than
27 dB and features equal power division of about -3.1 dB ±0.4 dB at both output ports across frequency
range of 13.5-18 GHz. The SIW power divider has been fabricated, and the measurement results show
acceptable performances. An additional SIW transmission line has been simulated and fabricated to analyze
the connector loss to verify the degraded performances of the measured results caused by the connector
performances.
ACKNOWLEDGEMENTS
The author would like to acknowledge the support from the Fundamental Research Grant Scheme
(FRGS) under a grant number of FRGS/1/2015/TK04/UNIMAP/02/16 from the Ministry of Higher
Education Malaysia.
REFERENCES
[1] Anonymous, "Differences in Application Between Power Dividers and Power Splitters," Keysight Technology,
USA, 2018.
[2] L. J. Berens, "Design, analysis, and construction of an equal split Wilkinson power divider.," Marquette
University, 2012.
[3] B. Rahali and M. Feham, "Design of K-Band substrate integrated waveguide coupler, circulator and power divider,"
International Journal of Information and Electronics Engineering, vol. 4, no. 1, pp. 47-53, 2014.
[4] A. Nasri, H. Zairi and A. Gharsallah, "Single Balanced Mixer Using Substrate Integrated Waveguide (SIW) 90°
Coupler," International Journal of Engineering and Technology, vol. 8, no. 1, pp. 61-65, 2016.
[5] O. Caytan, S. Lemey, S. Agneessens and H. Rogier, "SIW antennas as hybrid energy harvesting and power
management platforms for the internet of things," International Journal of Microwave and Wireless Technologies,
vol. 8, no. 4-5, pp. 767-775, 2016.
[6] F. Huang, J. Zhou and W. Hong, "Ku band continuously tunable circular cavity SIW filter with one parameter,"
IEEE Microwave and Wireless Components Letters, vol. 26, no. 4, pp. 270-272, 2016.
[7] B. Rahali and M. Feham, "Design of V-band substrate integrated waveguide power divider, circulator and coupler,"
Computer Science & Information Technology (CS & IT), pp. 35-44, 2013.
[8] N. A. Smith and R. Abhari, "Compact substrate integrated waveguide Wilkinson power dividers," 2009 IEEE
Antennas and Propagation Society International Symposium, Charleston, SC, 2009, pp. 1-4.
[9] Z. Yang, W. Chen, H. Lin, Y. Tao and H. Jin, "A novel SIW power divider with good out-of-band rejection and
isolation," IEICE Electronics Express, vol. 13, no. 8, pp. 1-6, 2016.
[10] Z. He, J. Cai, Z. Shao, X. Li and Y. Huang, "A novel power divider integrated with SIW and DGS technology,"
Progress In Electromagnetics Research, vol. 139, pp. 289-302, 2013.
[11] Z. Kordiboroujeni and J. Bornemann, "Efficient design of Substrate Integrated Waveguide power dividers for
antenna feed systems," 2013 7th European Conference on Antennas and Propagation (EuCAP), Gothenburg, 2013,
pp. 352-356.
[12] Y. Cassivi, L. Perregrini, P. Arcioni, M. Bressan, K. Wu and G. Conciauro, "Dispersion characteristics of substrate
integrated rectangular waveguide," IEEE Microwave and Wireless components letters, vol. 12, no. 9,
pp. 333-335, 2002.
[13] M. Jafari, G. Moradi, R. SHIRAZI and R. Mirzavand, "Design and implementation of a six-port junction based on
substrate integrated waveguide," Turkish Journal of Electrical Engineering & Computer Sciences, vol. 25, no. 3, pp.
2547-2553, 2017.
[14] D. Deslandes and K. Wu, "Accurate modeling, wave mechanisms, and design considerations of a substrate
integrated waveguide," IEEE Transactions on microwave theory and techniques, vol. 54, no. 6,
pp. 2516-2526, 2006.
[15] K. Wu, D. Dominic and C. Yves, "The substrate integrated circuits-a new concept for high-frequency electronics
and optoelectronics," in 6th International Conference on Telecommunications in Modern Satellite, Cable and
Broadcasting Service, 2003. TELSIKS 2003, Nis, 2003.
