This document discusses conductive inks for functional printing. It describes Agfa, a company that produces two core technologies for thin printable conductors: PEDOT:PSS conductive polymer and nano-silver ink. PEDOT:PSS is transparent, flexible and formable, while nano-silver ink offers high conductivity and allows printing thinner layers and smaller features. The document provides examples of applications for each technology and discusses parameters like curing time and temperature to optimize conductivity. It emphasizes that nano-silver ink can achieve high conductivity through multiple printing steps and higher curing temperatures.
This document discusses control panels for home appliances produced by plastic electronic using its specialized plastic film technology. It describes the touchskin concept of intuitive touch surfaces and its multiskin technology which integrates electronic functions and décor onto a single plastic film. The technology allows processing of conductive structures and assembly of components directly onto flat film substrates before forming into 3D control panels through injection molding. This integrated approach offers benefits over traditional control panel production like increased stability, compact size, and complex 3D form factors. Cost estimates are provided for the various components of a touchskin control console using this plastic film technology.
Captronic séminaire électronique imprimée - 20/09/2017 - Présentation du Laboratoire IMS / Université de Bordeaux - En partenariat avec l’AFELIM (Association Française de l'Electronique Imprimée) et le soutien du Pôle Numérique de la CCI Bordeaux Gironde, Cap’tronic a organisé le mercredi 20 septembre dans les locaux de l’IMS à Talence, une rencontre autour de l' "électronique imprimée" afin de faire un tour d’horizon de la chaîne de valeur d'une filière dont le marché mondial est estimé à 330 milliards de dollars en 2027.
Specialist Manufacturing SME 24 July 2012markhenrys
3D printing, also known as additive manufacturing, involves importing a digital design, slicing it into thin layers, and printing each layer using materials like metal powder, plastic, or liquid. Key 3D printing techniques include selective laser sintering (SLS), direct metal laser sintering (DMLS), fused deposition modeling (FDM), stereolithography (SLA), and laminated object manufacturing (LOM). These techniques are used across industries like defense, aerospace, automotive, and medical to produce prototypes and final parts in a more efficient manner compared to traditional manufacturing.
Captronic séminaire électronique imprimée - 20/09/2017 - Présentation de VFP Ink Technology- En partenariat avec l’AFELIM (Association Française de l'Electronique Imprimée) et le soutien du Pôle Numérique de la CCI Bordeaux Gironde, Cap’tronic a organisé le mercredi 20 septembre dans les locaux de l’IMS à Talence, une rencontre autour de l' "électronique imprimée" afin de faire un tour d’horizon de la chaîne de valeur d'une filière dont le marché mondial est estimé à 330 milliards de dollars en 2027.
Captronic séminaire électronique imprimée - présentation cea techpolenumerique33
Captronic séminaire électronique imprimée - 20/09/2017 - Présentation du CEA TECH / Liten - En partenariat avec l’AFELIM (Association Française de l'Electronique Imprimée) et le soutien du Pôle Numérique de la CCI Bordeaux Gironde, Cap’tronic a organisé le mercredi 20 septembre dans les locaux de l’IMS à Talence, une rencontre autour de l' "électronique imprimée" afin de faire un tour d’horizon de la chaîne de valeur d'une filière dont le marché mondial est estimé à 330 milliards de dollars en 2027.
Newest additive manufacturing technologies don’t erase the traditional knowl...Sentry Air Systems, Inc.
Additive manufacturing techniques frequently rely on powdered material of ultra-fine particles which are respiratory hazards to workers. This presentation identifies the process steps where #nanoparticles and UFP are potential hazards. It provides real-life examples of source capture air cleaners used in the manufacture of varied product types that help provide respiratory protection. #mfg #additivemanufacturing #assemblyshow #UFP
Radiation-Cured Components & Their Use in Hard, Scratch Resistant Coating App...Sartomer
This presentation covers the following topics:
- Current and potential hard coat applications
- Description of products tested and their attributes
- Taber haze and Taber abrasion resistance
- Weathering resistance
- Barrier properties of a typical hard coat formulation
- Polyurethane dispersion products (PUDs)
You can visit Sartomer at Sartomer.com and follow them on Twitter @SartomerGlobal and on LinkedIn.
3D printing is a method of additive manufacturing that builds 3D objects layer by layer by adding material. It allows for tangible goods to be produced from a digital design. There are several methods of 3D printing including selective laser sintering (SLS), stereolithography, fused deposition modeling (FDM), and polyjet matrix technology that use different materials and processes. 3D printing has applications across many industries like medical, mechanical, architecture, fashion, and jewelry for prototyping, production, and customized parts.
This document discusses control panels for home appliances produced by plastic electronic using its specialized plastic film technology. It describes the touchskin concept of intuitive touch surfaces and its multiskin technology which integrates electronic functions and décor onto a single plastic film. The technology allows processing of conductive structures and assembly of components directly onto flat film substrates before forming into 3D control panels through injection molding. This integrated approach offers benefits over traditional control panel production like increased stability, compact size, and complex 3D form factors. Cost estimates are provided for the various components of a touchskin control console using this plastic film technology.
Captronic séminaire électronique imprimée - 20/09/2017 - Présentation du Laboratoire IMS / Université de Bordeaux - En partenariat avec l’AFELIM (Association Française de l'Electronique Imprimée) et le soutien du Pôle Numérique de la CCI Bordeaux Gironde, Cap’tronic a organisé le mercredi 20 septembre dans les locaux de l’IMS à Talence, une rencontre autour de l' "électronique imprimée" afin de faire un tour d’horizon de la chaîne de valeur d'une filière dont le marché mondial est estimé à 330 milliards de dollars en 2027.
Specialist Manufacturing SME 24 July 2012markhenrys
3D printing, also known as additive manufacturing, involves importing a digital design, slicing it into thin layers, and printing each layer using materials like metal powder, plastic, or liquid. Key 3D printing techniques include selective laser sintering (SLS), direct metal laser sintering (DMLS), fused deposition modeling (FDM), stereolithography (SLA), and laminated object manufacturing (LOM). These techniques are used across industries like defense, aerospace, automotive, and medical to produce prototypes and final parts in a more efficient manner compared to traditional manufacturing.
Captronic séminaire électronique imprimée - 20/09/2017 - Présentation de VFP Ink Technology- En partenariat avec l’AFELIM (Association Française de l'Electronique Imprimée) et le soutien du Pôle Numérique de la CCI Bordeaux Gironde, Cap’tronic a organisé le mercredi 20 septembre dans les locaux de l’IMS à Talence, une rencontre autour de l' "électronique imprimée" afin de faire un tour d’horizon de la chaîne de valeur d'une filière dont le marché mondial est estimé à 330 milliards de dollars en 2027.
