1. Derek Payne
11136 Magnolia Drive 720-204-0542
Cleveland, OH 44106 dap97@case.edu
OBJECTIVE STATEMENT
Passionate and motivated electrical engineering graduate seeking full-time entry level position in hardware design.
EDUCATION
Case Western Reserve University
B.S. Electrical Engineering, 2016
GPA: 3.25
CO-OP / INTERNSHIPS
Hardware Engineer January to August, 2014
Rockwell Automation Mayfield Heights, OH
• Identified and implemented synchronous buck converter ICs for >95% efficiency, RoHS compliance, cost/size
reduction, increased temperature range on ControlLogix power supplies.
• Overhauled constant load test board for closed loop temperature control, enhanced spectral characterization during
radiated/conducted emissions testing of ControlLogix power supplies.
• Performed USB-IF full speed compliance testing and created streamlined internal procedure for future testing.
• Collaborated with intern team to create an automated table tennis showcase project for career fairs. Customized
motor driven rail-mount system for linear position control of movable solenoid paddle. Fabricated SerDes
communications boards for custom 2D light array, used for ball tracking and localization.
Controls Engineer May to December, 2015
Manufacturing Technology, Inc. South Bend, IN
• Revived non-operational 60-ton rotary welder. Replaced hard-wire relay logic with ControlLogix PLC and Windows
7 PC. Established temperature, pressure, and rotational speed PID control. Diagnosed hardware and software bugs.
• Retrofitted 400- and 480-ton aerospace rotary welders at customer site. Configured PLC ladder program, PanelView
program, and modern PC software for custom machine options. Identified and corrected anomalies.
• Initiated startup procedure for 250-ton automotive rotary welder. Verified schematics, established temperature/
pressure/rotational speed PID control loops, commissioned safety controller, assembled automation routines for
welded part shear/unload, optimized cycle time, and conducted customer runoff.
• Pioneered design of experiment for customer hybrid weld. Engineered support for high-speed temperature data
acquisition during precise period of weld cycle using NI cDAQ and thermocouple module.
SELECTED COURSEWORK
• Applied Circuit Design
• Electronics Analysis & Design
• Digital Logic Lab
• Power Systems Analysis
KEY SKILLS
• Familiar with CAD software: Altium, AutoCAD Electrical, EagleCAD, Mentor Graphics
• Experience with RSLogix 5000, MultiSim
• Familiar with MPLab, Quartus, Xilinx ISE
• Experience with MATLAB, Python, Verilog
• Familiar with C, Visual Basic, Java
• Comfortable working in command line environments
• Proficient with oscilloscopes, DMMs, logic analyzers, and other common test equipment
• Experience soldering through-hole and surface mount components, including 0402 passives and heat-pad QFNs
ACTIVITIES/INVOLVEMENT
• Case IEEE: Secretary (2012), Treasurer (2013), President (2014)
• Beta Nu chapter of Theta Chi Fraternity: Treasurer (2014)