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2. Silicon wafer
It is an integral part of semiconductor
which are fabricated in a crystalline
form.
Prominence
Highly essential as raw material for
substrates.
Micro-electronic devices are
developed through this element.
3. Fabrication
Process
Silicon wafers are manufactured in
several ways, however, modern
slicing methods are done for
superior cost-effectiveness.
Ingot Growth
Melting the raw silicon up to 1420
degrees Celsius develops the
polycrystalline which is then develops
ingot.
4. Slicing
Round sized with various
diameters methods is available
where suitable size is selected
for this process.
Cleaning
High precision cleaning is done to get rid
of Nano-foreign substances and dusts
accumulation over wafers.
5. Polishing
To give the desired finish to wafers
process is done around both surfaces
CMP, chemical mechanical polish.
Packing
Final inspections are done and
checked for its size as well as
diameter. Separate stacks are used
for arrangements.