Captronic séminaire électronique imprimée - présentation cea techpolenumerique33
Captronic séminaire électronique imprimée - 20/09/2017 - Présentation du CEA TECH / Liten - En partenariat avec l’AFELIM (Association Française de l'Electronique Imprimée) et le soutien du Pôle Numérique de la CCI Bordeaux Gironde, Cap’tronic a organisé le mercredi 20 septembre dans les locaux de l’IMS à Talence, une rencontre autour de l' "électronique imprimée" afin de faire un tour d’horizon de la chaîne de valeur d'une filière dont le marché mondial est estimé à 330 milliards de dollars en 2027.
Newest additive manufacturing technologies don’t erase the traditional knowl...Sentry Air Systems, Inc.
Additive manufacturing techniques frequently rely on powdered material of ultra-fine particles which are respiratory hazards to workers. This presentation identifies the process steps where #nanoparticles and UFP are potential hazards. It provides real-life examples of source capture air cleaners used in the manufacture of varied product types that help provide respiratory protection. #mfg #additivemanufacturing #assemblyshow #UFP
Radiation-Cured Components & Their Use in Hard, Scratch Resistant Coating App...Sartomer
This presentation covers the following topics:
- Current and potential hard coat applications
- Description of products tested and their attributes
- Taber haze and Taber abrasion resistance
- Weathering resistance
- Barrier properties of a typical hard coat formulation
- Polyurethane dispersion products (PUDs)
You can visit Sartomer at Sartomer.com and follow them on Twitter @SartomerGlobal and on LinkedIn.
3D printing is a method of additive manufacturing that builds 3D objects layer by layer by adding material. It allows for tangible goods to be produced from a digital design. There are several methods of 3D printing including selective laser sintering (SLS), stereolithography, fused deposition modeling (FDM), and polyjet matrix technology that use different materials and processes. 3D printing has applications across many industries like medical, mechanical, architecture, fashion, and jewelry for prototyping, production, and customized parts.
This document provides an overview of UV ink, including:
- The components of UV inks and the curing process using ultraviolet light.
- The benefits of UV ink such as fast drying, versatility, and lack of VOCs.
- The various substrates and printing applications used for UV inks.
- Factors that influence UV curing efficiency and common equipment used such as lamps, reflectors, and rollers.
- Testing, storage, and troubleshooting considerations for UV ink printing.
Sirris 2016 04-12 coating of 3-d printed parts_ddmSirris
Tenco DDM is a 3D printing and finishing service provider founded in 2012 with expertise in coating techniques. Their mission is to co-create high-end prototyping solutions using additive manufacturing and innovative finishing methods. They offer CAD, 3D printing, and finishing services including various coating types to provide painted, mirrored, or technically coated 3D printed parts for customers. Proper selection of 3D printing technology, materials, and post-processing is important to achieve the desired surface quality and functionality for applications.
The use of plasma technology as a pretreatment on plastic and composite substrates enables these heat-sensitive materials to be successfully coated with ultraviolet (UV) curable powder coatings. This presentation discusses the many benefits of UV cured powder coating on plastics and composites using Plasma technology including no substrate deformation or degradation, improved coating adhesion, removal of contaminates and more.
"Functional and Design Opportunities Using PVD + UV Coatings" by Jason Eich, Red Spot given at RadTech UV & EB Technology Expo & Conference 2014. To learn more about UV curable coatings, visit http://www.radtech.org.
Inkjet: A Driver For Change In The Coatings IndustryXennia Technology
Xennia's Dr Kay Yeong presented a talk at the European Coatings Conference in Berlin, Germany in Oct 2010. The talk discussed the impact of inkjet technology on the packaging coatings industry.
The conference presented a suite of high-level technical papers, given by invited international experts, on topics such as sustainable packaging coatings, printable coatings, heat seal lacquers and hybrid barrier films.
Industrial Plastic Fabrications Ltd, 3D printing, Plastic CNC Machining and F...Leanne Smart
3D printing, Plastic CNC Machining and Fabrication of bespoke plastic parts.
covering a wide range of industries, including; Automotive, Aerospace, Medical, TV and Film, Electrical, scientific,
IRJET- Study of Fused Deposition Modeling Process Parameters for Polycarbonat...IRJET Journal
This document describes a study on the effects of process parameters on parts manufactured using fused deposition modeling (FDM) of a polycarbonate/acrylonitrile butadiene styrene (PC/ABS) blend material. Five parameters were selected - extrusion temperature, bed temperature, layer thickness, raster width, and printing speed. Experiments were conducted using an L8 orthogonal array design in Taguchi methodology. Parts were manufactured and measured for dimensional accuracy, surface roughness, and flatness without support structures. The goal was to determine optimal parameter settings to improve part quality characteristics for this material.
This document provides information on epoxy and acrylate-based UV curing adhesives from Epoxy Technology Inc. It discusses the benefits of their epoxy-based systems including excellent adhesion, low shrinkage, ability to cure in shadows, and the option for thermal post-curing. Tables show recommended UV lamp types and curing times for different adhesive products. Examples of applications include fiber optic assembly, glob top encapsulation, and optical packaging.
UV-curable polyurethane dispersions (UV-PUDs) have become a well established and commercially successful class of products because of their combination of low environmental impact, range of achievable properties and ease of use. This presentation provides an overview of Sartomer's UV-PUDs, including end applications, liquid properties, processing and curing conditions, performance rankings and other features. For more information, go to www.sartomer.com and follow Sartomer on Twitter @SartomerGlobal.
This document provides an overview of selective laser sintering (SLS), a 3D printing technique that uses a laser to fuse powdered material together layer by layer. It defines SLS, describes the basic multi-step process, and lists common input parameters and materials used. The document outlines key advantages like lack of support structures and fast printing, as well as limitations such as prints being brittle and prone to warping. A variety of applications are mentioned, including aerospace, medical, electronics, and automotive uses.
Water-based UV coatings cured with LED systems offer several advantages over mercury lamp systems, including being more environmentally friendly and allowing curing of heat-sensitive substrates. However, oxygen inhibition can reduce curing depth and conversion rates for some systems. Using phosphine oxide photoinitiators and minimizing oxygen penetration through physical drying of dispersions can help overcome this. New thiol-modified chemistries also show promise for oxygen inhibition-free curing and shadow area cure. Proper selection of photoinitiator and coating type are important to realize the full benefits of LED curing for water-based UV systems.