Bulletin of Electr Eng and Inf ISSN: 2302-9285 
Design of Ku-band power divider using Substrate Integrated Waveguide technique (Tan Gan Siang)
179
[16] F. Xu and K. Wu, "Guided-wave and leakage characteristics of substrate integrated waveguide," IEEE Transactions
on microwave theory and techniques , vol. 53, no. 1, pp. 66-73, 2005.
BIOGRAPHIES OF AUTHORS
Tan Gan Siang received his Master of Science in Electronic Engineering from Universiti
Teknikal Malaysia Melaka (UTeM), Malaysia, in 2015. He is currently working toward his PhD
at School of Computer & Communication Engineering, Universiti Malaysia Perlis, Malaysia. His
research interests include microwave integrated circuits.
David Paul A/L David Dass received his Bachelor of Engineering (Communication Engineering)
from Universiti Malaysia Perlis (UniMAP), Malaysia, in 2017. His research interests include
microwave integrated circuits.
Dr. S. Z. Ibrahim was born in Limbang, Sarawak, Malaysia in 1981. She has a Bachelor of
Engineering in Telecommunication from the University of Malaya, Malaysia in 2004 and Master
of Engineering from University Technology of Malaysia in 2008. She received her PhD degrees
from University of Queensland Australia in 2012. She is currently working as a senior lecturer in
the School of Computer and Communication Engineering at Universiti Malaysia Perlis,
Malaysia. Most of her research interest is related to microwave components and its application.
Ts. Dr Mohd Nazri A Karim is a Senior Lecturer at the Department of Electronic Engineering
Technology, Faculty of Engineering Technology, Universiti Malaysia Perlis (UniMAP),
Malaysia. He received his PhD in communication engineering from the School of Computer and
Communication Engineering at Universiti Malaysia Perlis (UniMAP), Malaysia. His Master and
Bachelor Degree in Electronics (Telecommunication) Engineering from Universiti Teknologi
Malaysia (UTM), Malaysia in 2010 and 2006 respectively. He also a member of BEM, MBOT
and IEEE Member. His research interests include antenna and propagation, microwave
component and Radar technology especially in Ground Penetrating Radar (GPR).
Dr. Aliya A. Dewani (M’12) received the B. Eng. degree (Gold Medalist) from the University of
Kashmir, Srinagar, India, in 2005, the M. Eng. degree from University Technology Malaysia,
Malaysia, in 2007, and the Ph.D. degree in electrical engineering from Griffith University,
Brisbane, QLD, Australia, in 2016. Her doctoral research focused on the analysis and design of
frequency selective surfaces on thin conformal transparent substrates using screen printing
technology. She is currently a sessional lecturer with the Griffith School of Electrical
engineering, Griffith University. Her current research interests include computational
electromagnetics, design and modeling of engineered structures with novel electromagnetic
behavior, multiple scattering, and antenna measurements.

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Design of Ku-band power divider using Substrate Integrated Waveguide technique

  • 1. Bulletin of Electrical Engineering and Informatics Vol. 8, No. 1, March 2019, pp. 172~179 ISSN: 2302-9285, DOI: 10.11591/eei.v8i1.1410  172 Journal homepage: http://beei.org/index.php/EEI Design of Ku-band power divider using Substrate Integrated Waveguide technique Tan Gan Siang1 , David Paul David Dass2 , Siti Zuraidah Ibrahim3 , Mohd Nazri A. Karim4 , Aliya A. Dewani5 1,2,3 School of Computer & Communication Engineering, Universiti Malaysia Perlis, Malaysia 4 Department of Electronic Engineering Technology, Faculty of Engineering Technology, Universiti Malaysia Perlis, Malaysia 5 Center for Wireless Monitoring and Applications, School of Electrical Engineering, Griffith University, Brisbane, Australia Article Info ABSTRACT Article history: Received Oct 19, 2018 Revised Nov 23, 2018 Accepted Jan 8, 2019 A Ku-band Substrate Integrated Waveguide power divider is proposed. In this work, the SIW power divider is designed with T-junction configuration. The SIW technique enables the power divider to have low insertion loss, low cost and features uniplanar circuit. An additional of metallic via hole is added in the center of the junction to improve the return loss performance of the T- junction SIW power divider. The simulated input return losses at port 1 are better than 27 dB, and features equal power division of about -3.1 dB ±0.4 dB at both output ports across frequency range of 13.5-18 GHz. The SIW power divider is fabricated, and the measurement results show acceptable performances. Since there are some losses contributed by the SMA connector of the fabricated SIW power divider prototype, an additional SIW transmission line is simulated and fabricated to analyze the connector loss. Keywords: Metallic via hole Power divider Substrate Integrated Waveguide T-junction Copyright © 2019 Institute of Advanced Engineering and Science. All rights reserved. Corresponding Author: Siti Zuraidah Ibrahim, School of Computer and Communication Engineering (SCCE), Universiti Malaysia Perlis, First Floor, Pauh Putra Campus, 02600 Arau, Perlis, Malaysia. Email: sitizuraidah@unimap.edu.my 1. INTRODUCTION In microwave systems, one of the crucial components used to divide signal power is power divider. This component is mostly used in the transmission line for the communication and antenna system which needs around the laboratory for the help of developing, maintenance, configuration, calibration, and for the help of designing new microwave equipment or devices. The power divider is one of the passive electronic devices. This type of power divider is used in many microwave application, such as the distribution of low power signal for two or multiple antennas and intermodulation distortion measurement where the power divider is used to combine two power signal and produce one signal outputs [1]. From the microwave research trend, the substrate integration innovation of SIW is an appropriate design for the improvement of microwaves signal propagation. SIW is the simplest method to use in microwave component because of the immaterial radiation losses, particularly for wide frequency applications, and give the likelihood to be fabricated in planar innovations. An SIW design is similar to the standard rectangular waveguide. It is worked by applying a dielectric substrate inside two metal layers, then transmitting the signal in the form of the electromagnetic field with the arrangement of two columns of metalised vias on both sides. Also, the rising methods coordinate the propagation of microwave in the active and passive devices such as the power divider [2]. The SIW technique also has been used in the design of coupler [3], antenna [4] and filter [5].
  • 2. Bulletin of Electr Eng and Inf ISSN: 2302-9285  Design of Ku-band power divider using Substrate Integrated Waveguide technique (Tan Gan Siang) 173 A few SIW power dividers designs were demonstrated in the past few years [6-12]. Those designing methods have been proposed to develop the SIW power divider with different materials and different operating band. The SIW power divider with T-Junction configuration is done on Ku-Band [6], Ka-band [7] and 10-15 GHz frequency band [8]. Others configuration such as Half-mode SIW [9, 10] and DGS technology [11] is also proposed. There is also an SIW power divider for Antenna Feed systems [12]. The T- junction configuration SIW power divider has been used in the design of the SIW six-port [13]. An SIW power divider working on Ku-Band is presented in this paper. As compared to the previously published works on SIW power divider, this SIW power divider is easier to design with the T- junction configuration and can further optimize the insertion loss performance with the additional via hole. The presented SIW power divider is using a T-junction configuration and has a low insertion loss and can function as a power splitter. 2. CONFIGURATION AND DESIGN The structure of the SIW power divider is formed by T-junction configuration. The design layout had been presented in Figure 1. As depicted in Figure 1, the parameters Weq and Wtp represent the equivalent width of the SIW structure and the tapper width respectively. The parameter d represents the diameter of the via while the separation of via is represented by parameter p. Xp is the length to be optimised to achieve the required operating frequency of the SIW power divider. Figure 1. SIW power divider configuration For SIW method, the mode that will be appeared is the TE10 modes as the dominant mode. The dimension for designing the Ku-band power divider can be obtained from the mathematical expression written as (1) and (2) [14]: 1 2 ) 10 ( 95 . 0 2 −          −  = p d W c f r TE c  (1) p d W Weff  − = 95 . 0 2 (2) where c, εr, W, d and p are the speed of light, dielectric permittivity of the substrate, the width of the SIW, diameter and the separation between the via holes respectively. In order to minimize the signal leakage between vias holes, the via holes design must follow the following parametric conditions written as expression (3), (4), and (5) [15-16]: 25 . 0 /  c p  (3)
