2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
This guide provides a fast overview of the key features and functionality of Autodesk Robot Structural Analysis. It describes the general program layout and modules, how to navigate the interface, enter structural analysis data, run analyses, view and interpret results, design structural elements, and generate reports. The guide also includes a list of keyboard shortcuts.
Mainly supported today by flip-chip wafer bumping, 3D WLP, and WLCSP; the long term growth of the equipment and materials business will be supported by the expansion of 3D TSV stack platforms.
TSV integration is creating growth and significant interest in the equipment & materials industry
Mainly supported today by flip-chip wafer bumping, the equipment market generated revenue of more than $930M in 2013. It is expected that this equipment market revenue will peak at almost $2.5B. It is fueled by the 3D IC technology with TSV interconnects, an area offering opportunities for new developments in equipment modification—equipment that is much more expensive than the tools used for established Advanced Packaging platforms (3D WLP, WLCSP, flip-chip wafer bumping). Indeed, 2015 will be the key turning point for the adoption of 3D TSV Stacks since the memory manufacturers, such as Samsung, SK Hynix, Micron, have already started to ship prototypes this year and might be ready to enter in high-volume manufacturing next year....
More information on that report at: http://www.i-micronews.com/advanced-packaging-report/product/equipment-materials-for-3dic-wafer-level-packaging-applications.html#description
SiP technology can provide small form factors, low costs, and multi-function integration solutions. Some key technologies need to be developed to realize these benefits, including EMI shielding partitioning, antenna integration on PCBs, die placement on passive components, and integrating intellectual property cores directly into PCBs. Fan-out wafer level packaging and fan-out package-on-package technologies allow for thinner packages and high I/O routing densities at fine line/space pitches. Challenges include lithography control at sub-2 micron resolutions, high-density bump cleaning, and thin wafer warpage control.
A data safe haven is defined as a data access broker that maintains stringent security standards required by data providers, while enforcing access restrictions on researchers. It provides expertise in information governance, security, and data management that most research groups lack. A data safe haven structurally separates duties, requires access approval, and maintains private dedicated resources and automated auditing. It allows access to data not otherwise available and provides a secure platform for sensitive data sharing, research, and collaboration at an expert level that individual projects cannot achieve alone.
Over the past decade, chalcogenide glass substrates have become a preferred choice for IR optics. They offer many advantages that legacy materials such as germanium, silicon, and others simply cannot match. Because chalcogenide glasses are softer and prone to scratches, a protective layer is critical. A diamond-like carbon (DLC) coating is ideal for its extreme durability to withstand the harshest environmental conditions. However, coating chalcogenides with DLC is a notoriously challenging endeavor plagued by adhesion problems and coating defects.
In this webinar, IR expert Ray Pini compares chalcogenides’ properties to more traditional substrates to understand their growing popularity and delves into the adhesion challenges they present throughout the coating process. He shares how EMF has successfully produced dependable, long-lasting DLC coatings on chalcogenides at scale, along with top tips to ensure your coating partner has the capabilities and capacity to deliver the precision coating solutions you need.
Have questions about DLC on chalcogenides or other substrates…or other coatings? Our team is standing by. Please contact EMF at websales@emf-corp.com or +1-800-456-7070.
Open web girders (OWG) are bridge structures where the web part is only partially filled. This allows OWGs to be lighter than closed web girders while still providing enough structural strength. OWGs are commonly used for railway bridges due to their ability to support large spans without intermediate columns and resist lateral loads through their open web design. The document discusses the types, fabrication, merits, and uses of OWGs, concluding that they provide an economical support structure for applications like bridges over rivers and valleys.
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
The document discusses 3D integrated circuits (3D ICs) and through-silicon vias (TSVs). It provides an overview of Yole Developpement, a research and consulting firm focused on advanced packaging. Yole analyzes trends in the semiconductor packaging industry and markets for 3D ICs. The document outlines several applications of 3D ICs and TSVs, including image sensors, memory, logic, and MEMS. It compares the benefits of 2D and 3D packaging approaches and provides timelines for adoption of technologies like TSVs across different applications.