Stereolithography (SLA) is an additive manufacturing process that uses a laser to cure liquid photopolymer resin layer by layer. It works by scanning the laser beam across the surface of the resin to solidify each thin layer before building subsequent layers on top. The key advantages of SLA include its ability to produce parts with high accuracy and surface finish. However, it requires support structures and post-processing steps like curing and removal of supports. SLA has applications in prototyping, tooling, and low volume production.
Motivations, Opportunities and Challenges of Additive Manufacturing for Space...Altair
The document discusses the motivations, opportunities, and challenges of additive manufacturing (AM) for space applications. It outlines several benefits of AM including design freedom, mass reduction, and time savings. It then discusses challenges such as qualification of AM materials and processes as well as gaining customer and regulator acceptance. The document concludes by presenting several examples of AM applications in space structures and envisions more than 50% of spacecraft structures being 3D printed within a few years.
SLS is a rapid prototyping process that uses a laser to fuse powdered material like plastic, metal, or ceramic into a solid 3D object. A laser selectively fuses powdered material layer by layer based on a CAD model. The unfused powder acts as a support material and is removed after the build. SLS can produce parts with complex geometries from a variety of materials without the need for additional support structures.
Forecasting Of Advancements In Additive Manufacturing Gareth Gates
This document analyzes doubling the extrusion speeds of desktop 3D printers and the physical limitations. It measures the time to print a phone case at current speeds. Graphs show production costs decrease 16% each time speed doubles. The document forecasts plastic extrusion rates could reach over 1000 cm3/hr by 2050 through technological advances like multi-directional printing and holographic assembly, but further research is needed to optimize current printers for an 80 cm3/hr rate by 2023.
The document discusses selective laser sintering (SLS), a rapid prototyping technology that uses a laser to fuse powdered material into a 3D object. SLS works by scanning cross-sections from a CAD file onto a powder bed, fusing the material with a laser. This process is repeated layer-by-layer until the object is complete. SLS offers advantages like high accuracy, flexibility in materials used, and the ability to produce complex parts without supports. Some disadvantages are higher costs and potentially weaker parts compared to traditional manufacturing. The document provides details on the SLS process, parameters, materials used, defects that can occur, and applications.
SLS(Experimental setup and working process)
SOME 3D MODELS
INPUT PARAMETERS
COMMONLY USED POWDER MATERIALS
ADVANTAGES
LIMITATIONS
APPLICTIONS
CASE STUDY I
CASE STUDY II
CONCLUSION
The document discusses the challenges of meeting tighter registration requirements for high layer count printed circuit boards (PCBs). As PCBs increase in density and complexity to accommodate growing performance needs, manufacturers must improve registration tolerances. This requires advances in materials, processes, and equipment. A registration capability model is presented and used to predict success rates given specific tolerance requirements. Meeting future demands will require improved process control, reduced variation, and continued technology development across the PCB industry.
Selective laser sintering (SLS) is a rapid prototyping technology that produces physical models layer by layer directly from CAD files, without tools or fixtures. In SLS, a laser fuses powdered material, like nylon or metal, to build the final part. The process begins with an STL file and uses a laser to sinter powder materials together with high accuracy. SLS allows for quick fabrication of complex parts and reduces design errors compared to traditional manufacturing.
Get out! How to get kids active outdoorsDavid Ariagno
In an age of increased dependence on phones and wifi connections, kids are spending less and less time just enjoying the outdoors. It’s been proven that children who spend more time outdoors are more physically fit and otherwise healthier than those who spend more time on the couch on phones or computers. If you’ve got a child who’s difficult to get off the couch, here’s some ways to make outside more fun
This document provides an overview of UV ink, including:
- The components of UV inks and the curing process using ultraviolet light.
- The benefits of UV ink such as fast drying, versatility, and lack of VOCs.
- The various substrates and printing applications used for UV inks.
- Factors that influence UV curing efficiency and common equipment used such as lamps, reflectors, and rollers.
- Testing, storage, and troubleshooting considerations for UV ink printing.
Sirris 2016 04-12 coating of 3-d printed parts_ddmSirris
Tenco DDM is a 3D printing and finishing service provider founded in 2012 with expertise in coating techniques. Their mission is to co-create high-end prototyping solutions using additive manufacturing and innovative finishing methods. They offer CAD, 3D printing, and finishing services including various coating types to provide painted, mirrored, or technically coated 3D printed parts for customers. Proper selection of 3D printing technology, materials, and post-processing is important to achieve the desired surface quality and functionality for applications.
The use of plasma technology as a pretreatment on plastic and composite substrates enables these heat-sensitive materials to be successfully coated with ultraviolet (UV) curable powder coatings. This presentation discusses the many benefits of UV cured powder coating on plastics and composites using Plasma technology including no substrate deformation or degradation, improved coating adhesion, removal of contaminates and more.
"Functional and Design Opportunities Using PVD + UV Coatings" by Jason Eich, Red Spot given at RadTech UV & EB Technology Expo & Conference 2014. To learn more about UV curable coatings, visit http://www.radtech.org.
Inkjet: A Driver For Change In The Coatings IndustryXennia Technology
Xennia's Dr Kay Yeong presented a talk at the European Coatings Conference in Berlin, Germany in Oct 2010. The talk discussed the impact of inkjet technology on the packaging coatings industry.
The conference presented a suite of high-level technical papers, given by invited international experts, on topics such as sustainable packaging coatings, printable coatings, heat seal lacquers and hybrid barrier films.
Industrial Plastic Fabrications Ltd, 3D printing, Plastic CNC Machining and F...Leanne Smart
3D printing, Plastic CNC Machining and Fabrication of bespoke plastic parts.
covering a wide range of industries, including; Automotive, Aerospace, Medical, TV and Film, Electrical, scientific,
IRJET- Study of Fused Deposition Modeling Process Parameters for Polycarbonat...IRJET Journal
This document describes a study on the effects of process parameters on parts manufactured using fused deposition modeling (FDM) of a polycarbonate/acrylonitrile butadiene styrene (PC/ABS) blend material. Five parameters were selected - extrusion temperature, bed temperature, layer thickness, raster width, and printing speed. Experiments were conducted using an L8 orthogonal array design in Taguchi methodology. Parts were manufactured and measured for dimensional accuracy, surface roughness, and flatness without support structures. The goal was to determine optimal parameter settings to improve part quality characteristics for this material.
This document provides information on epoxy and acrylate-based UV curing adhesives from Epoxy Technology Inc. It discusses the benefits of their epoxy-based systems including excellent adhesion, low shrinkage, ability to cure in shadows, and the option for thermal post-curing. Tables show recommended UV lamp types and curing times for different adhesive products. Examples of applications include fiber optic assembly, glob top encapsulation, and optical packaging.