  • 3.  ISSN: 2302-9285 Bulletin of Electr Eng and Inf, Vol. 8, No. 1, March 2019 : 172 – 179 174 5 / g d   (4) d p d 2   (5) where λc and λg is the cutoff wavelength and the guided wavelength respectively. The metallic via hole is placed at the centre between port 2 and port 3. According to fundamental of the waveguide transmission theory, the metallic via hole is equivalent to a susceptance. The changing of the position of Xp can change the reflecting and scattering signal of the input signal. Three tapered lines are chosen as the transition between the microstrip line and SIW for each of the input and output port to provide the matching to the 50 Ω microstrip line. 3. SIMULATED AND MEASURED RESULTS The SIW power divider is constructed using a RO4003C substrate having εr=3.38 and the thickness=0.508 mm. The centre via, Xp has been added to achieve better return losses performance. Some parametric studies are performed on Xp to obtain the overall optimized performance on the proposed SIW power divider. The distance of the metallic via hole to the bottom vias, Xp has been adjusted to 2.78 mm and 4.83 mm and the simulated results are shown in Figure 2. When Xp is at 2.78 mm which is below the centre of the output ports, the bandwidth of reflection coefficient, S11 is increase over a wide band while the performance is degraded when the Xp at 4.83 mm. With this value, the operational bandwidth is limited to the frequency range of 13.15 GHz to 15.32 GHz. Therefore the value of Xp should not be more than ½ of the Weq value from bottom vias. (a) (b) Figure 2. Simulation results of S11 (a) After Xp adjusted to 4.83 mm and (b) After Xp adjusted to 2.78 mm
  • 4. Bulletin of Electr Eng and Inf ISSN: 2302-9285  Design of Ku-band power divider using Substrate Integrated Waveguide technique (Tan Gan Siang) 175 (a) (b) Figure 3. Simulation results of S12 and S13 (a) After Xp adjusted to 4.83 mm, (b) Xp adjusted to 2.78 mm The results for insertion loss S12 and S13 are shown on Figure 3. When Xp is at 4.83 mm, the signal achieved is -4 dB ±0.7 dB across frequency range of 13.15 GHz to 18 GHz. After Xp is adjusted to 2.78 mm, the insertion loss is improved to -3.3 dB ±0.2 dB accross 13.2 GHz to 18 GHz. The signal level achieved is better by which the signal is more constant which is have a flat coupling response. After the parametric study, the dimensions of the SIW T-junction power divider are determined. Table 1 shows the optimised dimensions of SIW power divider. After that, the SIW power divider is fabricated to verify the results. The fabricated SIW power divider is shown in Figure 4. Comparison between the simulation and measurement results is shown in Figure 5. Table 1. Parameter values of SIW T-junction power divider Parameter Weq Wstep d p Xp Dimension (mm) 8.159 4.024 0.6 0.7 2.78 Figure 4. Fabricated SIW power divider
  • 5.  ISSN: 2302-9285 Bulletin of Electr Eng and Inf, Vol. 8, No. 1, March 2019 : 172 – 179 176 (a) (b) (c) Figure 5. Comparison of SIW power divider simulation and measurement results (a) Return loss at Port 1 (S11) (b) Insertion loss at Port 2 (S21) (c) Insertion loss at Port 3 (S31) The simulated results of S21 and S31 are about -3.1 ±0.4 dB across the frequency range of 13.5 GHz-18 GHz, which shows an equal power division between port 2 and 3. The simulated return loss at port 1 is better than is 10 dB across 13 GHz to 18 GHz while the measured result of S11 indicates an operational frequency range of 15.4 GHz to 18 GHz. The measured results of the fabricated SIW power divider are slightly degraded about 2 dB loss for both S21 and S31. The main losses occurred in the measured results is due to the connector loss. The imperfect fabrication also contributed to the loss and imbalance amplitude of power division of the SIW power divider measurement results. An SIW transmission line is fabricated to investigate the loss caused by the connector. The fabrication of the SIW line is shown in Figure 6. The results of the simulation and measurement are shown in Figure 7.