This guide provides a fast overview of the key features and functionality of Autodesk Robot Structural Analysis. It describes the general program layout and modules, how to navigate the interface, enter structural analysis data, run analyses, view and interpret results, design structural elements, and generate reports. The guide also includes a list of keyboard shortcuts.
Mainly supported today by flip-chip wafer bumping, 3D WLP, and WLCSP; the long term growth of the equipment and materials business will be supported by the expansion of 3D TSV stack platforms.
TSV integration is creating growth and significant interest in the equipment & materials industry
Mainly supported today by flip-chip wafer bumping, the equipment market generated revenue of more than $930M in 2013. It is expected that this equipment market revenue will peak at almost $2.5B. It is fueled by the 3D IC technology with TSV interconnects, an area offering opportunities for new developments in equipment modification—equipment that is much more expensive than the tools used for established Advanced Packaging platforms (3D WLP, WLCSP, flip-chip wafer bumping). Indeed, 2015 will be the key turning point for the adoption of 3D TSV Stacks since the memory manufacturers, such as Samsung, SK Hynix, Micron, have already started to ship prototypes this year and might be ready to enter in high-volume manufacturing next year....
More information on that report at: http://www.i-micronews.com/advanced-packaging-report/product/equipment-materials-for-3dic-wafer-level-packaging-applications.html#description
SiP technology can provide small form factors, low costs, and multi-function integration solutions. Some key technologies need to be developed to realize these benefits, including EMI shielding partitioning, antenna integration on PCBs, die placement on passive components, and integrating intellectual property cores directly into PCBs. Fan-out wafer level packaging and fan-out package-on-package technologies allow for thinner packages and high I/O routing densities at fine line/space pitches. Challenges include lithography control at sub-2 micron resolutions, high-density bump cleaning, and thin wafer warpage control.
A data safe haven is defined as a data access broker that maintains stringent security standards required by data providers, while enforcing access restrictions on researchers. It provides expertise in information governance, security, and data management that most research groups lack. A data safe haven structurally separates duties, requires access approval, and maintains private dedicated resources and automated auditing. It allows access to data not otherwise available and provides a secure platform for sensitive data sharing, research, and collaboration at an expert level that individual projects cannot achieve alone.
Over the past decade, chalcogenide glass substrates have become a preferred choice for IR optics. They offer many advantages that legacy materials such as germanium, silicon, and others simply cannot match. Because chalcogenide glasses are softer and prone to scratches, a protective layer is critical. A diamond-like carbon (DLC) coating is ideal for its extreme durability to withstand the harshest environmental conditions. However, coating chalcogenides with DLC is a notoriously challenging endeavor plagued by adhesion problems and coating defects.
In this webinar, IR expert Ray Pini compares chalcogenides’ properties to more traditional substrates to understand their growing popularity and delves into the adhesion challenges they present throughout the coating process. He shares how EMF has successfully produced dependable, long-lasting DLC coatings on chalcogenides at scale, along with top tips to ensure your coating partner has the capabilities and capacity to deliver the precision coating solutions you need.
Have questions about DLC on chalcogenides or other substrates…or other coatings? Our team is standing by. Please contact EMF at websales@emf-corp.com or +1-800-456-7070.
Open web girders (OWG) are bridge structures where the web part is only partially filled. This allows OWGs to be lighter than closed web girders while still providing enough structural strength. OWGs are commonly used for railway bridges due to their ability to support large spans without intermediate columns and resist lateral loads through their open web design. The document discusses the types, fabrication, merits, and uses of OWGs, concluding that they provide an economical support structure for applications like bridges over rivers and valleys.
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
The document discusses 3D integrated circuits (3D ICs) and through-silicon vias (TSVs). It provides an overview of Yole Developpement, a research and consulting firm focused on advanced packaging. Yole analyzes trends in the semiconductor packaging industry and markets for 3D ICs. The document outlines several applications of 3D ICs and TSVs, including image sensors, memory, logic, and MEMS. It compares the benefits of 2D and 3D packaging approaches and provides timelines for adoption of technologies like TSVs across different applications.