UV-curable polyurethane dispersions (UV-PUDs) have become a well established and commercially successful class of products because of their combination of low environmental impact, range of achievable properties and ease of use. This presentation provides an overview of Sartomer's UV-PUDs, including end applications, liquid properties, processing and curing conditions, performance rankings and other features. For more information, go to www.sartomer.com and follow Sartomer on Twitter @SartomerGlobal.
This document provides an overview of selective laser sintering (SLS), a 3D printing technique that uses a laser to fuse powdered material together layer by layer. It defines SLS, describes the basic multi-step process, and lists common input parameters and materials used. The document outlines key advantages like lack of support structures and fast printing, as well as limitations such as prints being brittle and prone to warping. A variety of applications are mentioned, including aerospace, medical, electronics, and automotive uses.
Water-based UV coatings cured with LED systems offer several advantages over mercury lamp systems, including being more environmentally friendly and allowing curing of heat-sensitive substrates. However, oxygen inhibition can reduce curing depth and conversion rates for some systems. Using phosphine oxide photoinitiators and minimizing oxygen penetration through physical drying of dispersions can help overcome this. New thiol-modified chemistries also show promise for oxygen inhibition-free curing and shadow area cure. Proper selection of photoinitiator and coating type are important to realize the full benefits of LED curing for water-based UV systems.
Stereolithography (SLA) is an additive manufacturing process that uses a laser to cure liquid photopolymer resin layer by layer. It works by scanning the laser beam across the surface of the resin to solidify each thin layer before building subsequent layers on top. The key advantages of SLA include its ability to produce parts with high accuracy and surface finish. However, it requires support structures and post-processing steps like curing and removal of supports. SLA has applications in prototyping, tooling, and low volume production.
Motivations, Opportunities and Challenges of Additive Manufacturing for Space...Altair
The document discusses the motivations, opportunities, and challenges of additive manufacturing (AM) for space applications. It outlines several benefits of AM including design freedom, mass reduction, and time savings. It then discusses challenges such as qualification of AM materials and processes as well as gaining customer and regulator acceptance. The document concludes by presenting several examples of AM applications in space structures and envisions more than 50% of spacecraft structures being 3D printed within a few years.
SLS is a rapid prototyping process that uses a laser to fuse powdered material like plastic, metal, or ceramic into a solid 3D object. A laser selectively fuses powdered material layer by layer based on a CAD model. The unfused powder acts as a support material and is removed after the build. SLS can produce parts with complex geometries from a variety of materials without the need for additional support structures.
Forecasting Of Advancements In Additive Manufacturing Gareth Gates
This document analyzes doubling the extrusion speeds of desktop 3D printers and the physical limitations. It measures the time to print a phone case at current speeds. Graphs show production costs decrease 16% each time speed doubles. The document forecasts plastic extrusion rates could reach over 1000 cm3/hr by 2050 through technological advances like multi-directional printing and holographic assembly, but further research is needed to optimize current printers for an 80 cm3/hr rate by 2023.
The document discusses selective laser sintering (SLS), a rapid prototyping technology that uses a laser to fuse powdered material into a 3D object. SLS works by scanning cross-sections from a CAD file onto a powder bed, fusing the material with a laser. This process is repeated layer-by-layer until the object is complete. SLS offers advantages like high accuracy, flexibility in materials used, and the ability to produce complex parts without supports. Some disadvantages are higher costs and potentially weaker parts compared to traditional manufacturing. The document provides details on the SLS process, parameters, materials used, defects that can occur, and applications.
SLS(Experimental setup and working process)
SOME 3D MODELS
INPUT PARAMETERS
COMMONLY USED POWDER MATERIALS
ADVANTAGES
LIMITATIONS
APPLICTIONS
CASE STUDY I
CASE STUDY II
CONCLUSION
The document discusses the challenges of meeting tighter registration requirements for high layer count printed circuit boards (PCBs). As PCBs increase in density and complexity to accommodate growing performance needs, manufacturers must improve registration tolerances. This requires advances in materials, processes, and equipment. A registration capability model is presented and used to predict success rates given specific tolerance requirements. Meeting future demands will require improved process control, reduced variation, and continued technology development across the PCB industry.
Selective laser sintering (SLS) is a rapid prototyping technology that produces physical models layer by layer directly from CAD files, without tools or fixtures. In SLS, a laser fuses powdered material, like nylon or metal, to build the final part. The process begins with an STL file and uses a laser to sinter powder materials together with high accuracy. SLS allows for quick fabrication of complex parts and reduces design errors compared to traditional manufacturing.
Get out! How to get kids active outdoorsDavid Ariagno
In an age of increased dependence on phones and wifi connections, kids are spending less and less time just enjoying the outdoors. It’s been proven that children who spend more time outdoors are more physically fit and otherwise healthier than those who spend more time on the couch on phones or computers. If you’ve got a child who’s difficult to get off the couch, here’s some ways to make outside more fun
Este documento presenta información sobre diferentes carreras universitarias, incluyendo Comercio Internacional, Arquitectura, Oceanografía y Desarrollo de Videojuegos. Para cada carrera, se proporciona el título obtenido, la duración de la carrera, las materias principales y el campo laboral posible para graduados.
Dokumen tersebut membahas perbandingan antara Web 1.0, Web 2.0, dan Web 3.0 serta alat-alat yang menerapkan metodologi Scrum dan penjelasan tentang web server.
El documento describe los conceptos clave de la planificación de proyectos. Explica que un plan de proyecto informático establece el enfoque para desarrollar el proyecto de manera exitosa mediante la definición de objetivos, requisitos y planes de capacitación. También define la estrategia de negocio como la forma de ubicar los recursos de la empresa para lograr los objetivos del proyecto. Además, identifica factores externos como el mercado, la cultura y la resistencia al cambio que pueden afectar el proyecto.
El documento proporciona instrucciones en 7 pasos para desmontar un ordenador personal completamente. Primero se quitan la tapa y la grabadora DVD desatornillando los tornillos de sujeción. Luego se retira el disco duro y la fuente de alimentación desconectando los cables. Finalmente se extraen los componentes del panel frontal, la memoria RAM y la placa base desatornillando cuidadosamente todos los tornillos de sujeción.
Este documento discute las causas de la dificultad que tienen los adolescentes para buscar información en Internet. Algunas de las causas principales son la falta de educación adecuada sobre cómo buscar en Internet, que los adolescentes no saben qué páginas web son apropiadas, y la gran cantidad de información disponible en la web.