  • 6. Bulletin of Electr Eng and Inf ISSN: 2302-9285  Design of Ku-band power divider using Substrate Integrated Waveguide technique (Tan Gan Siang) 177 Figure 6. Fabricated SIW transmission line (a) (b) Figure 7. Comparison of simulated and measured results (a) S11 (b) S21of SIW transmission line As depicted in Figure 7, the measured S21 result of the connector is degraded about 2 dB insertion losses and more significant at high frequency. The measured result of S11 result also indicates degraded reflection coefficient performance of the fabricated connector. Comparison of the SIW power divider to the previously researched SIW power divider is made to show the advantage of the design. The comparison between the simulation insertion losses of the SIW power dividers is shown in Table 2. The comparisons show that the proposed SIW power divider has lower insertion loss.
  • 7.  ISSN: 2302-9285 Bulletin of Electr Eng and Inf, Vol. 8, No. 1, March 2019 : 172 – 179 178 Table 2. Comparison of SIW power dividers performance in simulation References Operating Frequency (GHz) Substrate Topology Insertion loss (dB) [3] 18-26.5 Not available T-junction 3.45 ±0.5 [5] 8.5-16 RO4350 Y-junction 3.9 ±0.2 [6] 8.25-12.25 RT5880 Half-mode with slots and resistor 4.0 ±0.5 [7] 8-9.4 RT5880 T-junction with slots 4.0 ±0.3 This work 13.5-18 RO4003 T-junction 3.1 ±0.4 4. CONCLUSION A Ku-band T-junction SIW power divider has been presented. The additional via successfully enhanced the insertion loss performance. As a result, the simulated input return losses at port 1 are better than 27 dB and features equal power division of about -3.1 dB ±0.4 dB at both output ports across frequency range of 13.5-18 GHz. The SIW power divider has been fabricated, and the measurement results show acceptable performances. An additional SIW transmission line has been simulated and fabricated to analyze the connector loss to verify the degraded performances of the measured results caused by the connector performances. ACKNOWLEDGEMENTS The author would like to acknowledge the support from the Fundamental Research Grant Scheme (FRGS) under a grant number of FRGS/1/2015/TK04/UNIMAP/02/16 from the Ministry of Higher Education Malaysia. REFERENCES [1] Anonymous, "Differences in Application Between Power Dividers and Power Splitters," Keysight Technology, USA, 2018. [2] L. J. Berens, "Design, analysis, and construction of an equal split Wilkinson power divider.," Marquette University, 2012. [3] B. Rahali and M. Feham, "Design of K-Band substrate integrated waveguide coupler, circulator and power divider," International Journal of Information and Electronics Engineering, vol. 4, no. 1, pp. 47-53, 2014. [4] A. Nasri, H. Zairi and A. Gharsallah, "Single Balanced Mixer Using Substrate Integrated Waveguide (SIW) 90° Coupler," International Journal of Engineering and Technology, vol. 8, no. 1, pp. 61-65, 2016. [5] O. Caytan, S. Lemey, S. Agneessens and H. Rogier, "SIW antennas as hybrid energy harvesting and power management platforms for the internet of things," International Journal of Microwave and Wireless Technologies, vol. 8, no. 4-5, pp. 767-775, 2016. [6] F. Huang, J. Zhou and W. Hong, "Ku band continuously tunable circular cavity SIW filter with one parameter," IEEE Microwave and Wireless Components Letters, vol. 26, no. 4, pp. 270-272, 2016. [7] B. Rahali and M. Feham, "Design of V-band substrate integrated waveguide power divider, circulator and coupler," Computer Science & Information Technology (CS & IT), pp. 35-44, 2013. [8] N. A. Smith and R. Abhari, "Compact substrate integrated waveguide Wilkinson power dividers," 2009 IEEE Antennas and Propagation Society International Symposium, Charleston, SC, 2009, pp. 1-4. [9] Z. Yang, W. Chen, H. Lin, Y. Tao and H. Jin, "A novel SIW power divider with good out-of-band rejection and isolation," IEICE Electronics Express, vol. 13, no. 8, pp. 1-6, 2016. [10] Z. He, J. Cai, Z. Shao, X. Li and Y. Huang, "A novel power divider integrated with SIW and DGS technology," Progress In Electromagnetics Research, vol. 139, pp. 289-302, 2013. [11] Z. Kordiboroujeni