Dokumen tersebut membahas tentang responsive web design, contoh website yang menggunakan teknik tersebut, dan framework Bootstrap dan Foundation untuk membangun desain web yang responsif.
Lithography technology and trends for « Semiconductor frontier » held by Aman...Yole Developpement
Lithography technology and trends for « Semiconductor frontier »
Mask aligners are the fastest lithography technology
Stepper technology provides the best resolution
Key requirements for Advanced Packaging
LED manufacturers use small diameter wafers (2”, 3”, 4” or 6”) and transition more rapidly than traditional semiconductor’s industry to larger diameters
WAFER SIZE
Wafer bow can reach up to 50μm for 2” wafers and 100μm for 4”, inducing pattern distortion.
WAFER BOW
2”
4”
6”
LED manufacturers can use different substrates, mostly sapphire or SiCwafers, which are transparent with light-diffusing features such as rough or patterned surfaces. Also, they can use metal wafers for vertical structures, so there’s large material variability.
MiniLED for Display Applications: LCD and Digital Signage report by Yole Déve...Yole Developpement
MiniLEDs bring new strength to LCD players in the battle against OLED and enable increased LED
adoption on digital signage.
More information on : https://www.i-micronews.com/report/product/miniled-for-display-applications-lcd-and-digital-signage.html
Sirris manufacturing day 2013 DTI Denmark - Olivier JaySirris
The Danish Technological Institute is an independent, not-for-profit technological service institute approved by the Danish Ministry of Science, Technology and Innovation. It was founded in 1906 to provide technical assistance to Danish industry, mainly small enterprises, through teaching, advice, testing, and technological research. It generates revenue from performing research and development activities, working with Danish and international business and organization customers, and through performance contracts. It has offices throughout Denmark and subsidiaries in Sweden, Poland, and the US. The Institute focuses on working with industry from the idea phase through basic research, applied technology development, and commercialization of proven technologies.
The document discusses applications of pH and other process measurements in pulp and paper mills. It notes that accurate pH measurements are critical for bleaching processes due to environmental regulations. It also explains that pH measurements can be challenging due to abrasive pulp stock and chemical additives, requiring frequent sensor cleaning and maintenance to ensure accuracy. New sensor designs aim to reduce maintenance needs to make pH measurement more manageable for mill operators.
LED UV Flexo Low Migration inks developped by Siegwerk for printing food packaging & labels in narrow web. High reactivity and HIgh adhesion levels on wide variety of substrates.
This talk by Clive Ayling, Managing Director, Meteor Inkjet Ltd, at the IMI InPrint USA conference, April 2017, highlights the key considerations in making the most important design decision for ink jet printing systems - printhead selection. Printheads are the highest cost system component and printer performance and output quality are dependent on printhead characteristics and specifications.
Learn the key parameters and methodology to make an informed printhead selection decision for your industrial ink jet system.
This document provides information on Lisun Electronics Inc., a manufacturer of lighting and electrical test instruments. It includes contact and location details for Lisun Group's global offices in Hong Kong, Shanghai, and Los Angeles. The bulk of the document describes Lisun's desktop spectrophotometer product lines, including models DSCD-900, DSCD-901, and DSCD-910. It provides specifications, technical details, sample images and applications for each model.
The document provides an overview of MBD Org Chart, activities, and De Nora Group organization. It includes:
1. An MBD org chart showing the corporate manager and various departments, including marketing, business development, sales regions, and their connections.
2. Details on the business development manager role and responsibilities, including product portfolio management, market analysis, and identifying business opportunities.
3. An overview of De Nora Group's organization worldwide in 2010, including its production facilities, markets, main customers, and competitors.
Graphene has potential applications across many industries such as electronics, energy, composites, and biomedical. It shows promise in satisfying demands around properties like low sheet resistance, tunability of electron mobility, and high thermal conductivity. Graphene technology readiness varies by application, from basic research to commercialization, with areas like composites and some electronics applications closer to commercial use. The graphene industry value chain involves raw material suppliers, manufacturers, application developers, and end users. Key regions for graphene technology include North America, Europe, and Asia Pacific.
JTOPTICS® 800GBASE SR8 100m QSFP DD optical transceiver, known as the 800G QSFP DD SR8 (JT 800G QSFPDD SR8), is meticulously engineered for operation over multimode fiber systems, utilizing a nominal wavelength of 850nm (MMF). This transceiver complies with the QSFP28 MSA and IEEE 802.3cd 200GBASE SR4 standards, seamlessly integrating eight data lanes in each direction at 8x53.125G. The electrical interface features a 76-contact edge-type connector, while the optical interface utilizes a 16-fiber MTP (MPO) connector.
Key Features:
1. Eight channels full duplex transceiver modules for efficient bidirectional communication.
2. Transmission data rate up to 106.25G per 8x53Gbps PAM4 for high-speed data transfer.
3. Features an 8x106.25Gbps PAM4 transmitter and PAM4 receiver for reliable performance.
4. Utilizes an 8-channel 850nm VCSEL array and a PIN photo detector array for enhanced functionality.
5. Power consumption is kept below 13W for energy efficiency.
6. Hot-pluggable QSFP DD form factor for convenient installation.
7. Maximum link length of 70m over OM4 and 100m over OM5 multimode fiber for flexibility in connectivity.
8. MPO 16 connector receptacle for streamlined connectivity.
Built-in digital diagnostic functions for comprehensive monitoring.
9. Operates in a temperature range from 0°C to +70°C, suitable for various environments.
10. Operates on a 3.3V power supply voltage for simplified power management.
11. RoHS compliant, demonstrating adherence to environmental standards through being lead-free.
QSFPDD 800GBASE DR4 offers an impressive transmission distance of up to 10 Km over a single-mode fiber link. This Quad Small Form Factor Pluggable Double Density (QSFP DD) transceiver, featuring an optical MPO 12/MTP 12 connector, is specifically designed for long-range single-mode 800 Gigabit Ethernet (800GbE) high-speed applications, capable of reaching speeds of up to 800 gigabits per second. The 800 Gigabit Ethernet signal is efficiently carried over four parallel lanes, with one wavelength per lane. Additionally, it can be utilized as an 8x100G breakout to QSFP28 DR 100G.
Key Features:
1. QSFP DD MSA and CMIS compliant, ensuring compatibility and standard adherence.
2. Compliant with the 802.3 800GBASE DR8 standard.
3. Utilizes an 8x106.25Gbps (53.125GBd PAM4) electrical interface for efficient data transfer.
4. Employs an 8x106.25Gbps (53.125GBd PAM4) optics architecture for enhanced performance.
5. Power consumption is below 16.5W for energy efficiency.
6. Maximum link length of 10Km over G.652 single-mode fiber with KP FEC.
7. MPO 16 receptacles and built-in digital diagnostic functions for streamlined connectivity and comprehensive monitoring.
8. Operates in a temperature range from 0°C to +70°C, suitable for various environments.
9. Operates on a 3.3V power supply voltage for simplified power management.
10. RoHS compliant, demonstrating adherence to environmental standards through being lead-free.
The document summarizes a presentation on analyzing the influence of additive manufacturing on the environmental and economic performance of supply chains for low-demand spare parts. It discusses the current global supply chain model and how additive manufacturing could enable local production. The research question asks what influence AM has on costs and sustainability. An economic and environmental model of a single-echelon supply chain is presented. A case study examines 5 situations, finding AM is more economical for production price changes, minimum order quantities, and mould remanufacturing. It is also better environmentally for energy reductions, minimum order quantities, and uncertain demand portfolios. The conclusion is that AM is interesting to replace regular production in certain circumstances.
200G QSFP56 to 2xQSFP28 AOC Active optical Cable Data Sheet By JTOPTICSJayani Technologies Ltd
The JTOPTICS® 200G QSFP28-DD Breakout AOC is an innovative QSFP56 VCSEL-based (Vertical Cavity Surface-Emitting Laser) active optical splitter cable (AOC) delivering cost-effective connectivity for 200Gb/s to 2 x 100Gb/s applications in Ethernet and InfiniBand EDR environments. Compliant with both QSFP28 and QSFP-DD MSA specifications, this cable facilitates seamless integration between system units. The design incorporates a 200Gb/s QSFP-DD connector on one end and two separate 100Gb/s QSFP28 connectors on the other, making it ideal for establishing links between a switch and two servers.
Key Features:
Hot Pluggable QSFP-DD and QSFP28 MSA Compliant for versatile and standardized connectivity.
4-channel 850nm VCSEL array and PIN photo-detector array ensuring reliable data transmission.
Supports 200G to 2x 100G Ethernet Interoperability for versatile application scenarios.
8x 25G NRZ electrical interface enabling high-speed data transfer.
8x 25G NRZ optical interface facilitating efficient communication.
Data rate up to 25.78125Gbps per channel ensuring fast and reliable performance.
Compliant with QSFP-DD MSA, CMIS, and IEEE 802.3 standards for industry compatibility.
Low power dissipation for energy-efficient operations.
Max. Power Consumption of 4W for optimized power management.
Commercial or industrial case operating temperature range ensuring suitability for various environments.
MMF cable with customizable length up to 70M (OM3) & 100m (OM4) for flexible installations.
Single 3.3V power supply simplifying power management.
Built-in digital diagnostic functionality for advanced monitoring.
RoHS compliant (lead-free) aligning with environmental standards.
This document describes Light Runner, a fiber optic benchtop laboratory solution developed jointly with IIT Delhi. Light Runner is a self-contained integrated system offering over 40 experiments related to fiber optic parameters, components, optical communication systems, and testing. It uses industrial grade silica fiber and components. Key features include a touchscreen interface, computerized operation with interactive software, and proprietary software for theoretical concepts and saving student results. Light Runner has received several awards and recognition and is used by leading academic institutions worldwide.
The document provides information on Prima Power's laser cutting product range, including details on several laser cutting machine models. It discusses the advantages of CO2 and fiber laser technologies and highlights features of the Laser Genius, Platino Fiber Evo, and Platino machines. The summary focuses on key capabilities and specifications of the highlighted machines.
The document provides an overview of material and chemical research activities at ITRI Jassy in Taiwan. It describes the various divisions and their research focuses, including materials for displays, energy storage, electronics, chemicals and fibers. It also summarizes key projects on hybrid materials, coatings, fibers and international collaborations.
Samsung Analyst Day 2013: S.LSI Namsung Woo Samsung System LSI BusinessVasilis Ananiadis
1) Samsung System LSI provides application processors, image sensors, and foundry services for the mobile device and IoT markets.
2) They are focusing on developing high performance yet low power processors using big.LITTLE architecture and FinFET processes. Their APs currently lead the industry in performance.
3) Samsung is also working on new products like ModAP which integrates cellular modems with APs, and solutions for the growing IoT market involving devices for smart homes and buildings.
4) On the foundry side, they aim to be the technology leader with 14nm FinFET and beyond, and serve not just tier 1 customers but also tier 2/3 through their foundry services
400G QSFP-DD to QSFP-DD AOC Active optical Cable Data Sheet By JTOPTICSJayani Technologies Ltd
The JTOPTICS® 400G QSFP-DD AOC (active optical cable) is a cutting-edge 400 Gb/s parallel active optical cable designed to transmit parallel 8×50 Gb/s PAM4 signals over multi-mode fiber (MMF) cables, delivering exceptional performance for distances up to 100m. This cable adheres to the standards set by QSFP-DD MSA and the CMIS 4.0. With support for eight electrical interface lanes, each operating at a data rate of 53.125G, the cable provides an impressive aggregate bandwidth of up to 425Gb/s.
Key Features:
Hot-pluggable QSFP-DD active optical cable assemblies for convenient and versatile connectivity.
8x 50G PAM4 electrical interface for high-speed data transfer.
8x 50G PAM4 optical interface ensuring efficient and reliable communication.
Data rate up to 53.125Gbps per channel, delivering fast and robust performance.
8-channels 850nm VCSEL array and PIN photo-detector array for reliable signal transmission.
Compliant with QSFP-DD MSA, CMIS, and IEEE 802.3 standards for industry compatibility.
Low power dissipation for energy-efficient operations.
Compliant with IEEE 802.3cd 200GBASE-SR4 and InfiniBand HDR/HDR100, meeting advanced networking requirements.
MMF cable with customizable length up to 70m (OM3) or 100m (OM4/OM5), allowing flexible installations.
10W maximum power dissipation per 400G QSFP-DD SR8 module for optimized power management.
Commercial case operating temperature range ensuring suitability for various environments.
Single 3.3V power supply simplifying power management.
Built-in digital diagnostic functionality for advanced monitoring.
RoHS compliant (lead-free) adhering to environmental standards.