and J. Bornemann, "Efficient design of Substrate Integrated Waveguide power dividers for antenna feed systems," 2013 7th European Conference on Antennas and Propagation (EuCAP), Gothenburg, 2013, pp. 352-356. [12] Y. Cassivi, L. Perregrini, P. Arcioni, M. Bressan, K. Wu and G. Conciauro, "Dispersion characteristics of substrate integrated rectangular waveguide," IEEE Microwave and Wireless components letters, vol. 12, no. 9, pp. 333-335, 2002. [13] M. Jafari, G. Moradi, R. SHIRAZI and R. Mirzavand, "Design and implementation of a six-port junction based on substrate integrated waveguide," Turkish Journal of Electrical Engineering & Computer Sciences, vol. 25, no. 3, pp. 2547-2553, 2017. [14] D. Deslandes and K. Wu, "Accurate modeling, wave mechanisms, and design considerations of a substrate integrated waveguide," IEEE Transactions on microwave theory and techniques, vol. 54, no. 6, pp. 2516-2526, 2006. [15] K. Wu, D. Dominic and C. Yves, "The substrate integrated circuits-a new concept for high-frequency electronics and optoelectronics," in 6th International Conference on Telecommunications in Modern Satellite, Cable and Broadcasting Service, 2003. TELSIKS 2003, Nis, 2003.
  • 8. Bulletin of Electr Eng and Inf ISSN: 2302-9285  Design of Ku-band power divider using Substrate Integrated Waveguide technique (Tan Gan Siang) 179 [16] F. Xu and K. Wu, "Guided-wave and leakage characteristics of substrate integrated waveguide," IEEE Transactions on microwave theory and techniques , vol. 53, no. 1, pp. 66-73, 2005. BIOGRAPHIES OF AUTHORS Tan Gan Siang received his Master of Science in Electronic Engineering from Universiti Teknikal Malaysia Melaka (UTeM), Malaysia, in 2015. He is currently working toward his PhD at School of Computer & Communication Engineering, Universiti Malaysia Perlis, Malaysia. His research interests include microwave integrated circuits. David Paul A/L David Dass received his Bachelor of Engineering (Communication Engineering) from Universiti Malaysia Perlis (UniMAP), Malaysia, in 2017. His research interests include microwave integrated circuits. Dr. S. Z. Ibrahim was born in Limbang, Sarawak, Malaysia in 1981. She has a Bachelor of Engineering in Telecommunication from the University of Malaya, Malaysia in 2004 and Master of Engineering from University Technology of Malaysia in 2008. She received her PhD degrees from University of Queensland Australia in 2012. She is currently working as a senior lecturer in the School of Computer and Communication Engineering at Universiti Malaysia Perlis, Malaysia. Most of her research interest is related to microwave components and its application. Ts. Dr Mohd Nazri A Karim is a Senior Lecturer at the Department of Electronic Engineering Technology, Faculty of Engineering Technology, Universiti Malaysia Perlis (UniMAP), Malaysia. He received his PhD in communication engineering from the School of Computer and Communication Engineering at Universiti Malaysia Perlis (UniMAP), Malaysia. His Master and Bachelor Degree in Electronics (Telecommunication) Engineering from Universiti Teknologi Malaysia (UTM), Malaysia in 2010 and 2006 respectively. He also a member of BEM, MBOT and IEEE Member. His research interests include antenna and propagation, microwave component and Radar technology especially in Ground Penetrating Radar (GPR). Dr. Aliya A. Dewani (M’12) received the B. Eng. degree (Gold Medalist) from the University of Kashmir, Srinagar, India, in 2005, the M. Eng. degree from University Technology Malaysia, Malaysia, in 2007, and the Ph.D. degree in electrical engineering from Griffith University, Brisbane, QLD, Australia, in 2016. Her doctoral research focused on the analysis and design of frequency selective surfaces on thin conformal transparent substrates using screen printing technology. She is currently a sessional lecturer with the Griffith School of Electrical engineering, Griffith University. Her current research interests include computational electromagnetics, design and modeling of engineered structures with novel electromagnetic behavior, multiple scattering, and antenna measurements.