400G QSFP-DD to QSFP-DD AOC Active optical Cable Data Sheet By JTOPTICS
B_Muys_AFIP2016_Agfa
1. Conductive Inks for Functional Printing
Less is More
< = >
Bavo Muys
Application Manager Orgacon & Silver Electronic Materials
Advanced Coatings and Chemicals
Agfa Materials
2. 2/31
Today’s Presentation
Agfa - Agfa-Materials
Printed Electronics Challenges
Thin Printable Conductors: 2 core technologies:
PEDOT:PSS Conductive Polymer
– Key properties
– Applications and examples of application know how
Nano-Silver Ink
– High conductive efficiency
– Drying and curing
– Continuous Improvements: curing time, adhesion, environmental stability
– Inkjet Ink
– Applications
Conclusions
3. 3/31
Agfa in the World
Agfa Gevaert Group 2014 : 10,846 FTE
Headquarters in Mortsel (Antwerp), Belgium
Group Sales 2014 : €2,620 Billion
Graphics €1,355 B
Healthcare €1,069 B
Specialty Products €0.197 B
2014 Recurring EBIT €152 M , EBITDA €222 M
2014 Net Cash from Operating Activities €151 M
2014 Profit for the year €59 M
Healthcare: No 1-2 Prepress: No 1-2
Sales organizations in 40 countries
Manufacturing sites in 10 countries
Representations in 100 countries
Listing Euronext Brussels
Agfa Gevaert Group 2014 : 10,846 FTE
Headquarters in Mortsel (Antwerp), Belgium
Group Sales 2014 : €2,620 Billion
Graphics €1,355 B
Healthcare €1,069 B
Specialty Products €0.197 B
2014 Recurring EBIT €152 M , EBITDA €222 M
2014 Net Cash from Operating Activities €151 M
2014 Profit for the year €59 M
Healthcare: No 1-2 Prepress: No 1-2
Sales organizations in 40 countries
Manufacturing sites in 10 countries
Representations in 100 countries
Listing Euronext Brussels
Integrated prepress solutions to
the printing and industrial ink jet
printing industry: consumables,
hardware, software and services
for production workflow, project
and color management.
Integrated prepress solutions to
the printing and industrial ink jet
printing industry: consumables,
hardware, software and services
for production workflow, project
and color management.
Integrated solutions for capturing,
processing and managing diagnostic
images and IT solutions that integrate
the imaging workflow into the overall
hospital operations across departmental
disciplines (PACS, HIS, RIS, CIS).
Integrated solutions for capturing,
processing and managing diagnostic
images and IT solutions that integrate
the imaging workflow into the overall
hospital operations across departmental
disciplines (PACS, HIS, RIS, CIS).
Supplies film-based products and
high-tech solutions to large B2B
customers outside the graphic and
healthcare markets, e.g. synthetic
paper, functional foils, conductive
materials, specialty inks.
Supplies film-based products and
high-tech solutions to large B2B
customers outside the graphic and
healthcare markets, e.g. synthetic
paper, functional foils, conductive
materials, specialty inks.
Agfa Graphics Agfa HealthCare
Agfa-Gevaert Group
Parent Company
Agfa Materials
Specialty Products
Agfa Graphics Agfa Materials
Specialty Products
Agfa Materials
Specialty Products
Agfa-Gevaert Group
Parent Company
Agfa Materials
Specialty Products
Agfa-Gevaert Group
Parent Company
Agfa Materials
Specialty Products
Graphics
51.7%
HealthCare
40.8%
Specialty Products
7.5%
By Business Group By Region
Europe
40.1%
NAFTA
24.7
%
Latin
America
Asia & ROW
26%
9.2%
Agfa Gevaert Group
Agfa Graphics Agfa HealthCare
Agfa-Gevaert Group
Parent Company
Agfa Materials
Specialty Products
Agfa Graphics Agfa Materials
Specialty Products
Agfa Materials
Specialty Products
Agfa-Gevaert Group
Parent Company
Agfa Materials
Specialty Products
Agfa-Gevaert Group
Parent Company
Agfa Materials
Specialty Products
4. 4/31
Printed Electronics Challenges
New PE products are announced almost daily
RFID enabled devices, sensors, smart packaging and clothing, touch enabled surfaces, energy harvesting, …
Key drivers from materials development side [< = >]
efficient material usage with improved material properties
inexpensive substrates paper, low-T° polymer films
are important to open door to mass-applications
efficient manufacturing methods
using installed manufacturing lines screen printing; R2R
reduces investment costs
simple processes additive vs. subtractive processing
reduces process costs
miniaturization and integration in other layers/objects
flexible – formable – unobtrusive
Quad Industries
ThinFilmElectronics
7. 7/31
Orgacon – Transparent Conductive polymer
PEDOT:PSS is very flexible compared to inorganic coatings like ITO
Direct benefits in flexible applications
Also allows high speed / low cost manufacturing processes
Can be formed after coating and drying, important for IMD & IML applications.
8. 8/31
Courtesy Multek
Orgacon – Transparent Conductive polymer (PEDOT:PSS)
Applications
antistatic applications for optical films and packaging
polymer capacitors
TCF – transparent electrodes: lower optical density < = > higher conductivity
same as: lower SER < = > higher VLT
coated electrodes for PDLC displays
printed electrodes for capacitive sensors and AC-EL
Courtesy KDI
9. 9/31
Orgacon – Transparent Conductive polymer (PEDOT:PSS)
Orgacon Screen Printing Inks
Grade Typical applications SER @ P77/55
(Ohm/square)
SER x OD *
ASTM D 1003
Viscosity
(Pas), 25°C
EL-P3040 Transparent conductive
electrode for EL
applications
680 40 > 8
EL-P3145 Patterned transparent
conductive structures for
EL and touch
applications
240 10 > 12
EL-P3155 Patterned transparent
conductive structures for
LED-backlit capacitive
sensors
350 14 > 12
EL-P5010 Patterned medium-
transparent conductive
fine structures for EL and
touch applications
280 50 > 100
EL-P5015 Patterned transparent
conductive fine
structures for EL and
touch applications, OPV
ITO substitution
125 18 > 100
[< = >]
10. 10/31
Application example:
Printed LED backlit Capacitive switch module
Choosing the right materials for:
White LED stability
Optical Clear Adhesive (OCA)
11. 11/31
Application know how:
Printed LED backlit Capacitive switch module
White LED stability
PEDOT:PSS conductive polymers are sensitive for
light between 400 and 500 nm
This can be a problem with White LED backlit
Because of this typical white LED stability problem,
AGFA developed a new STABILISED screen printing ink EL-P 3155
Relatief activeringsspectrum van ORGACON
0%
10%
20%
30%
40%
50%
60%
300 400 500 600 700 800 900
Golflengte (nm)
Relatievegevoeligheid(m²/MJ)
White LED
[< = >]
12. 12/31
Application know how:
Printed LED backlit Capacitive switch module
Optical Clear Adhesive (OCA)
Some OCA’s interact with PEDOT:PSS-conductive polymers,
others do not influence the conductivity over time:
Choose the right OCA
a Clear Mask can be applied between transparent electrode and OCA
[< = >]
14. 14/31
Nano Silver ink : high conductive efficiency
Nanoparticles sinter at 150°C
Big increase in conductivity
Flake geometry does not
change significantly at curing T°
[< = >]
3D SEM of flake ink layer 3D SEM of SI-P1000x ink layer
SEM of flake ink layer
SEM of SI-P1000x ink layer
15. 15/31
Nano Silver ink : high conductive efficiency
Compared to flake inks, with 1kg SI-P1000x nanosilver ink,
2 to 3x more area can be printed with the same conductivity.
This can be exploited in 3 ways
Print thinner layers with same conductivity
Print smaller features
Maximize conductivity in one printing step
[< = >]
[< = >]
[< = >]
16. 16/31
Nano Silver ink : high conductive efficiency
Print thinner layers with the same conductivity (P77/55 ► P180/27)
200 mOhm/sq
tDFT ≈ 5 µm
40mOhm/sq@25µm
53 mOhm/sq
tDFT ≈ 1,2 µm
2,5mOhm/sq@25µm
3D SEM of flake ink layer 3D SEM of SI-P1000x ink layer
PET substrate
[< = >]
17. 17/31
Nano Silver ink : high conductive efficiency
Come to our tabletop and ask for
your printed business card demonstrator
[< = >]
ss730/13 mesh: 24500:730=34µm
34 x 0,8= 27µm 34x 2=54µm
Print Smaller futures
30µm- fine line printing
PVF-screen + emulsion
System build-up
To print 30µm lines
nano silver ink
19. 19/31
Nano Silver ink : Drying and Curing
Final conductivity determined by substrate and by curing temperature
Recommended sintering conditions (pre-dryed) : 150°C for minimum 2 minutes
>30% of Ag bulk conductivity on many substrates
can double to 70% at 250°C
Other sintering technologies: reduce time and/or substrate T°
NIR (Near infrared) on white porous substrates: less than 5 s sintering time possible
%bulk Ag i.f.o. Curing Temperature
0,0%
10,0%
20,0%
30,0%
40,0%
50,0%
60,0%
70,0%
80,0%
Astera PET Powercoat
XD
Teslin Dupont
500VN
Powercoat
XD
Dupont
500VN
%bulkAg(100%=max)
150°C
180°C
250°C
All trademarks property of their respective owners
21. 21/31
Agfa Nano Silver ink : Drying and Curing
New ink formulation with increased curing speed (hot air belt oven)
Other curing technologies
in evaluation
22. 22/31
Advances in adhesion – SI-P1000x vs. R&D ink
SI-P1000x
ink
R&D
ink
Nanosilver sintering precludes the use of large amounts of binder to promote adhesion
Trade-off with conductivity
SI-P1000x has good adhesion to mainly print-treated substrates
R&D ink has excellent adhesion, even on difficult substrates, e.g.untreated PET, ITO, PI
with even better bulk conducitivity vs. SI-P1000x
Agfa PET
COVEME PET
MTSL DY AW PowerCoat ITO PET
Kaneka PI
Apical100NP
DuPont PET
Melinex S
All trademarks property of their respective owners
0
0 0 0 0
0
00
0 5 55
Adhesion tested acc. to DIN EN ISO 2409 (ASTM D3359)
0 = perfect (no material removed); 5 = bad (everything removed)
23. 23/31
Advances in adhesion – SI-P1000x vs. R&D ink
Creasing test: OK
All trademarks property of their respective owners
• Material: PI
• Creased 1 time in, 1 time out
• Roll weight: 1750g
• ∆R/R : <4%
24. 24/31
Agfa Nano Silver ink : Environmental Stability
Stability under stringent operating conditions needed for a lot of applications
(e.g. automotive)
Agfa Nano Silver ink was evaluated on different substrates and for different conditions
Print-treated PET: Agfa, Coveme
Paper and synthetic paper: teslin, Arjowiggins PowerCoat™
Polyimide: DuPont Kapton™
85C/85%RH, 500h
60C/95%RH, 500h
-30
-20
-10
0
10
20
30
0 120 240 360 480 600
PET - Agfa Astera
PET - Coveme MTSL DY
Teslin
Paper - PowerCoat XD125
PI- Kapton 500VN
-30
-20
-10
0
10
20
30
0 120 240 360 480 600
PET - Agfa Astera
PET - Coveme MTSL DY
Teslin
Paper - Pow erCoat XD125
PI- Kapton 500VN
Relative change in resistance, 85°C/85%RH Relative change in resistance, 60°C/95%RH
Relative change ∆R/R0 < 10%
All trademarks property of their respective owners
25. 25/31
Agfa Nano Silver inkjet ink
To unlock the potential of inkjet for Printed Electronics,
Agfa Specialty Products and Ceradrop (MGI Digital Technology company), have joined forces
The aim is developing an inkjet metallization solution for Printed Electronics
that brings inkjet technology from R&D to the manufacturing floor
Parties combine their respective know-how on a exclusive basis
Agfa: nanosilver and inkjet ink development
Ceradrop: digital fabrication technology
+
A strategic cooperation for inkjet
26. 26/31
Applications of nanosilver inks: antenna and FPCB
Printed Ag cannot compete with other metals only on cost…
smart card inlays – Cu wired antenna inlays
RFID labels – Al or Cu stamped or etched
Printing has advantages from TCO* point of view
no complicated, time-consuming etching or plating baths
no additional integration steps with adhesive layers
support for variable data / variable deposit (inkjet)
Typical specifications
down to 5 mOhm/sq in 1 printing step (~10 µm DFT)
200 µm printing resolution (for chip mounting)
*Total Cost of Ownership
28. 28/31
Application of combination
Agfa nano-silver ink & transparent conductive polymer ink
Touch sensors for automotive/white goods
PET with
Conductive circuitry
Orgacon™ PEDOT:PSS transparent keys
EMI shielding
With nanosilver ink, total ink deposit can be
lowered while keeping resistance target
esp. for EMI part
Due to low DFT of nanosilver layer, high
reliability interconnection with printed Orgacon
layers is obtained
Mitsubishi EK Wagon
Transparent Capacitive Switches for HVAC Controls
(courtesy Multek)
29. 29/31
Conclusions
Orgacon products expand possibilities for Printed Electronics
Conductive polymer based inks offer transparency and conductivity, plus
direct patterning methods
compatibility with flexible/formed substrates
Nanosilver based ink offer a high silver efficiency, plus
easy processing with conventional screen printing
excellent stability
support for high conductivity and/or high resolution circuitry
[< = >]